EMIF02-SPK01F2 2-line IPAD™, EMI filter and ESD protection Features ■ EMI symmetrical (I/O) low-pass filter ■ High efficiency in EMI filtering ■ Very low PCB space consuming: 1.07 mm x 1.47 mm ■ Very thin package: 0.65 mm ■ High efficiency in ESD suppression ■ High reliability offered by monolithic integration ■ High reducing of parasitic elements through integration and wafer level packaging Flip-Chip package (5 bumps) Figure 1. 3 2 1 Complies with the following standards: ■ Pin configuration (bump side) IEC 61000-4-2 level 4, on output pins: – 15 kV (air discharge) – 8 kV (contact discharge) I2 ■ IEC 61000-4-2 Level 1, on input pins: – 2 kV (air discharge) – 2 kV (contact discharge) O2 ■ MIL STD 883E - Method 3015-6 Class 3 I1 B GND Figure 2. A O1 C Basic cell configuration Low-pass Filter Applications Input Output Where EMI filtering in ESD sensitive equipment is required: ■ Mobile phones and communication systems ■ Computers, printers and MCU Boards Ri/o = 10 Ω Cline = 200 pF GND GND GND Description The EMIF02-SPK01 is a highly integrated device designed to suppress EMI/RFI noise in all systems subjected to electromagnetic interferences. The EMIF02 Flip-Chip packaging means the package size is equal to the die size. This filter includes an ESD protection circuitry which prevents damage to the application when subjected to ESD surges up 15 kV. TM: IPAD is a trademark of STMicroelectronics. September 2011 Doc ID 11740 Rev 2 1/7 www.st.com 7 Electrical characteristics 1 EMIF02-SPK01F2 Electrical characteristics Table 1. Absolute maximum ratings (Tamb = 25 °C) Symbol Tj Parameter Maximum junction temperature Value Unit 125 °C Top Operating temperature range -40 to +85 °C Tstg Storage temperature range -55 to +150 °C Figure 3. Electrical characteristics (definitions) I Symbol VBR IRM VRM VCL RD IPP IR VF Cline = = = = = = = = = Parameter Breakdown voltage Leakage current @ VRM Stand-off voltage Clamping voltage Dynamic impedance Peak pulse current Breakdown current Forward voltage drop Line capacitance IPP VCL VBR IR IRM VRM IRM V VRM VBR VCL IR IPP Table 2. Electrical characteristics (Tamb = 25 °C) Symbol 2/7 Test condition Min. Typ. 6 8 Max. Unit VBR IR = 1 mA IRM VRM = 3 V per line RI/O Tolerance ± 20% 10 Ω Cline VR = 0 V 200 pF V 500 Doc ID 11740 Rev 2 nA EMIF02-SPK01F2 Figure 4. Electrical characteristics S21 (dB) attenuation measurements Figure 5. and Aplac simulation 0.00 Analog crosstalk measurements 0.00 dB dB --5.00 --10.00 --10.00 --20.00 --15.00 --20.00 --30.00 --25.00 --40.00 --30.00 --50.00 -35.00 -40.00 100.0k 1.0M 10.0M f/Hz 100.0M --60.00 100.0k 1.0G Figure 6. ESD response to IEC 61000-4-2 (+15kV air discharge) on one input V(in) and one output V(out) Figure 7. Figure 8. Line capacitance versus applied voltage 1.0M 10.0M f/Hz 100.0M 1.0G ESD response to IEC 61000-4-2 (–15kV air discharge) on one input V(in) and one output V(out) C(pF) 250 F=1MHz Vosc=30mVRMS Tj=25°C 200 150 100 50 VR(V) 0 0 1 2 3 Doc ID 11740 Rev 2 4 5 3/7 Electrical characteristics Figure 9. IN1 EMIF02-SPK01F2 Aplac mode Rbump Lbump Rspk Lspk Lbump Rbump GND OUT1 Lsub model = D1 model = D2 Rsub Rbump GND model = D3 Lbump model = D1 model = D2 Lgnd