STMICROELECTRONICS STPS30120DJF-TR

STPS30120DJF
Power Schottky rectifier
Features
■
Very small conduction losses
■
Negligible switching losses
■
Extremely fast switching
■
Low forward voltage drop
■
Low thermal resistance
■
High avalanche capability specified
■
ECOPACK®2 compliant component
A
K
A
K
K
Description
Schottky rectifier suited for switch mode power
supply and high frequency DC to DC converters.
Packaged in PowerFLAT™, this device is
intended for use in low voltage, high frequency
inverters, free-wheeling and polarity protection
applications.
A
A
PowerFLAT 5x6
STPS30120DJF
Table 1.
Device summary
Symbol
Value
IF(AV)
30 A
VRRM
120 V
Tj (max)
150 °C
VF(typ)
0.61 V
TM: PowerFLAT is a trademark of STMicroelectronics
May 2011
Doc ID 15671 Rev 5
1/7
www.st.com
7
Characteristics
1
STPS30120DJF
Characteristics
Table 2.
Absolute Ratings (limiting values, anode terminals short circuited)
Symbol
VRRM
Repetitive peak reverse voltage
IF(RMS)
Forward rms current
Unit
120
V
45
A
Average forward current
Tc = 80 °C, δ = 0.5
30
A
IFSM
Surge non repetitive forward current
tp = 10 ms sinusoidal
200
A
PARM
Repetitive peak avalanche power
tp = 1 µs Tj = 25 °C
12500
W
-65 to + 175
°C
150
°C
Value
Unit
2.5
°C/W
Tj
Storage temperature range
Maximum operating junction temperature (1)
1
dPtot <
condition to avoid thermal runaway for a diode on its own heatsink
Rth(j-a)
dTj
Table 3.
Thermal resistance
Symbol
Rth(j-c)
Table 4.
Symbol
IR(1)
Parameter
Junction to case
Static electrical characteristics (anode terminals short circuited)
Parameter
Reverse leakage
current
Test conditions
Tj = 25 °C
Tj = 125 °C
Tj = 25 °C
VF(1)
Forward voltage drop
Tj = 125 °C
Tj = 25 °C
Tj = 125 °C
Min.
VR = VRRM
Typ.
5.5
Max.
Unit
35
µA
16
mA
0.84
IF = 15 A
0.61
0.67
V
0.92
IF = 30 A
1. Pulse test: tp = 380 µs, δ < 2%
To evaluate the conduction losses use the following equation:
P = 0.61 x IF(AV) + 0.005 IF2(RMS)
2/7
Value
IF(AV)
Tstg
1.
Parameter
Doc ID 15671 Rev 5
0.68
0.75
STPS30120DJF
Figure 1.
Characteristics
Average forward power dissipation Figure 2.
versus average forward current
PF(AV)(W)
30.0
δ=0.5
35
δ=1
Average forward current versus
ambient temperature (δ = 0.5)
IF(AV)(A)
Rth(j-a)=Rth(j-c)
30
25.0
δ=0.2
25
20.0
δ=0.1
δ=0.05
20
15.0
15
10.0
10
T
T
5.0
5
IF(AV)(A)
δ=tp/T
δ=tp/T
tp
0.0
tp
Tamb(°C)
0
0
5
Figure 3.
10
15
20
25
30
35
40
Normalized avalanche power
derating versus pulse duration
0
25
Figure 4.
PARM(tp)
PARM(1µs)
1
1.2
50
75
100
125
150
Normalized avalanche power
derating versus junction
temperature
PARM (Tj)
PARM(25°C)
1
0.1
0.8
0.6
0.4
0.01
0.2
tp(µs)
0.001
0.01
0.1
Figure 5.
200
1
10
100
1000
Non repetitive surge peak forward
current versus overload duration
(maximum values)
100
125
150
Relative variation of thermal
impedance, junction to case,
versus pulse duration
Zth(j-c)/Rth(j-c)
0.9
160
0.8
140
0.7
120
0.6
Tc=25°C
100
80
Tc=75°C
60
0
1.E-03
75
1.0
180
20
50
Figure 6.
