HITACHI 2SK1095

2SK1095
Silicon N-Channel MOS FET
Application
TO–220FM
High speed power switching
Features
•
•
•
•
Low on-resistance
High speed switching
Low drive current
4 V gate drive device
– Can be driven from 5 V source
• Suitable for motor drive, DC-DC converter,
power switch and solenoid drive
2
12
3
1
1. Gate
2. Drain
3. Source
3
Table 1 Absolute Maximum Ratings (Ta = 25°C)
Item
Symbol
Ratings
Unit
———————————————————————————————————————————
Drain to source voltage
VDSS
60
V
———————————————————————————————————————————
Gate to source voltage
VGSS
±20
V
———————————————————————————————————————————
Drain current
ID
25
A
———————————————————————————————————————————
Drain peak current
ID(pulse)*
100
A
———————————————————————————————————————————
Body to drain diode reverse drain current
IDR
25
A
———————————————————————————————————————————
Channel dissipation
Pch**
30
W
———————————————————————————————————————————
Channel temperature
Tch
150
°C
———————————————————————————————————————————
Storage temperature
Tstg
–55 to +150
°C
———————————————————————————————————————————
*
PW ≤ 10 µs, duty cycle ≤ 1 %
** Value at TC = 25 °C
2SK1095
Table 2 Electrical Characteristics (Ta = 25°C)
Item
Symbol
Min
Typ
Max
Unit
Test conditions
———————————————————————————————————————————
Drain to source breakdown
voltage
V(BR)DSS
60
—
—
V
ID = 10 mA, VGS = 0
———————————————————————————————————————————
Gate to source breakdown
voltage
V(BR)GSS
±20
—
—
V
IG = ±100 µA, VDS = 0
———————————————————————————————————————————
Gate to source leak current
IGSS
—
—
±10
µA
VGS = ±16 V, VDS = 0
———————————————————————————————————————————
Zero gate voltage drain current
IDSS
—
—
250
µA
VDS = 50 V, VGS = 0
———————————————————————————————————————————
Gate to source cutoff voltage
VGS(off)
1.0
—
2.0
V
ID = 1 mA, VDS = 10 V *
———————————————————————————————————————————
Static drain to source on state
resistance
RDS(on)
—
0.033
0.04
Ω
ID = 15 A, VGS = 10 V *
———————
——————————–
0.05
ID = 15 A, VGS = 4 V *
0.06
———————————————————————————————————————————
Forward transfer admittance
|yfs|
12
20
—
S
ID = 15 A, VDS = 10 V
———————————————————————————————————————————
Input capacitance
Ciss
—
1400
—
pF
VDS = 10 V, VGS = 0,
————————————————————————————————
Output capacitance
Coss
—
720
—
pF
f = 1 MHz
————————————————————————————————
Reverse transfer capacitance
Crss
—
220
—
pF
———————————————————————————————————————————
Turn-on delay time
td(on)
—
15
—
ns
————————————————————————————————
Rise time
tr
—
130
—
ns
ID = 15 A, VGS = 10 V,
RL = 2 Ω
————————————————————————————————
Turn-off delay time
td(off)
—
270
—
ns
————————————————————————————————
Fall time
tf
—
180
—
ns
———————————————————————————————————————————
Body to drain diode forward
voltage
VDF
—
1.3
—
V
IF = 25 A, VGS = 0
———————————————————————————————————————————
Body to drain diode reverse
recovery time
trr
—
135
—
ns
IF = 25 A, VGS = 0,
diF/dt = 50 A/µs
———————————————————————————————————————————
* Pulse Test
See characterist curves of 2SK972.
2SK1095
Power vs. Temperature Derating
Maximum Safe Operation Area
10
µs
0
m
s
10
s
m
)
ot
=
(T C
Sh
n
tio
(1
ra
3
µs
1
=
pe
O
20
is
th
in ted
n i
30
io m
at is li (on)
r
pe ea DS
10 O ar y R
b
10
40
100
PW
Drain Current ID (A)
500
300
C
D
1.0
)
°C
25
Channel Dissipation Pch (W)
60
Ta = 25°C
0.5
Normalized Transient Thermal Impedance γS (t)
0
50
100
Case Temperature TC (°C)
150
1
0.3
1.0
3
10
30 100
Drain to Source Voltage VDS (V)
Normalized Transient Thermal Impedance vs. Pulse Width
3
1.0
TC = 25°C
D=1
0.5
0.3
0.2
θch–c(t) = γS(t) · θch–c
θch–c = 4.17°C/W, TC = 25°C
PDM
D = PW
T
PW
T
0.1
0.1
0.05
0.03
0.01
10 µ
0.02
ulse
0.01 hot P
S
1
100 µ
1m
10 m
Pulse Width PW (s)
100 m
1
10