MICROWAVE CORPORATION HMC158 v03.0304 GaAs MMIC SMT PASSIVE FREQUENCY DOUBLER, 1.3 - 4.0 GHz INPUT Typical Applications Features The HMC158 is suitable for: Conversion Loss: 15 dB • Wireless Local Loop Fo, 3Fo, 4Fo Isolation: 40 dB • LMDS, VSAT, and Pt to Pt Radios Input Drive Level: 10 to 20 dBm • UNII & HiperLAN • Test Equipment FREQ. MULTIPLIERS - CHIP 4 Functional Diagram The HMC158 is a miniature frequency doubler in a MMIC die. Suppression of undesired fundamental and higher order harmonics is 40 dB typical with respect to input signal level. The doubler uses the same diode/balun technology used in Hittite MMIC mixers, features small size and requires no DC bias. Electrical Specifications, TA = +25° C, As a Function of Drive Level Input = +10 dBm Parameter Min. Typ. Input = +15 dBm Max. Min. Typ. Input = +20 dBm Max. Min. Typ. Max. Units Frequency Range, Input 1.7 - 4.0 1.7 - 3.5 1.3 - 4.0 GHz Frequency Range, Output 3.4 - 8.0 3.4 - 7.0 2.6 - 8.0 GHz Conversion Loss 4-6 General Description 18 22 15 18 15 18 dB FO Isolation (with respect to input level) 37 45 dB 3FO Isolation (with respect to input level) 40 50 dB 4FO Isolation (with respect to input level) 32 40 dB For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order Online at www.hittite.com HMC158 v03.0304 MICROWAVE CORPORATION GaAs MMIC FREQUENCY DOUBLER, 1.3 - 4.0 GHz INPUT CONVERSION GAIN (dB) GaAs MMIC PUMPED MIXER 17 - Level* 25 GHz Conversion Gain vs.SUB-HARMONICALLY Drive Level Isolation @ +15 dBm Drive *With respect to input level Input Return Loss vs. Drive Level Output Return Loss vs. Drive Level For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order Online at www.hittite.com FREQ. MULTIPLIERS - CHIP 4 4-7 HMC158 v03.0304 MICROWAVE CORPORATION GaAs MMIC FREQUENCY DOUBLER, 1.3 - 4.0 GHz INPUT Absolute Maximum Ratings +27 dBm Storage Temperature -65 to +150 °C Operating Temperature -55 to +85 °C Outline Drawing FREQ. MULTIPLIERS - CHIP 4 Input Drive NOTES: 1. THREE PADS ON EACH CORNER MUST BE BONDED TO GROUND (12 TOTAL). 2. ALL DIMENSIONS IN INCHES [MILLIMETERS] 3. ALL TOLERANCES ARE ±0.025 [0.001] 4. DIE THICKNESS IS 0.254 [0.010] 5. BOND PADS ARE 0.100 [0.004] SQUARE 6. EQUALLY SPACED AT 0.150 [0.006] CENTERS 7. BACKSIDE METALLIZATION: NONE 8. BOND PAD METALLIZATION: GOLD 4-8 For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order Online at www.hittite.com HMC158 v03.0304 MICROWAVE CORPORATION GaAs MMIC FREQUENCY DOUBLER, 1.3 - 4.0 GHz INPUT Handling Precautions Follow these precautions to avoid permanent damage. Cleanliness: Handle the chips in a clean environment. DO NOT attempt to clean the chip using liquid cleaning systems. Static Sensitivity: Follow ESD precautions to protect against > ± 250V ESD strikes. General Handling: Handle the chip along the edges with a vacuum collet or with a sharp pair of bent tweezers. The surface of the chip has fragile air bridges and should not be touched with vacuum collet, tweezers, or fingers. Mounting The chip is back-metallized and can be die mounted with AuSn eutectic preforms or with electrically conductive epoxy. The mounting surface should be clean and flat. Epoxy Die Attach: Apply a minimum amount of epoxy to the mounting surface so that a thin epoxy fillet is observed around the perimeter of the chip once it is placed into position. Cure epoxy per the manufacturer’s schedule. Wire Bonding Ball or wedge bond with 1.0 diameter pure gold wire. Thermosonic wirebonding wiht a nominal stage temperature of 150 °C and a ball bonding force of 40 to 50 grams or wedge bonding force of 18 to 22 grams is recommended. Use the minimum level of ultrasonic energry to achieve reliable wirebonds. Wirebonds should be started on the chip and terminated on the package. RF bonds should be as short as possible. For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order Online at www.hittite.com 4 FREQ. MULTIPLIERS - CHIP Transients: Suppress instrument and bias supply transients while bias is applied. Use shielded signal and bias cables to minimize inductive pick-up. 4-9