HMC240 v00.0403 MICROWAVE CORPORATION GaAs MMIC SPDT SWITCH DC - 4.0 GHz Typical Applications Features The HMC240 is ideal for: Broadband Performance: DC - 4.0 GHz • Telecom Infrastructure Low Insertion Loss: 0.5 dB @ 2.0 GHz • Microwave Radio & VSAT High IIP3: +48 dBm • Military & Space Small Size: 0.70 mm x 0.70 mm x 0.13 mm • Test Instrumentation General Description Functional Diagram The HMC240 is a low cost GaAs MESFET SPDT switch chip. Covering DC to 4.0 GHz, this switch offers high isolation and low insertion loss. RF1 and RF2 are reflective shorts when “off”. The switch can operate using either two negative control logic inputs of -5/0V or two positive control voltage logic inputs of 0/+5V. All data is tested with the chip in a 50 Ohm test fixture connected via 0.025 mm (1 mil) diameter wire bonds of 0.31 mm (12 mils) length. SWITCHES - CHIP 7 Pads 3 & 7 are alternate A & B Control Inputs. Electrical Specifications, TA = +25° C, With 0/-5V Control or +5/0V Control, 50 Ohm System Parameter Frequency Insertion Loss DC - 1.0 GHz DC - 2.0 GHz DC - 3.0 GHz DC - 4.0 GHz Isolation DC - 4.0 GHz Return Loss 7-8 “On State” Min. 24 DC - 1.0 GHz DC - 2.0 GHz DC - 3.0 GHz DC - 4.0 GHz Typ. Max. Units 0.4 0.5 0.6 0.9 0.7 0.8 0.9 1.4 dB dB dB dB 28 dB 22 16 14 11 dB dB dB dB Input Power for 1 dB Compression 0.5 - 1.0 GHz 0.5 - 4.0 GHz 25 23 30 29 dBm dBm Input Third Order Intercept (Two-Tone Input Power= +7 dBm Each Tone) 0.5 - 1.0 GHz 0.5 - 4.0 GHz 43 40 48 45 dBm dBm Switching Characteristics tRISE, tFALL (10/90% RF) tON, tOFF (50% CTL to 10/90% RF) DC - 4.0 GHz 3 10 ns ns For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order Online at www.hittite.com HMC240 v00.0403 MICROWAVE CORPORATION GaAs MMIC SPDT SWITCH DC - 4.0 GHz GaAs MMIC SUB-HARMONICALLY Isolation PUMPED Insertion Loss vs. Temperature 0 MIXER 17 - 25 GHz 0 -5 -10 ISOLATION (dB) -1 -1.5 -2 +25 C +85 C -55 C -2.5 -15 RF1 RF2 -20 -25 -30 -35 -40 -45 -3 -50 0 0.5 1 1.5 2 2.5 3 3.5 4 0 0.5 1 1.5 FREQUENCY (GHz) 2 2.5 3 3.5 4 FREQUENCY (GHz) Return Loss 0.1 and 1 dB Input Compression Point 0 32 7 31 RFC RF1, RF2, ON INPUT P1dB (dBm) 30 -10 -15 -20 29 28 27 26 25 1.0 dB Compression Point 0.1 dB Compression Point 24 -25 23 -30 0 0.5 1 1.5 2 2.5 3 3.5 22 0.5 4 1 1.5 FREQUENCY (GHz) 2 2.5 3 FREQUENCY (GHz) Input Third Order Intercept Point 60 3.5 4 55 INPUT IP3 (dBm) RETURN LOSS (dB) -5 SWITCHES - CHIP INSERTION LOSS (dB) -0.5 50 45 40 +25 C +85 C -40 C 35 30 0.5 1 1.5 2 2.5 3 3.5 4 FREQUENCY (GHz) For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order Online at www.hittite.com 7-9 MICROWAVE CORPORATION HMC240 v00.0403 GaAs MMIC SPDT SWITCH DC - 4.0 GHz Absolute Maximum Ratings < 0.5 GHz 0.5 - 4 GHz RF Input Power Vctrl= 0/+5 (-5)V +27 dBm +34 dBm Control Voltage Range (A & B= 0/+5V) -0.2 to +10 Vdc Control Voltage Range (A & B= -5/0V) -10 to +0.2 Vdc Storage Temperature -65 to +150 deg C Operating Temperature -55 to +85 deg C Positive Control Voltage Negative Control Voltage State Bias Condition State Bias Condition Low 0 Vdc @ 10 uA Low -3 Vdc @ 10 uA to -8 Vdc @ 70 uA High +3 Vdc @ 10 uA to +8 Vdc @ 70 uA High 0 Vdc @ 10 uA Control input voltage tolerences are ±0.2 Vdc. 7 Truth Table: Positive Control Voltage SWITCHES - CHIP Control Input 7 - 10 Control input voltage tolerences are ±0.2 Vdc. Control Current Signal