TPA2015D1 SLOS638A – NOVEMBER 2011 – REVISED NOVEMBER 2011 www.ti.com 2 W Constant Output Power Class-D Audio Amplifier With Adaptive Boost Converter and Battery Tracking SpeakerGuard™ AGC Check for Samples: TPA2015D1 FEATURES 1 • 2 • • • • • • • • • DESCRIPTION Built-In SpeakerGuardTM Automatic Gain Control (AGC) with Enhanced Battery Tracking – Limits Battery Current Consumption – Prevents Audio Clipping 2 W into 8 Ω Load From 3.6 V Supply (6% THD) Integrated Adaptive Boost Converter – Increases Efficiency at Low Output Power Low Quiescent Current of 1.7 mA from 3.6 V Operates From 2.5 V to 5.2 V Thermal and Short-Circuit Protection with Auto Recovery Three Gain Settings: 6 dB, 15.5 dB, and 20 dB Independent Control for Boost and Class-D Pin-to-Pin Compatible with TPA2013D1 Available in 1.954 mm × 1.954 mm 16-ball WCSP Package The TPA2015D1 is a high efficiency Class-D audio power amplifier with battery-tracking SpeakerGuard™ AGC technology and an integrated adaptive boost converter that enhances efficiency at low output power. It drives up to 2 W into an 8 Ω speaker (6% THD). With 85% typical efficiency, the TPA2015D1 helps extend battery life when playing audio. The built-in boost converter generates a 5.5 V supply voltage for the Class-D amplifier. This provides a louder audio output than a stand-alone amplifier directly connected to the battery. The SpeakerGuardTM AGC adjusts the Class-D gain to limit battery current and prevent heavy clipping. The TPA2015D1 has an integrated low-pass filter to improve the RF rejection and reduce DAC out-of-band noise, increasing the signal to noise ratio (SNR). The TPA2015D1 is available in a space saving 1.954 mm × 1.954 mm, 0.5 mm pitch WCSP package (YZH). APPLICATIONS • • Cell Phones, PDA, GPS Portable Electronics and Speakers SIMPLIFIED APPLICATION DIAGRAM 2.2 mH Connected to Supply 6.8 mF - 22 mF VBAT 2.2 mF - 10 mF Differential Audio Inputs SW PVOUT PVDD ININ+ OUT+ Gain Control GAIN AGC Control AGC Boost Enable ENB Class-D Enable END TPA2015D1 OUT- GND 1 2 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. SpeakerGuard is a trademark of Texas Instruments. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2011, Texas Instruments Incorporated TPA2015D1 SLOS638A – NOVEMBER 2011 – REVISED NOVEMBER 2011 www.ti.com These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. FUNCTIONAL BLOCK DIAGRAM SW VBAT ENB END Boost Converter Battery Monitor Bias & Control Oscillator AGC IN+ IN- PVOUT +20 dB +15.5 dB +6 dB PVDD PVDD Gain Select: + AGC PWM – AGND HBridge OUT+ OUTGND GAIN GND DEVICE PINOUT WCSP (YZH) PACKAGE (TOP VIEW) Symbol Side PVDD 2 PVOUT SW GND A1 A2 A3 A4 OUT+ GAIN AGC VBAT B1 B2 B3 B4 OUT- GND END GND C1 C2 C3 C4 GND IN+ IN- ENB D1 D2 D3 D4 Submit Documentation Feedback Copyright © 2011, Texas Instruments Incorporated Product Folder Link(s): TPA2015D1 TPA2015D1 SLOS638A – NOVEMBER 2011 – REVISED NOVEMBER 2011 www.ti.com PIN FUNCTIONS PIN INPUT/ OUTPUT/ POWER (I/O/P) DESCRIPTION NAME WCSP PVDD A1 I Class-D power stage supply voltage. PVOUT A2 O Boost converter output. SW A3 I Boost and rectifying switch input. GND A4, C2, C4, D1 P Ground; all ground balls must be connected for proper functionality. OUT+ B1 O Positive audio output. GAIN B2 I Gain