SN65LVDS93A www.ti.com................................................................................................................................................................................................. SLLS992 – AUGUST 2009 FLATLINK™ TRANSMITTER Check for Samples: SN65LVDS93A FEATURES 1 • • 2 • • • • • Industrial Temperature Range –40°C to 85°C LVDS Display Serdes Interfaces Directly to LCD Display Panels with Integrated LVDS Package Options: 4.5mm × 7mm BGA, and 8.1mm × 14mm TSSOP 1.8V up to 3.3V Tolerant Data Inputs to Connect Directly to Low-Power, Low-Voltage Application and Graphic Processors Transfer Rate up to 135Mpps (Mega Pixel Per Second); Pixel Clock Frequency Range 10MHz to 135MHz Suited for Display Resolutions Ranging From HVGA up to HD With Low EMI Operates From a Single 3.3V Supply and 170mW (typ.) at 75MHz • • • • • • 28 Data Channels Plus Clock In Low-Voltage TTL to 4 Data Channels Plus Clock Out Low-Voltage Differential Consumes Less Than 1mW When Disabled Selectable Rising or Falling Clock Edge Triggered Inputs ESD: 5kV HBM Support Spread Spectrum Clocking (SSC) Compatible with all OMAP ™ 2x, OMAP™3x, and DaVinci ™ Application Processors APPLICATIONS • • • LCD Display Panel Driver UMPC and Netbook PC Digital Picture Frame DESCRIPTION The SN65LVDS93A LVDS serdes (serializer/deserializer) transmitter contains four 7-bit parallel load serial-out shift registers, a 7 × clock synthesizer, and five low-voltage differential signaling (LVDS) drivers in a single integrated circuit. These functions allow 28 bits of single-ended LVTTL data to be synchronously transmitted over five balanced-pair conductors for receipt by a compatible receiver, such as the SN65LVDS94. When transmitting, data bits D0 through D27 are each loaded into registers upon the edge of the input clock signal (CLKIN). The rising or falling edge of the clock can be selected via the clock select (CLKSEL) pin. The frequency of CLKIN is multiplied seven times and then used to serially unload the data registers in 7-bit slices. The four serial streams and a phase-locked clock (CLKOUT) are then output to LVDS output drivers. The frequency of CLKOUT is the same as the input clock, CLKIN. The SN65LVDS93A requires no external components and little or no control. The data bus appears the same at the input to the transmitter and output of the receiver with the data transmission transparent to the user(s). The only user intervention is selecting a clock rising edge by inputting a high level to CLKSEL or a falling edge with a lowlevel input and the possible use of the shutdown/clear (SHTDN). SHTDN is an active-low input to inhibit the clock and shut off the LVDS output drivers for lower power consumption. A low level on this signal clears all internal registers at a low level. The SN65LVDS93A is characterized for operation over ambient air temperatures of –40°C to 85°C. 1 2 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. OMAP, DaVinci are trademarks of Texas Instruments. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2009, Texas Instruments Incorporated SN65LVDS93A SLLS992 – AUGUST 2009................................................................................................................................................................................................. www.ti.com These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. ORDERING INFORMATION (1) (1) PART NUMBER PART MARKING PACKAGE SN65LVDS93AZQLR LVDS93A in BGA package 56-pin ZQL LARGE T&R SN65LVDS93ADGG LVDS93A in TSSOP package 56-pin DGG TUBE SN65LVDS93ADGGR LVDS93A in TSSOP package 56-pin DGG LARGE T&R For the most current package and ordering information, see the Package Option Addendum located at the end of this data sheet, or refer to our web site at www.ti.com. ABSOLUTE MAXIMUM RATINGS (1) Supply voltage range, VCC, IOVCC, LVDSVCC, PLLVCC (2) Voltage range at any output terminal Voltage range at any input terminal Continuous power dissipation Charged Device Model (CDM) (4) all pins Machine Model (MM) (5) all pins (1) (2) (3) (4) (5) 2 UNIT V -0.5 to VCC + 0.5 V -0.5 to IOVCC + 0.5 V See the dissipation rating table Human Body Model (HBM) (3) all pins ESD rating VALUE -0.5 to 4 5 kV 500 V 150 V Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those specified is not implied. All voltages are with respect to the GND terminals. In accordance with JEDEC Standard 22, Test Method A114-A. In accordance with JEDEC Standard 22, Test Method C101. In accordance with JEDEC Standard 22, Test Method A115-A. Submit Documentation Feedback Copyright © 2009, Texas Instruments Incorporated Product Folder Link(s): SN65LVDS93A SN65LVDS93A www.ti.com................................................................................................................................................................................................. SLLS992 – AUGUST 2009 RECOMMENDED OPERATING CONDITIONS over operating free-air temperature range (unless otherwise noted) MIN NOM MAX Supply voltage, VCC PARAMETER 3 3.3 3.6 LVDS output Supply voltage, LVDSVCC 3 3.3 3.6 PLL analog supply voltage, PLLVCC 3 3.3 3.6 1.62 1.8 / 2.5 / 3.3 3.6 IO input reference Supply voltage, IOVCC Power supply noise on any VCC terminal UNIT V 0.1 High-level input voltage, VIH Low-level input voltage, VIL IOVCC = 1.8V IOVCC/2 + 0.3V IOVCC = 2.5V IOVCC/2 + 0.4V IOVCC = 3.3V IOVCC/2 + 0.5V V IOVCC = 1.8V IOVCC/2 - 0.3V IOVCC = 2.5V IOVCC/2 - 0.4V IOVCC = 3.3V IOVCC/2 - 0.5V Differential load impedance, ZL Operating free-air temperature, TA V 90 132 Ω -45 85 C DISSIPATION RATINGS PACKAGE CIRCUIT BOARD MODEL DGG ZQL DGG ZQL (1) (2) Low-K High-K (1) TJA ≤ 25°C DERATING FACTOR (2) ABOVE TJA = 25°C TJA = 70°C POWER RATING 1111mW 12.3mW/°C 555mW 1034mW 11.5mW/°C 517mW 1730mW 19mW/°C 865mW 2000mW 22mW/°C 1000mW In accordance with the High-K and Low-K thermal metric definitions of EIA/JESD51-2. This is the inverse of the junction-to-ambient thermal resistance when board-mounted and with no air flow. TIMING REQUIREMENTS PARAMETER Input clock period, tc MIN MAX UNIT 7.4 100 ns Input clock modulation w/ modulation frequency 30kHz 8% w/ modulation frequency 50kHz 6% High-level input clock pulse width duration, tw 0.4 tc Input signal transition time, tt Data set up time, D0 through D27 before CLKIN (See Figure 3) Data hold time, D0 through D27 after CLKIN 0.6 tc ns 3 ns 2 ns 0.8 ns Submit Documentation Feedback Copyright © 2009, Texas Instruments Incorporated Product Folder Link(s): SN65LVDS93A 3 SN65LVDS93A SLLS992 – AUGUST 2009................................................................................................................................................................................................. www.ti.com DGG PACKAGE (TOP VIEW) IOVCC 1 56 D5 2 3 55 54 D7 GND D8 4 53 5 52 GND D1 6 51 D0 D9 D10 7 50 8 49 D27 GND VCC D11 9 10 48 47 D12 11 46 D13 12 45 Y1P GND D14 13 44 14 15 43 42 LVDSVCC GND Y2M 16 41 17 18 40 39 19 38 D19 GND 20 37 CLKOUTP Y3M Y3P 21 36 GND D20 35 34 GND D21 22 23 D22 24 33 D23 25 32 IOVCC D24 D25 26 31 27 30 28 29 D6 D15 D16 CLKSEL D17 D18 D4 D3 D2 Y0M Y0P Y1M Y2P CLKOUTM PLLVCC GND SHTDN CLKIN D26 GND DGG PIN LIST 4 Pin # Signal Pin # Signal Pin # Signal Pin # 1 IOVCC 15 D15 29 GND 43 GND 2 D5 16 D16 30 D26 44 LVDSVCC 3 D6 17 CLKSEL 31 CLKIN 45 Y1P 4 D7 18 D17 32 SHTDN 46 Y1M 5 GND 19 D18 33 GND 47 Y0P 6 D8 20 D19 34 PLLVCC 48 Y0M 7 D9 21 GND 35 GND 49 GND 8 D10 22 D20 36 GND 50 D27 9 VCC 23 D21 37 Y3P 51 D0 10 D11 24 D22 38 Y3M 52 D1 11 D12 25 D23 39 CLKOUTP 53 GND 12 D13 26 IOVCC 40 CLKOUTM 54 D2 13 GND 27 D24 41 Y2P 55 D3 14 D14 28 D25 42 Y2M 56 D4 Submit Documentation Feedback Signal Copyright © 2009, Texas Instruments Incorporated Product Folder Link(s): SN65LVDS93A