HITACHI HD74AC175

HD74AC175
Quad D-Type Flip-Flop
Description
The HD74AC175 is a high-speed quad D flip-flop. The device is useful for general flip-flop requirements
where clock and clear inputs are common. The information on the D inputs is stored during the Low-toHigh clock transition. Both true and complemented outputs of each flip-flop are provided. A Master Reset
input resets all flip-flops, independent of the Clock or D inputs, when Low.
Features
•
•
•
•
•
Edge-Triggered D-Type Inputs
Buffered Positive Edge-Triggered Clock
Asynchronous Common Reset
True and Complement Output
Outputs Source/Sink 24 mA
HD74AC175
Pin Arrangement
MR 1
16 VCC
Q0 2
15 Q3
Q0 3
14 Q3
D0 4
13 D3
D1 5
12 D2
Q1 6
11 Q2
Q1 7
10 Q2
GND 8
9 CP
(Top view)
Logic Symbol
D0
D1
D2
D3
CP
MR
Q0 Q0 Q1 Q1 Q2 Q2 Q3 Q3
Pin Names
D0 to D3
CP
MR
Q0 to Q3
Q0 to Q 3
2
Data Inputs
Clock Pulse Input
Master Reset Input
True Outputs
Complement Outputs
HD74AC175
Functional Description
The HD74AC175 consists of four edge-triggered D flip-flops with individual D inputs and Q and Q
outputs. The Clock and Master Reset are common. The four flip-flops will store the state of their
individual D inputs on the Low-to-High clock (CP) transition, causing individual Q and Q outputs to
follow. A Low input on the Master Reset (MR) will force all Q outputs Low and Q outputs High
independent of Clock or Data inputs. The HD74AC175 is useful for general logic applications where a
common Master Reset and Clock are acceptable.
Truth Table
Inputs
Outputs
@ tn, MR = H
@ tn+1
Dn
Qn
Qn
L
L
H
H
H
L
H :
L :
tn :
t n + 1:
High Voltage Level
Low Voltage Level
Bit Time before Clock Pulse
Bit Time after Clock Pulse
Logic Diagram
MR CP D3
D2
D
Q
D1
D
CP Q
CD
Q
D
CP Q
CD
Q3 Q3
D0
Q
D
CP Q
CD
Q2 Q2
Q
CP Q
CD
Q1 Q1
Q0 Q0
Please note that this diagram is provided only for the understanding of logic operations and should not be
used to estimate propagation delays.
3
HD74AC175
DC Characteristics (unless otherwise specified)
Item
Symbol
Max
Unit
Condition
Maximum quiescent supply current
I CC
80
µA
VIN = VCC or ground, VCC = 5.5 V,
Ta = Worst case
Maximum quiescent supply current
I CC
8.0
µA
VIN = VCC or ground, VCC = 5.5 V,
Ta = 25°C
AC Characteristics
Ta = +25°C
CL = 50 pF
Ta = –40°C to +85°C
CL = 50 pF
Item
Symbol
VCC (V)*1
Min
Typ
Max
Min
Max
Unit
Maximum clock
f max
3.3
149
—
—
139
—
MHz
5.0
187
—
—
187
—
3.3
1.0
9.5
12.0
1.0
13.5
5.0
1.0
7.0
9.0
1.0
9.5
3.3
1.0
8.5
13.0
1.0
14.5
5.0
1.0
6.0
9.5
1.0
10.5
3.3
1.0
7.5
12.5
1.0
13.5
5.0
1.0
5.5
9.0
1.0
10.0
3.3
1.0
8.5
11.0
1.0
12.5
5.0
1.0
6.0
8.5
1.0
9.5
frequency
Propagation delay
t PLH
CP to Qn or Qn
Propagation delay
t PHL
CP to Qn or Qn
Propagation delay
t PLH
MR to Qn
Propagation delay
MR to Q n
Note:
4
t PHL
1. Voltage Range 3.3 is 3.3 V ± 0.3 V
Voltage Range 5.0 is 5.0 V ± 0.5 V
ns
ns
ns
ns
HD74AC175
AC Operating Requirements
Ta = –40°C
to +85°C
CL = 50 pF
Ta = +25°C
CL = 50 pF
Item
Symbol
VCC (V)*1 Typ
Guaranteed Minimum
Unit
Set-up time, HIGH or LOW
t su
3.3
2.0
4.5
4.5
ns
5.0
1.0
3.0
3.0
3.3
0
1.0
1.0
5.0
0
1.0
1.0
3.3
2.5
4.5
4.5
5.0
2.0
3.5
3.5
3.3
2.5
4.5
5.0
5.0
2.0
3.5
3.5
3.3
–2.0
0.0
0.0
5.0
–1.0
0.0
0.0
Dn to CP
Hold time, HIGH or LOW
th
Dn to CP
CP pulse width HIGH or LOW
MR pulse width, LOW
Recovery time MR to CP
Note:
tw
tw
t rec
ns
ns
ns
ns
1. Voltage Range 3.3 is 3.3 V ± 0.3 V
Voltage Range 5.0 is 5.0 V ± 0.5 V
Capacitance
Item
Symbol
Typ
Unit
Condition