selection pin. AGC B3 I Enable and select AGC. VBAT B4 P Supply voltage. OUT– C1 O Negative audio output. END C3 I Enable for the Class-D amplifier; set to logic high to enable. IN+ D2 I Positive audio input. IN– D3 I Negative audio input. ENB D4 I Enable for the boost converter; set to logic high to enable. ORDERING INFORMATION PACKAGED DEVICES (1) PART NUMBER (2) SYMBOL 16-ball, 1.954mm × 1.954 mm WSCP TPA2015D1YZHR OEN 16-ball, 1.954 mm × 1.954 mm WSCP TPA2015D1YZHT OEN TA –40°C to 85°C (1) (2) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI Web site at www.ti.com. The YZH package is only available taped and reeled. The suffix “R” indicates a reel of 3000, the suffix “T” indicates a reel of 250. ABSOLUTE MAXIMUM RATINGS Over operating free–air temperature range, TA= 25°C (unless otherwise noted) (1) MIN MAX Supply voltage VBAT –0.3 V 6V Input Voltage, VI IN+, IN– –0.3 V VBAT + 0.3 V Output continuous total power dissipation See the Thermal Information Table Operating free-air temperature range, TA –40°C 85°C Operating junction temperature range, TJ –40°C 150°C Storage temperature range, TSTG –65°C 150°C 6Ω Minimum load impedance ESD Protection (1) HBM 2000 V CDM 500 V MM 100 V Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute–maximum–rated conditions for extended periods may affect device reliability. Submit Documentation Feedback Copyright © 2011, Texas Instruments Incorporated Product Folder Link(s): TPA2015D1 3 TPA2015D1 SLOS638A – NOVEMBER 2011 – REVISED NOVEMBER 2011 www.ti.com THERMAL INFORMATION TPA2015D1 THERMAL METRIC (1) YZH UNITS 16 PINS θJA Junction-to-ambient thermal resistance 75 θJC(top) Junction-to-case(top) thermal resistance 22 θJB Junction-to-board thermal resistance 26 ψJT Junction-to-top characterization parameter 0.5 ψJB Junction-to-board characterization parameter 25 θJC(bottom) Junction-to-case(bottom) thermal resistance n/a (1) °C/W For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. RECOMMENDED OPERATING CONDITIONS MIN MAX Supply voltage, VBAT 2.5 5.2 VIH High–level input voltage, END, ENB 1.3 VIL Low–level input voltage, END, ENB TA Operating free-air temperature TJ Operating junction temperature UNIT V V 0.6 V –40 85 °C –40 150 °C MAX UNIT ELECTRICAL CHARACTERISTICS VBAT= 3.6 V, Gain = 6 dB, RAGC = Float, TA = 25°C, RL = 8 Ω + 33 μH (unless otherwise noted) PARAMETER TEST CONDITIONS END = 0 V, ENB = VBAT TYP 2.5 5.2 2.5 5.2 END = VBAT, ENB = VBAT, AGC option 0 2.8 5.2 END = ENB = VBAT, boost converter active 5.2 5.8 V END = VBAT, ENB = 0 V 3.1 5.25 V VBAT supply voltage range END = VBAT, ENB = VBAT, AGC options 1, 2, and 3 Class-D supply voltage range MIN V VBAT = 2.5 V to 5.2 V, END = ENB = VBAT 85 VBAT = 2.5 V to 5.2 V, END = VBAT, ENB = 0 V (pass through mode) 75 Operating quiescent current END = 0 V, ENB = VBAT 0.5 END = ENB = VBAT 1.7 2.2 mA Shutdown quiescent current VBAT = 2.5 V to 5.2 V, END = ENB = GND 0.2 3 μA Power supply ripple rejection Gain = 6 dB (connect to GND) Gain control pin voltage Gain = 15.5 dB (float) Gain = 20 dB (connect to VBAT) AGC with no inflection point, R(AGC) = Open AGC control pin voltage Start-up time 4 mA 0 0.25 × VBAT 0.4 × VBAT 0.6 × VBAT 2 1.36 1.75 AGC option 2 (inflection = 3.78 V) , R(AGC) = 27 kΩ (±5%) 0.94 1.2 AGC option 