AGILENT AMMP-5618-TR1

Agilent AMMP-5618
6–20 GHz General Purpose Amplifier
Data Sheet
Features
• 5 x 5 mm surface mount package
• Broad band performance 6–20 GHz
• High +19 dBm output power
• Medium 13 dB typical gain
• 50Ω input and output match
Description
Agilent’s AMMP-5618 is a high
power, medium gain amplifier
that operates from 6 GHz to
20 GHz. The amplifier is designed
to be an easy-to-use component
for any surface mount PCB
application. In communication
systems, it can be used as a LO
buffer, or as a transmit driver
amplifier. During typical operation with a single 5V supply, each
gain stage is biased for Class-A
operation for optimal power
output with minimal distortion.
The amplifier has integrated 50Ω
I/O match, DC blocking, self-bias
and choke to eliminate complex
tuning and assembly processes
typically required by hybrid
(discrete-FET) amplifiers. The
package is fully SMT compatible
with backside grounding and I/O
to simplify assembly.
Note: These devices are ESD
sensitive. The following precautions are strongly recommended.
Ensure that an ESD approved
carrier is used when dice are
transported from one destination
to another. Personal grounding is
to be worn at all times when
handling these devices.
• Single 5V (107 mA) supply bias
Vd
1
2
3
RFin 8
4 RFout
Applications
• Microwave radio systems
• Satellite VSAT, DBS up/down link
7
6
5
Attention:
Observe precautions for
handling electrostatic
sensitive devices.
• LMDS & Pt-Pt mmW long haul
• Broadband wireless access
(including 802.16 and 802.20
WiMax)
• WLL and MMDS loops
• Commercial grade military
ESD Machine Model (Class A)
ESD Human Body Model (Class 0)
Refer to Agilent Application Note A004R:
Electrostatic Discharge Damage and Control.
Absolute Maximum Ratings [1]
Symbol
Parameters/Conditions
Units
Min.
Vd
Positive Drain Voltage
V
7
Id
Drain Current
mA
150
Pin
CW Input Power
dBm
20
Tch
Operating Channel Temperature
°C
+150
Tstg
Storage Case Temperature
°C
Tmax
Max. Assembly Temp (60 sec max)
°C
-65
Max.
+150
+300
Note:
1. Operation in excess of any one of these conditions may result in permanent damage to this device.
AMMP-5618 DC Specifications/Physical Properties[1]
Symbol
Parameters and Test Conditions
Units
Id
Drain Supply Current (under any RF power drive and temperature) (Vd=5.0V)
θch-b
Thermal Resistance[2] (Backside temperature, T
b = 25°C)
Min.
Typ.
Max.
mA
107
140
°C/W
34
Notes:
1. Ambient operational temperature TA = 25°C unless otherwise noted.
2. Channel-to-backside Thermal Resistance (Tchannel (Tc) = 34°C) as measured using infrared microscopy. Thermal Resistance at backside temperature (Tb)
= 25°C calculated from measured data.
RF Specifications[3,4,6] (TA = 25°C, Vd = 5.0V, Id(Q)= 107 mA, Zo =50 Ω)
Symbol
Parameters and Test Conditions
Units
Typ.
Sigma
Gain
Small-signal Gain [5]
dB
13
0.4
NF
Noise Figure into 50Ω [5]
dB
4.4
0.2
P-1dB
Output Power at 1 dB Gain Compression
dBm
+19
0.9
OIP3
Third Order Intercept Point;
∆f = 100 MHz; Pin = -20 dBm
dBm
+30
1.2
RLin
Input Return Loss
dB
-12
0.7
RLout
Output Return Loss
dB
-12
0.6
Isol
Reverse Isolation
dB
-40
1.2
Notes:
3. Small/Large -signal data measured in a fully de-embedded test fixture form TA = 25°C.
4. Pre-assembly into package performance verified 100% on-wafer per AMMC-5618 published specifications
5. This final package part performance is verified by a functional test correlated to actual performance at one or more frequencies
6. Specifications are derived from measurements in a 50Ω test environment. Aspects of the amplifier performance may be improved over a more narrow
bandwidth by application of additional conjugate, linearity, or low noise (Γopt) matching.
