DSZ412SE DSZ412SE Avalanche Diode Replaces July 2000 version, DS5107-3.3 DS5107-4.0 October 2001 KEY PARAMETERS FEATURES ■ Double Side Cooling VRRM 4400V ■ High Surge Capability IF(AV) 219A ■ Avalanche Capability IFSM 1500A APPLICATIONS ■ Freewheel Diode Rectification ■ VOLTAGE RATINGS Type Number DSZ412SE44 Repetitive Peak Reverse Voltage VRRM V 4400 Conditions VRSM = VRRM + 100V Lower voltage grades available Outline type code: E ORDERING INFORMATION Order as: (See Package Details for further information) Fig. 1 Package outline DSZ412SE44 Note: Please use the complete part number when ordering and quote this number in any future correspondance relating to your order. 1/9 www.dynexsemi.com DSZ412SE CURRENT RATINGS Tcase = 75oC unless otherwise stated Symbol Parameter Conditions Max. Units 219 A Double Side Cooled Half wave resistive load IF(AV) Mean forward current IF(RMS) RMS value - 344 A Continuous (direct) forward current - 333 A 132 A IF Single Side Cooled (Anode side) IF(AV) Mean forward current IF(RMS) RMS value - 207 A Continuous (direct) forward current - 181 A Conditions Max. Units IF Half wave resistive load CURRENT RATINGS THeatsink = 55oC unless otherwise stated Symbol Parameter Double Side Cooled IF(AV) Mean forward current Half wave resistive load, THeatsink = 55oC 230 A IF(RMS) RMS value THeatsink = 55oC 360 A Continuous (direct) forward current THeatsink = 55oC 345 A IF Single Side Cooled (Anode side) IF(AV) Mean forward current Half wave resistive load, THeatsink = 55oC 140 A IF(RMS) RMS value THeatsink = 55oC 220 A Continuous (direct) forward current THeatsink = 55oC 195 A IF 2/9 www.dynexsemi.com DSZ412SE SURGE RATINGS Symbol IFRM 2 It Max. Units Half sine φ = 30˚; THeatsink = 55oC 1990 A 10ms; Tj = 150oC 11250 A2s 3ms; Tj = 150oC 7250 A2s 1500 A 10 kW Parameter Repetitive peak forward current Conditions 2 I t for fusing IFSM Surge (non-repetitive) forward current With 50% VRRM, Tj =150˚C PRSM Non-repetitive peak avalanche power 10µs avalanche, Tj = 150˚C THERMAL RATINGS AND MECHANICAL DATA Symbol Min. Max. Units dc - 0.115 o Half-wave - 0.129 o 3 phase - 0.150 o dc - 0.270 o Half-wave - 0.284 o 3 phase - 0.305 o Forward (conducting) - 165 o Reverse (blocking) - 150 o Storage temperature range –55 150 o f Frequency 10 400 Hz - Clamping force 2.5 3.8 kN Rth(j-h) Rth(j-h) Tvj Tstg Parameter Thermal resistance - junction to heatsink Thermal resistance - junction to heatsink Conditions Double side cooled Clamping force 3.0kN with mounting compound Single side cooled Clamping force 3.0kN with mounting compound C/W C/W C/W C/W C/W C/W C Virtual junction temperature C C 3/9 www.dynexsemi.com DSZ412SE CHARACTERISTICS Symbol Parameter Min. Max. Units At 300A peak, Tcase = 25oC - 2.1 V At VRRM, Tcase = 150oC - 20 mA At 50 % VRRM, Tcase = 150oC 1* 10* mA Threshold voltage At Tvj = 150˚C - 1.12 V Slope resistance At Tvj =150˚C - 3.75 mΩ VFM Forward voltage IRM Peak reverse current VTO rT Conditions *This selection for series sharing only upon request. CURVES Fig.2 Maximum (limit) forward characteristics 4/9 www.dynexsemi.com DSZ412SE Fig.3 Dissipation curves - double side cooled Fig.4 Dissipation curves - single side cooled 5/9 www.dynexsemi.com DSZ412SE Fig.5 Surge (non-repetitive) forward current vs time (with 50% VRRM, Tcase = 150˚C) Fig.6 Stored charge 6/9 www.dynexsemi.com DSZ412SE Fig.7 Maximum (limit) transient thermal impedance 7/9 www.dynexsemi.com DSZ412SE PACKAGE DETAILS For further package information, please visit our website or contact your nearest Customer Service Centre. All dimensions in mm, unless stated otherwise. DO NOT SCALE. 