3 (inflection = 3.96 V) , R(AGC) = 18 kΩ (±5%) 0 0.825 37.6 IN+, IN– 40 0.6 V 42.4 μA 1.3 V Boost converter followed by Class-D amplifier 6 10 Boost converter only 1 4 Class-D amplifier only 5 6 Submit Documentation Feedback V 0.75 × VBAT AGC option 1 (inflection = 3.55 V), R(AGC) = 39 kΩ (±5%) AGC control pin output current Input common-mode voltage range dB ms Copyright © 2011, Texas Instruments Incorporated Product Folder Link(s): TPA2015D1 TPA2015D1 SLOS638A – NOVEMBER 2011 – REVISED NOVEMBER 2011 www.ti.com OPERATING CHARACTERISTICS VBAT = 3.6 V, TA = 25°C, RL = 8 Ω + 33 μH (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT BOOST CONVERTER V(PVOUT) I(BOOST) = 0 mA Boost converter output voltage range Boost converter input current limit IL 5.4 I(BOOST) = 700 mA Boost converter efficiency fBOOST Boost converter frequency V Power supply current 1500 mA 450 mA END = 0 V, I(PVOUT) = 100 mA constant 88% Boost converter start-up current limit η 6 5.4 1.2 MHz CLASS-D AMPLIFIER PO Output power VO THD = 1%, VBAT = 2.5 V, f = 1 kHz 1200 THD = 1%, VBAT = 3 V, f = 1 kHz 1500 THD = 1%, VBAT = 3.6 V, f = 1 kHz 1700 THD = 1%, VBAT = 3 V, f = 1 kHz, 6 dB crest factor sine burst, no clipping Output peak voltage 5.2 GAIN < 0.25 × VBAT AV 15.5 GAIN > 0.75 × VBAT ΔAV Gain accuracy VOOS Output offset voltage V 6 0.4 × VBAT < GAIN < 0.6 × VBAT (or float) Closed-loop voltage gain mW dB 20 –0.5 0.5 dB 10 mV AV = 6 dB 27.8 AV = 15.5 dB 14.9 AV = 20 dB 10.1 Input impedance in shutdown (per input pin) END = 0 V 88.4 kΩ ZO Output impedance in shutdown END = 0 V 2 kΩ fCLASS-D Switching frequency Input impedance (per input pin) RIN EN 560 Noise output voltage 24.8 A-weighted, GAIN = 15.5 dB 33.4 A-weighted, GAIN = 20 dB THD+N AC PSRR Total harmonic distortion plus noise (1) AC-Power supply ripple rejection (output referred) Audio frequency passband ripple 600 A-weighted, GAIN = 6 dB kΩ 640 kHz μVRMS 42.4 PO = 100 mW, f = 1 kHz 0.06% PO = 500 mW, f = 1 kHz 0.07% 200 mVPP ripple, f = 217 Hz 75 200 mVPP ripple, f = 4 kHz 70 dB fAUDIO = 20 Hz, CIN = 1 μF –0.2 –0.1 0 fAUDIO = 16 kHz, CIN = 1 μF –0.2 –0.1 0 dB AUTOMATIC GAIN CONTROL AGC gain range 0 AGC gain step size dB dB AGC attack time (gain decrease) 0.026 ms/dB AGC release time (gain increase) 1600 ms/dB Limiter threshold voltage VBAT > inflection point 6.15 VBAT vs. Limiter slope VBAT < inflection point 3 AGC inflection point (1) 20 0.5 AGC option 1, R(AGC) = 39 kΩ (±5%) 3.55 AGC option 2, R(AGC) = 27 kΩ (±5%) 3.78 AGC option 3, R(AGC) = 18 kΩ (±5%) 3.96 V V/V V A-weighted Submit Documentation Feedback Copyright © 2011, Texas Instruments Incorporated Product Folder Link(s): TPA2015D1 5 TPA2015D1 SLOS638A – NOVEMBER 2011 – REVISED NOVEMBER 2011 www.ti.com TEST SET-UP FOR GRAPHS 1 mF + TPA2015D1 IN+ OUT+ Measurement Output Load – IN– OUT– 30 kHz Low-Pass Filter + Measurement Input – 1 mF SW PVDD PVOUT GND VBAT 22 mF 2.2 mH 10 mF + Supply – 6 (1) The 1 µF input capacitors (CI) were shorted for input common-mode voltage measurements. (2) A 33 μH inductor was placed in series with the load resistor to emulate a small speaker for efficiency measurements. (3) The 30 kHz low-pass filter is required even if the analyzer has an internal low-pass filter. An R-C low pass filter (100 