IM(A)
40
Tj(°C)
0
25
0.5
0.4
0.3
Tc=125°C
IM
t(s)
t
δ =0.5
0.2
0.1
Single pulse
tp(s)
0.0
1.E-02
1.E-01
1.E+00
1.E-05
Doc ID 15671 Rev 5
1.E-04
1.E-03
1.E-02
1.E-01
1.E+00
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Characteristics
Figure 7.
1.E+02
STPS30120DJF
Reverse leakage current versus
reverse voltage applied (typical
values)
Figure 8.
IR(mA)
Junction capacitance versus
reverse voltage applied (typical
values)
C(pF)
10000
F=1MHz
Vosc=30mVRMS
Tj=25°C
Tj=150°C
1.E+01
Tj=125°C
1.E+00
Tj=100°C
1000
1.E-01
Tj=75°C
1.E-02
Tj=50°C
1.E-03
Tj=25°C
VR(V)
VR(V)
100
1.E-04
0
10
Figure 9.
60
20
30
40
50
60
70
80
90
100
110
1
120
Forward voltage drop versus
forward current
100
10
1000
Figure 10. Thermal resistance junction to
ambient versus copper surface
under tab
IFM(A)
Rth(j-a) (°C/W)
250
55
50
Epoxy printed circuit board FR4,
copper thickness = 35 µm
200
45
40
Tj=125°C
(Maximum values)
35
150
30
25
100
Tj=125°C
(Typical values)
20
Tj=25°C
(Maximum values)
15
50
10
VFM(V)
5
SCu(cm²)
0
0
0.0
4/7
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.1
0
Doc ID 15671 Rev 5
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4
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9
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STPS30120DJF
Package information
●
Epoxy meets UL94,V0
●
Lead-free package
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK® is an ST trademark.
Table 5.
PowerFLAT 5x6 dimensions
Dimensions
Ref.
Min.
D2
E2
K
e
b
A2
Inches
Max.
Min.
Typ.
Max.
A
0.80
1.00
0.031
0.039
A1
0.02
0.05
0.001
0.002
b
D
Typ.
A2
L
A
A1
Millimeters
0.25
0.30
0.50
D
D2
0.010
0.012
5.20
4.11
0.020
0.205
4.31
0.162
0.170
e
1.27
0.050
E
6.15
0.242
E
E2
3.50
3.70
0.138
0.146
L
0.50
0.80
0.020
0.031
K
1.275
1.575
0.050
0.062
Figure 11. Footprint (dimensions in mm)
5.35
4.41
3.86
4.33
6.29
2
Package information
0.98
0.95
0.62
1.27
Doc ID 15671 Rev 5
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Ordering Information
STPS30120DJF
Figure 12. Tape and reel specifications
Dot identifying Pin A1 location
2.0
Ø 1.55
1.75
4.0
0.30
0.20
5.30
12.0
5.5
Ø 1.5
R 0.50
6.30
8.0
1.20
All dimensions are typical values in mm
3
Ordering Information
Table 6.
4
Ordering information
Order code
Marking
Package
STPS30120DJF-TR
PS30 120
PowerFLAT 5x6
Weight Base qty
0.095 g
3000
Delivery mode
Tape and reel
Revision history
Table 7.
6/7
User direction of unreeling
Document revision history
Date
Revision
Changes
18-May-2009
1
First issue.
09-Nov-2009
2
Updated Table 1.
25-Feb-2010
3
Corrected order code and marking in Table 6.
30-Jul-2010
4
Replace Power QFN with PowerFLAT.
20-May-2011
5
Updated package graphics. Added mention of terminals to
captions of Table 2 and Table 4. Updated base quantity and
marking in Table 6. Added Figure 12.
Doc ID 15671 Rev 5
STPS30120DJF
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