TI SN65LVCP402RGER

SN65LVCP402
www.ti.com....................................................................................................................................................... SLLS699A – JUNE 2007 – REVISED JANUARY 2009
Gigabit 2x2 CROSSPOINT SWITCH
FEATURES
1
•
•
•
•
•
•
•
•
•
•
•
•
Up to 4.25 Gbps Operation
Non-blocking Architecture Allows Each
Output to be Connected to Any Input
30 ps of Deterministic Jitter
Selectable Transmit Pre-Emphasis Per Lane
Receive Equalization
Available Packaging 24 Pin QFN
Propagation Delay Times: 500 ps Typical
Inputs Electrically Compatible With
CML Signal Levels
Operates From a Single 3.3-V Supply
Ability to 3-STATE Outputs
Low Power: 290 mW (typ)
Integrated Termination Resistors
DESCRIPTION
The SN65LVCP402 is a 2x2 non-blocking crosspoint
switch in a flow-through pin-out allowing for ease in
PCB layout. VML signaling is used to achieve a
high-speed data throughput while using low power.
Each of the output drivers includes a 2:1 multiplexer
to allow any input to be routed to any output. Internal
signal paths are fully differential to achieve the high
signaling speeds while maintaining low signal skews.
The SN65LVCP402 incorporates 100-Ω termination
resistors for those applications where board space is
a premium. Built-in transmit pre-emphasis and
receive equalization for superior signal integrity
performance.
The SN65LVCP402 is characterized for operation
from -40°C to 85°C.
•
•
•
•
•
Clock Buffering/Clock MUXing
Wireless Base Stations
High-Speed Network Routing
Telecom/Datacom
XAUI 802.3ae Protocol Backplane Redundancy
EQ
APPLICATIONS
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2007–2009, Texas Instruments Incorporated
SN65LVCP402
SLLS699A – JUNE 2007 – REVISED JANUARY 2009....................................................................................................................................................... www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
LOGIC DIAGRAM
EQ
TERMINAL FUNCTIONS
TERMINAL
NAME
NO.
TYPE
DESCRIPTION
Differential Inputs (with 50-Ω
termination to VBB)
xA=P; xB=N
Line Side Differential Inputs CML compatible
High Speed I/O
xA
xB
2, 5
3, 6
xY
xZ
17, 14
16, 13
Differential Output xY=P; xZ=N
Switch Side Differential Outputs. VML
24, 7
Input
Data Enable; Active Low; LVTTL; When not enabled the output
is in 3-STATE mode for power savings
1, 18
Input; S1 = Channel 1
Switching Selection; LVTTL
Input; P11- Channel 1 bit one
Output Preemphasis Control; LVTTL
Input: Selection for Receive
Equalization Setting
EQ=1 (default) is for the 5 dB setting; EQ=0 is for the 12 dB
setting
Power
Power Supply 3.3 V ±5%
Control Signals
xDE
S1, S2
P11-P22
22, 21, 9, 10
EQ
23
Power Supply
VCC
8, 12, 19
GND
11, 15, 20
Thermal Pad
VBB
2
The ground center pad of the package must be connected to
GND plane with thermal vias.
Thermal Pad
4
Input
Receiver input biasing voltage. For ac coupling, VBB should be
left floating for optimal bias value. For dc coupling, VBB can
driven to change the common mode. VBB should not be tied to
ground.
Submit Documentation Feedback
Copyright © 2007–2009, Texas Instruments Incorporated
Product Folder Link(s): SN65LVCP402
SN65LVCP402
www.ti.com....................................................................................................................................................... SLLS699A – JUNE 2007 – REVISED JANUARY 2009
EQUIVALENT INPUT AND OUTPUT SCHEMATIC DIAGRAMS
VCC
IN+
RT(SE)
= 50 W
Gain
Stage
+ EQ
VCC
RBBDC
RT(SE)
= 50 W
IN−
VBB
ESD
LineEndTermination
Self−Biasing Network
Figure 1. Equivalent Input Circuit Design
OUT+
49.9 W
OUT−
49.9 W
VOCM
1 pF
Figure 2. Common-Mode Output Voltage Test Circuit
Table 1. CROSSPOINT LOGIC TABLES
OUTPUT CHANNEL 1 (1Y/1Z)
CONTROL
PINS
OUTPUT CHANNEL 2 (2Y/2Z)
INPUT
SELECTED
CONTROL
PINS
S1
INPUT
SELECTED
S2
0
1A/1B
0
1A/1B
1
2A/2B
1
2A/2B
AVAILABLE OPTIONS
(1)
(2)
TA
DESCRIPTION
-40°C to 85°C
Serial multiplexer
PACKAGED DEVICE (1) (2)
RGE (24 pin)
SN65LVCP402
The package is available taped and reeled. Add an R suffix to device types (e.g., SN65LVCP402RGER).
