TSC TSM8N50

TSM8N50
500V N-Channel MOSFET
TO-251
(IPAK)
TO-252
(DPAK)
PRODUCT SUMMARY
Pin Definition:
1. Gate
2. Drain
3. Source
VDS (V)
RDS(on)(Ω)
ID (A)
500
0.85 @ VGS =10V
7.2
Features
Block Diagram
●
Low On-Resistance.
●
High power and current handing capability.
Ordering Information
Part No.
Package
Packing
TO-251
75pcs / Tube
TSM8N50CH C5G
TSM8N50CP ROG
TO-252
Note: “G” denotes for Halogen Free
2.5Kpcs / 13” Reel
N-Channel MOSFET
Absolute Maximum Rating (Tc = 25oC unless otherwise noted)
Parameter
Symbol
Limit
Unit
Drain-Source Voltage
VDS
500
V
Gate-Source Voltage
VGS
±30
V
7.2
A
4.3
A
IDM
28.8
A
EAS
181
mJ
PTOT
89
W
TJ
150
Tc = 25ºC
Continuous Drain Current
Pulsed Drain Current
Tc = 100ºC
(Note 1)
Single Pulse Avalanche Energy
(Note 2)
o
Total Power Dissipation @ TC = 25 C
Operating Junction Temperature
ID
Storage Temperature Range
TSTG
Note1: Repetitive Rating : Pulse width limited by maximum junction temperature.
Note2: L=7mH, IAS =8A, VDD = 50V, VDS = 200V, Starting TJ = 25℃
ºC
o
-55 to +150
C
Thermal Performance
Parameter
Symbol
Limit
Thermal Resistance - Junction to Case
RӨJC
1.4
Thermal Resistance - Junction to Ambient
RӨJA
50
1/7
Unit
o
C/W
Version: A12
TSM8N50
500V N-Channel MOSFET
Electrical Specifications (Tc = 25oC unless otherwise noted)
Parameter
Conditions
Symbol
Min
Typ
Max
Unit
Static
Drain-Source Breakdown Voltage
VGS = 0V, ID = 250uA
BVDSS
500
--
--
V
Drain-Source On-State Resistance
VGS = 10V, ID = 3.6A
RDS(ON)
--
0.7
0.85
Ω
Gate Threshold Voltage
VDS = VGS, ID = 250uA
VGS(TH)
2.0
3.0
4.0
V
Zero Gate Voltage Drain Current
VDS = 500V, VGS = 0V
IDSS
--
--
1
uA
Gate Body Leakage
VGS = ±30V, VDS = 0V
IGSS
--
--
±100
nA
Qg
--
26.6
--
Qgs
--
5.4
--
Qgd
--
6.82
--
Ciss
--
1595
--
Coss
--
127.4
--
Crss
--
14.5
--
td(on)
--
22
--
tr
--
6.8
--
td(off)
--
42
--
tf
--
4.8
--
IS
--
--
7
A
VSD
--
--
1.5
V
Dynamic
(Note a)
Total Gate Charge
Gate-Source Charge
Gate-Drain Charge
VDD = 400V, ID = 7A,
VGS = 10V
Input Capacitance
Output Capacitance
VDS = 25V, VGS = 0V,
f = 1.0MHz
Reverse Transfer Capacitance
Switching
nC
pF
(Note a)
Turn-On Delay Time
Turn-On Rise Time
VGS = 10V, ID = 7A,
Turn-Off Delay Time
VDD = 250V, RGEN = 9.1Ω
Turn-Off Fall Time
nS
Source-Drain Diode Ratings and Characteristic
Source Current
Diode Forward Voltage
IS =7A, VGS = 0V
Note a: Pulse Test : Pulse Width < 300µs, Duty Cycle < 2%.
2/7
Version: A12
TSM8N50
500V N-Channel MOSFET
Gate Charge Test Circuit & Waveform
Resistive Switching Test Circuit & Waveform
EAS Test Circuit & Waveform
3/7
Version: A12
TSM8N50
500V N-Channel MOSFET
Diode Reverse Recovery Time Test Circuit & Waveform
4/7
Version: A12
TSM8N50
500V N-Channel MOSFET
TO-251 Mechanical Drawing
Unit: Millimeters
5/7
Version: A12
TSM8N50
500V N-Channel MOSFET
TO-252 Mechanical Drawing
Unit: Millimeters
6/7
Version: A12
TSM8N50
500V N-Channel MOSFET
Notice
Specifications of the products displayed herein are subject to change without notice. TSC or anyone on its behalf,
assumes no responsibility or liability for any errors or inaccuracies.
Information contained herein is intended to provide a product description only. No license, express or implied, to
any intellectual property rights is granted by this document. Except as provided in TSC’s terms and conditions of
sale for such products, TSC assumes no liability whatsoever, and disclaims any express or implied warranty,
relating to sale and/or use of TSC products including liability or warranties relating to fitness for a particular purpose,
merchantability, or infringement of any patent, copyright, or other intellectual property right.
The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications.
Customers using or selling these products for use in such applications do so at their own risk and agree to fully
indemnify TSC for any damages resulting from such improper use or sale.
7/7
Version: A12