2
AMMP-5618 Typical Performance (TA = 25°C, Vd = 5V, Id = 107 mA, Z in = Z out = 50Ω unless otherwise stated)
Note: These measurements are in 50Ω test environment. Aspects of the amplifier performance may be improved over a narrower
bandwidth by application of additional conjugate, linearity or low noise (Γopt) matching.
15
0
12
-10
9
-20
0
-5
6
S11 (dB)
S12 (dB)
S21 (dB)
-10
-30
-15
-20
-40
3
-25
-30
-50
0
4
6
8
10
12
14
16
18
20
4
22
6
8
10
12
14
16
18
20
22
6
8
12
14
16
18
20
22
Figure 3. Input Return Loss.
35
8
0
10
FREQUENCY (GHz)
Figure 2. Isolation.
Figure 1. Gain.
30
-5
7
25
-15
OP-1dB (dBm)
NF (dB)
-10
S22 (dB)
4
FREQUENCY (GHz)
FREQUENCY (GHz)
6
5
-20
20
15
10
5
-30
3
4
6
8
10
12
14
16
18
20
0
6
22
8
10
12
14
16
20
20
25°C
-40°C
+85°C
S12 (dB)
5
-30
14
16
18
FREQUENCY (GHz)
Figure 7. Gain Over Temperature.
18
20
25°C
-40°C
+85°C
-10
-15
-60
12
16
-50
-5
10
14
-40
25°C
-40°C
+85°C
8
12
-5
S11 (dB)
-20
10
6
10
0
-10
15
4
8
Figure 6. Typical Power, OP-1dB and OIP3.
0
0
6
FREQUENCY (GHz)
Figure 5. Noise Figure.
Figure 4. Output Return Loss.
S21 (dB)
18
FREQUENCY (GHz)
FREQUENCY (GHz)
3
OP1dB
OIP3
4
-25
20
22
-20
4
6
8
10
12
14
16
18
20
FREQUENCY (GHz)
Figure 8. Isolation Over Temperature.
22
4
6
8
10
12
14
16
18
20
FREQUENCY (GHz)
Figure 9. Input RL Over Temperature.
22
AMMP-5618 Typical Performance (TA = 25°C, Vd = 5V, Id = 107 mA, Z in = Z out = 50Ω unless otherwise stated)
Note: These measurements are in 50Ω test environment. Aspects of the amplifier performance may be improved over a narrower
bandwidth by application of additional conjugate, linearity or low noise (Γopt) matching.
0
8
25°C
-40°C
+85°C
-5
108
25°C
-40°C
+85°C
7
106
104
-15
6
Idd (mA)
NF (dB)
S21 (dB)
-10
5
-20
100
98
25°C
-40°C
+85°C
4
-25
-30
102
96
94
3
4
6
8
10
12
14
16
18
20
22
6
8
10
FREQUENCY (GHz)
12
14
16
18
20
3
3.5
4
FREQUENCY (GHz)
Figure 10. Output Return Loss Over
Temperature.
Figure 11. NF Over Temperature.
5
Figure 12. Bias Current Over Temperature.
0
16
4.5
Vdd (V)
0
3V
4V
5V
-10
12
3V
4V
5V
-5
8
0
-30
-15
-50
-60
4
6
8
10
12
14
16
18
20
4
22
6
10
12
14
16
0
-20
20
4
OIP3 (dBm)
12
8
20
18
FREQUENCY (GHz)
Figure 16. Output Return Loss Over Vdd.
20
18
20
15
0
6
8
10
12
14
16
FREQUENCY (GHz)
Figure 17. Output Power Over Vdd.
3V
4V
5V
5
0
16
18
20
10
3V
4V
5V
-30
14
16
35
4
12
14
Figure 15. Input RL Over Vdd.
-25
10
12
25
-20
8
10
30
-15
6
8
16
OP-1dB (dBm)
-10
4
6
FREQUENCY (GHz)
20
3V
4V
5V
-5
4
18
Figure 14. Isolation Over Vdd.
Figure 13. Gain Over Vdd.
S22 (dB)
8
FREQUENCY (GHz)
FREQUENCY (GHz)
-35
-10
-40
3V
4V
5V
4
S11 (dB)
S12 (dB)
S21 (dB)
-20
18
20
6
8
10
12
14
16
FREQUENCY (GHz)
Figure 18. OIP3 Over Vdd.