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com.
Submit Documentation Feedback
Copyright © 2007–2009, Texas Instruments Incorporated
Product Folder Link(s): SN65LVCP402
3
SN65LVCP402
SLLS699A – JUNE 2007 – REVISED JANUARY 2009....................................................................................................................................................... www.ti.com
DISSIPATION RATINGS
PACKAGE THERMAL CHARACTERISTICS (1)
Parameter
Conditions
θJA (junction-to-ambient) #1
4-layer JEDEC Board (JESD51-7), Airflow = 0 ft/min
106.6 C/W
θJA (junction-to-ambient) #2
4-layer JEDEC Board (JESD51-7) using 4 Thermal-vias of 22-mil diameter
each, Airflow = 0 ft/min
55.4 C/W
(1)
NOM
See application note SPRA953 for a detailed explanation of thermal parameters (http://www-s.ti.com/sc/psheets/spra953/spra953.pdf).
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range (unless otherwise noted) (1)
UNIT
VCC
Supply voltage range (2)
VI
Voltage range
ESD
TJ
–0.5 V to 6 V
Control inputs, all outputs
Receiver inputs
All pins
4 kV
Charged-Device Model (4)
All pins
500 V
See Package Thermal Characteristics
Table
Maximum junction temperature
2
Reflow temperature package soldering, 4 seconds
(2)
(3)
(4)
4
–0.5 V to 4 V
Human Body Model (3)
Moisture sensitivity level
(1)
–0.5 V to (VCC + 0.5 V)
260°C
Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
All voltage values, except differential I/O bus voltages, are with respect to network ground terminal.
Tested in accordance with JEDEC Standard 22, Test Method A114-A.
Tested in accordance with JEDEC Standard 22, Test Method C101.
Submit Documentation Feedback
Copyright © 2007–2009, Texas Instruments Incorporated
Product Folder Link(s): SN65LVCP402
SN65LVCP402
www.ti.com....................................................................................................................................................... SLLS699A – JUNE 2007 – REVISED JANUARY 2009
RECOMMENDED OPERATING CONDITIONS
dR
Operating data rate
VCC
Supply voltage
VCC(N)
Supply voltage noise amplitude
TJ
Junction temperature
TA
Operating free-air temperature (1)
MIN
NOM
MAX
UNIT
4.25
Gbps
3.135
3.3
3.465
10 Hz to 2 GHz
V
20
mV
125
°C
-40
85
°C
dR(in) ≤ 1.25 Gbps
100
1750
mVPP
1.25 Gbps < dR(in) ≤ 3.125 Gbps
100
1560
mVPP
dR(in) > 3.125 Gbps
100
1000
mVPP
Note: for best jitter performance ac
coupling is recommended.
1.5
DIFFERENTIAL INPUTS
Receiver peak-to-peak differential input
voltage (2)
VID
VICM
Receiver common-mode
input voltage
|V
VCC *
1.6
|
ID
2
V
CONTROL INPUTS
VIH
High-level input voltage
2
VCC + 0.3
V
VIL
Low-level input voltage
–0.3
0.8
V
120
Ω
DIFFERENTIAL OUTPUTS
RL
(1)
(2)
Differential load resistance
80
100
Maximum free-air temperature operation is allowed as long as the device maximum junction temperature is not exceeded.
Differential input voltage VID is defined as | IN+ – IN– |.
