PF0121 MOS FET Power Amplifier Module for GSM Mobile Phone ADE-208-097A (Z) 2nd Edition July 1996 Application For GSM CLASS2 890 to 915 MHz Features • Low power control current: 0.9 mA Typ • High speed switching: 1.5 µsec Typ • Wide power control range: 100 dB Typ Pin Arrangement • RF-B2 5 4 3 2 5 1 1: Pin 2: VAPC 3: VDD 4: Pout 5: GND PF0121 Internal Diagram and External Circuit G G GND GND Pin1 Pin Pin2 VAPC Z1 FB1 Pin Pin3 VDD C2 FB2 VAPC Pin4 Pout C1 VDD Z2 Pout C1 = 0.01 µF (Ceramic chip capacitor) C2 = 330 µF (Aluminum Electrolyte Capacitor) FB = Ferrite bead BL01RN1-A62-001 (Manufacture: MURATA) or equivalent Z1 = Z2 = 50 Ω (Microstrip line) Absolute Maximum Ratings (Tc = 25°C) Item Symbol Rating Unit Supply voltage VDD 17 V Supply current I DD 6 A APC voltage VAPC 8 V Input power Pin 20 mW Operating case temperature Tc (op) –30 to +110 °C Storage temperature Tstg –40 to +110 °C 2 PF0121 Electrical Characteristics (Tc = 25°C) Item Symbol Min Typ Max Unit Test Condition Drain cutoff current I DS — — 500 µA VDD = 17 V, VAPC = 0 V Total efficiency ηT 30 35 — % Pin = 2 mW, VDD = 12.5 V, 2nd harmonic distortion 2nd H.D. — –50 –40 dBc Pout = 13 W (at APC controlled), 3rd harmonic distortion 3rd H.D. — –55 –45 dBc RL = Rg = 50 Ω, Tc = 25°C Input VSWR VSWR (in) — 2 3 — Output power (1) Pout (1) 17 23 — W Pin = 2 mW, VDD = 12.5 V, VAPC = 7 V, RL =Rg = 50 Ω, Tc = 25°C Output power (2) Pout (2) 9 12 — W Pin = 2 mW, VDD = 10.3V, VAPC = 7 V, RL = Rg = 50 Ω, Tc = 80°C Isolation — — –60 –40 dBm Pin = 2 mW, VDD = 12.5 V, VAPC = 0.5 V, RL = Rg = 50 Ω, Tc = 25°C Switching time t r, t f — 1.5 2 µs Pin = 2 mW, VDD = 12.5 V, Pout = 13 W, RL = Rg = 50 Ω, Tc = 25°C Stability — No parasitic oscillation — Pin = 2 mW, VDD = 12.5 V, Pout ≤ 13 W (at APC controlled), Rg = 50 Ω, Tc = 25°C, Output VSWR = 20:1 All phases Test System Diagram S.G VAPC VDD Power Meter L.P.F Spectrum Analyzer 3dB ATT Test Fixture Directional Coupler RF SW. Directional Coupler Phase Shifter Power Meter Short 3 PF0121 Switching Time Test Diagram VDD=12.5 V S.G Z=50Ω Pin D.U.T P.G f=10 kHz Pout VAPC 1SS106 100p Oscillo Scope 2p 2p 50% 1SS106 50% VAPC 2.2 kΩ 95% Vout Vout 4 Duty=1/8 Power Meter 5% tr tf PF0121 Test Fixture Pattern Unit: mm 26.5 28 2.88 6 4 4 1.5 3.5 2.88 16 4.5 3 VAPC 3.5 16.5 4 15 4 4 2.88 2.88 80 VDD 100 Grass Epoxy Double sided PCB (t = 1.6 mm, εr = 4.8) C1=0.01µF (Ceramic Chip Capacitor) C2=330µF (Aluminum Electrolyte Capacitor) L1=L2 : BLO2RN1-R62 (Manufacturer : MURATA) or equivalent (Ferrite Bead Inductor) The coefficient of RF line loss in the P.C.B is showed bellow. 1/ (S21)2 = 1/ (0.9805)2 = 1.068 Mechanical Characteristics Item Conditions Spec Torque for screw up the heatsink flange M3 Screw Bolts 4 to 6 kg•cm Warp size of the heatsink flange: S S=0 +0.3/–0 mm S 5 PF0121 Note for Use • Unevenness and distortion at the surface of the heatsink attached module should be less than 0.05 mm. • It should not be existed any dust between module and heatsink. • MODULE should be separated from PCB less than 1.5 mm. Soldering temperature and soldering time should be less than 230°C, 10 sec. (Soldering position spaced from the root point of the lead frame: 2 mm) • Recommendation of thermal joint compounds is TYPE G746. (Manufacturer: Shin-Etsu Chemical, Co., Ltd.) • To protect devices from electro-static damage, soldering iron, measuring-equipment and human body etc. should be grounded. • Torque for screw up the heatsink flange should be 4 to 6 kg · cm with M3 screw bolts. • Don't solder the flange directly. • It should make the lead frame as straight as possible. • The module should be screwed up before lead soldering. • It should not be given mechanical and thermal stress to lead and flange of the module. • When the external parts (Isolator, Duplexer, etc.) of the module are changed, the electrical characteristics should be evaluated enough. • Don't washing the module except lead pins. • To get good stability, ground impedance between the module GND flange and PCB GND pattern should be designed as low as possible. 