Ω, 47 nF) is used on each output for the data sheet graphs. Submit Documentation Feedback Copyright © 2011, Texas Instruments Incorporated Product Folder Link(s): TPA2015D1 TPA2015D1 SLOS638A – NOVEMBER 2011 – REVISED NOVEMBER 2011 www.ti.com TYPICAL CHARACTERISTICS VBAT = 3.6 V, Gain = 6 dB, CI = 1 µF, CBOOST = 22 µF, LBOOST = 2.2 µH, AGC = Float, ENB = END = VBAT, and Load = 8 Ω + 33 µH unless otherwise specified. SPACER −80 10m Gain = 20 dB AGC = Float RL = 8 Ω + 33 µH No Input Signal −90 −100 Amplitude − dBV Supply Current − A 8m Gain = 20 dB AGC = Float RL = 8 Ω + 33 µH 6m 4m −110 −120 −130 2m −140 −150 0 2.3 2.6 2.9 3.2 3.5 3.8 4.1 4.4 4.7 0 5.0 2k 4k 6k 8k VBAT − V Figure 1. QUIESCENT SUPPLY CURRENT vs SUPPLY VOLTAGE Figure 2. A-WEIGHTED OUTPUT NOISE vs FREQUENCY 6 1.0 Gain = 20 dB RL = 8 Ω + 33 µH f = 1 kHz RAGC = Float VOUT − Output Voltage − Vp 0.6 0.4 0.2 VBAT = 3.0 V VBAT = 3.6 V VBAT = 4.2 V 0.0 0.0 0.5 1.0 1.5 2.0 4 3 VBAT = 2.5 V VBAT = 2.7 V VBAT = 3.0 V VBAT = 3.3 V VBAT = 3.6 V VBAT = 4.2 V VBAT = 5.0 V 2 1 0 0.0 2.5 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 PO − Output Power − W VIN − Input Voltage − Vp Figure 3. SUPPLY CURRENT vs OUTPUT POWER Figure 4. PEAK OUTPUT VOLTAGE vs PEAK INPUT VOLTAGE 100 80 Efficiency – % Gain = 20 dB RL = 8 Ω + 33 µH RAGC = 27 kΩ 5 60 Auto Pass Through Boosted 40 20 VBAT VBAT VBAT VBAT VBAT Gain = 20 dB RL = 8 W + 33 mH f = 1 kHz 0 0.01 0.1 1 = 2.7 V = 3.0 V = 3.6 V = 4.2 V = 5.0 V 2 THD+N − Total Harmonic Distortion + Noise − % IVBAT − Supply Current − A 0.8 10k 12k 14k 16k 18k 20k 22k 24k Frequency − Hz 100 10 RL = 8 Ω + 33 µH RAGC = Float, Boost Enabled Gain = 6 dB, f = 1 kHz VBAT = 2.8 V VBAT = 3.0 V VBAT = 3.6 V VBAT = 4.2 V VBAT = 5.0 V 1 0.1 0.01 1m PO – Output Power – W 10m 100m 1 4 PO − Output Power − W Figure 5. TOTAL EFFICIENCY vs OUTPUT POWER Figure 6. TOTAL HARMONIC DISTORTION + NOISE vs OUTPUT POWER Submit Documentation Feedback Copyright © 2011, Texas Instruments Incorporated Product Folder Link(s): TPA2015D1 7 TPA2015D1 SLOS638A – NOVEMBER 2011 – REVISED NOVEMBER 2011 www.ti.com TYPICAL CHARACTERISTICS (continued) VBAT = 3.6 V, Gain = 6 dB, CI = 1 µF, CBOOST = 22 µF, LBOOST = 2.2 µH, AGC = Float, ENB = END = VBAT, and Load = 8 Ω + 33 µH unless otherwise specified. 5.0 4.0 RL = 8 Ω + 33 µH VIN = 0.45 VRMS f = 1 kHz Gain = 20 dB 3.0 RAGC = Float RAGC = 39 kΩ RAGC = 27 kΩ RAGC = 18 kΩ 2.0 1.0 2.3 VBAT = 2.5 V RL = 8 Ω + 33 µH RAGC = Float Gain = 6 dB 1 0.1 0.01 0.001 Figure 7. MAXIMUM OUTPUT VOLTAGE vs SUPPLY VOLTAGE Figure 8. TOTAL HARMONIC DISTORTION + NOISE vs FREQUENCY 3.2 3.5 3.8 4.1 4.4 4.7 1.5 RL = 8 Ω + 33 µH VIN = 0.45 VRMS f = 1 kHz Gain = 20 dB 1.0 RAGC = Float RAGC = 39 kΩ RAGC = 27 kΩ RAGC = 18 kΩ 0.5 0.0 2.3 2.6 2.9 3.2 3.5 3.8 4.1 4.4 4.7 20 5.0 2.0 100 VBAT = 3.6 V RL = 8 Ω + 33 µH RAGC = Float Gain = 6 dB 1 RL = 8 Ω + 33 µH VIN = 0.45 VRMS f = 1 kHz Gain = 20 dB IVBAT − Supply Current − A 0.8 0.6 0.4 RAGC = Float RAGC = 39 kΩ RAGC = 27 kΩ RAGC = 18 kΩ 0.2 0.0 2.3 2.6 2.9 3.2 3.5 3.8 4.1 4.4 4.7 5.0 0.001 100 1k f − Frequency − Hz 10k 20k Figure 10. TOTAL HARMONIC DISTORTION + NOISE vs FREQUENCY 10 VBAT = 4.2 V RL = 8 Ω + 33 µH RAGC = Float Gain = 6 dB 1 Po = 100 mW Po = 500 mW Po = 1W 0.1 0.01 0.001 20 VBAT − Supply