AMMP-5618 Typical Scattering Parameters[1] (TA = 25°C, Vd = 5V, ZO = 50Ω)
Freq.
GHz
dB
S11
Mag
Phase
dB
S21
Mag
Phase
dB
S12
Mag
Phase
dB
S22
Mag
Phase
2.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
6.0
6.5
7.0
7.5
8.0
8.5
9.0
9.5
10.0
10.5
11.0
11.5
12.0
12.5
13.0
13.5
14.0
14.5
15.0
15.5
16.0
16.5
17.0
17.5
18.0
18.5
19.0
19.5
20.0
20.5
21.0
21.5
22.0
22.5
23.0
23.5
24.0
24.5
-2.995
-3.432
-4.250
-4.096
-4.325
-4.797
-6.417
-11.055
-18.578
-23.802
-25.186
-27.287
-27.021
-24.540
-23.582
-23.477
-24.304
-22.475
-19.215
-16.258
-14.234
-13.024
-12.514
-12.482
-12.919
-13.636
-13.993
-13.835
-13.000
-12.524
-12.067
-11.963
-12.862
-12.547
-11.062
-10.610
-10.469
-10.018
-9.997
-10.136
-9.631
-7.870
-5.619
-4.449
-4.155
-4.196
0.708
0.674
0.613
0.624
0.608
0.576
0.478
0.280
0.118
0.065
0.055
0.043
0.045
0.059
0.066
0.067
0.061
0.075
0.109
0.154
0.194
0.223
0.237
0.238
0.226
0.208
0.200
0.203
0.224
0.236
0.222
0.200
0.181
0.187
0.225
0.272
0.300
0.316
0.316
0.311
0.330
0.404
0.524
0.599
0.620
0.617
70.854
7.524
-59.292
-112.628
-174.493
121.652
52.449
-16.473
-62.704
-78.360
-114.355
176.586
89.220
16.508
-43.865
-104.344
-175.038
107.849
44.619
-5.409
-51.554
-95.001
-138.454
177.883
132.024
87.229
38.470
-5.903
-52.805
-103.865
-152.985
153.118
93.198
28.065
-33.067
-88.132
-138.271
173.388
122.816
65.257
-1.277
-59.633
-127.317
171.791
119.140
71.146
-22.696
-16.093
-4.538
-1.726
0.287
5.870
10.805
13.764
14.224
14.468
14.500
14.416
14.509
14.512
14.512
14.523
14.491
14.473
14.479
14.388
14.419
14.367
14.328
14.202
14.147
13.972
14.029
13.739
13.725
13.966
14.024
14.002
14.148
14.132
14.210
14.091
13.858
13.623
13.398
13.019
12.886
12.504
11.738
10.831
9.293
8.021
0.073
0.157
0.593
0.461
0.394
1.131
3.164
4.712
5.385
5.475
5.495
5.506
5.501
5.503
5.503
5.510
5.490
5.479
5.482
5.425
5.382
5.350
5.326
5.249
5.216
5.054
4.971
4.920
4.969
5.109
5.143
5.130
5.217
5.207
5.254
5.183
5.046
4.911
4.785
4.797
4.724
4.219
3.863
3.480
2.915
2.518
45.614
62.385
-0.007
-157.105
-52.399
-107.307
-175.227
108.456
38.847
-23.228
-75.874
-127.412
-176.352
134.523
87.924
41.684
-3.914
-48.272
-93.057
-137.014
179.443
136.208
92.923
50.240
6.926
-35.308
-77.276
-118.133
-158.923
158.580
115.249
72.656
29.105
-14.187
-58.599
-104.365
-149.000
165.396
122.433
77.749
29.934
-13.003
-63.650
-112.183
-157.885
159.348
-58.670
-49.826
-43.091
-36.349
-39.160
-42.543
-50.015
-46.815
-42.183
-40.719
-39.954
-39.602
-39.264
-39.039
-38.938
-38.808
-38.711
-38.711
-38.700
-38.773
-38.489
-38.221
-38.071
-37.739
-37.252
-37.903
-37.680
-38.692
-39.424
-38.107
-37.443
-37.604
-37.848
-38.170
-38.384
-39.112
-39.698
-40.748
-42.165
-43.928
-45.145
-49.217
-47.596
-53.021
-51.322
-46.344
0.001
0.003
0.007
0.015
0.011
0.007
0.003
0.005
0.008
0.009
0.010
0.010
0.011
0.011
0.011
0.011
0.012
0.012
0.012
0.012
0.012
0.012
0.012
0.013
0.014
