VN5R003H-E
3 mΩ reverse battery protection switch
Datasheet − production data
Features
Max supply voltage
VCC
-16 to 41 V
Operating voltage range
VCC
-16 to 28 V
On-state resistance
RON
3 mΩ
GA P GC FT00135
HPak
■
■
General
– Optimized electromagnetic emissions
– Very low electromagnetic susceptibility
– Compliant with European directive
2002/95/EC
Description
The VN5R003H-E is a device made using
STMicroelectronics® VIPower® technology. It is
intended for providing reverse battery protection
to an electronic module.
Protections
– Automatic switch off in case of negative
input voltage
– Electrostatic discharge protection
This device has two power pins (Drain and
Source) and a control pin IN. If the IN voltage
versus Drain is negative the device is turned on.
Application
■
A negative voltage of Drain pin versus IN
automatically turns off the device. When IN is left
open, device is in OFF-state and behaves like a
power diode between Source and Drain pins.
Reverse battery protection of an electronic
control unit
Table 1.
Device summary
Order codes
Package
HPAK
April 2012
This is information on a product in full production.
Tube
Tape and reel
VN5R003H-E
VN5R003HTR-E
Doc ID 17602 Rev. 5
1/20
www.st.com
1
Contents
VN5R003H-E
Contents
1
Block diagram and pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
2
Electrical specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
2.1
Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
2.2
Thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
2.3
Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
3
Application information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
4
Package and PC board thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
4.1
5
6
2/20
HPAK thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Package and packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
5.1
ECOPACK® . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
5.2
HPAK mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
5.3
HPAK suggested land pattern . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
5.4
Packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Doc ID 17602 Rev. 5
VN5R003H-E
List of tables
List of tables
Table 1.
Table 2.
Table 3.
Table 4.
Table 5.
Table 6.
Table 7.
Table 8.
Table 9.
Table 10.
Table 11.
Device summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Pin function . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Thermal data. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Power section for reverse battery mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Electrical transient requirements (part 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Electrical transient requirements (part 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Electrical transient requirements (part 3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Thermal parameter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
HPAK mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Doc ID 17602 Rev. 5
3/20
List of figures
VN5R003H-E
List of figures
Figure 1.
Figure 2.
Figure 3.
Figure 4.
Figure 5.
Figure 6.
Figure 7.
Figure 8.
Figure 9.
Figure 10.
Figure 11.
Figure 12.
Figure 13.
Figure 14.
4/20
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Configuration diagram (top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Current and voltage conventions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Maximum pulsed drain current (VBATT = 13 V) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Battery supplied systems . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Switched systems . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
PC board. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Rthj-amb vs PCB copper area in open box free air condition . . . . . . . . . . . . . . . . . . . . . . . 12
HPAK thermal impedance junction ambient single pulse . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Thermal fitting model of a single-channel HSD in HPAK . . . . . . . . . . . . . . . . . . . . . . . . . . 13
HPAK package dimension . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
HPAK suggested pad layout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
HPAK tube shipment (no suffix) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
HPAK tape and reel (suffix “TR”) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Doc ID 17602 Rev. 5
VN5R003H-E
1
Block diagram and pin description
Block diagram and pin description
Figure 1.
Block diagram
SOURCE
IN
DRIVER
DRAIN
Table 2.
Pin function
Name
Drain
Source
IN
Function
Power MOS drain
Power MOS source
Control pin
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Block diagram and pin description
Figure 2.
VN5R003H-E
Configuration diagram (top view)
1 - SOURCE
2 - SOURCE
3 - IN
4 - DRAIN
5 - NC
6 - SOURCE
7 - SOURCE
TAB - DRAIN
*$3*&)7
6/20
Doc ID 17602 Rev. 5
VN5R003H-E
2
Electrical specifications
Electrical specifications
Figure 3.
Current and voltage conventions
IS
SOURCE
ID
DRAIN
IN
VIN
2.1
VCC
VD
VS
IN
Absolute maximum ratings
Stressing the device above the rating listed in Table 3 may cause permanent damage to the
device. These are stress ratings only and operation of the device at these or any other
conditions above those indicated in the operating sections of this specification is not implied.
Exposure to the conditions in table below for extended periods may affect device reliability.
Table 3.
Absolute maximum ratings
Symbol
Value
Unit
-16 to 41
V
Source or Drain current
60
A
-IS, -ID
Reverse currents
60
A
EMAX
Inductive clamp energy
L = 2 mH, VD = 0 V, IN open, IS < 0, Tjstart = 25°C
0.9
J
VESD
Electrostatic discharge
(Human Body Model: R = 1.5 KΩ; C = 100 pF)
- All terminals
5000
V
VESD
Charge device model (CDM-AEC-Q100-011)
1000
V
Junction operating temperature
-40 to 150
°C
Storage temperature
-55 to 150
°C
VS
IS, ID
Tj
Tstg
Parameter
Source power terminal DC voltage (reverse battery mode)
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Electrical specifications
2.2
VN5R003H-E
Thermal data
Table 4.