Voltage − V Figure 11. SUPPLY CURRENT vs SUPPLY VOLTAGE Po = 50 mW Po = 250 mW Po = 500 mW 0.01 20 THD+N − Total Harmonic Distortion + Noise − % 1.0 20k 0.1 5.0 Figure 9. OUTPUT POWER vs SUPPLY VOLTAGE 10k 10 VBAT − Supply Voltage − V 8 Po = 25 mW Po = 125 mW Po = 200 mW 1k f − Frequency − Hz 2.9 2.5 PO − Output Power − W 10 VBAT − Supply Voltage − V 2.6 THD+N − Total Harmonic Distortion + Noise − % VOUT − Maximum Output Voltage − Vp 6.0 THD+N − Total Harmonic Distortion + Noise − % SPACER 100 1k f − Frequency − Hz 10k 20k Figure 12. TOTAL HARMONIC DISTORTION + NOISE vs FREQUENCY Submit Documentation Feedback Copyright © 2011, Texas Instruments Incorporated Product Folder Link(s): TPA2015D1 TPA2015D1 SLOS638A – NOVEMBER 2011 – REVISED NOVEMBER 2011 www.ti.com TYPICAL CHARACTERISTICS (continued) VBAT = 3.6 V, Gain = 6 dB, CI = 1 µF, CBOOST = 22 µF, LBOOST = 2.2 µH, AGC = Float, ENB = END = VBAT, and Load = 8 Ω + 33 µH unless otherwise specified. SPACER 40k RL = 8 Ω + 33 µH Input Level = 0.2 VPP Gain = 6 dB Output Referred −20 VBAT = 2.5 V VBAT = 3.6 V VBAT = 4.2 V VBAT = 5.0 V −40 −60 −80 RIN − Input Impedance Per Leg − Ω Supply Ripple Rejection − dB 0 30k 25k 20k 15k 10k 5k −100 20 100 1k f − Frequency − Hz 10k 0 20k Figure 13. SUPPLY RIPPLE REJECTION vs FREQUENCY 2 4 6 8 10 12 Gain − dB 14 16 18 20 Figure 14. INPUT IMPEDANCE (PER INPUT) vs GAIN 6 6 VBAT = 3.6 V Gain = 6 dB POUT = 100mW @ 1kHz RL = 8 Ω + 33 µH VBAT = 3.6 V Gain = 6 dB POUT = 100 mW @ 1kHz RL = 8 Ω + 33 µH ENB and END VOUT+ − VOUT− 4 V − Voltage − V 4 V − Voltage − V RL = 8 Ω + 33 µH 35k 2 0 ENB and END VOUT+ − VOUT− 2 0 −2 −2 0 5m 10m t − Time − s 15m 20m 0 2m 4m 6m t − Time − s 8m Figure 15. STARTUP TIMING Figure 16. SHUTDOWN TIMING Figure 17. EMC PERFORMANCE PO = 50 mW with 2 INCH SPEAKER CABLE Figure 18. EMC PERFORMANCE PO = 750 mW with 2 INCH SPEAKER CABLE 10m Submit Documentation Feedback Copyright © 2011, Texas Instruments Incorporated Product Folder Link(s): TPA2015D1 9 TPA2015D1 SLOS638A – NOVEMBER 2011 – REVISED NOVEMBER 2011 www.ti.com APPLICATION INFORMATION APPLICATION CIRCUIT 2.2 mH Connected to Supply 6.8 mF - 22 mF VBAT 2.2 mF - 10 mF Differential Audio Inputs SW PVOUT PVDD ININ+ OUT+ Gain Control GAIN AGC Control AGC Boost Enable ENB Class-D Enable END TPA2015D1 OUT- GND Figure 19. Typical Application Schematic with Differential Input Signals 2.2 mH Connected to Supply 6.8 mF - 22 mF VDD 2.2 mF - 10 mF Single-Ended Audio Inputs SW PVOUT PVDD ININ+ OUT+ Gain Control GAIN AGC Control AGC Boost Enable ENB Class-D Enable END TPA2015D1 OUT- GND Figure 20. Typical Application Schematic with Single-Ended Input Signals 10 Submit Documentation Feedback Copyright © 2011, Texas Instruments Incorporated Product Folder Link(s): TPA2015D1 TPA2015D1 SLOS638A – NOVEMBER 2011 – REVISED NOVEMBER 2011 www.ti.com GLOSSARY The application section uses the following terms: Limiter level The maximum output voltage allowed before amplifier gain is automatically reduced. SpeakerGuard™ TI's trademark name for the automatic gain control technology. It protects speakers by limiting maximum output power. Inflection point The battery voltage threshold for reducing the limiter level. If the battery voltage drops below the inflection point, the limiter