ELECTRICAL CHARACTERISTICS
over operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP (1)
MAX
UNIT
DIFFERENTIAL INPUTS
VIT+
Positive going differential
input high threshold
VIT–
Negative going differential
input low threshold
A(EQ)
Equalizer gain
RT(D)
Termination resistance,
differential
VBB
Open-circuit Input voltage
(input self-bias voltage)
R(BBDC)
Biasing network dc
impedance
R(BBAC)
Biasing network ac
impedance
50
–50
at 1.875 GHz (EQ=0)
mV
12
80
AC-coupled inputs
mV
100
dB
120
Ω
1.6
V
30
kΩ
375 MHz
42
1.875 GHz
8.4
RL = 100 Ω ±1%,
PRES_1 = PRES_0=0;
PREL_1 = PREL_0=0; 4 Gbps alternating
1010-pattern;
Figure 3
650
mVPP
–650
mVPP
Ω
DIFFERENTIAL OUTPUTS
VODH
High-level output voltage
VODL
Low-level output voltage
VODB(PP)
Output differential voltage
without preemphasis (2)
VOCM
Output common mode voltage
ΔVOC(SS)
Change in steady-state
common-mode output voltage
between logic states
(1)
(2)
1000
1300
1500
1.65
See Figure 2
1
mVPP
V
mV
All typical values are at TA = 25°C and VCC = 3.3 V supply unless otherwise noted. They are for reference purposes and are not
production tested.
Differential output voltage V(ODB) is defined as | OUT+ – OUT– |.
Submit Documentation Feedback
Copyright © 2007–2009, Texas Instruments Incorporated
Product Folder Link(s): SN65LVCP402
5
SN65LVCP402
SLLS699A – JUNE 2007 – REVISED JANUARY 2009....................................................................................................................................................... www.ti.com
ELECTRICAL CHARACTERISTICS (continued)
over operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
Output preemphasis voltage
ratio,
V(PE)
V
ODB(PP)
VODPE(PP)
MIN
TYP (1)
Px_2:Px_1 = 00
0
Px_2:Px_1 = 01
RL = 100 Ω ±1%;
x = Channel 1 or 2; Px_2:Px_1 = 10
See Figure 3
Px_2:Px_1= 11
3
MAX
UNIT
dB
6
9
t(PRE)
Preemphasis duration
measurement
Output preemphasis is set to 9 dB during test
PREx_x = 1;
Measured with a 100-MHz clock signal;
RL = 100 Ω ±1%, See Figure 4
175
ps
ro
Output resistance
Differential on-chip termination between OUT+ and
OUT–
100
Ω
CONTROL INPUTS
IIH
High-level Input current
VIN = VCC
IIL
Low-level Input current
VIN = GND
R(PU)
Pullup resistance
5
-125
µA
-90
µA
35
kΩ
POWER CONSUMPTION
PD
Device power dissipation
All outputs terminated 100 Ω
PZ
Device power dissipation in
3-state
All outputs in 3-state
ICC
Device current consumption
All outputs
terminated 100 Ω
290
414
mW
331
mW
115
mA
TYP (1)
MAX
UNIT
3
6
ns
0.5
0.7
ns
0.5
0.7
ns
PRBS 27-1 pattern at 4 Gbps
SWITCHING CHARACTERISTICS
over operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
MULTIPLEXER
t(SM)
Multiplexer switch time
Multiplexer to valid output
DIFFERENTIAL OUTPUTS
tPLH
Low-to-high propagation
delay
tPHL
High-to-low propagation
delay
tr
Rise time
tf
Fall time
tsk(p)
Pulse skew, | tPHL – tPLH | (2)
tsk(o)
Output skew
(3)
tsk(pp)
Part-to-part skew (4)
tzd
3-State switch time to
disable
tze
RJ
(1)
(2)
(3)
(4)
6
Propagation delay input to output
See Figure 6
20% to 80% of VO(DB); Test Pattern: 100-MHz clock signal;
See Figure 5 and Figure 8
80
ps
80
ps
20
ps
100
ps
300
ps
Assumes 50 Ω to Vcm and 150 pF load on each output
20
ns
3-State switch time to
enable
Assumes 50 Ω to Vcm and 150 pF load on each output
10
ns
Device random jitter, rms
See Figure 8 for test circuit.
