STMICROELECTRONICS VNL5160N3-E

VNL5160N3-E
VNL5160S5-E
OMNIFET III
fully protected low-side driver
Features
2
Type
Vclamp
RDS(on)
ID
VNL5160N3-E
41 V
160 mΩ
1
3.5 A
VNL5160S5-E
SOT-223
■
Drain current:3.5A
■
ESD protection
■
Overvoltage clamp
■
Thermal shutdown
■
Current and power limitation
■
Very low standby current
■
Very low electromagnetic susceptibility
■
In compliance with the 2002/95/EC European
directive
■
Open drain status output(a)
■
Specially intended for R10W or 2x R5W
automotive signal lamps
2
3
SO-8
Description
The VNL5160N3-E and VNL5160S5-E are
monolithic devices, made using
STMicroelectronics® VIPower® Technology,
intended for driving resistive or inductive loads
with one side connected to the battery. Built-in
thermal shutdown protects the chip from
overtemperature and short circuit. Output current
limitation protects the devices in an overload
condition. In the case of a long duration overload,
the device limits the dissipated power to a safe
level up to thermal shutdown intervention.
Thermal shutdown, with automatic restart, allows
the device to recover normal operation as soon as
a fault condition disappears. Fast
demagnetization of inductive loads is achieved at
turn-off.
a. Valid for VNL5160S5-E only.
Table 1.
Device summary
Order codes
Package
Tube
Tape and reel
SOT-223
VNL5160N3-E
VNL5160N3TR-E
SO-8
VNL5160S5-E
VNL5160S5TR-E
February 2012
Doc ID 16364 Rev 2
1/26
www.st.com
1
Contents
VNL5160N3-E, VNL5160S5-E
Contents
1
Block diagrams and pins configurations . . . . . . . . . . . . . . . . . . . . . . . . 5
2
Absolute maximum rating . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
2.1
Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
2.2
Thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
3
Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
4
Application information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
4.1
5
6
7
2/26
MCU I/O protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Package and PC board thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
5.1
SOT-223 thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
5.2
SO-8 thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Package and packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
6.1
ECOPACK® packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
6.2
SOT-223 mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
6.3
SO8 mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
6.4
SOT-223 packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
6.5
SO8 packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
Doc ID 16364 Rev 2
VNL5160N3-E, VNL5160S5-E
List of tables
List of tables
Table 1.
Table 2.
Table 3.
Table 4.
Table 5.
Table 6.
Table 7.
Table 8.
Table 9.
Table 10.
Table 11.
Table 12.
Table 13.
Table 14.
Table 15.
Table 16.
Table 17.
Table 18.
Device summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Pin function . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Suggested connections for unused and not connected pins . . . . . . . . . . . . . . . . . . . . . . . . 7
Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Thermal data. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
PowerMOS section . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Source drain diode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Input section . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Status pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Logic input . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Openload detection. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Supply section . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Switching characteristics (Vcc=13V). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Protection and diagnostics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Truth table . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
SOT-223 thermal parameter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
SO-8 thermal parameter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
Doc ID 16364 Rev 2
3/26
List of figures
VNL5160N3-E, VNL5160S5-E
List of figures
Figure 1.
Figure 2.
Figure 3.
Figure 4.
Figure 5.
Figure 6.
Figure 7.
Figure 8.
Figure 9.
Figure 10.
Figure 11.
Figure 12.
Figure 13.
Figure 14.
Figure 15.
Figure 16.
Figure 17.
Figure 18.
Figure 19.
Figure 20.
Figure 21.
Figure 22.
4/26
VNL5160N3-E block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
VNL5160S5-E block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
VNL5160N3-E current and voltage conventions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
VNL5160S5-E current and voltage conventions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Configuration diagrams (top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Switching characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
VNL5160N3-E application schematic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
VNL5160S5-E application schematic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Maximum demagnetization energy . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
SOT-223 PC board . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
SOT-223 Rthj-amb vs PCB copper area in open box free air condition . . . . . . . . . . . . . . . 16
SOT-223 thermal impedance junction ambient single pulse . . . . . . . . . . . . . . . . . . . . . . . 17
SOT-223 thermal fitting model(1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
SO-8 PC board . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
SO-8 Rthj-amb vs PCB copper area in open box free air condition . . . . . . . . . . . . . . . . . . 19
SO-8 thermal impedance junction ambient single pulse. . . . . . . . . . . . . . . . . . . . . . . . . . . 19
SO-8 thermal fitting mode(1)l. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
SOT-223 mechanical data & package outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
SO8 mechanical data & package outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
SOT-223 tape and reel shipment (suffix “TR”) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
SO-8 tube shipment (no suffix) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
SO-8 tape and reel shipment (suffix “TR”) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Doc ID 16364 Rev 2
VNL5160N3-E, VNL5160S5-E
1
Block diagrams and pins configurations
Block diagrams and pins configurations
Figure 1.