level automatically reduces. Although it lowers the maximum output power, it prevents high battery currents at end-of-charge low battery voltages. Battery track The name for the continuous limiter level reduction at battery voltages below the inflection point. AGC Automatic gain control. VBAT The battery supply voltage to the TPA2015D1. The VBAT pin is the input to the boost converter. Fixed-gain The nominal audio gain as set by the GAIN pin. If the audio output voltage remains below the limiter level, the amplifier gain will return to the fixed-gain. Attack time The rate of AGC gain decrease. The attack time is constant at 0.026 ms/dB. Release time The rate of AGC gain increase. The release time is constant at 1600 ms/dB. SPEAKERGUARD™ THEORY OF OPERATION SpeakerGuard™ protects speakers, improves loudness, and limits peak supply current. If the output audio signal exceeds the limiter level, then SpeakerGuard™ decreases amplifier gain. The rate of gain decrease, the attack time, is fixed at 0.026 ms/dB. SpeakerGuard™ increases the gain once the output audio signal is below the limiter level. The rate of gain increase, the release time, is fixed at 1600 ms/dB. Figure 21 shows this relationship. Submit Documentation Feedback Copyright © 2011, Texas Instruments Incorporated Product Folder Link(s): TPA2015D1 11 TPA2015D1 SLOS638A – NOVEMBER 2011 – REVISED NOVEMBER 2011 www.ti.com INPUT SIGNAL Release Time Attack Time GAIN Gain Step LIMITER LEVEL OUTPUT SIGNAL Figure 21. SpeakerGuard Attack and Release Times BATTERY TRACKING SPEAKERGUARD™ The TPA2015D1 monitors the battery voltage and the audio signal, automatically decreasing gain when battery voltage is low and audio output power is high. It finds the optimal gain to maximize loudness and minimize battery current, providing louder audio and preventing early shutdown at end-of-charge battery voltages. SpeakerGuard decreases amplifier gain when the audio signal exceeds the limiter level. The limiter level automatically decreases when the supply voltage (VBAT) is below the inflection point. Figure 22 shows a plot of the limiter level as a function of the supply voltage. Limiter Level Limiter Level (VBAT > inflection point) Inflection point Limiter Level (VBAT = inflection point) Supply Voltage Figure 22. Limiter Level vs Supply Voltage The limiter level decreases within 60 µs of the supply voltage dropping below the inflection point. Although this is slightly slower than the 26 µs/dB SpeakerGuard attack time, the difference is audibly imperceptible. 12 Submit Documentation Feedback Copyright © 2011, Texas Instruments Incorporated Product Folder Link(s): TPA2015D1 TPA2015D1 SLOS638A – NOVEMBER 2011 – REVISED NOVEMBER 2011 www.ti.com Connect a resistor between the AGC pin and ground to set the inflection point, as shown in Table 1. Leave the AGC pin floating to disable the inflection point, keeping the limiter level constant over all supply voltages. The maximum limiter level is fixed, as is the slope of the limiter level versus supply voltage. If different values for maximum limiter level and slope are required, contact your local Texas Instruments representative. Table 1. AGC Function Table Function Resistor on AGC pin Inflection Point Constant limiter level; battery