BERT setting 10–15
Alternating 10-pattern.
2
ps-rms
All outputs terminated with 100 Ω
25
0.8
All typical values are at 25°C and with 3.3 V supply unless otherwise noted.
tsk(p) is the magnitude of the time difference between the tPLH and tPHL of any output of a single device.
tsk(o) is the magnitude of the time difference between the tPLH and tPHL of any two outputs of a single device.
tsk(pp) is the magnitude of the difference in propagation delay times between any specified terminals of two devices when both devices
operate with the same supply voltages, at the same temperature, and have identical packages and test circuits.
Submit Documentation Feedback
Copyright © 2007–2009, Texas Instruments Incorporated
Product Folder Link(s): SN65LVCP402
SN65LVCP402
www.ti.com....................................................................................................................................................... SLLS699A – JUNE 2007 – REVISED JANUARY 2009
SWITCHING CHARACTERISTICS (continued)
over operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
0 dB preemphasis
Intrinsic deterministic device (PREx_x = 0);
jitter (5) (6), peak-to-peak
See Figure 8 for the test
circuit.
DJ
(5)
(6)
(7)
PRBS 27-1
pattern
0 dB preemphasis
Absolute deterministic
(PREx_x = 0);
output jitter (7), peak-to-peak See Figure 8 for the test
circuit.
PRBS 27-1
pattern
MIN
TYP (1)
MAX
4 Gbps
UNIT
30
1.25 Gbps
Over 20-inch
FR4 trace
7
4 Gbps
Over FR4
trace 2-inch
to 20 inches
long
20
ps
ps
Intrinsic deterministic device jitter is a measurement of the deterministic jitter contribution from the device. It is derived by the equation
(DJ(OUT) – DJ(IN) ), where DJ(OUT) is the total peak-to-peak deterministic jitter measured at the output of the device in PSPP. DJ(IN) is the
peak-to-peak deterministic jitter of the pattern generator driving the device.
The SN65LVCP402 built-in passive input equalizer compensates for ISI. For a 20-inch FR4 transmission line with 8-mil trace width, the
LVCP402 typically reduces jitter by 60 ps from the device input to the device output.
Absolute deterministic output jitter reflects the deterministic jitter measured at the SN65LVCP402 output. The value is a real measured
value with a Bit error tester as described in Figure 8. The absolute DJ reflects the sum of all deterministic jitter components accumulated
over the link: DJ(absolute) = DJ(Signal generator) + DJ(transmission line) + DJ(intrinsic(LVCP402)).
Table 2. Preemphasis Controls Settings
(1)
Px_2 (1)
Px_1 (1)
OUTPUT
PREEMPHASIS
LEVEL IN dB
OUTPUT LEVEL IN mVPP
DE-EMPHASIZED
PRE-EMPHASIZED
TYPICAL FR4
TRACE LENGTH
0
0
0 dB
1200
1200
10 inches of FR4 trace
0
1
3 dB
850
1200
20 inches of FR4 trace
1
0
6 dB
600
1200
30 inches of FR4 trace
1
1
9 dB
425
1200
40 inches of FR4 trace
x = 1 or 2
Table 2. Receive Equalization Settings
EQ
Equalization
Typical Line Trace
1
5 dB
25 inches of FR4
12 dB
43 inches of FR4
0
Submit Documentation Feedback
Copyright © 2007–2009, Texas Instruments Incorporated
Product Folder Link(s): SN65LVCP402
7
SN65LVCP402
SLLS699A – JUNE 2007 – REVISED JANUARY 2009....................................................................................................................................................... www.ti.com
PARAMETER MEASUREMENT INFORMATION
1−bit
1 to N bit
3−dB Preemphasis
VODPE3(pp)
9−dB Preemphasis
VOCM
VODB(PP)
VODPE2(pp)
6−dB Preemphasis
VODPE1(pp)
0−dB Preemphasis
VOH
VOL
Figure 3. Preemphasis and Output Voltage Waveforms and Definitions
1−bit
VODPE3(pp)
9−dB Preemphasis
1 to N bit
VODB(PP)
80%
20%
tPRE
Figure 4. t(PRE) Preemphasis Duration Measurement
80%
80%
VODB
20%
20%
tr
tf
Figure 5. Driver Output Transition Time
8
Submit Documentation Feedback
Copyright © 2007–2009, Texas Instruments Incorporated
Product Folder Link(s): SN65LVCP402
SN65LVCP402
www.ti.com....................................................................................................................................................... SLLS699A – JUNE 2007 – REVISED JANUARY 2009
PARAMETER MEASUREMENT INFORMATION (continued)
VID = 0 V
IN
t PHLD
t PLHD
VOD = 0 V
OUT
Figure 6. Propagation Delay Input to Output
VA
0V
VB
Clock Input
0V
Ideal Output
VY − VZ
1/fo
1/fo
Period Jitter
Cycle-to-Cycle Jitter
Actual Output
Actual Output
0V
0V
VY − VZ
VY − VZ
tc(n)
tc(n)
tc(n +1)
tjit(cc) = | tc(n) − tc(n + 1) |
tjit(pp) = | tc(n) − 1/fo |
Peak-to-Peak Jitter
VA
PRBS Input
VY
0V
VB
PRBS Output
0V
VZ
tjit(pp)
A.