Thermal data
Symbol
Parameter
Rthj-case Thermal resistance junction-case
Rthj-amb
2.3
Thermal resistance junction-ambient (mounted on FR4
using 6 cm2 copper pad)
Unit
0.5
°C/W
42
°C/W
Electrical characteristics
Table 5.
Power section for reverse battery mode(1)
Symbol
Parameter
Test conditions
Min.
Typ.
VS
Operating supply voltage
—
-16
13
Max. Unit
28
V
VCLPDS
Drain-Source clamp
voltage
VD = 0 V, IN open, IS = -5 A
17
23
V
VCLPDIN
Drain input clamp
voltage
VIN = 0 V, ID = 20 mA
41
52
V
Source drain voltage
IN = open, IS = 10 A; Tj = 25°C
VF
RON
IIN
IIN(REV)
On state resistance
between SOURCE and
Drain terminals
0.85
IS = 10 A; Tj = 25°C;
8 V < VCC < 28 V
VS = 13 V , VIN = 0 V
Reverse input current
VS = -16 V, VIN = 0 V
VS = -16 V, VD = 0 V, IN open
1. Operating conditions: 40°C < Tj < 150°C
Doc ID 17602 Rev. 5
V
3
mΩ
IS = 10 A; Tj = 150°C;
8 V < VCC < 28 V
Input current
IOUT_rev Output reverse current
8/20
Max.
5.5
2
3
mA
-2
0
mA
-1.5
-0.5
mA
VN5R003H-E
Electrical specifications
Table 6.
ISO 7637-2:
2004(E)
Test pulse
Electrical transient requirements (part 1)
Test levels(1)
III
IV
1(2)
-75 V
-100 V
2a
+37 V
3a
Number of
pulses or
test times
Burst cycle/pulse
repetition time
Delays and
Impedance
Min.
Max.
5000 pulses
0.5 s
5s
2 ms, 10 Ω
+50 V
5000 pulses
0.2 s
5s
50 µs, 2 Ω
-100 V
-150 V
1h
90 ms
100 ms
0.1 µs, 50 Ω
3b
+75 V
+100 V
1h
90 ms
100 ms
0.1 µs, 50 Ω
4
-6 V
-7 V
1 pulse
—
100 ms, 0.01 Ω
5b(3)
+65 V
+87 V
1 pulse
—
400 ms, 2 Ω
1. The above test levels must be considered referred to VCC = 13.5 V except for pulse 5b.
2. The device does not turn Off once the ISO pulse is applied.
3. Valid in case of external load dump clamp: 40 V maximum referred to ground.
Table 7.
Electrical transient requirements (part 2)
Test level results(1)
ISO 7637-2:
2004(E)
Test pulse
III
IV
1
C
C
2a
C
C
3a
C
C
3b
C
C
4
C
C
5b(2)
C
C
1. Transient pulses have been applied with the INPUT pin grounded with R1>5Ω.
2. Valid in case of external load dump clamp: 40V maximum referred to ground.
Table 8.
Electrical transient requirements (part 3)
Class
Contents
C
All functions of the device are performed as designed after exposure to disturbance.
E
One or more functions of the device are not performed as designed after exposure to
disturbance and cannot be returned to proper operation without replacing the device.
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Electrical specifications
Figure 4.
VN5R003H-E
Maximum pulsed drain current (VBATT = 13 V)
-AXIMUM0ULSED$RAIN#URRENT
)MAX!
#
#
0ULSESEC
Note:
PCB FR4 area = 58 mm x 58 mm, PCB thickness = 2 mm, Cu thickness = 35 mm,
Copper areas: minimum pad lay-out and 2 cm2
10/20
Doc ID 17602 Rev. 5
'!0'#&4
VN5R003H-E
3
Application information
Application information
Figure 5 shows the solution for systems supplied directly from the battery. If the system
goes into Stand-by mode, the transistor T1 is switched off by the microcontroller with zero
quiescent current. System is still supplied through the PowerMOS body diode.
Figure 5.
Battery supplied systems
,*1,7,216:,7&+
6
7RV\VWHPVXSSO\
'
92/7$*(
5(*8/$725
9EDW
&+$5*(3803
&+$5*(
3803
&
,1
5
7
("1($'5
Figure 6 refers to a solution for systems supplied after the ignition switch. Low quiescent
currents are not strictly required, so resistor R1 can be directly connected to ground.
Figure 6.
Switched systems
6
7RV\VWHPVXSSO\
'
92/7$*(
5(*8/$725
9EDW
&+$5*(3803
&+$5*(
3803
&
,1
5
("1($'5
Doc ID 17602 Rev. 5
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Package and PC board thermal data
VN5R003H-E
4
Package and PC board thermal data
4.1
HPAK thermal data
Figure 7.
PC board
Note:
Layout condition of Rth and Zth measurements (Board finish thickness 1.6 mm +/- 10%, board double layer, board
dimension 78 mm x 86 mm, board material FR4, Cu thickness = 70 µm (front and back side), thermal vias separation
1.2 mm, thermal via diameter 0.3 mm +/- 0.08 mm, Cu thickness on vias 25 µm, footprint dimension 6.4 mm x 7 mm).
