ETC P4C1024

P4C1024
P4C1024
HIGH SPEED 128K x 8
CMOS STATIC RAM
FEATURES
High Speed (Equal Access and Cycle Times)
— 15/17/20/25/35 ns (Commercial)
— 20/25/35/45 ns (Industrial)
Single 5 Volts ±10% Power Supply
Easy Memory Expansion Using CE1, CE2 and
OE Inputs
Common Data I/O
Three-State Outputs
Fully TTL Compatible Inputs and Outputs
Advanced CMOS Technology
Fast tOE
Automatic Power Down
Packages
—32-Pin 300 mil DIP and SOJ
—32-Pin 400 mil SOJ
DESCRIPTION
The P4C1024 is a 1,048,576-bit high-speed CMOS
static RAM organized as 128Kx8. The CMOS memory
requires no clocks or refreshing, and has equal access
and cycle times. Inputs are fully TTL-compatible. The
RAM operates from a single 5V±10% tolerance power
supply.
The P4C1024 device provides asynchronous operations with matching access and cycle times. Memory
locations are specified on address pins A0 to A16. Reading is accomplished by device selection (CE1 low and
CE2 high) and output enabling (OE) while write enable
(WE) remains HIGH. By presenting the address under
these conditions, the data in the addressed memory
Access times of 15 nanoseconds permit greatly en- location is presented on the data input/output pins. The
hanced system operating speeds. CMOS is utilized to input/output pins stay in the HIGH Z state when either
reduce power consumption to a low level. The P4C1024 CE1 or OE is HIGH or WE or CE2 is LOW.
is a member of a family of PACE RAM™ products offering fast access times.
Package options for the P4C1024 include 32-pin 300
mil DIP and SOJ packages as well as 400 mil SOJ.
PIN CONFIGURATION
FUNCTIONAL BLOCK DIAGRAM
•••
ROW SELECT
A
(9)
A
••• •••
INPUT
DATA
CONTROL
••• •••
••• •••
I/O1
262,144BIT
MEMORY
ARRAY
COLUMN
I/O
I/O2
COLUMN
SELECT
•••
CONTROL
CIRCUIT
A
(8)
1
32
VCC
2
31
A15
A14
3
30
CE2
A12
4
29
WE
A7
5
28
A13
A6
6
27
A8
A5
7
26
A9
A4
8
25
A11
A3
9
24
OE
A2
10
23
A10
A1
11
22
CE1
A0
12
21
I/O0
13
20
I/O7
I/O6
I/O1
I/O2
WE
CE1
CE2
NC
A16
GND
•••
14
19
15
16
18
17
I/O5
I/O4
I/O3
1024.2
DIP (P300), SOJ (J300, J400)
TOP VIEW
A
1024.1
OE
Means Quality, Service and Speed
1Q97
141
P4C1024
RECOMMENDED OPERATING TEMPERATURE & SUPPLY VOLTAGE
Temperature Range (Ambient)
Supply Voltage
Commercial (0°C to 70°C)
4.5V ≤ VCC ≤ 5.5V
Industrial (-40°C to 85°C)
4.5 ≤ VCC ≤ 5.5V
MAXIMUM RATINGS
Stresses greater than those listed can cause permanent damage to the device. These are absolute stress
ratings only. Functional operation of the device is not implied at these or any other conditions in excess of those
given in the operational sections of this data sheet. Exposure to Maximum Ratings for extended periods can
adversely affect device reliability.
Parameter
Symbol
Min
Max
Unit
VCC
Supply Voltage with Respect to GND
-0.5
7.0
V
VTERM
Terminal Voltage with Respect to GND (up to 7.0V)
-0.5
VCC + 0.5
V
TA
Operating Ambient Temperature
-55
125
°C
STG
Storage Temperature
-65
150
°C
IOUT
Output Current into Low Outputs
25
mA
ILAT
Latch-up Current
>200
mA
DC ELECTRICAL CHARACTERISTICS
(Over Recommended Operating Temperature & Supply Voltage)
Symbol
Parameter
Min
Test Conditions
VOH
Output High Voltage
(I/O0 - I/O7)
IOH = –4mA, VCC = 4.5V
VOL
Output Low Voltage
(I/O0 - I/O7)
IOL = 8 mA
IOL = 10 mA
Max
2.4
Unit
V
V
0.4
0.5
V
VIH
Input High Voltage
2.2
VCC + 0.3
V
VIL
Input Low Voltage
-0.5
0.8
V
ILI
Input Leakage Current
GND ≤ VIN ≤ VCC
Ind'l.
Com'l.