All input pulses are supplied by an Agilent 81250 Stimulus System.
B.
The measurement is made on a TEK TDS6604 running TDSJIT3 application software.
Figure 7. Driver Jitter Measurement Waveforms
Pattern
Generator
DC
Block
D+
Pre-amp
Coax
SMA
20−inch FR4
DC
Block
D−
400 mVPP
Differential
Coax
SMA
RX
+
EQ
M
U
X
<2” 50 Ω TL
SMA
<2” 50 Ω TL
SMA
DC
Block
Coax
OUT
0 dB
Coupled
Transmission line
DC
Block
Coax
SN65LVCP402
Jitter Test
Instrument
Characterization Test Board
Figure 8. AC Test Circuit — Jitter and Output Rise Time Test Circuit
The SN65LVCP402 input equalizer provides 5-dB frequency gain to compensate for frequency loss of a shorter
backplane transmission line. For characterization purposes, a 24-inch FR-4 coupled transmission line is used in
place of the backplane trace. The 24-inch trace provides roughly 5 dB of attenuation between 375 MHz and
1.875 GHz, representing closely the characteristics of a short backplane trace. The loss tangent of the FR4 in the
test board is 0.018 with an effective ε(r) of 3.1.
Submit Documentation Feedback
Copyright © 2007–2009, Texas Instruments Incorporated
Product Folder Link(s): SN65LVCP402
9
SN65LVCP402
SLLS699A – JUNE 2007 – REVISED JANUARY 2009....................................................................................................................................................... www.ti.com
TYPICAL DEVICE BEHAVIOR
Eye After 51 inch FR-4 Trace, Input 800 mVPP
Eye After 51 inch FR-4 Trace, Input 800 mVPP,
Through the 404 With Pre-emphasis at 3 dB
100 ps/div
Pre-emphasis Levels
50 ps/div
Figure 10. Preemphasis Signal Shape
NOTE: 51 Inch (128.54 cm) Input Trace, dR = 4.25
Gbps; 27- 1 PRBS
Figure 9. Data Input and Output Pattern
LVCP402
4.25 Gbps
Signal
Generator
7-1
PRBS 2
800 mVPP Input
35-inches,
88.9 cm FR4
51-inches,
129.54 cm FR4
35-inches,
88.9 cm FR4
Figure 11. Data Output Pattern
10
Submit Documentation Feedback
Copyright © 2007–2009, Texas Instruments Incorporated
Product Folder Link(s): SN65LVCP402
SN65LVCP402
www.ti.com....................................................................................................................................................... SLLS699A – JUNE 2007 – REVISED JANUARY 2009
TYPICAL CHARACTERISTICS
DETERMINISTIC OUTPUT JITTER
vs
DATA RATE
DIFFERENTIAL OUTPUT VOLTAGE
vs
DATA RATE
1.4
27-1 PRBS pattern,
A 22 inch FR-4 Trace 8-mil Wide is
Driving th LVCP402.