VNL5160N3-E block diagram
$2!).
,/')#
#ONTROL$IAGNOSTIC
#URRENT
,IMITATION
).054
0OWER
#LAMP
$2)6%2
/6%24%-0%2!452%
02/4%#4)/.
/6%2,/!$02/4%#4)/.
!#4)6%0/7%2,)-)4!4)/.
'.$
("1($'5
Figure 2.
VNL5160S5-E block diagram
$2!).
3500,9
6/,4!'%
3500,9
,/')#
#ONTROL$IAGNOSTIC
/&&3TATE
/PENLOAD
#URRENT
,IMITATION
).054
34!453
0OWER
#LAMP
$2)6%2
/6%24%-0%2!452%
02/4%#4)/.
/6%2,/!$02/4%#4)/.
!#4)6%0/7%2,)-)4!4)/.
'.$
("1($'5
Doc ID 16364 Rev 2
5/26
Block diagrams and pins configurations
Table 2.
VNL5160N3-E, VNL5160S5-E
Pin function
Name
Function
INPUT
Voltage controlled input pin with hysteresis, CMOS compatible. Controls output
switch state(1)
DRAIN
PowerMOS drain
SOURCE
PowerMOS source and ground reference for the control section
SUPPLY
VOLTAGE
Supply voltage connected to the signal part (5V)
Open drain digital diagnostic pin(2)
STATUS
1. Internally connected to Vsupply in the VNL5160N3-E.
2. Valid for VNL5160S5-E only.
Figure 3.
VNL5160N3-E current and voltage conventions
ID
VDS
DRAIN
IIN
INPUT
SOURCE
VIN
Figure 4.
VNL5160S5-E current and voltage conventions
ID
IIN
INPUT
ISTAT
DRAIN
STATUS
VDS
VIN
IS
VSTAT
SUPPLY
VOLTAGE
VSUPPLY
6/26
Doc ID 16364 Rev 2
SOURCE
VNL5160N3-E, VNL5160S5-E
Figure 5.
Block diagrams and pins configurations
Configuration diagrams (top view)
SOT-223
Table 3.
SO-8
Suggested connections for unused and not connected pins
Connection/pin
Status
N.C.
Input
Floating
X
X
X
To ground
Not allowed
X
Through 10kΩ resistor
Doc ID 16364 Rev 2
7/26
Absolute maximum rating
2
VNL5160N3-E, VNL5160S5-E
Absolute maximum rating
Stressing the device above the rating listed in Table 4 may cause permanent damage to the
device. These are stress ratings only and operation of the device at these or any other
conditions above those indicated in the Operating sections of this specification is not
implied. Exposure to absolute maximum rating conditions for extended periods may affect
device reliability. Refer also to the STMicroelectronics SURE Program and other relevant
quality document
2.1
Absolute maximum ratings
Table 4.
Absolute maximum ratings
Value
Symbol
SOT-223
VDS
ID
- ID
Drain-source voltage (VIN=0V)
V
Internally limited
A
-4
A
Reverse DC drain current
DC supply current
IIN
DC input current
ISTAT
DC status current
SO-8
Internally clamped
DC drain current
IS
-
-1 to 10
-1 to 10
-
VESD1
Electrostatic discharge (R=1.5kΩ; C=100pF)
– INPUT
– STATUS
– SUPPLY
– DRAIN
VESD2
Electrostatic discharge on output pin only
(R=330Ω, C=150pF)
mA
-1 to 10
4000
4000
4000
5000
mA
mA
V
2000
V
Junction operating temperature
-40 to 150
°C
Tstg
Storage temperature
-55 to 150
°C
Eas
Single pulse avalanche energy
L = 8.5 mH, Tj = 150 °C, RL = 0 Ω,
Vbatt = 13.5 V, Iout = IlimL
37
mJ
Tj
8/26
Unit
Parameter
Doc ID 16364 Rev 2
VNL5160N3-E, VNL5160S5-E
2.2
Absolute maximum rating
Thermal data
Table 5.