SN65LVDS93A www.ti.com................................................................................................................................................................................................. SLLS992 – AUGUST 2009 ZQL PACKAGE (TOP VIEW) 6 5 4 3 2 1 D8 D7 D5 D4 D2 D1 D9 GND D6 D3 D0 D27 D11 VCC D10 GND Y0P Y0M D13 D12 IOVCC GND Y1P Y1M D14 GND GND D16 D15 Y2P Y2M D17 D18 CLKSEL GND CLKP CLKM D19 GND IOVCC GND Y3P Y3M D20 D21 D25 SHTDN PLLVCC GND D22 D23 D24 D26 CLKIN GND K J H G F LVDSVCC E D C B A ZQL PIN LIST Ball # Signal Ball # Signal Ball # Signal A1 GND A2 CLKIN A3 D26 A4 D24 A5 D23 A6 D22 B1 GND B2 PLLVCC B3 SHTDN B4 D25 B5 D21 B6 D20 C1 Y3M C2 Y3P C3 GND C4 IOVCC C5 GND C6 D19 D1 CLKM D2 CLKP D3 GND D4 CLKSEL D5 D18 D6 D17 E1 Y2M E2 Y2P E3 ball not populated E4 ball not populated E5 D15 E6 D16 F1 LVDSVCC F2 GND F3 ball not populated F4 ball not populated F5 GND F6 D14 G1 Y1M G2 Y1P G3 GND G4 IOVCC G5 D12 G6 D13 H1 Y0M H2 Y0P H3 GND H4 D10 H5 VCC H6 D11 J1 D27 J2 D0 J3 D3 J4 D6 J5 GND J6 D9 K1 D1 K2 D2 K3 D4 K4 D5 K5 D7 K6 D8 Submit Documentation Feedback Copyright © 2009, Texas Instruments Incorporated Product Folder Link(s): SN65LVDS93A 5 SN65LVDS93A SLLS992 – AUGUST 2009................................................................................................................................................................................................. www.ti.com PIN FUNCTIONS PIN I/O Y0P, Y0M, Y1P, Y1M, Y2P, Y2M Y3P, Y3M DESCRIPTION Differential LVDS data outputs. Outputs are high-impedance when SHTDN is pulled low (de-asserted) LVDS Out Differential LVDS Data outputs. Output is high-impedance when SHTDN is pulled low (de-asserted). Note: if the application only requires 18-bit color, this output can be left open. CLKP, CLKM Differential LVDS pixel clock output. Output is high-impedance when SHTDN is pulled low (de-asserted). D0 – D27 Data inputs; supports 1.8V to 3.3V input voltage selectable by VDD supply. To connect a graphic source successfully to a display, the bit assignment of D[27:0] is critical (and not necessarily intuitive). Note: if application only requires 18-bit color, connect unused inputs D5, D10, D11, D16, D17, D23, and D27 to GND. CMOS IN with pulldn CLKIN Input pixel clock; rising or falling clock polarity is selectable by Control input CLKSEL. SHTDN Device shut down; pull low (de-assert) to shut down the device (low power, resets all registers) and high (assert) for normal operation. CLKSEL Selects between rising edge input clock trigger (CLKSEL = VIH and falling edge input clock trigger (CLKSEL = VIL). VCC 3.3V digital Supply Voltage IOVCC I/O supply reference voltage (1.8V up to 3.3V matching the GPU data output signal swing) PLLVCC Power Supply (1) 3.3V PLL analog supply LVDSVCC 3.3V LVDS output analog supply GND Supply Ground for VCC, IOVCC, LVDSVCC, and PLLVCC. (1) 6 For a multilayer pcb, it is recommended to keep one common GND layer underneath the device and connect all ground terminals directly to this plane. Submit Documentation Feedback Copyright © 2009, Texas Instruments Incorporated Product Folder Link(s): SN65LVDS93A SN65LVDS93A www.ti.com................................................................................................................................................................................................. SLLS992 – AUGUST 2009 FUNCTIONAL BLOCK DIAGRAM Parallel-Load 7-bit Shift Register D0, D1, D2, D3, D4, D6, D7 7 A,B,...G SHIFT/LOAD >CLK Y0P Y0M Parallel-Load 7-bit Shift Register D8, D9, D12, D13, D14, D15, D18 7 A,B,...G SHIFT/LOAD >CLK Y1P Y1M Parallel-Load 7-bit Shift Register D19, D20, D21, D22, D24, D25, D26 7 A,B,...G SHIFT/LOAD >CLK Y2P Y2M Parallel-Load 7-bit Shift Register D27, D5, D10, D11, D16, D17, D23 7 A,B,...G SHIFT/LOAD >CLK Y3P Y3M Control Logic SHTDN 7X Clock/PLL 7XCLK CLKIN >CLK CLKINH CLKSEL