0.013
0.013
0.012
0.011
0.012
0.013
0.013
0.013
0.012
0.012
0.011
0.010
0.009
0.008
0.006
0.006
0.003
0.004
0.002
0.003
0.005
91.028
-30.565
172.431
-48.599
-129.213
166.320
130.192
155.918
114.699
69.159
27.235
-12.197
-50.735
-88.381
-124.530
-160.536
163.632
128.550
92.021
61.222
26.022
-8.975
-43.893
-78.798
-114.505
-153.055
172.112
133.007
104.224
82.267
37.833
0.928
-35.629
-72.292
-109.537
-147.597
176.777
139.612
102.558
74.095
49.307
-1.915
-40.229
-136.023
114.374
21.965
-0.537
-0.694
-1.503
-3.848
-4.217
-5.052
-6.475
-8.555
-10.393
-12.156
-14.372
-17.196
-18.937
-17.986
-16.383
-15.281
-14.875
-15.430
-16.520
-18.494
-20.529
-22.659
-24.039
-24.607
-24.958
-26.020
-25.949
-25.799
-23.027
-21.872
-21.936
-22.039
-22.843
-24.452
-24.014
-20.632
-16.990
-13.793
-11.540
-9.819
-8.659
-7.188
-7.034
-7.133
-7.517
-8.346
0.940
0.923
0.841
0.642
0.615
0.559
0.475
0.373
0.302
0.247
0.191
0.138
0.113
0.126
0.152
0.172
0.180
0.169
0.149
0.119
0.094
0.074
0.063
0.059
0.057
0.050
0.050
0.051
0.071
0.081
0.080
0.079
0.072
0.060
0.063
0.093
0.141
0.204
0.265
0.323
0.369
0.437
0.445
0.440
0.421
0.383
118.786
56.844
-77.196
-20.982
-101.456
-168.104
130.723
79.201
36.021
-7.111
-54.746
-111.340
-179.767
115.789
65.272
25.081
-11.906
-47.630
-83.772
-122.670
-163.935
150.698
107.199
69.051
37.568
10.165
-2.864
-10.215
-27.632
-63.932
-90.189
-122.785
-163.441
144.595
83.275
30.364
-10.504
-47.217
-83.538
-119.330
-153.160
166.236
131.591
97.415
61.706
22.766
25.0
-4.530
0.594
23.384
6.897
2.212
116.230
-45.149
0.006
-35.249
-9.765
0.325
-21.448
Note:
1. Data obtained from in fixture de-embedded
to package edge.
Input Reference
Plane
Input Reference
Plane
for
s-parameters
for s-parameters
5
Output Reference
Plane Plane
Output
Reference
for
s-parameters
for s-parameters.
(View from package bottom)
Biasing and Operation
The AMMC-5618 is normally
biased with a single positive
drain supply connected to both
VD pins through bypass capacitors as shown in Figure 19. The
recommended supply voltage is
5V. It is important to have 0.1 µF
bypass capacitor, and the capacitor should be placed as close to
the component as possible.
The AMMC-5618 does not require
a negative gate voltage to bias
any of the three stages. No
ground wires are needed because
all ground connections are made
with plated through-holes to the
backside of the package.
Refer to the Absolute Maximum
Ratings table for allowed DC and
thermal conditions.
Vd
(Typ 5V)
0.1 µF
1
RFin
2
3
4
8
7
6
RFout
5
BASE
GND
Figure 19. Typical Application.
VD2
VD1
Feedback
Network
Feedback
Network
Matching
RF Input
Matching
RF Output
Matching
VG1
Figure 20. Simplified MMIC Schematic.
6
VG2
Figure 21. Demonstration Board
(available upon request).
1
.200 [5.08]
Recommended SMT Attachment
The AMMP Packaged Devices are
compatible with high volume
surface mount PCB assembly
processes.