Thermal data
Maximum value
Symbol
Rthj-amb
Parameter
Thermal resistance junction-ambient
Unit
SOT-223
SO-8
146.8(1)
103.1
°C/W
1. When mounted on a standard single-sided FR4 board with 0.5cm2 of Cu (at least 35 µm thick) connected
to all DRAIN pins
Doc ID 16364 Rev 2
9/26
Electrical characteristics
3
VNL5160N3-E, VNL5160S5-E
Electrical characteristics
Values specified in this section are for VIN = Vsupply = 4.5 V to 5.5 V, -40 °C < Tj < 150 °C,
unless otherwise stated.
Table 6.
Symbol
Vsupply
PowerMOS section
Parameter
Test conditions
Operating supply
voltage
Typ.
Max.
Unit
3.5
5
5.5
V
160
170
320
mΩ
mΩ
46
52
V
RON
On-state resistance
VIN = Vsupply = 5V
ID = 1 A; Tj = 25 °C
ID = 1 A; Tj = 150 °C
VCLAMP
Drain-source clamp
voltage
VIN = 0 V; ID = 1 A
41
VCLTH
Drain-source clamp
threshold voltage
VIN = 0 V; ID = 2 mA
36
Off-state output current
VIN = 0 V; VDS = 13 V; Tj = 25 °C
VIN = 0 V; VDS = 13 V; Tj = 125 °C
0
0
IDSS
Table 7.
Symbol
VSD
Table 8.
Symbol
V
3
5
µA
Max.
Unit
Source drain diode
Parameter
Forward on voltage
Test conditions
Min.
ID = 1 A; VIN = 0 V
Typ.
0.8
V
Input section(1)
Parameter
Test conditions
IISS
Supply current from
input pin
On-state VIN = Vsupply = 5 V;
VDS = 0 V
VICL
Input clamp voltage
IS = 1 mA
IS = -1 mA
Input threshold
voltage
VDS = VIN; ID = 1 mA
VINTH
1. Valid for VNL5160N3-E option (input & supply pins connected together).
10/26
Min.
Doc ID 16364 Rev 2
Min.
Typ.
Max.
Unit
30
110
µA
7
V
V
3.5
V
5.5
-0.7
1
VNL5160N3-E, VNL5160S5-E
Electrical characteristics
Status pin(1)
Table 9.
Symbol
Parameter
Test conditions
Min.
Typ.
Max.
Unit
VSTAT
Status low output
voltage
ISTAT = 1 mA
0.5
V
ILSTAT
Status leakage current
Normal operation,
VSTAT = 5 V
10
µA
CSTAT
Status pin input
capacitance
Normal operation,
VSTAT = 5 V
100
pF
VSTCL
Status clamp voltage
ISTAT = 1 mA
ISTAT = -1 mA
7
V
V
5.5
-0.7
1. Valid for VNL5160S5-E option.
Table 10.
Symbol
Logic input(1)
Parameter
Test conditions
VIL
Input low level voltage
IIL
Low level input current
VIH
Input high level voltage
IIH
High level input current
VI(hyst)
Input hysteresis voltage
VICL
Min.
VIN = 0.9 V
Max.
Unit
0.9
V
1
µA
2.1
V
VIN = 2.1 V
10
0.13
IIN = 1 mA
IIN = -1 mA
Input clamp voltage
Typ.
µA
V
5.5
7
V
V
-0.7
1. Valid for VNL5160S5-E option.
Table 11.
Openload detection(1)
Symbol
Parameter
VOl
td(oloff)
Test conditions
Min.
Typ.
Max.
Unit
Open-load off-state voltage
detection threshold
VIN = 0 V
0.6
1.2
1.7
V
Delay between INPUT falling
edge and STATUS falling
edge in openload condition
IOUT = 0 A
45
425
1100
µs
1. Valid for VNL5160S5-E option.
Table 12.
Symbol
IS
VSCL
Supply section(1)
Parameter
Supply current
Test conditions
Min. Typ. Max. Unit
Off-state Tj = 25 °C; VIN = VDRAIN = 0 V;
On-state Tj = 25 °C; VIN = 5 V; VDS = 0 V
I
= 1mA
Supply clamp voltage SCL
ISCL = -1mA
10
25
5.5
-0.7
25
110
µA
µA
7
V
V
1. Valid for VNL5160S5-E option.
Doc ID 16364 Rev 2
11/26
Electrical characteristics
Table 13.