CLKOUTP CLKOUTM RISING/FALLING EDGE Submit Documentation Feedback Copyright © 2009, Texas Instruments Incorporated Product Folder Link(s): SN65LVDS93A 7 SN65LVDS93A SLLS992 – AUGUST 2009................................................................................................................................................................................................. www.ti.com Dn CLKIN or CLKIN CLKOUT Previous cycle Next Current cycle Y0 D0-1 D7 D6 D4 D3 D2 D1 D0 D7+1 Y1 D8-1 D18 D15 D14 D13 D12 D9 D8 D18+1 Y2 D19-1 D26 D25 D24 D22 D21 D20 D19 D26+1 Y3 D27-1 D23 D17 D16 D11 D10 D5 D27 D23+1 Figure 1. Typical SN65LVDS93A Load and Shift Sequences LVDSVCC IOVCC 5W D or SHTDN 50W 7V YnP or YnM 10kW 300kW 7V Figure 2. Equivalent Input and Output Schematic Diagrams 8 Submit Documentation Feedback Copyright © 2009, Texas Instruments Incorporated Product Folder Link(s): SN65LVDS93A SN65LVDS93A www.ti.com................................................................................................................................................................................................. SLLS992 – AUGUST 2009 ELECTRICAL CHARACTERISTICS over operating free-air temperature range (unless otherwise noted) PARAMETER VT Input voltage threshold |VOD| Differential steady-state output voltage magnitude TEST CONDITIONS MIN TYP (1) MAX IOVCC/2 250 UNIT V 450 mV RL = 100Ω, See Figure 4 Δ|VOD| Change in the steady-state differential output voltage magnitude between opposite binary states VOC(SS) Steady-state common-mode output voltage VOC(PP) Peak-to-peak common-mode output voltage See Figure 4 tR/F (Dx, CLKin) = 1ns IIH High-level input current VIH = IOVCC IIL Low-level input current VIL = 0 V ±10 μA VOY = 0 V ±24 mA 1 1.125 35 1.375 mV V 35 mV 25 μA IOS Short-circuit output current VOD = 0 V ±12 mA IOZ High-impedance state output current VO = 0 V to VCC ±20 μA Rpdn Input pull-down integrated resistor on all inputs (Dx, CLKSEL, SHTDN, CLKIN) IOVCC = 1.8V 200 IOVCC = 3.3V 100 IQ Quiescent current disabled, all inputs at GND; SHTDN = VIL 2 kΩ 100 μA SHTDN = VIH, RL = 100Ω (5 places), grayscale pattern (Figure 5) VCC = 3.3V, fCLK = 75MHz I(VCC) + I(PLLVCC) + I(LVDSVCC) 51.9 62 I(IOVCC) with IOVCC = 3.3V 0.4 1.2 I(IOVCC) with IOVCC = 1.8V 0.1 mA SHTDN = VIH, RL = 100Ω (5 places), 50% transition density pattern (Figure 5), VCC = 3.3V, fCLK = 75MHz I(VCC) + I(PLLVCC) + I(LVDSVCC) 53.3 65 I(IOVCC) with IOVCC = 3.3V 0.6 2.5 I(IOVCC) with IOVCC = 1.8V 0.2 mA SHTDN = VIH, RL = 100Ω (5 places), worst-case pattern (Figure 6), VCC = 3.6V, fCLK = 75MHz ICC Supply current (average) I(VCC) + I(PLLVCC) + I(LVDSVCC) 63.7 77 I(IOVCC) with IOVCC = 3.3V 1.3 3.3 I(IOVCC) with IOVCC = 1.8V 0.5 mA SHTDN = VIH, RL = 100Ω (5 places), worst-case pattern (Figure 6), fCLK = 100MHz I(VCC) + I(PLLVCC) + I(LVDSVCC) 81.6 94 I(IOVCC) with IOVCC = 3.6V 1.6 3.8 I(IOVCC) with IOVCC = 1.8V 0.6 mA SHTDN = VIH, RL = 100Ω (5 places), worst-case pattern (Figure 6), fCLK = 135MHz CI (1) I(VCC) + I(PLLVCC) + I(LVDSVCC) 102.2 116 I(IOVCC) with IOVCC = 3.6V 2.1 4.5 I(IOVCC) with IOVCC = 1.8V 0.8 Input capacitance 2 mA pF All typical values are at VCC = 3.3 V, TA = 25°C. Submit Documentation Feedback Copyright © 2009, Texas Instruments Incorporated Product Folder Link(s): SN65LVDS93A 9 SN65LVDS93A SLLS992 – AUGUST 2009................................................................................................................................................................................................. www.ti.com SWITCHING CHARACTERISTICS over operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP (1) MAX 0 0.1 ns UNIT t0 Delay time, CLKOUT↑ after Yn valid (serial bit position 0, equal D1, D9, D20, D5) t1 Delay time, CLKOUT↑ after Yn valid (serial bit position 1, equal D0, D8, D19, D27) 1 /7 tc - 0.1 1 /7 tc + 0.1 ns t2 Delay time, CLKOUT↑ after Yn