Figure 8.
Rthj-amb vs PCB copper area in open box free air condition
24(J?AMB #7
24(JAMB
0#"#UHEATSINKAREACM>
("1($'5
12/20
Doc ID 17602 Rev. 5
VN5R003H-E
Package and PC board thermal data
Figure 9.
HPAK thermal impedance junction ambient single pulse
:4( #7
#UCM
#UCM
#UFOOTPRINT
4IMES
'!0'#&4
Figure 10. Thermal fitting model of a single-channel HSD in HPAK
GAPGCFT 00133
Note:
The fitting model is a simplified thermal tool and is valid for transient evolutions where the embedded protections
(power limitation or thermal cycling during thermal shutdown) are not triggered.
Doc ID 17602 Rev. 5
13/20
Package and PC board thermal data
VN5R003H-E
Equation 1: pulse calculation formula
ZTHδ = R TH ⋅ δ + ZTHtp ( 1 – δ )
where δ = tP/T
Table 9.
14/20
Thermal parameter
Area/island (cm2)
Footprint
R1 (°C/W)
0.01
R2 (°C/W)
0.15
R3 (°C/W)
1
R4 (°C/W)
8
R5 (°C/W)
4
8
28
21
12
R6 (°C/W)
31
24
16
C1 (W.s/°C)
0.005
C2 (W.s/°C)
0.05
C3 (W.s/°C)
0.08
C4 (W.s/°C)
0.4
C5 (W.s/°C)
0.8
1.4
3
C6 (W.s/°C)
3
6
9
Doc ID 17602 Rev. 5
VN5R003H-E
Package and packing information
5
Package and packing information
5.1
ECOPACK®
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK® is an ST trademark.
5.2
HPAK mechanical data
Figure 11.
HPAK package dimension
GAPGCFT00134
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Package and packing information
Table 10.
VN5R003H-E
HPAK mechanical data
Data book mm
Ref. dim
16/20
Typ
Min.
Max.
A
—
2.20
2.40
A1
—
0.90
1.10
A2
—
0.03
0.23
b
—
0.45
0.60
b4
—
5.20
5.40
c
—
0.45
0.60
c2
—
0.48
0.60
D
—
6.00
6.20
D1
5.10
—
—
E
—
6.40
6.60
E1
5.20
—
—
e
0.85
—
—
e1
—
1.60
1.80
e2
—
3.30
3.50
e3
—
5.00
5.20
H
—
9.35
10.10
L
—
1
—
(L1)
2.80
—
—
L2
0.80
—
—
L4
—
0.60
1.00
R
0.20
—
—
V2
—
0°
8°
Doc ID 17602 Rev. 5
VN5R003H-E
5.3
Package and packing information
HPAK suggested land pattern
Figure 12. HPAK suggested pad layout(a)
All dimensions are in mm.
5.4
Packing information
Figure 13. HPAK tube shipment (no suffix)
A
C
B
Base q.ty
Bulk q.ty
Tube length (± 0.5)
A
B
C (± 0.1)
75
3000
532
6
21.3
0.6
All dimensions are in mm.
a. The land pattern proposed is not intended to over-rule User's PCB design, manufacturing and soldering
process rules
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Package and packing information
VN5R003H-E
Figure 14. HPAK tape and reel (suffix “TR”)
REEL DIMENSIONS
All dimensions are in mm.
Base q.ty
Bulk q.ty
A (max)
B (min)
C (± 0.2)
F
G (+ 2 / -0)
N (min)
T (max)
2500
2500
330
1.5
13
20.2
16.4
60
22.4
TAPE DIMENSIONS
According to Electronic Industries Association
(EIA) Standard 481 rev. A, Feb 1986
Tape width
Tape hole spacing
Component spacing
Hole diameter
Hole diameter
Hole position
Compartment depth
Hole spacing
W
P0 (± 0.1)
P
D (± 0.1/-0)
D1 (min)
F (± 0.05)
K (max)
P1 (± 0.1)
16
4
8
1.5
1.5
7.5
2.75
2
All dimensions are in mm.
End
Start
Top
No components
Components
No components
cover
tape
500mm min
Empty components pockets
saled with cover tape.
User direction of feed
18/20
Doc ID 17602 Rev. 5
500mm min
VN5R003H-E
6
Revision history
Revision history
Table 11.
Document revision history
Date
Revision
Changes
23-Jun-2010
1
Initial release.
06-Jul-2010
2
Updated Table 4: Thermal data.
06-Oct-2010
3
Added Figure 4: Maximum pulsed drain current (VBATT = 13 V)
18-Nov-2010
4
Changed document status from target specification to datasheet.
Table 3: Absolute maximum ratings:
– Removed VD row
Table 5: Power section for reverse battery mode
– IIN: added maximum value
Table 6: Electrical transient requirements (part 1)
– Added Note 2
Updated Figure 5: Battery supplied systems and Figure 6: Switched
systems
17-Apr-2012
5
Updated Figure 4: Maximum pulsed drain current (VBATT = 13 V)
Doc ID 17602 Rev. 5
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VN5R003H-E
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