Path State Truth Table: Negative Control Voltage Control Input Control Current Signal Path State A (Vdc) B (Vdc) Ia (uA) Ib (uA) RFC to RF1 RFC to RF2 A (Vdc) B (Vdc) Ia (uA) Ib (uA) RFC to RF1 RFC to RF2 0 +5 -50 50 ON OFF -5 0 -50 50 ON OFF +5 0 50 -50 OFF ON 0 -5 50 -50 OFF ON Note: This part can be controlled with either positive or negative voltages per the above table. DC blocks are required at ports RFC, RF1 and RF2 if positive control voltage is used. For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order Online at www.hittite.com MICROWAVE CORPORATION HMC240 v00.0403 GaAs MMIC SPDT SWITCH DC - 4.0 GHz Outline Drawing NOTES: 1. DIMENSIONS IN INCHES [MILLIMETERS]. 2. DIE THICKNESS IS 0.005”. 3. TYPICAL BOND PAD IS 0.004” SQUARE. 4. TYPICAL BOND PAD SPACING IS 0.006” CENTER TO CENTER. 5. BOND PAD METALLIZATION: GOLD. 6. PADS 4 AND 6 MUST BE CONNECTED TO RF/DC GROUND. Pad Descriptions Pad Number Function Description 1, 7 A, A (alt.) See truth table and control voltage table. Connect either pad 1 or pad 7 to control logic input. 2, 5, 8 RF1, RFC, RF2 These pads are DC coupled and matched to 50 Ohms. Blocking capacitors are required. 3, 9 B, B (alt.) See truth table and control voltage table. Connect either pad 3 or pad 9 to control logic input. 4, 6 AC GND Must be connected to RF/DC ground. Interface Schematic For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order Online at www.hittite.com SWITCHES - CHIP 7 7 - 11 MICROWAVE CORPORATION v00.0403 HMC240 GaAs MMIC SPDT SWITCH DC - 4.0 GHz Assembly Diagram SWITCHES - CHIP 7 Handling Precautions Follow these precautions to avoid permanent damage. Cleanliness: Handle the chips in a clean environment. DO NOT attempt to clean the chip using liquid cleaning systems. Static Sensitivity: Follow ESD precautions to protect against > ± 250V ESD strikes. Transients: Suppress instrument and bias supply transients while bias is applied. Use shielded signal and bias cables to minimize inductive pick-up. General Handling: Handle the chip along the edges with a vacuum collet or with a sharp pair of bent tweezers. The surface of the chip has fragile air bridges and should not be touched with vacuum collet, tweezers, or fingers. Mounting The chip is back-metallized and can be die mounted with electrically conductive epoxy. The mounting surface should be clean and flat. Epoxy Die Attach: Apply a minimum amount of epoxy to the mounting surface so that a thin epoxy fillet is observed around the perimeter of the chip once it is placed into position. Cure epoxy per the manufacturer’s schedule. Wire Bonding Ball or wedge bond with 0.025mm (1 mil) diameter pure gold wire. Thermosonic wirebonding with a nominal stage temperature of 150 deg. C and a ball bonding force of 40 to 50 grams or wedge bonding force of 18 to 22 grams is recommended. Use the minimum level of ultrasonic energy to achieve reliable wirebonds. Wirebonds should be started on the chip and terminated on the package or substrate. All bonds should be as short as possible <0.31mm (12 mils). 7 - 12 For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order Online at www.hittite.com MICROWAVE CORPORATION v00.0403 HMC240 GaAs MMIC SPDT SWITCH DC - 4.0 GHz Notes: SWITCHES - CHIP 7 For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order Online at www.hittite.com 7 - 13