-10
-5
+10
+5
µA
ILO
Output Leakage Current
GND ≤ VOUT ≤ VCC
CE1 ≥ VIH or CE2 ≤ VIL
Ind'l.
Com'l.
-10
-5
+10
+5
µA
IOS
Output Short-Circuit
Current
VOUT = GND, VCC = Max (Single
output) not to exceed 30 second
duration
-350
mA
ISB1
VCC Current
CMOS Standby Current
(CMOS Input Levels)
VCC = 5.5V, IOUT = 0 mA
CE1 ≥ VCC -0.2V, CE2 ≤ 0.2V
20
(Standard)
mA
142
P4C1024
CAPACITANCES
(VCC = 5.0V, TA = 25°C, f = 1.0 MHz)
Symbol
CIN
COUT
Parameter
Test Conditions
Max
Input Capacitance
VIN = 0V
8
pF
Output Capacitance
VOUT = 0V
10
pF
Unit
POWER DISSIPATION CHARACTERISTICS VS. SPEED
Symbol
ICC
Parameter
Dynamic Operating Current
Temperature
Range
Commercial
Industrial
-15
-17
-20
-25
-35
-45
190
N/A
180
N/A
160
175
150
165
145
160
N/A
155
Unit
mA
mA
*Tested with outputs open and all address and data inputs changing at the maximum write-cycle rate.
The device is continuously enabled for writing, i.e., CE2 ≥ VIH (min), CE1, and WE ≤ VIL (max). Switching inputs are 0V
and 3V.
AC ELECTRICAL CHARACTERISTICS - READ CYCLE
(Over Recommended Operating Temperature & Supply Voltage)
Symbol
Parameter
-35
-45
-15
-17
-20
-25
Min Max Min Max Min Max Min Max Min Max Min Max
Unit
tRC
Read Cycle Time
tAA
Address Access Time
15
17
20
25
35
45
ns
tAC
Chip Enable Access
Time
Output Hold from
Address Change
15
17
20
25
35
45
ns
tOH
17
15
20
25
45
35
ns
3
3
3
3
3
3
ns
3
3
3
3
3
3
ns
tLZ
Chip Enable to
Output in Low Z
tHZ
Chip Disable to
Output in High Z
8
9
9
11
15
20
ns
tOE
Output Enable Low
to Data Valid
6
7
9
10
15
20
ns
tOLZ
Output Enable Low
to Low Z
tOHZ
Output Enable High
to High Z
tPU
Chip Enable to
Power Up Time
tPD
Chip Disable to
Power Down Time
0
0
0
12
0
9
7
6
0
0
143
20
0
15
11
0
0
15
0
0
20
ns
20
ns
0
20
ns
25
ns
P4C1024
OE CONTROLLED)(1)
READ CYCLE NO. 1 (OE
tRC(5)
ADDRESS
tAA
OE
tOH
t OE
t
CE
OLZ
CE 2
tAC
t OHZ
t LZ
t HZ
DATA OUT
NOTES:
1. WE is HIGH for READ cycle.
2. CE1 and OE is LOW and CE2 is HIGH for read cycle.
3. ADDRESS must be valid prior to, or coincident with later of
CE1 transition LOW or CE2 transition HIGH.
4. Transition is measured ± 200 mV from steady state voltage
prior to change, with loading as specified in Figure1. This
parameter is sampled and not 100% tested.
5. READ Cycle Time is measured from the last valid address to
the first transitioning address.
READ CYCLE NO. 2 (ADDRESS CONTROLLED)
t RC (5)
ADDRESS
t AA
t OH
DATA OUT
DATA VALID
PREVIOUS DATA VALID
CE CONTROLLED)
READ CYCLE NO. 3 (CE
tRC
CE 1
CE 2
tHZ
tAC
tLZ
DATA OUT
DATA VALID
HIGH IMPEDANCE
ICC
tPD
tPU
VCC SUPPLY I
SB
CURRENT
144
P4C1024
AC CHARACTERISTICS - WRITE CYCLE
(Over Recommended Operating Temperature & Supply Voltage)
Symbol
Parameter
-15
-17
-45
-25
-20
-35
Unit
Min Max Min Max Min Max Min Max Min Max Min Max
tWC
Write Cycle Time
15
17
20
25
35
45
ns
tCW
Chip Enable Time
to End of Write
Address Valid to
End of Write
12
13
15
18
22
30
ns
12
13
15
20
25
35
ns
0
0
0
0
0
0
ns
tWP
Address Set-up
Time
Write Pulse Width
12
12
15
18
22
25
ns
tAH
Address Hold Time
0
0
0
0
0
0
ns
tDW
Data Valid to End
of Write
Data Hold Time
7
7
8
10
15
20
ns
0
0
0
0
0
0
ns
tAW
tAS
tDH
tWZ
Write Enable to
Output in High Z
tOW
Output Active from
End of Write
8
8
3
10
3
3
3
15
11
3
18
3
WE CONTROLLED)(6)
WRITE CYCLE NO. 1 (WE
t WC
(9)
ADDRESS
tCW
CE 1
CE 2
t AW
tWP
tAH
WE
t AS
t DW
DATA IN
DATA VALID
(4)
t OW
tWZ
(7)
DATA OUT
tDH
(4,7)
DATA UNDEFINED
HIGH IMPEDANCE
Notes:
6. CE1 and WE are LOW and CE2 is HIGH for WRITE cycle.
7. OE is LOW for this WRITE cycle to show twz and tow.
8. If CE1 goes HIGH or CE2 goes LOW simultaneously with WE HIGH, the output remains in a high impedance state.
9. Write Cycle Time is measured from the last valid address to the first transitioning address.
145
ns
ns
P4C1024
CE CONTROLLED)(6)
TIMING WAVEFORM OF WRITE CYCLE NO.2 (CE
tWC (9)
ADDRESS
tAS
tCW
CE 1
tAH
tAW
CE2
t WP
WE
tDW
DATA VALID
DATA IN
DATA OUT
tDH
(12)
HIGH IMPEDANCE
TRUTH TABLE
AC TEST CONDITIONS
Input Pulse Levels
CE1 CE2 OE WE
I/O
GND to 3.0V
Mode
Input Rise and Fall Times
3ns
Standby
H
X
X
X
High Z Standby
Input Timing Reference Level
1.5V
1.5V
Standby
X
L
X
X
High Z Standby
DOUT Disabled
L
H
H
H
High Z
Active
See Figures 1 and 2
Read
L
DOUT
L
L
X
H
Write
H
H
L
High Z
Active
Active
Output Timing Reference Level
Output Load
Power
+5V
480 Ω
RTH
D OUT
D OUT
255 Ω
30pF* (5pF* for t HZ , t LZ , t OHZ ,
t OLZ , t WZ and t OW )
Figure 1. Output Load
= 166.5 Ω
VTH = 1.73 V
30pF* (5pF* for t HZ , t LZ , t OHZ,
t OLZ , t WZ and t OW )
Figure 2. Thevenin Equivalent
* including scope and test fixture.
Note:
Because of the ultra-high speed of the P4C1024, care must be taken
when testing this device; an inadequate setup can cause a normal
functioning part to be rejected as faulty. Long high-inductance leads
that cause supply bounce must be avoided by bringing the VCC and
ground planes directly up to the contactor fingers. A 0.01 µF high
frequency capacitor is also required between VCC and ground.
146
To avoid signal reflections, proper termination must be used; for
example, a 50Ω test environment should be terminated into a 50Ω
load with 1.73V (Thevenin Voltage) at the comparator input, and a
116Ω resistor must be used in series with DOUT to match 166Ω
(Thevenin Resistance).
P4C1024
TEMPERATURE RANGE SUFFIX
PACKAGE SUFFIX
Package
Suffix
P3
J3
J4
Temperature
Description
Range Suffix
Description
C
Plastic DIP, 300 mil wide standard
Plastic SOJ, 300 mil wide standard
Plastic SOJ, 400 mil wide standard
Commercial Temperature Range,
0˚C to +70˚C
Industrial Temperature Range,
-40˚C to +85˚C
I
ORDERING INFORMATION
Performance Semiconductor's part numbering scheme is as follows:
P4C 1024
ss
p
t
Temperature Range: C, I
Package Code: P3, J3, J4
Speed (Access/Cycle Time): 15, 17, etc.
Device Number: 1024
Static RAM Prefix
SELECTION GUIDE
The P4C1024 is available in the following temperature, speed and package options.
Temperature
Range
Package
Commercial
Temperature
Plastic DIP 300
Plastic SOJ 300
Plastic SOJ 400
Industrial
Temperature
Plastic DIP 300
Plastic SOJ 300
Plastic SOJ 400
-15
-17
Speed (ns)
-20
-25
-35
-15P3C -17P3C -20P3C -25P3C -35P3C
-15J3C -17J3C -20J3C -25J3C -35J3C
-15J4C -17J4C -20J4C -25J4C -35J4C
N/A
N/A
N/A
N/A
N/A
N/A
N/A = Not Available
147
-20P3I
-20J3I
-20J4I
-25P3I
-25J3I
-25J4I
-35P3I
-35J3I
-35J4I
P4C1024
148