3.5x2.0mm SMD CHIP LED LAMP APK3520SYCK Features Description ! 3.5mmX2.0mm SMT !LOW LED, 1.3mm THICKNESS. POWER CONSUMPTION. ! WIDE ! IDEAL SUPER BRIGHT YELLOW VIEWING ANGLE. The Super Bright Yellow source color devices are made with DH InGaAlP on GaAs substrate Light Emitting Diode. FOR BACKLIGHT AND INDICATOR. ! VARIOUS COLORS AND LENS TYPES AVAILABLE. !PACKAGE : 2000PCS / REEL. Package Dimensions Notes: 1. All dimensions are in millimeters (inches). 2. Tolerance is ±0.2(0.0079") unless otherwise noted. 3. Specifications are subject to change without notice. SPEC NO:DSAD1165 APPROVED : J. Lu REV NO: V.1 CHECKED : Allen Liu DATE:MAR/27/2003 DRAWN:D.L.HUANG PAGE: 1 OF 4 Selection Guide Par t No . Dic e APK3520SYCK Iv (m c d ) @ 20 m A L en s Ty p e SUPER BRIGHT YELLOW(InGaAlP) WATER CLEAR V i ew i n g An g l e Min . Ty p . 2θ1/2 50 85 120° Note: 1. θ1/2 is the angle from optical centerline where the luminous intensity is 1/2 the optical centerline value. Electrical / Optical Characteristics at T)=25°°C Sy m b o l Par am et er D ev i c e λpeak Peak Wavelength Super Bright Yellow λD Dominate Wavelength ∆λ1/2 Ty p . Max . Un it s Tes t Co n d it io n s 590 nm I F =20mA Super Bright Yellow 590 nm I F =20mA Spectral Line Half-width Super Bright Yellow 20 nm I F =20mA C Capacitance Super Bright Yellow 20 pF V F =0V;f =1MHz VF Forward Voltage Super Bright Yellow 2.0 2.5 V I F =20mA IR Reverse Current Super Bright Yellow 10 uA V R = 5V Absolute Maximum Ratings at T)=25°°C Par am et er Su p er B r ig h t Yello w Un it s Power dissipation 125 mW DC Forward Current 30 mA Peak Forward Current [1] 17 5 mA Reverse Voltage 5 V Operating/Storage Temperature -40°C To +85°C Note: 1. 1/10 Duty Cycle, 0.1ms Pulse Width. SPEC NO:DSAD1165 APPROVED : J. Lu REV NO: V.1 CHECKED : Allen Liu DATE:MAR/27/2003 DRAWN:D.L.HUANG PAGE: 2 OF 4 Super Bright Yellow SPEC NO:DSAD1165 APPROVED : J. Lu APK3520SYCK REV NO: V.1 CHECKED : Allen Liu DATE:MAR/27/2003 DRAWN:D.L.HUANG PAGE: 3 OF 4 APK3520SYCK SMT Reflow Soldering Instructions Number of reflow process shall be less than 2 times and cooling process to normal temperature is required between first and second soldering process. Recommended Soldering Pattern (Units : mm) Tape Specifications (Units : mm) SPEC NO:DSAD1165 APPROVED : J. Lu REV NO: V.1 CHECKED : Allen Liu DATE:MAR/27/2003 DRAWN:D.L.HUANG PAGE: 4 OF 4