Input capacitance
CIN
4.5
pF
VCC = 5.5 V
Power dissipation capacitance
CPD
45.0
pF
VCC = 5.0 V
5
Unit: mm
19.20
20.00 Max
1
7.40 Max
9
6.30
16
8
1.3
0.48 ± 0.10
2.54 Min 5.06 Max
2.54 ± 0.25
0.51 Min
1.11 Max
7.62
+ 0.13
0.25 – 0.05
0° – 15°
Hitachi Code
JEDEC
EIAJ
Weight (reference value)
DP-16
Conforms
Conforms
1.07 g
Unit: mm
10.06
10.5 Max
9
1
8
1.27
*0.42 ± 0.08
0.40 ± 0.06
0.10 ± 0.10
0.80 Max
*0.22 ± 0.05
0.20 ± 0.04
2.20 Max
5.5
16
0.20
7.80 +– 0.30
1.15
0° – 8°
0.70 ± 0.20
0.15
0.12 M
*Dimension including the plating thickness
Base material dimension
Hitachi Code
JEDEC
EIAJ
Weight (reference value)
FP-16DA
—
Conforms
0.24 g
Unit: mm
9.9
10.3 Max
9
1
8
0.635 Max
*0.42 ± 0.08
0.40 ± 0.06
0.15
*0.22 ± 0.03
0.20 ± 0.03
1.27
0.11
0.14 +– 0.04
1.75 Max
3.95
16
0.10
6.10 +– 0.30
1.08
0° – 8°
0.67
0.60 +– 0.20
0.25 M
*Dimension including the plating thickness
Base material dimension
Hitachi Code
JEDEC
EIAJ
Weight (reference value)
FP-16DN
Conforms
Conforms
0.15 g
Unit: mm
4.40
5.00
5.30 Max
16
9
1
8
0.65
0.13 M
1.10 Max
0.65 Max
0.10
*Dimension including the plating thickness
Base material dimension
6.40 ± 0.20
0.07 +0.03
–0.04
0.20 ± 0.06
1.0
*0.17 ± 0.05
0.15 ± 0.04
0.08
*0.22 +– 0.07
0° – 8°
0.50 ± 0.10
Hitachi Code
JEDEC
EIAJ
Weight (reference value)
TTP-16DA
—
—
0.05 g
Cautions
1. Hitachi neither warrants nor grants licenses of any rights of Hitachi’s or any third party’s patent,
copyright, trademark, or other intellectual property rights for information contained in this document.
Hitachi bears no responsibility for problems that may arise with third party’s rights, including
intellectual property rights, in connection with use of the information contained in this document.
2. Products and product specifications may be subject to change without notice. Confirm that you have
received the latest product standards or specifications before final design, purchase or use.
3. Hitachi makes every attempt to ensure that its products are of high quality and reliability. However,
contact Hitachi’s sales office before using the product in an application that demands especially high
quality and reliability or where its failure or malfunction may directly threaten human life or cause risk
of bodily injury, such as aerospace, aeronautics, nuclear power, combustion control, transportation,
traffic, safety equipment or medical equipment for life support.
4. Design your application so that the product is used within the ranges guaranteed by Hitachi particularly
for maximum rating, operating supply voltage range, heat radiation characteristics, installation
conditions and other characteristics. Hitachi bears no responsibility for failure or damage when used
beyond the guaranteed ranges. Even within the guaranteed ranges, consider normally foreseeable
failure rates or failure modes in semiconductor devices and employ systemic measures such as failsafes, so that the equipment incorporating Hitachi product does not cause bodily injury, fire or other
consequential damage due to operation of the Hitachi product.
5. This product is not designed to be radiation resistant.
6. No one is permitted to reproduce or duplicate, in any form, the whole or part of this document without
written approval from Hitachi.
7. Contact Hitachi’s sales office for any questions regarding this document or Hitachi semiconductor
products.
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