track OFF Floating or connected to VBAT disabled AGC battery track option 1 39 kΩ 3.55 V AGC battery track option 2 27 kΩ 3.78 V AGC battery track option 3 18 kΩ 3.96 V The audio signal is not affected by the SpeakerGuard™ function unless the peak audio output voltage exceeds the limiter level. Figure 23 shows the relationship between the audio signal, the limiter level, the supply voltage, and the supply current. When VBAT is greater than the inflection point, the limiter level allows the output signal to slightly clip to roughly 6% THD at 2 W into 8 Ω. This is an acceptable peak distortion level for most small-sized portable speakers, while ensuring maximum loudness from the speaker. Battery Tracking SpeakerGuard™ Example Phase 1 Battery discharging normally; supply voltage is above inflection point; audio output remains below limiter level. The limiter level remains constant because the supply voltage is greater than the inflection point. Amplifier gain is constant at fixed-gain as set by the GAIN pin. The audio output remains at a constant loudness. The boost converter allows the audio output to swing above the battery supply voltage. Battery supply current increases as supply voltage decreases. Phase 2 Battery continues to discharge normally; supply voltage decreases below inflection point; limiter level decreases below audio output. The limiter level decreases as the battery supply voltage continues to decrease. SpeakerGuard™ lowers amplifier gain, reducing the audio output below the new limiter level. The supply current decreases due to reduced output power. Phase 3 Battery supply voltage is constant; audio output remains below limiter level. The audio output, limiter level, and supply current remain constant as well. Phase 4 Phone plugged in and battery re-charges; supply voltage increases. The limiter level increases as the supply voltage increases. SpeakerGuard™ increases amplifier gain slowly, increasing audio output. Because the TPA2015D1 supply current is proportional to the PVOUT-to-VBAT ratio, the supply current decreases as battery supply voltage increases. Phase 5 Battery supply voltage is constant; audio output is below limiter level. SpeakerGuard™ continues to increase amplifier gain to the fixed-gain as set by the GAIN pin. The audio output signal increases (slowly due to release time) to original value. Phase 6 Battery supply voltage is constant; audio output remains below limiter level. Amplifier gain equal to fixed-gain as set by the GAIN pin. Audio output signal does not change. Supply current remains constant. Submit Documentation Feedback Copyright © 2011, Texas Instruments Incorporated Product Folder Link(s): TPA2015D1 13 TPA2015D1 SLOS638A – NOVEMBER 2011 – REVISED NOVEMBER 2011 www.ti.com Supply Current Limiter Level Class-D Voltage Supply Voltage Audio Signal Phase 1 Phase 2 Phase 3 Phase 5 Phase 4 Phase 6 Inflection point Figure 23. Relationship Between Supply Voltage, Current, Limiter Level, and Output Audio Signal SpeakerGuard with Varying Input Levels SpeakerGuard protects speakers by decreasing gain during large output transients. Figure 24 shows the maximum output voltage at different input voltage levels. The load is 8 Ω and the gain is 15.5 dB (6 V/V). VOUT − Maximum