The DJ is Measured on the Output of the
LVCP402
40
35
12
Deterministic Output Jitter - ps
45
30
25
20
15
10
5
4.25 Gbps
10
3.75 Gbps
3.125 Gbps
8
6
4
2
0
2.5 Gbps
1.25 Gbps
-2
0
0
1
2
3
4
5
6
7
1.2
1
0.8
0.6
0.4
0.2
0
0
8
VOD - Differential Output Voltage - VPP
14
50
Deterministic Output Jitter - ps
DETERMINISTIC OUTPUT JITTER
vs
DIFFERENTIAL INPUT AMPLITUDE
DR - Data Rate - Gbps
1500
500
1000
2000
VID - Differential Input Amplitude - mV
Figure 12.
0
1
2
3
4
5
6
DR - Data Rate - Gbps
Figure 13.
SUPPLY NOISE vs DETERMINISTIC
JITTER
vs
DATA RATE
7
8
Figure 14.
DETERMINISTIC OUTPUT JITTER
vs
COMMON-MODE INPUT VOLTAGE
14
35
Deterministic Output Jitter - ps
Deterministic Output Jitter – ps
Noise = 200 mV
Noise = 650 mV
Noise = 300 mV
30
25
20
Noise = 50 mV
15
Noise = 100 mV
Noise = 400 mV
10
5
12
10
4.25 Gbps
8
6
4
2
0
0
0
1
4
3
2
DR – Data Rate – Gbps
5
0
1
2.5
3
0.5
2
1.5
VIC - Common Mode Input Voltage - V
Figure 15.
Figure 16.
Submit Documentation Feedback
Copyright © 2007–2009, Texas Instruments Incorporated
Product Folder Link(s): SN65LVCP402
11
SN65LVCP402
SLLS699A – JUNE 2007 – REVISED JANUARY 2009....................................................................................................................................................... www.ti.com
APPLICATION INFORMATION
BANDWIDTH REQUIREMENTS
Error free transmission of data over a transmission line has specific bandwidth demands. It is helpful to analyze
the frequency spectrum of the transmit data first. For an 8B10B coded data stream at 3.75 Gbps of random data,
the highest bit transition density occurs with a 1010 pattern (1.875 GHz). The least transition density in 8B10B
allows for five consecutive ones or zeros. Hence, the lowest frequency of interest is 1.875 GHz/5 = 375 MHz.
Real data signals consist of higher frequency components than sine waves due to the fast rise time. The faster
the rise time, the more bandwidth becomes required. For 80-ps rise time, the highest important frequency
component is at least 0.6/(π × 80 ps) = 2.4 GHz. Figure 17shows the Fourier transformation of the 375-MHz and
1.875-GHz trapezoidal signal.
Signal Amplitude − dB
0
20 dB/dec
1875 MHz With
80 ps Rise Time
−5
20 dB/dec
375 MHz With
80 ps Rise Time
−10
40 dB/dec
−15
80%
20%
tr
−20
−25
40 dB/dec
tPeriod = 1/f
100
1000
f − Frequency − MHz
1/(pi x 100/60 tr) = 2.4 GHz
10000
Figure 17. Approximate Frequency Spectrum of the Transmit Output Signal With 80 ps Rise Time
The spectrum analysis of the data signal suggests building a backplane with little frequency attenuation up to
2 GHz. Practically, this is achievable only with expensive, specialized PCB material. To support material like
FR4, a compensation technique is necessary to compensate for backplane imperfections.
EXPLANATION OF EQUALIZATION
Backplane designs differ widely in size, layer stack-up, and connector placement. In addition, the performance is
impacted by trace architecture (trace width, coupling method) and isolation from adjacent signals. Common to
most commercial backplanes is the use of FR4 as board material and its related high-frequency signal
attenuation. Within a backplane, the shortest to longest trace lengths differ substantially – often ranging from
8 inches up to 40 inches. Increased loss is associated with longer signal traces. In addition, the backplane
connector often contributes a good amount of signal attenuation. As a result, the frequency signal attenuation for
a 300-MHz signal might range from 1 dB to 4 dB while the corresponding attenuation for a 2-GHz signal might
span 6 dB to 24 dB. This frequency dependent loss causes distortion jitter on the transmitted signal. Each
LVCP402 receiver input incorporates an equalizer and compensates for such frequency loss. The
SN65LVCP402 equalizer provides 5/12 dB of frequency gain between 375 MHz and 1.875 GHz, compensating
roughly for 20 inches of FR4 material with 8-mil trace width. Distortion jitter improvement is substantial, often
providing more than 30-ps jitter reduction. The 5-dB compensation is sufficient for most short backplane traces.
