VDI 130-06P1 VII 130-06P1 VID 130-06P1 VIO 130-06P1 IC25 = 121 A = 600 V VCES VCE(sat) typ. = 2.3 V IGBT Modules in ECO-PAC 2 Short Circuit SOA Capability Square RBSOA Preliminary data sheet VII X15 SV18 NTC X16 T16 NTC X16 IK10 F1 B3 PS18 X15 L9 VX18 LMN X16 NTC X15 K10 L9 AC1 S GH10 E2 AC1 IK10 L9 X13 A VDI VID OP9 IJK VIO Pin arangement see outlines Features IGBTs Symbol Conditions Maximum Ratings VCES TVJ = 25°C to 150°C VGES 600 V ± 20 V • NPT IGBT's - positive temperature coefficient of saturation voltage - fast switching IC25 IC80 TC = 25°C TC = 80°C 121 83 A A • FRED diodes - fast reverse recovery - low forward voltage ICM VCEK VGE = ±15 V; RG = 2.2 Ω; TVJ = 125°C RBSOA, Clamped inductive load; L = 100 µH 200 360 A V • Industry Standard Package - solderable pins for PCB mounting - isolated DCB ceramic base plate tSC (SCSOA) VCE = VCES; VGE = ±15 V; RG = 2.2 Ω; TVJ = 125°C non-repetitive 10 µs Ptot TC = 25°C 379 W Symbol Conditions VCE(sat) IC = 130 A; VGE = 15 V; TVJ = 25°C TVJ = 125°C VGE(th) IC = 1.5 mA; VGE = VCE ICES VCE = VCES; IGES VCE = 0 V; VGE = ± 20 V td(on) tr td(off) tf Eon Eoff 2.3 2.6 4.5 VGE = 0 V; TVJ = 25°C TVJ = 125°C Inductive load, TVJ = 125°C VCE = 300 V; IC = 80 A VGE = 15/0 V; RG = 2.2 Ω Cies VCE = 25 V; VGE = 0 V; f = 1 MHz RthJC RthJH (per IGBT) with heatsink compound (0.42 K/m.K; 50 µm) IXYS reserves the right to change limits, test conditions and dimensions. © 2003 IXYS All rights reserved 2.9 V V 6.5 V 1.2 7.5 mA mA 400 nA 25 11 150 30 0.8 2.3 ns ns ns ns mJ mJ 4.2 nF 0.66 0.33 K/W K/W • space and weight savings • reduced protection circuits • leads with expansion bend for stress relief Typical Applications • AC and DC motor control • AC servo and robot drives • power supplies • welding inverters 303 Characteristic Values (TVJ = 25°C, unless otherwise specified) min. typ. max. Advantages 1-2 VDI 130-06P1 VII 130-06P1 VID 130-06P1 VIO 130-06P1 VII Reverse diodes (FRED) Symbol Conditions Maximum Ratings IF25 IF80 TC = 25°C TC = 80°C Symbol Conditions VF IF = 80 A; TVJ = 25°C TVJ = 125°C 1.85 1.40 IRM trr IF = 60 A; diF/dt = 500 A/µs; TVJ = 125°C VR = 300 V; VGE = 0 V 28 100 A ns RthJC RthJH with heatsink compound (0.42 K/m.K; 50 µm) 1.32 0.66 K/W K/W 134.0 82.3 A A Characteristic Values min. typ. max. 2.06 V V B3 Temperature Sensor NTC Symbol Conditions Characteristic Values min. typ. max. R25 B25/50 T = 25°C 4.75 5.0 3375 5.25 kΩ K VIO Module Symbol Conditions Maximum Ratings TVJ Tstg -40...+150 -40...+150 °C °C VISOL IISOL ≤ 1 mA; 50/60 Hz 3000 V~ Md mounting torque (M4) a Max. allowable acceleration 1.5 - 2.0 14 - 18 50 Nm lb.in. m/s2 Symbol Conditions Characteristic Values min. typ. max. dS dA Creepage distance on surface (Pin to heatsink) Strike distance in air (Pin to heatsink) 11.2 11.2 Weight mm mm 24 VDI g VID IXYS reserves the right to change limits, test conditions and dimensions. © 2003 IXYS All rights reserved 303 Data according to IEC 60747 and refer to a single transistor or diode unless otherwise stated. 2-2