2 holes Ø3.6 ± 0.1 x 2.0 ± 0.1 deep (One in each electrode) Cathode Ø42max Ø25nom. 15 14 Ø25nom. Anode Nominal weight: 65g Package outline type code: E Note: 1. Package maybe supplied with pins and/or tags. 8/9 www.dynexsemi.com DSZ412SE POWER ASSEMBLY CAPABILITY The Power Assembly group was set up to provide a support service for those customers requiring more than the basic semiconductor, and has developed a flexible range of heatsink / clamping systems in line with advances in device types and the voltage and current capability of our semiconductors. We offer an extensive range of air and liquid cooled assemblies covering the full range of circuit designs in general use today. The Assembly group continues to offer high quality engineering support dedicated to designing new units to satisfy the growing needs of our customers. Using the up to date CAD methods our team of design and applications engineers aim to provide the Power Assembly Complete solution (PACs). DEVICE CLAMPS Disc devices require the correct clamping force to ensure their safe operation. The PACs range offers a varied selection of pre-loaded clamps to suit all of our manufactured devices. This include cube clamps for single side cooling of ‘T’ 22mm Clamps are available for single or double side cooling, with high insulation versions for high voltage assemblies. Please refer to our application note on device clamping, AN4839 HEATSINKS Power Assembly has its own proprietary range of extruded aluminium heatsinks. They have been designed to optimise the performance or our semiconductors. Data with respect to air natural, forced air and liquid cooling (with flow rates) is available on request. For further information on device clamps, heatsinks and assemblies, please contact your nearest Sales Representative or Customer Services. http://www.dynexsemi.com e-mail: [email protected] HEADQUARTERS OPERATIONS DYNEX SEMICONDUCTOR LTD Doddington Road, Lincoln. Lincolnshire. LN6 3LF. United Kingdom. Tel: 00-44-(0)1522-500500 Fax: 00-44-(0)1522-500550 DYNEX POWER INC. 99 Bank Street, Suite 410, Ottawa, Ontario, Canada, K1P 6B9 Tel: 613.723.7035 Fax: 613.723.1518 Toll Free: 1.888.33.DYNEX (39639) CUSTOMER SERVICE CENTRES Mainland Europe Tel: +33 (0)1 58 04 91 00. Fax: +33 (0)1 46 38 51 33 North America Tel: (613) 723-7035. Fax: (613) 723-1518. UK, Scandinavia & Rest Of World Tel: +44 (0)1522 500500. Fax: +44 (0)1522 500020 SALES OFFICES Mainland Europe Tel: +33 (0)1 58 04 91 00. Fax: +33 (0)1 46 38 51 33 North America Tel: (613) 723-7035. Fax: (613) 723-1518. Toll Free: 1.888.33.DYNEX (39639) / Tel: (949) 733-3005. Fax: (949) 733-2986. UK, Scandinavia & Rest Of World Tel: +44 (0)1522 500500. Fax: +44 (0)1522 500020 These offices are supported by Representatives and Distributors in many countries world-wide. © Dynex Semiconductor 2001 Publication No. DS5107-4 Issue No. 4.0 October 2001 TECHNICAL DOCUMENTATION – NOT FOR RESALE. PRINTED IN UNITED KINGDOM Datasheet Annotations: Dynex Semiconductor annotate datasheets in the top right hard corner of the front page, to indicate product status. The annotations are as follows:Target Information: This is the most tentative form of information and represents a very preliminary specification. No actual design work on the product has been started. Preliminary Information: The product is in design and development. The datasheet represents the product as it is understood but details may change. Advance Information: The product design is complete and final characterisation for volume production is well in hand. No Annotation: The product parameters are fixed and the product is available to datasheet specification. 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These products are not suitable for use in any medical products whose failure to perform may result in significant injury or death to the user. All products and materials are sold and services provided subject to the Company's conditions of sale, which are available on request. All brand names and product names used in this publication are trademarks, registered trademarks or trade names of their respective owners. 9/9 www.dynexsemi.com