2 3
8
4
7
The PCB material and mounting
pattern, as defined in the data
sheet, optimizes RF performance
and is strongly recommended.
An electronic drawing of the land
pattern is available upon request
from Agilent Sales & Application
Engineering.
6 5
.200 [5.08]
.075 [1.91]
Front View
Side View
.114 [2.9]
.011 [0.28]
.014 [0.365]
.018 [0.46]
3 2 1
.016 [0.40]
.126 [3.2]
4
8
.059 [1.5]
.100 [2.54]
.012 [0.30]
.029 [0.75]
5
6 7
.100 [2.54]
.028 [0.70]
.016 [0.40]
.093 [2.36]
Dimensional Tolerances: 0.002" [0.05 mm]
Back View
Notes:
1. * Indicates Pin 1
2. Dimensions are in inches [millimeters]
3. All Grounds must be soldered to PCB RF Ground
Figure 22. Outline Drawing.
.093 [2.36]
.010 [0.25]
.016 [0.40]
.011 [0.28]
.0095 [0.24]
.016 [0.40]
.126 [3.20]
.059 [1.50] .020 [0.50]
.012 [0.3]
.018 [0.46]
.0095 [0.24]
.018 [0.46]
.114 [2.90]
Figure 23. Suggested PCB Material and Land Pattern.
7
Manual Assembly
1. Follow ESD precautions while
handling packages.
2. Handling should be along the
edges with tweezers.
3. Recommended attachment is
conductive solder paste.
Please see recommended
solder reflow profile. Conductive epoxy is not recommended. Hand soldering is not
recommended.
4. Apply solder paste using a
stencil printer or dot placement. The volume of solder
paste will be dependent on
PCB and component layout
and should be controlled to
ensure consistent mechanical
and electrical performance.
5. Follow solder paste and
vendor’s recommendations
when developing a solder
reflow profile. A standard
profile will have a steady ramp
up from room temperature to
the pre-heat temperature to
avoid damage due to thermal
shock.
6. Packages have been qualified
to withstand a peak temperature of 260° C for 20 seconds.
Verify that the profile will not
expose device beyond these
limits.
Solder Reflow Profile
The most commonly used solder
reflow method is accomplished in
a belt furnace using convection
heat transfer. The suggested
reflow profile for automated
reflow processes is shown in
Figure 24. This profile is designed
to ensure reliable finished joints.
However, the profile indicated in
Figure 1 will vary among different solder pastes from different
manufacturers and is shown here
for reference only.
Stencil Design Guidelines
A properly designed solder
screen or stencil is required to
ensure optimum amount of solder
paste is deposited onto the PCB
pads. The recommended stencil
layout is shown in Figure 25. The
stencil has a solder paste deposition opening approximately 70%
to 90% of the PCB pad. Reducing
stencil opening can potentially
generate more voids underneath.
On the other hand, stencil
openings larger than 100% will
lead to excessive solder paste
smear or bridging across the I/O
pads. Considering the fact that
solder paste thickness will
directly affect the quality of the
solder joint, a good choice is to
use a laser cut stencil composed
of 0.127 mm (5 mils) thick
stainless steel which is capable of
producing the required fine
stencil outline.
The combined PCB and stencil
layout is shown in Figure 26.
300
Peak = 250 ± 5°C
250
Temp (°C)
Melting point = 218°C
200
150
100
50
Ramp 1
0
0
Preheat
50
Ramp 2
100
Reflow
150
Cooling
200
250
300
Seconds
Figure 24. Suggested Lead-Free Reflow Profile for SnAgCu Solder Paste.
0.40
0.46
0.70
0.60
0.67
0.60
1.60
0.36
0.40
0.9550
0.95
3.20 1.80 0.40
0.36
0.36
1.80
0.27
0.36
0.30
0.27
0.36
1.60
0.40
4x - R0.14
Figure 25. Stencil Outline Drawing (mm).
8
Stencil
Opening
2.90
Figure 26. Combined PCB and Stencil Layouts (mm).
Part Number Ordering Information
Device Orientation (Top View)
Part Number
Devices
per Container
Container
AMMP-5618-BLK
10
antistatic bag
AMMP-5618-TR1
100
7” Reel
AMMP-5618-TR2
500
7” Reel
Carrier Tape and Pocket Dimensions
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January 31, 2005
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