valid (serial bit position 2, equal D7, D18, D26. D23) 2 /7 tc - 0.1 2 /7 tc + 0.1 ns t3 Delay time, CLKOUT↑ after Yn valid (serial bit position 3; equal D6, D15, D25, D17) 3 /7 tc - 0.1 3 /7 tc + 0.1 ns t4 Delay time, CLKOUT↑ after Yn valid (serial bit position 4, equal D4, D14, D24, D16) 4 /7 tc - 0.1 4 /7 tc + 0.1 ns t5 Delay time, CLKOUT↑ after Yn valid (serial bit position 5, equal D3, D13, D22, D11) 5 /7 tc - 0.1 5 /7 tc + 0.1 ns t6 Delay time, CLKOUT↑ after Yn valid (serial bit position 6, equal D2, D12, D21, D10) 6 /7 tc - 0.1 6 /7 tc + 0.1 ns tc(o) Output clock period Δtc(o) -0.1 See Figure 7, tC = 10ns, |Input clock jitter| < 25ps (2) tc Output clock cycle-to-cycle jitter (3) tC = 10ns; clean reference clock, see Figure 8 ±26 tC = 10ns with 0.05UI added noise modulated at 3MHz, see Figure 8 ±44 tC = 7.4ns; clean reference clock, see Figure 8 ±35 tC = 7.4ns with 0.05UI added noise modulated at 3MHz, see Figure 8 ±42 ns ps tw High-level output clock pulse duration tr/f Differential output voltage transition time (tr or tf) See Figure 4 ten Enable time, SHTDN↑ to phase lock (Yn valid) f(clk) = 135MHz, See Figure 9 6 ns tdis Disable time, SHTDN↓ to off-state (CLKOUT high-impedance) f(clk) = 135MHz, See Figure 10 7 ns (1) (2) (3) 4 /7 tc 225 ns 500 ps All typical values are at VCC = 3.3 V, TA = 25°C. |Input clock jitter| is the magnitude of the change in the input clock period. The output clock cycle-to-cycle jitter is the largest recorded change in the output clock period from one cycle to the next cycle observed over 15,000 cycles.Tektronix TDSJIT3 Jitter Analysis software was used to derive the maximum and minimum jitter value. PARAMETER MEASUREMENT INFORMATION tsu thold Dn CLKIN All input timing is defined at IOVDD / 2 on an input signal with a 10% to 90% rise or fall time of less than 3 ns. CLKSEL = 0V. Figure 3. Set Up and Hold Time Definition 10 Submit Documentation Feedback Copyright © 2009, Texas Instruments Incorporated Product Folder Link(s): SN65LVDS93A SN65LVDS93A www.ti.com................................................................................................................................................................................................. SLLS992 – AUGUST 2009 PARAMETER MEASUREMENT INFORMATION (continued) 49.9W ± 1% (2 PLCS) YP VOD VOC YM 100% 80% VOD(H) 0V VOD(L) 20% 0% tf tr VOC(PP) VOC(SS) VOC(SS) 0V Figure 4. Test Load and Voltage Definitions for LVDS Outputs. CLKIN D0,8,16 D1,9,17 D2,10,18 D3,11,19 D4-7,12-15,20-23 D24-27 The 16 grayscale test pattern test device power consumption for a typical display pattern. Figure 5. 16 Grayscale Test Pattern Submit Documentation Feedback Copyright © 2009, Texas Instruments Incorporated Product Folder Link(s): SN65LVDS93A 11 SN65LVDS93A SLLS992 – AUGUST 2009................................................................................................................................................................................................. www.ti.com PARAMETER MEASUREMENT INFORMATION (continued) T CLKIN EVEN Dn ODD Dn The worst-case test pattern produces nearly the maximum switching frequency for all of the LVDS outputs. Figure 6. Worst-Case Power Test Pattern t7 CLKIN CLKOUT t6 t5 t4 t3 t2 t0 Yn t1 VOD(H) ~2.5V CLKOUT or Yn 1.40V CLKIN 0.00V ~0.5V VOD(L) t7 t0-6 CLKOUT is shown with CLKSEL at high-level. CLKIN polarity depends on CLKSEL input level. Figure 7. SN65LVDS93A Timing Definitions 12 Submit Documentation Feedback Copyright © 2009, Texas Instruments Incorporated Product Folder Link(s): SN65LVDS93A SN65LVDS93A www.ti.com................................................................................................................................................................................................. SLLS992 – AUGUST 2009 PARAMETER MEASUREMENT INFORMATION (continued) Reference + Device Under Test VCO + Modulation v(t) = A sin(2 pfmodt) HP8656B Signal Generator, 0.1 MHz-990 MHz HP8665A Synthesized Signal Generator, 0.1 MHz-4200 MHz Device Under Test RF Output Modulation Input RF Output CLKIN DTS2070C Digital TimeScope CLKOUT Input Figure 8. Output Clock Jitter Test Set Up CLKIN Dn ten SHTDN Invalid Yn Valid Figure 9. Enable Time Waveforms CLKIN tdis SHTDN CLKOUT Figure 10. Disable Time Waveforms Submit Documentation Feedback Copyright © 2009, Texas Instruments Incorporated Product Folder Link(s): SN65LVDS93A 13 SN65LVDS93A SLLS992 – AUGUST 2009................................................................................................................................................................................................. www.ti.com TYPICAL CHARACTERISTICS AVERAGE GRAYSCALE ICC vs CLOCK FREQUENCY 800 Total Device Current (Using Grayscale pattern) Over Pixel Clock Frequency Output Jitter 90 700 80 600 Period Clock Jitter - ps-pp ICC - Average Supply Current - mA 100 OUTPUT CLOCK JITTER vs INPUT CLOCK JITTER VCC = 3.6V 70 60 50 VCC = 3.3V 40 Input Jitter 500 400 300 200 VCC = 3V CLK Frequency During Test = 100MHz 30 100 20 10 30 50 70 90 110 130 0 0.01 fclk - Clock Frequency - MHz 0.10 1 10 f(mod) - Input Modular Frequency - MHz Figure 11. Figure 12. TYPICAL PRBS OUTPUT SIGNAL OVER ONE CLOCK PERIOD PRBS Data Signal V - Voltage - 80mV/div CLKL Signal Clock Signal: 135MHz tk - Time - 1ns/div Figure 13. 14 Submit Documentation Feedback Copyright © 2009, Texas Instruments Incorporated Product Folder Link(s): SN65LVDS93A SN65LVDS93A www.ti.com................................................................................................................................................................................................. SLLS992 – AUGUST 2009 APPLICATION INFORMATION Power Up Sequence The SN65LVDS93A does not require a specific power up sequence. It is permitted to power up IOVCC while VCC, VCCPLL, and VCCLVDS remain powered down and connected to GND. The input level of the SHTDN during this time does not matter as only the input stage is powered up while all other device blocks are still powered down. It is also permitted to power up all 3.3V power domains while IOVCC is still powered down to GND. The device will not suffer damage. However, in this case, all the I/Os are detected as logic HIGH, regardless of their true input voltage level. Hence, connecting SHTDN to GND will still be interpreted as a logic HIGH; the LVDS output stage will turn on. The power consumption in this condition is significantly higher than standby mode, but still lower than normal mode. Submit Documentation Feedback Copyright © 2009, Texas Instruments Incorporated Product Folder Link(s): SN65LVDS93A 15 SN65LVDS93A SLLS992 – AUGUST 2009................................................................................................................................................................................................. www.ti.com Typical Application Schematic Figure 14 represents the schematic drawing of the SN65LVDS93A evaluation module. J1 U1H GND1 GND2 GND3 GND4 GND5 GND6 GND7 PLLGND LVDSGND1 LVDSGND2 J3 CLKM CLKP Y0P Y0M Y1P Y1M Y2P Y2M IOVCC R4 4.7k R5 4.7k R6 4.7k R7 4.7k R8 4.7k R9 4.7k Y3P Y3M R10 4.7k JMP1 U1B J2 K1 K2 J3 K3 J4 K5 D0 D1 D2 D3 D4 D6 D7 D1 D2 G2 G1 J5 E1 E2 sma_surface J6 sma_surface C2 C1 J7 sma_surface SN65LVDS93AZQL J8 sma_surface J9 sma_surface 14 Header 7x2 J10 sma_surface IOVCC R11 4.7k R12 4.7k R13 4.7k R14 4.7k R15 4.7k R16 4.7k R17 4.7k sma_surface JMP2 U1C D8 D9 D12 D13 D14 D15 D18 J4 sma_surface H2 H1 1 2 SN65LVDS93AZQL K6 J6 G5 G6 F6 E5 D5 sma_surface U1A SN65LVDS93AZQL D0 D1 D2 D3 D4 D6 D7 J2 sma_surface C3 C5 D3 F5 G3 H3 J5 A1 B1 F2 D8 D9 D12 D13 D14 D15 D18 1 2 IOVCC IOVCC 14 R1 4.7k Header 7x2 SN65LVDS93AZQL R2 IOVCC R18 4.7k R19 4.7k R20 4.7k R21 4.7k R22 4.7k R23 4.7k