STPS30120DJF Power Schottky rectifier Features ■ Very small conduction losses ■ Negligible switching losses ■ Extremely fast switching ■ Low forward voltage drop ■ Low thermal resistance ■ High avalanche capability specified ■ ECOPACK®2 compliant component A K A K K Description Schottky rectifier suited for switch mode power supply and high frequency DC to DC converters. Packaged in PowerFLAT™, this device is intended for use in low voltage, high frequency inverters, free-wheeling and polarity protection applications. A A PowerFLAT 5x6 STPS30120DJF Table 1. Device summary Symbol Value IF(AV) 30 A VRRM 120 V Tj (max) 150 °C VF(typ) 0.61 V TM: PowerFLAT is a trademark of STMicroelectronics May 2011 Doc ID 15671 Rev 5 1/7 www.st.com 7 Characteristics 1 STPS30120DJF Characteristics Table 2. Absolute Ratings (limiting values, anode terminals short circuited) Symbol VRRM Repetitive peak reverse voltage IF(RMS) Forward rms current Unit 120 V 45 A Average forward current Tc = 80 °C, δ = 0.5 30 A IFSM Surge non repetitive forward current tp = 10 ms sinusoidal 200 A PARM Repetitive peak avalanche power tp = 1 µs Tj = 25 °C 12500 W -65 to + 175 °C 150 °C Value Unit 2.5 °C/W Tj Storage temperature range Maximum operating junction temperature (1) 1 dPtot < condition to avoid thermal runaway for a diode on its own heatsink Rth(j-a) dTj Table 3. Thermal resistance Symbol Rth(j-c) Table 4. Symbol IR(1) Parameter Junction to case Static electrical characteristics (anode terminals short circuited) Parameter Reverse leakage current Test conditions Tj = 25 °C Tj = 125 °C Tj = 25 °C VF(1) Forward voltage drop Tj = 125 °C Tj = 25 °C Tj = 125 °C Min. VR = VRRM Typ. 5.5 Max. Unit 35 µA 16 mA 0.84 IF = 15 A 0.61 0.67 V 0.92 IF = 30 A 1. Pulse test: tp = 380 µs, δ < 2% To evaluate the conduction losses use the following equation: P = 0.61 x IF(AV) + 0.005 IF2(RMS) 2/7 Value IF(AV) Tstg 1. Parameter Doc ID 15671 Rev 5 0.68 0.75 STPS30120DJF Figure 1. Characteristics Average forward power dissipation Figure 2. versus average forward current PF(AV)(W) 30.0 δ=0.5 35 δ=1 Average forward current versus ambient temperature (δ = 0.5) IF(AV)(A) Rth(j-a)=Rth(j-c) 30 25.0 δ=0.2 25 20.0 δ=0.1 δ=0.05 20 15.0 15 10.0 10 T T 5.0 5 IF(AV)(A) δ=tp/T δ=tp/T tp 0.0 tp Tamb(°C) 0 0 5 Figure 3. 10 15 20 25 30 35 40 Normalized avalanche power derating versus pulse duration 0 25 Figure 4. PARM(tp) PARM(1µs) 1 1.2 50 75 100 125 150 Normalized avalanche power derating versus junction temperature PARM (Tj) PARM(25°C) 1 0.1 0.8 0.6 0.4 0.01 0.2 tp(µs) 0.001 0.01 0.1 Figure 5. 200 1 10 100 1000 Non repetitive surge peak forward current versus overload duration (maximum values) 100 125 150 Relative variation of thermal impedance, junction to case, versus pulse duration Zth(j-c)/Rth(j-c) 0.9 160 0.8 140 0.7 120 0.6 Tc=25°C 100 80 Tc=75°C 60 0 1.E-03 75 1.0 180 20 50 Figure 6. IM(A) 40 Tj(°C) 0 25 0.5 0.4 0.3 Tc=125°C IM t(s) t δ =0.5 0.2 0.1 Single pulse tp(s) 0.0 1.E-02 1.E-01 1.E+00 1.E-05 Doc ID 15671 Rev 5 1.E-04 1.E-03 1.E-02 1.E-01 1.E+00 3/7 Characteristics Figure 7. 1.E+02 STPS30120DJF Reverse leakage current versus reverse voltage applied (typical values) Figure 8. IR(mA) Junction capacitance versus reverse voltage applied (typical values) C(pF) 10000 F=1MHz Vosc=30mVRMS Tj=25°C Tj=150°C 1.E+01 Tj=125°C 1.E+00 Tj=100°C 1000 1.E-01 Tj=75°C 1.E-02 Tj=50°C 1.E-03 Tj=25°C VR(V) VR(V) 100 1.E-04 0 10 Figure 9. 60 20 30 40 50 60 70 80 90 100 110 1 120 Forward voltage drop versus forward current 100 10 1000 Figure 10. Thermal resistance junction to ambient versus copper surface under tab IFM(A) Rth(j-a) (°C/W) 250 55 50 Epoxy printed circuit board FR4, copper thickness = 35 µm 200 45 40 Tj=125°C (Maximum values) 35 150 30 25 100 Tj=125°C (Typical values) 20 Tj=25°C (Maximum values) 15 50 10 VFM(V) 5 SCu(cm²) 0 0 0.0 4/7 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 0 Doc ID 15671 Rev 5 1 2 3 4 5 6 7 8 9 10 STPS30120DJF Package information ● Epoxy meets UL94,V0 ● Lead-free package In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. Table 5. PowerFLAT 5x6 dimensions Dimensions Ref. Min. D2 E2 K e b A2 Inches Max. Min. Typ. Max. A 0.80 1.00 0.031 0.039 A1 0.02 0.05 0.001 0.002 b D Typ. A2 L A A1 Millimeters 0.25 0.30 0.50 D D2 0.010 0.012 5.20 4.11 0.020 0.205 4.31 0.162 0.170 e 1.27 0.050 E 6.15 0.242 E E2 3.50 3.70 0.138 0.146 L 0.50 0.80 0.020 0.031 K 1.275 1.575 0.050 0.062 Figure 11. Footprint (dimensions in mm) 5.35 4.41 3.86 4.33 6.29 2 Package information 0.98 0.95 0.62 1.27 Doc ID 15671 Rev 5 5/7 Ordering Information STPS30120DJF Figure 12. Tape and reel specifications Dot identifying Pin A1 location 2.0 Ø 1.55 1.75 4.0 0.30 0.20 5.30 12.0 5.5 Ø 1.5 R 0.50 6.30 8.0 1.20 All dimensions are typical values in mm 3 Ordering Information Table 6. 4 Ordering information Order code Marking Package STPS30120DJF-TR PS30 120 PowerFLAT 5x6 Weight Base qty 0.095 g 3000 Delivery mode Tape and reel Revision history Table 7. 6/7 User direction of unreeling Document revision history Date Revision Changes 18-May-2009 1 First issue. 09-Nov-2009 2 Updated Table 1. 25-Feb-2010 3 Corrected order code and marking in Table 6. 30-Jul-2010 4 Replace Power QFN with PowerFLAT. 20-May-2011 5 Updated package graphics. Added mention of terminals to captions of Table 2 and Table 4. Updated base quantity and marking in Table 6. Added Figure 12. Doc ID 15671 Rev 5 STPS30120DJF Please Read Carefully: Information in this document is provided solely in connection with ST products. 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