6 PF0121 Characteristic Curves VAPC, ηT, VSWR (in) vs. VDD (1) 6 10 50 f=890 MHz, Pin=2 mW Pout=13 W, Tc=25°C, Rg=Rl=50 Ω 3 Apc Voltage VAPC (V) V.S.W.R. (in) 4 40 ηT 6 30 VAPC 4 2 2 1 0 10 20 VSWRin 11 12 13 14 Efficiency ηT (%) 8 5 10 15 0 16 Supply Voltage VDD (V) VAPC, ηT, VSWR (in) vs. VDD (2) 6 10 50 f=915 MHz, Pin=2 mW Pout=13 W, Tc=25°C, Rg=Rl=50 Ω 8 3 2 40 ηT 6 30 VAPC 4 20 2 Efficiency ηT (%) 4 Apc Voltage VAPC (V) V.S.W.R. (in) 5 10 VSWRin 1 0 10 11 12 13 14 15 0 16 Supply Voltage VDD (V) 7 PF0121 50 35 f = 890 MHz V =12.5 V DD Pin = 2 mW VDD=15.6 V Tc = 25°C 30 Rg = Rl = 50Ω 10.8 V 25 15.6 V 12.5 V Efficiency ηT (%) 40 30 20 10.8 V 15 20 ηT 10 Output Power Pout (W) ηT, Pout vs. VAPC (1) 10 5 Pout 0 0 0 4 2 6 8 Apc Voltage VAPC (V) ηT, Pout vs. VAPC (2) f = 915 MHz Pin = 2 mW Tc = 25°C Rg = Rl = 50Ω Efficiency ηT (%) 40 35 VDD=15.6 V VDD=15.6 V 30 12.5 V 25 10.8 V 12.5 V 30 20 10.8 V ηT 15 20 10 10 Pout 5 0 0 0 2 4 Apc Voltage VAPC (V) 8 6 8 Output Power Pout (W) 50 PF0121 VAPC, ηT, VSWR (in) vs. Pin (1) 6 10 50 f=890 MHz, VDD=12.5 V, Pout=13 W, Tc=25°C, Rg=Rl=50 Ω 8 3 40 ηT 6 30 4 20 Efficiency ηT (%) 4 Apc Voltage VAPC (V) V.S.W.R. (in) 5 VAPC 2 2 1 0 10 VSWRin 0 2 6 4 8 0 10 Input Power Pin (mW) VAPC, ηT, VSWR (in) vs. Pin (2) 6 10 50 f=915 MHz, VDD=12.5 V, Pout=13 W, Tc=25°C, Rg=Rl=50 Ω 3 Apc Voltage VAPC (V) V.S.W.R. (in) 4 40 ηT 6 30 4 20 Efficiency ηT (%) 8 5 VAPC 2 2 1 0 10 VSWRin 0 2 4 6 8 0 10 Input Power Pin (mW) 9 PF0121 VAPC, ηT, VSWR (in) vs. Frequency 6 10 50 Pin=2 mW, VDD=12.5 V, Pout=13 W, Tc=25°C, Rg=Rl=50 Ω 3 40 ηT 6 30 4 20 VAPC 2 2 1 0 890 10 VSWRin 895 900 905 Frequency f (MHz) 10 910 0 915 Efficiency ηT (%) 4 8 Apc Voltage VAPC (V) V.S.W.R. (in) 5 PF0121 Package Dimensions 60.5 ± 0.5 57.5 ± 0.5 3 13.0 ± 1 49.8 ± 0.5 0.25 2.3 0.6 5.0 +– 0.3 0.5 4 3.3 2 5±1 1 R1.6 6.35 ± 0.5 11.0 ± 0.3 12.7 ± 0.5 Unit: mm 9.2 ± 1 8.0 ± 1 22.0 ± 1 Hitachi Code JEDEC EIAJ Weight (reference value) RF-B2 — — 16 g 11 Cautions 1. Hitachi neither warrants nor grants licenses of any rights of Hitachi’s or any third party’s patent, copyright, trademark, or other intellectual property rights for information contained in this document. Hitachi bears no responsibility for problems that may arise with third party’s rights, including intellectual property rights, in connection with use of the information contained in this document. 2. Products and product specifications may be subject to change without notice. Confirm that you have received the latest product standards or specifications before final design, purchase or use. 3. Hitachi makes every attempt to ensure that its products are of high quality and reliability. However, contact Hitachi’s sales office before using the product in an application that demands especially high quality and reliability or where its failure or malfunction may directly threaten human life or cause risk of bodily injury, such as aerospace, aeronautics, nuclear power, combustion control, transportation, traffic, safety equipment or medical equipment for life support. 4. 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Ltd. 16 Collyer Quay #20-00 Hitachi Tower Singapore 049318 Tel: 535-2100 Fax: 535-1533 Hitachi Asia Ltd. Taipei Branch Office 3F, Hung Kuo Building. No.167, Tun-Hwa North Road, Taipei (105) Tel: <886> (2) 2718-3666 Fax: <886> (2) 2718-8180 Hitachi Asia (Hong Kong) Ltd. Group III (Electronic Components) 7/F., North Tower, World Finance Centre, Harbour City, Canton Road, Tsim Sha Tsui, Kowloon, Hong Kong Tel: <852> (2) 735 9218 Fax: <852> (2) 730 0281 Telex: 40815 HITEC HX Copyright ' Hitachi, Ltd., 1999. All rights reserved. Printed in Japan.