R24 4.7k JMP6 U1G JMP3 U1D D19 D20 D21 D22 D24 D25 D 26 C6 B6 B5 A6 A4 B4 A3 D19 D20 D21 D22 D24 D25 D26 SHTDN CLKSEL 1 2 B3 D4 SHTDN CLKSEL 1 2 3 4 Header 2x2 SN65LVDS93AZQL 14 U1J NC1 NC2 NC3 NC4 Header 7x2 SN65LVDS93AZQL IOVCC R25 4.7k R26 4.7k R27 4.7k R28 4.7k R29 4.7k R30 4.7k E3 E4 F3 F4 SN65LVDS93AZQL R31 4.7k JMP4 U1E D5 D10 D11 D16 D17 D23 D27 D5 D10 D11 D16 D17 D23 D27 K4 H4 H6 E6 D6 A5 J1 VCC 1 2 IOVCC U1I VCC PLLVCC LVDSVCC 14 IOVCC1 IOVCC2 Header 7x2 SN65LVDS93AZQL G4 B2 F1 H5 C4 SN65LVDS93AZQL VCC VCC C31 1uF C32 0.1uF C33 0.01uF VCC C34 1uF C35 0.1uF C36 0.01uF IOVCC C40 1uF C41 0.1uF C42 0.01uF C37 1uF C38 0.1uF C39 0.01uF PLACE UNDER LVDS93A (bottom pcb side) Figure 14. Schematic Example (SN65LVDS93A Evaluation Board) 16 Submit Documentation Feedback Copyright © 2009, Texas Instruments Incorporated Product Folder Link(s): SN65LVDS93A SN65LVDS93A www.ti.com................................................................................................................................................................................................. SLLS992 – AUGUST 2009 PCB Routing Figure 15 shows a possible breakout of the data input and output signals from the BGA package. R1 R2 R3 R4 R5 R6 R7 R8 G0 G1 D8 D7 D5 D4 D2 D1 D9 GND D6 D3 D0 D27 D11 VCC D10 GND Y0P Y0M D13 D12 IOVCC GND Y1P Y1M D14 GND GND GND D16 D15 GND D17 D18 CLKSEL D19 GND IOVCC D20 D21 D25 D22 D23 D24 G2 G3 G4 G5 G6 G7 B0 B1 LVDS GND LVDS VCC Y2P Y2M GND CLKP CLKM GND Y3P Y3M B2 B3 B4 B5 B6 SHTDN PLLVCC LVDS GND +PLL GND D26 CLKIN PLL GND B7 HS VS EN CLK Figure 15. PCB Routing Example Submit Documentation Feedback Copyright © 2009, Texas Instruments Incorporated Product Folder Link(s): SN65LVDS93A 17 SN65LVDS93A SLLS992 – AUGUST 2009................................................................................................................................................................................................. www.ti.com 16-BIT BUS EXTENSION In a 16-bit bus application (Figure 16), TTL data and clock coming from bus transceivers that interface the backplane bus arrive at the Tx parallel inputs of the LVDS serdes transmitter. The clock associated with the bus is also connected to the device. The on-chip PLL synchronizes this clock with the parallel data at the input. The data is then multiplexed into three different line drivers which perform the TTL to LVDS conversion. The clock is also converted to LVDS and presented to a separate driver. This synchronized LVDS data and clock at the receiver, which recovers the LVDS data and clock, performs a conversion back to TTL. Data is then demultiplexed into a parallel format. An on-chip PLL synchronizes the received clock with the parallel data, and then all are presented to the parallel output port of the receiver. 16-Bit BTL Bus Interface SN74FB2032 SN74FB2032 CLK TTL Interface LVDS Interface 0 To 10 Meters (Media Dependent) SN65LVDS94 SN65LVDS93A TTL Interface D0–D7 8 8 D8–D15 8 8 D8–D15 XMIT Clock D0–D7 RCV Clock Backplane Bus 16-Bit BTL Bus Interface SN74FB2032 SN74FB2032 CLK Backplane Bus Figure 16. 16-Bit Bus Extension 16-BIT BUS EXTENSION WITH PARITY In the previous application we did not have a checking bit that would provide assurance that the data crosses the link. If we add a parity bit to the previous example, we would have a diagram similar to the one in Figure 17. The device following the SN74FB2032 is a low-cost parity generator. Each transmit-side transceiver/parity generator takes the LVTTL data from the corresponding transceiver, performs a parity calculation over the byte, and then passes the bits with its calculated parity value on the parallel input of the LVDS serdes transmitter. Again, the on-chip PLL synchronizes this transmit clock with the eighteen parallel bits (16 data + 2 parity) at the input. The synchronized LVDS data/parity and clock arrive at the receiver. The receiver performs the conversion from LVDS to LVTTL and the transceiver/parity generator performs the parity calculations. These devices compare their corresponding input bytes with the value received on the parity bit. The transceiver/parity generator will assert its parity error output if a mismatch is detected. 