VNL5160N3-E, VNL5160S5-E
Switching characteristics (Vcc=13V(1))
SOT-223(2)
Symbol
Parameter
SO-8
Test conditions
Unit
Min.
Typ.
Max
Min.
Typ.
Max.
td(ON)
Turn-on delay time
RL = 13Ω, VCC = 13V(3)
8.9
8.9
µs
td(OFF)
Turn-off delay time
RL = 13Ω, VCC = 13V
13.2
13.2
µs
tr
Rise time
RL = 13Ω, VCC = 13V
14.1
14.1
µs
tf
Fall time
RL = 13Ω, VCC = 13V
11.5
11.5
µs
WON
Switching energy
losses at turn-on
RL = 13Ω, VCC = 13V
34.3
34.3
µJ
WOFF
Switching energy
losses at turn-off
RL = 13Ω, VCC = 13V
34.3
34.3
µJ
1. See Figure 7: VNL5160N3-E application schematic and Figure 8: VNL5160S5-E application schematic.
2. 3.5 V < Vsupply = Vin < 5.5 V.
3. See Figure 6: Switching characteristics.
Table 14.
Protection and diagnostics
Test conditions(1)
Symbol
Parameter
IlimH
DC short circuit current
VDS = 13V; VIN = Vsupply = 5V
IlimL
Short circuit current
during thermal cycling
VDS = 13V; TR < Tj < TTSD;
VIN = Vsupply = 5V
2.5
Α
tdlim
Step response current
limit
VDS = 13V; Vinput = 5V
20
µs
TTSD
Shutdown temperature
TR
Reset temperature
TRS(2)
Thermal reset of
STATUS
THYST
Thermal hysteresis
(TTSD - TR)
Typ.
Max.
Unit
3.5
5
7.5
A
150
175
TRS+1 TRS+5
135
2. Valid for VNL5160S5-E option.
Doc ID 16364 Rev 2
200
°C
°C
°C
7
1. Vsupply=Vinput in VNL5160N3-E version.
12/26
Min.
°C
VNL5160N3-E, VNL5160S5-E
Table 15.
Electrical characteristics
Truth table (1)
Conditions
INPUT
DRAIN
STATUS
Normal operation
L
H
H
L
H
H
Current limitation
L
H
H
X
H
H
Overtemperature
L
H
H
H
H
L
Undervoltage
L
H
H
H
X
X
Output voltage < VOL
L
H
L
L
L
H
1. Valid for VNL5160S5-E option
Figure 6.
Switching characteristics
ID
90%
tr
tf
10%
t
Vgen
td(on)
td(off)
t
Doc ID 16364 Rev 2
13/26
Application information
4
VNL5160N3-E, VNL5160S5-E
Application information
Figure 7.
VNL5160N3-E application schematic
Vcc
+5V
RL
INPUT
µC
DRAIN
Rprot
SOURCE
Figure 8.
14/26
VNL5160S5-E application schematic
Doc ID 16364 Rev 2
VNL5160N3-E, VNL5160S5-E
MCU I/O protection
ST suggests to insert a resistor (Rprot) in line to prevent the µC I/O pins from latching up(b).
The value of these resistors is a compromise between the leakage current of µC and the
current required by the LSD I/Os (Input levels compatibility) with the latch-up limit of µC I/Os:
0.7/Ilatchup ≤ Rprot ≤ (VOHµC-VIH) / IIHmax
Calculation example:
For the following conditions:
Ilatchup ≥ 20mA
VOHµC ≥ 4.5V
35Ω ≤ Rprot ≤100kΩ.
Recommended value is Rprot =10kΩ
Figure 9.
Maximum demagnetization energy
10
1
VNL5160x - Single Pulse
Repetitive pulse Tjstart=100°C
I (A)
4.1
Application information
Repetitive pulse Tjstart=125°C
0.1
1
10
100
L (mH)
b. In case of negative transient on the drain pin.
Doc ID 16364 Rev 2
15/26
Package and PC board thermal data
VNL5160N3-E, VNL5160S5-E
5
Package and PC board thermal data
5.1
SOT-223 thermal data
Figure 10. SOT-223 PC board
GAPGCFT00530
Note:
Layout condition of Rth and Zth measurements (PCB FR4 area = 30 mm x 30 mm,PCB
thickness = 2 mm, Cu thickness=35 µm, Copper areas: from minimum pad layout to
0.8 cm2).
