STMICROELECTRONICS STPS8170DEE

STPS8170DEE
Power Schottky rectifier
Datasheet  production data
Features
NC
■
Very low conduction losses
■
Negligible switching losses
■
Extremely fast switching
■
Low thermal resistance
■
Avalanche capacity specified
■
High junction temperature
■
ECOPACK®2 compliant component
A
K
A
A
A
A
A
A
NC
A
A
NC
K
K
Description
This Schottky rectifier is designed for switch mode
power supply and high frequency DC to DC
converters.
Packaged in PowerFLAT™, this device is
intended for use in low voltage, high frequency,
inverters, free-wheeling, by-pass diode and
polarity protection applications.Its low profile was
especially designed to be used in applications
with space-saving constraints.
PowerFLAT(3.3 x 3.3)
STPS8170DEE-TR
Table 1.
Device summary
Symbol
Value
IF(AV)
8A
VRRM
170 V
Tj (max)
175 °C
VF (typ)
0.66 V
TM: PowerFLAT is a trademark of STMicroelectronics
September 2012
This is information on a product in full production.
Doc ID 023260 Rev 1
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www.st.com
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Characteristics
1
STPS8170DEE
Characteristics
Table 2.
Absolute ratings (limiting values Tamb = 25 °C unless otherwise specified)
Symbol
Parameter
Value
Unit
VRRM
Repetitive peak reverse voltage
170
V
IF(RMS)
Forward rms current
15
A
8
A
= 0.5
IF(AV)
Average forward current
IFSM
Surge non repetitive forward current tp = 10 ms sinusoidal
100
A
Repetitive peak avalanche power
400
W
-65 to +175
°C
175
°C
PARM(1)
Tstg
Tj
Tc = 145 °C
tp = 10 µs Tj = 125 °C
Storage temperature range
Maximum operating junction temperature
1. For pulse time duration deratings, please refer to Figure 3. More details regarding the avalanche energy
measurements and diode validation in the avalanche are provided in the STMicroelectronics Application
notes AN1768, “Admissible avalanche power of schottky diodes” and AN2025, “Converter improvement
using Schottky rectifier avalanche specification”.
Table 3.
Thermal resistance
Symbol
Rth(j-c)
Table 4.
Parameter
Junction to case
Parameter
IR(1)
Reverse leakage current
Forward voltage drop
Test conditions
Tj = 25 °C
Tj = 125 °C
Tj = 25 °C
Tj = 125 °C
VR = VRRM
IF = 8A
1. Pulse test: tp = 5 ms,  < 2%
2. Pulse test: tp = 380 µs,  < 2%
To evaluate the conduction losses use the following equation:
P = 0.62 x IF(AV) + 0.0125 x IF2(RMS)
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Unit
4
°C/W
Static electrical characteristics
Symbol
VF(2)
Value
Doc ID 023260 Rev 1
Min.
Typ.
-
1.5
Max.
Unit
15
µA
15
mA
0.90
-
0.66
0.72
V
STPS8170DEE
Figure 1.
Characteristics
Average forward power dissipation Figure 2.
versus average forward current
PF(AV)(W)
Average forward current versus
ambient temperature( = 0.5)
IF(AV)(A)
10
9
δ = 0.5
δ = 0.2
8
7
Rth(j-a)=Rth(j-c)
8
δ = 0.1
δ = 0.05
6
δ=1
6
(
)
5
4
4
3
T
T
2
2
1
IF(AV)(A)
δ =tp/T
δ =tp/T
tp
Tamb(°C)
tp
0
0
0
1
Figure 3.
2
3
4
5
6
7
8
9
10
0
11
Normalized avalanche power
derating versus pulse duration
Figure 4.
50
75
100
125
150
175
Relative variation of thermal
impedance junction to case versus
pulse duration
Zth(j-c)/Rth(j-c)
PARM (t p )
PARM (10 µs)
1
25
1.0
0.9
0.8
0.7
0.1
0.6
0.5
0.4
0.01
0.3
0.2
0.1
t p(µs)
0.001
1
10
Figure 5.
100
1000
Reverse leakage current versus
reverse voltage applied (typical
values)
tp(s)
Single pulse
0.0
1.E-05
Figure 6.
1.E-04
1.E-03
1.E-02
1.E-01
1.E+00
Junction capacitance versus
reverse voltage applied (typical
values)
C(pF)
IR(mA)
1000
1.E+01
Tj = 150 °C
1.E+00
F=1 MHz
VOSC=30 mVRMS
Tj =25 °C
Tj = 125 °C
Tj = 100 °C
1.E-01
Tj = 75 °C
100
1.E-02
Tj = 50 °C
1.E-03
Tj = 25 °C
1.E-04
VR(V)
VR(V)
1.E-05
10
0
20
40
60
80
100
120
140
160
180
1
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100
1000
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Characteristics
Figure 7.
STPS8170DEE
Forward voltage drop versus
forward current
Figure 8.
IFM(A)
Thermal resistance junction to
ambient versus copper surface
under tab
Rth(j-a)(°C/W)
100.0
250
Tj=125 °C
(Maximum values)
PowerFLAT (3.3x3.3)
epoxy printed board FR4, copper thickness=35µm
200
10.0
150
Tj=125 °C
(Typical values)
Tj=25 °C
(Maximum values)
100
1.0
50
SCu(cm²)
VFM(V)
0
0.1
0.0
4/8
0.2
0.4
0.6
0.8
1.0
1.2
0
1
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STPS8170DEE
Package information
●
Epoxy meets UL94,V0
●
Lead-free package
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK® is an ST trademark.
Figure 9.
PowerFLAT-3.3x3.3-8L dimensions (definitions)
Exposed pad
L1
b
L
E
E2
nc
nc
e/2
D/2
D
D2
D3
e
E/2
A3
a
k
a
k
L2
A
Index area
(D/2 x E/2)
A4
2
Package information
Table 5.
Projection
PowerFLAT-8L dimensions (values)
Dimensions
Ref.
A
Millimeters
Inches
Min.
Typ.
Max.
Min.
Typ.
Max.
0.95
1.00
1.05
0.037
0.039
0.041
A3
0.20
0.0079
A4
0.20
0.0079
b
0.30
0.37
0.44
0.012
0.015
0.017
D
3.20
3.30
3.40
0.126
0.130
0.134
D2
2.24
2.31
2.38
0.088
0.091
0.094
D3
1.60
1.67
1.74
0.063
0.066
0.069
e
0.65
0.026
E
3.20
3.30
3.40
0.126
0.130
0.134
E2
1.68
1.75
1.82
0.066
0.069
0.072
L
0.31
0.38
0.45
0.012
0.015
0.018
L1
0.55
0.62
0.69
0.22
0.024
0.027
L2
0.86
0.93
1.00
0.034
0.037
0.039
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Package information
STPS8170DEE
Figure 10. Footprint (dimensions in mm)
3.50
0.80
0.42
3.50
2.28
1.75
1.75
1.25
1.79
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STPS8170DEE
3
Ordering information
Ordering information
Table 6.
4
Ordering information
Order code
Marking
STPS8170DEE-TR
PS8170
Package
PowerFLAT
(3.3 x 3.3)
Weight
Base qty
Delivery mode
34 mg
3000
Tape and reel
13” reel
Revision history
Table 7.
Document revision history
Date
Revision
09-Sep-2012
1
Changes
First issue.
Doc ID 023260 Rev 1
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STPS8170DEE
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