18 Submit Documentation Feedback Copyright © 2009, Texas Instruments Incorporated Product Folder Link(s): SN65LVDS93A SN65LVDS93A www.ti.com................................................................................................................................................................................................. SLLS992 – AUGUST 2009 16-Bit BTL Bus Interface TTL Interface LVDS Interface 0 To 10 Meters (Media Dependent) TTL Interface W/Parity SN65LVDS93A SN74FB2032 9 Bit Latchable Transceiver/ With Parity Generator 8 Parity Parity 8 D8–D15 SN74FB2032 9 Bit Latchable Transceiver/ With Parity Generator TTL Interface 16-Bit BTL Bus Interface SN65LVDS94 8 D0–D7 TTL Interface W/Parity 9 Bit Latchable Transceiver/ With Parity Generator 8 Parity Parity D0–D7 SN74FB2032 D8–D15 9 Bit Latchable Transceiver/ With Parity Generator SN74FB2032 Parity Error CLK XMIT Clock RCV Clock CLK Backplane Bus Backplane Bus Figure 17. 16-Bit Bus Extension With Parity LOW COST VIRTUAL BACKPLANE TRANSCEIVER Figure 18 represents LVDS serdes in an application as a virtual backplane transceiver (VBT). The concept of a VBT can be achieved by implementing individual LVDS serdes chipsets in both directions of subsystem serialized links. Depending on the application, the designer will face varying choices when implementing a VBT. In addition to the devices shown in Figure 18, functions such as parity and delay lines for control signals could be included. Using additional circuitry, half-duplex or full-duplex operation can be achieved by configuring the clock and control lines properly. The designer may choose to implement an independent clock oscillator at each end of the link and then use a PLL to synchronize LVDS serdes's parallel I/O to the backplane bus. Resynchronizing FIFOs may also be required. Figure 18. Virtual Backplane Transceiver Submit Documentation Feedback Copyright © 2009, Texas Instruments Incorporated Product Folder Link(s): SN65LVDS93A 19 PACKAGE OPTION ADDENDUM www.ti.com 4-Sep-2009 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty SN65LVDS93ADGG ACTIVE TSSOP DGG 56 SN65LVDS93ADGGR ACTIVE TSSOP DGG SN65LVDS93AZQLR ACTIVE BGA MI CROSTA R JUNI OR ZQL 35 Lead/Ball Finish MSL Peak Temp (3) Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR 56 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR 56 1000 Green (RoHS & no Sb/Br) SNAGCU Level-2-260C-1 YEAR (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. 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Addendum-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 3-Sep-2009 TAPE AND REEL INFORMATION *All dimensions are nominal Device SN65LVDS93ADGGR Package Package Pins Type Drawing TSSOP DGG 56 SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) 2000 330.0 24.4 Pack Materials-Page 1 8.6 B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant 15.6 1.8 12.0 24.0 Q1 PACKAGE MATERIALS INFORMATION www.ti.com 3-Sep-2009 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) SN65LVDS93ADGGR TSSOP DGG 56 2000 346.0 346.0 41.0 Pack Materials-Page 2 MECHANICAL DATA MTSS003D – JANUARY 1995 – REVISED JANUARY 1998 DGG (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE 48 PINS SHOWN 0,27 0,17 0,50 48 0,08 M 25 6,20 6,00 8,30 7,90 0,15 NOM Gage Plane 1 0,25 24 0°– 8° A 0,75 0,50 Seating Plane 0,15 0,05 1,20 MAX PINS ** 0,10 48 56 64 A MAX 12,60 14,10 17,10 A MIN 12,40 13,90 16,90 DIM 4040078 / F 12/97 NOTES: A. B. C. D. All linear dimensions are in millimeters. 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