Cgnd IN2 Rgnd OUT2 Rbump Lbump Rspk Lspk Lbump Rbump Ground return EMIF02-SPK01F1 model Figure 10. Aplac parameters Model D1 Model D3 Model D2 aplacvar Ls 1nH CJO=Cdiode1 CJO=Cdiode3 CJO=Cdiode2 aplacvar Rs 150m BV=7 BV=7 BV=7 aplacvar Rspk 10 IBV=1u IBV=1u IBV=1u aplacvar Lspk 10p IKF=1000 IKF=1000 IKF=1000 aplacvar Cdiode1 234pF IS=10f IS=10f IS=10f aplacvar Cdiode2 3.5ppF ISR=100p ISR=100p ISR=100p aplacvar Cdiode3 1nF N=1 N=1 N=1 aplacvar Lbump 50pH M=0.3333 M=0.3333 M=0.3333 aplacvar Rbump 10m RS=0.7 RS=0.12 RS=0.3 aplacvar Rsub 0.5m VJ=0.6 VJ=0.6 VJ=0.6 aplacvar Lsub 10pH TT=50n TT=50n TT=50n aplacvar Rgnd 1m aplacvar Lgnd 50pH aplacvar Cgnd 0.15pF 4/7 Doc ID 11740 Rev 2 EMIF02-SPK01F2 2 Ordering information Ordering information Figure 11. Ordering information scheme EMIF yy - xxx zz Fx EMI Filter Number of lines Information x = resistance value (Ohms) z = capacitance value / 10(pF) or 3 letters = application 2 digits = version Package F = Flip-Chip x = 1: 500µm, Bump = 315µm = 2: Leadfree Pitch = 500µm, Bump = 315µm Packaging information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. Figure 12. Flip-Chip dimensions 500 µm ± 10 315 µm ± 50 650 µm ± 50 1.47 mm ± 50µm 0 µm ± 15 435 µm 250 µm ± 10 50 3 1.07 mm ± 50µm Figure 13. Footprint Figure 14. Marking Dot, ST logo xx = marking z = manufacturing location yww = datecode (y = year ww = week) Copper pad Diameter : 250 µm recommended, 300 µm max Solder stencil opening: 330µm E x x z y ww Solder mask opening recommendation: 340 µm min for 315 µm copper pad diameter Doc ID 11740 Rev 2 5/7 Ordering information EMIF02-SPK01F2 Figure 15. Packing Dot identifying Pin A1 location Ø 1.5 ± 0.1 ST E ST E xxz yww xxz yww xxz yww 0.73 ± 0.05 4 ± 0.1 User direction of unreeling All dimensions in mm 4 1.75 ± 0.1 ST E 3.5 ± 0.1 8 ± 0.3 4 ± 0.1 Ordering information Table 3. Ordering information Order code EMIF02-SPK01F2 Marking Package Weight Base qty Delivery mode FX Flip Chip 2.1 mg 5000 Tape and reel (7”) Note: More packing information is available in the applications note: AN1235: “Flip-Chip: package description and recommendations for use” AN 1751: “EMI filters: Recomendations and measurements” 5 Revision history Table 4. 6/7 Document revision history Date Revision Changes 14-Oct-2006 1 Initial release. 08-Sep-2011 2 Updated Figure 12 and Figure 13. Doc ID 11740 Rev 2 EMIF02-SPK01F2 Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein. UNLESS OTHERWISE SET FORTH IN ST’S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS EXPRESSLY APPROVED IN WRITING BY TWO AUTHORIZED ST REPRESENTATIVES, ST PRODUCTS ARE NOT RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY, DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER’S OWN RISK. Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any liability of ST. ST and the ST logo are trademarks or registered trademarks of ST in various countries. Information in this document supersedes and replaces all information previously supplied. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners. © 2011 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Philippines - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com Doc ID 11740 Rev 2 7/7