For longer trace lengths, it is recommended to enable transmit preemphasis in addition.
12
Submit Documentation Feedback
Copyright © 2007–2009, Texas Instruments Incorporated
Product Folder Link(s): SN65LVCP402
SN65LVCP402
www.ti.com....................................................................................................................................................... SLLS699A – JUNE 2007 – REVISED JANUARY 2009
SETTING THE PREEMPHASIS LEVEL
The receive equalization compensates for ISI. This reduces jitter and opens the data eye. In order to find the
best preemphasis setting for each link, calibration of every link is recommended. Assuming each link consists of
a transmitter (with adjustable pre-emphasis such as LVCP402) and the LVCP402 receiver, the following steps
are necessary:
1. Set the transmitter and receiver to 0-dB preemphasis; record the data eye on the LVCP402 receiver output.
2. Increase the transmitter preemphasis until the data eye on the LVCP402 receiver output looks the cleanest.
Submit Documentation Feedback
Copyright © 2007–2009, Texas Instruments Incorporated
Product Folder Link(s): SN65LVCP402
13
PACKAGE OPTION ADDENDUM
www.ti.com
26-Jan-2009
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
SN65LVCP402RGER
ACTIVE
VQFN
RGE
24
3000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
SN65LVCP402RGERG4
ACTIVE
VQFN
RGE
24
3000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
SN65LVCP402RGET
ACTIVE
VQFN
RGE
24
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
SN65LVCP402RGETG4
ACTIVE
VQFN
RGE
24
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
Lead/Ball Finish
MSL Peak Temp (3)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
14-Jul-2012
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
SN65LVCP402RGER
VQFN
RGE
24
3000
330.0
12.4
4.25
4.25
1.15
8.0
12.0
Q2
SN65LVCP402RGET
VQFN
RGE
24
250
180.0
12.4
4.25
4.25
1.15
8.0
12.0
Q2
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
14-Jul-2012
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
SN65LVCP402RGER
VQFN
RGE
24
3000
367.0
367.0
35.0
SN65LVCP402RGET
VQFN
RGE
24
250
210.0
185.0
35.0
Pack Materials-Page 2
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46C and to discontinue any product or service per JESD48B. Buyers should
obtain the latest relevant information before placing orders and should verify that such information is current and complete. All
semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale supplied at the time
of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components which meet ISO/TS16949 requirements, mainly for automotive use. Components which
have not been so designated are neither designed nor intended for automotive use; and TI will not be responsible for any failure of such
components to meet such requirements.
Products
Applications
Audio
www.ti.com/audio
Automotive and Transportation www.ti.com/automotive
Amplifiers
amplifier.ti.com
Communications and Telecom www.ti.com/communications
Data Converters
dataconverter.ti.com
Computers and Peripherals
www.ti.com/computers
DLP® Products
www.dlp.com
Consumer Electronics
www.ti.com/consumer-apps
DSP
dsp.ti.com
Energy and Lighting
www.ti.com/energy
Clocks and Timers
www.ti.com/clocks
Industrial
www.ti.com/industrial
Interface
interface.ti.com
Medical
www.ti.com/medical
Logic
logic.ti.com
Security
www.ti.com/security
Power Mgmt
power.ti.com
Space, Avionics and Defense
www.ti.com/space-avionics-defense
Microcontrollers
microcontroller.ti.com
Video and Imaging
www.ti.com/video
RFID
www.ti-rfid.com
OMAP Mobile Processors
www.ti.com/omap
TI E2E Community
e2e.ti.com
Wireless Connectivity
www.ti.com/wirelessconnectivity
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2012, Texas Instruments Incorporated