Figure 11.
SOT-223 Rthj-amb vs PCB copper area in open box free air condition
RTHjamb
160
footprint
150 RTHj_amb(°C/W)
140
130
120
110
100
90
80
70
60
0
0.5
1
1.5
2
PCB Cu heatsink area (cm^2) - (refer to PCB layout)
16/26
Doc ID 16364 Rev 2
2.5
VNL5160N3-E, VNL5160S5-E
Package and PC board thermal data
Figure 12. SOT-223 thermal impedance junction ambient single pulse
ZTH (°C/W)
1000
Footprint
2 cm2
100
10
1
0.1
0.0001
0.001
0.01
0.1
1
Time (s)
10
100
1000
Equation 1: pulse calculation formula
Z
THδ
= R
TH
⋅δ+Z
THtp
(1 – δ)
where δ = tP/T
Figure 13. SOT-223 thermal fitting model(1)
1. The fitting model is a simplified thermal tool and is valid for transient evolutions where the embedded
protections (power limitation or thermal cycling during thermal shutdown) are not triggered.
Table 16.
SOT-223 thermal parameter
Area/island (cm2)
FP
R1 (°C/W)
1.4
R2 (°C/W)
1.8
R3 (°C/W)
4.5
R4 (°C/W)
24
Doc ID 16364 Rev 2
2
17/26
Package and PC board thermal data
Table 16.
5.2
VNL5160N3-E, VNL5160S5-E
SOT-223 thermal parameter (continued)
Area/island (cm2)
FP
R5 (°C/W)
0.1
R6 (°C/W)
115
C1 (W·s/°C)
0.0003
C2 (W·s/°C)
0.002
C3 (W·s/°C)
0.03
C4 (W·s/°C)
0.16
C5 (W·s/°C)
1000
C6 (W·s/°C)
0.4
2
45
2
SO-8 thermal data
Figure 14. SO-8 PC board
GAPGCFT00534
Note:
18/26
Layout condition of Rth and Zth measurements (PCB FR4 area = 58 mm x 58 mm,PCB
thickness = 2 mm, Cu thickness=35 µm, Copper areas: from minimum pad layout to 2 cm2).
Doc ID 16364 Rev 2
VNL5160N3-E, VNL5160S5-E
Package and PC board thermal data
Figure 15. SO-8 Rthj-amb vs PCB copper area in open box free air condition
RTHjamb
115
RTHj_amb(°C/W)
105
footprint
95
85
75
65
0
0.5
1
1.5
2
2.5
PCB Cu heatsink area (cm^2) - (refer to PCB layout)
Figure 16. SO-8 thermal impedance junction ambient single pulse
ZTH (°C/W)
1000
Footprint
100
2 cm2
10
1
0.1
0.0001
0.001
0.01
0.1
1
Time (s)
10
100
1000
Equation 2: pulse calculation formula
Z
THδ
= R
TH
⋅δ+Z
THtp
(1 – δ)
where δ = tP/T
Doc ID 16364 Rev 2
19/26
Package and PC board thermal data
VNL5160N3-E, VNL5160S5-E
Figure 17. SO-8 thermal fitting mode(1)l
1. The fitting model is a simplified thermal tool and is valid for transient evolutions where the embedded
protections (power limitation or thermal cycling during thermal shutdown) are not triggered.
Table 17.
20/26
SO-8 thermal parameter
Area/island (cm2)
0.07
R1 (°C/W)
1.4
R2 (°C/W)
3.2
R3 (°C/W)
3.5
R4 (°C/W)
21
R5 (°C/W)
16
R6 (°C/W)
58
C1 (W·s/°C)
0.0008
C2 (W·s/°C)
0.0032
C3 (W·s/°C)
0.0075
C4 (W·s/°C)
0.045
C5 (W·s/°C)
0.35
C6 (W·s/°C)
1.05
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2
28
2
VNL5160N3-E, VNL5160S5-E
Package and packing information
6
Package and packing information
6.1
ECOPACK® packages
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK® is an ST trademark.
6.2
SOT-223 mechanical data
Figure 18. SOT-223 mechanical data & package outline
0046067
Doc ID 16364 Rev 2
21/26
Package and packing information
6.3
VNL5160N3-E, VNL5160S5-E
SO8 mechanical data
Figure 19. SO8 mechanical data & package outline
mm
inch
DIM.
MIN.
TYP.
A
MAX.
MIN.
TYP.
MAX.
1.750
0.0689
A1
0.100
0.250 0.0039
0.0098
A2
1.250
0.0492
b
0.280
0.480 0.0110
0.0189
c
0.170
0.230 0.0067
0.0091
D (1)
4.800
4.900
5.000 0.1890 0.1929 0.1969
E
5.800
6.000
6.200 0.2283 0.2362 0.2441
E1(2)
3.800
3.900
4.000 0.1496 0.1535 0.1575
e
1.270
0.0500
h
0.250
0.500 0.0098
L
0.400
1.270 0.0157
L1
k
ccc
1.040
0˚
OUTLINE AND
MECHANICAL DATA
0.0197
0.0500
0.0409
8˚
0.100
0˚
8˚
0.0039
Notes: 1. Dimensions D does not include mold flash,
protrusions or gate burrs.
Mold flash, potrusions or gate burrs shall not
exceed 0.15mm in total (both side).
2. Dimension “E1” does not include interlead flash
or protrusions. Interlead flash or protrusions shall
not exceed 0.25mm per side.
SO-8
0016023 D
22/26
Doc ID 16364 Rev 2
VNL5160N3-E, VNL5160S5-E
6.4
Package and packing information
SOT-223 packing information
The devices can be packed in tube or tape and reel shipments (see the Table 1: Device
summary).
Figure 20. SOT-223 tape and reel shipment (suffix “TR”)
Reel dimensions
Base Q.ty
Bulk Q.ty
A (max)
B (min)
C (± 0.2)
F
G (+ 2 / -0)
N (min)
T (max)
1000
1000
330
1.5
13
20.2
12.4
60
18.4
Tape dimensions
According to Electronic Industries Association
(EIA) Standard 481 rev. A, Feb. 1986
Tape width
Tape Hole Spacing
Component Spacing
Hole Diameter
Hole Diameter
Hole Position
Compartment Depth
Hole Spacing
W
P0 (± 0.1)
P
D (+ 0.1/-0)
D1 (min)
F (± 0.05)
K (max)
P1 (± 0.1)
12
4
8
1.5
1.5
5.5
4.5
2
All dimensions are in mm.
End
Start
Top
cover
tape
No components
Components
No components
500mm min
Empty components pockets
saled with cover tape.
500mm min
User direction of feed
Doc ID 16364 Rev 2
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Package and packing information
6.5
VNL5160N3-E, VNL5160S5-E
SO8 packing information
Figure 21. SO-8 tube shipment (no suffix)
B
Base Q.ty
Bulk Q.ty
Tube length (± 0.5)
A
B
C (± 0.1)
C
A
100
2000
532
3.2
6
0.6
All dimensions are in mm.
Figure 22. SO-8 tape and reel shipment (suffix “TR”)
REEL DIMENSIONS
Base Q.ty
Bulk Q.ty
A (max)
B (min)
C (± 0.2)
F
G (+ 2 / -0)
N (min)
T (max)
2500
2500
330
1.5
13
20.2
12.4
60
18.4
All dimensions are in mm.
TAPE DIMENSIONS
According to Electronic Industries Association
(EIA) Standard 481 rev. A, Feb. 1986
Tape width
Tape Hole Spacing
Component Spacing
Hole Diameter
Hole Diameter
Hole Position
Compartment Depth
Hole Spacing
W
P0 (± 0.1)
P
D (+ 0.1/-0)
D1 (min)
F (± 0.05)
K (max)
P1 (± 0.1)
12
4
8
1.5
1.5
5.5
4.5
2
All dimensions are in mm.
End
Start
Top
cover
tape
No components
Components
500mm min
Empty components pockets
saled with cover tape.
User direction of feed
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Doc ID 16364 Rev 2
No components
500mm min
VNL5160N3-E, VNL5160S5-E
7
Revision history
Revision history
Table 18.
Document revision history
Date
Revision
Changes
17-Nov-2009
1
Initial release.
20-Feb-2012
2
Update the entire document in ST template.
Update Section : Features in cover page.
Doc ID 16364 Rev 2
25/26
VNL5160N3-E, VNL5160S5-E
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