Output Voltage − Vp 6.0 5.0 RL = 8 Ω + 33 µH RAGC = 27 kΩ f = 1 kHz Gain = 15.5 dB 4.0 3.0 2.0 1.0 2.3 VIN = 0.707 VRMS VIN = 0.564 VRMS VIN = 0.475 VRMS 2.6 2.9 3.2 3.5 3.8 4.1 4.4 4.7 5.0 VBAT − Supply Voltage − V Figure 24. MAXIMUM OUTPUT VOLTAGE vs SUPPLY VOLTAGE A 0.707 VRMS sine-wave input signal forces the output voltage to 4.242 VRMS, or 6.0 VPEAK. Above 3.9 V supply, the boost converter voltage sags due to high output current, resulting in a peak Class-D output voltage of about 5.4 V. As the supply voltage decreases below 3.9 V, the limiter level decreases. This causes the gain to decrease, and the peak Class-D output voltage lowers. With a 0.564 VRMS input signal, the peak Class-D output voltage is 4.78 V. When the supply voltage is above 3.45 V, the output voltage remains below the limiter level, and the gain stays at 15.5 dB. Once the supply drops below 3.45 V, the limiter level decreases below 4.78 V, and SpeakerGuard decreases the gain. The same rationale applies to the 0.475 VRMS input signal. Although the supply voltage may be below the inflection point, audio gain does not decrease until the Class-D output voltage is above the limiter level. 14 Submit Documentation Feedback Copyright © 2011, Texas Instruments Incorporated Product Folder Link(s): TPA2015D1 TPA2015D1 SLOS638A – NOVEMBER 2011 – REVISED NOVEMBER 2011 www.ti.com SPEAKER LOAD LIMITATION Speakers are non-linear loads with varying impedance (magnitude and phase) over the audio frequency. A portion of speaker load current can flow back into the boost converter output via the Class-D output H-bridge high-side device. This is dependent on the speaker's phase change over frequency, and the audio signal amplitude and frequency content. Most portable speakers have limited phase change at the resonant frequency, typically no more than 40 or 50 degrees. To avoid excess flow-back current, use speakers with limited phase change. Otherwise, flow-back current could exceed the 10 mA rating of the boost converter voltage clamp and drive the PVOUT voltage above the absolute maximum recommended operational voltage. Confirm proper operation by connecting the speaker to the TPA2015D1 and driving it at maximum output swing. Observe the PVOUT voltage with an oscilloscope. In the unlikely event the PVOUT voltage exceeds 6.5 V, add a 6.8 V Zener diode between PVOUT and ground to ensure the TPA2015D1 operates properly. The amplifier has thermal overload protection and decatives if the die temperature exceeds 150°C. It automatically reactivates once die temperature returns below 150°C. Built-in output over-current protection deactivates the amplifier if the speaker load becomes short-circuited. The amplifier automatically restarts within 200 ms after the over-current event. Although the TPA2015D1 Class-D output can withstand a short between OUT+ and OUT-, do not connect either output directly to GND, PVDD, or VBAT as this could damage the device. WARNING Do not connect OUT+ or OUT- directly to GND, PVDD, or VBAT as this could damage the Class-D output stage. Submit Documentation Feedback Copyright © 2011, Texas Instruments Incorporated Product Folder Link(s): TPA2015D1 15 TPA2015D1 SLOS638A – NOVEMBER 2011 – REVISED NOVEMBER 2011 www.ti.com FULLY DIFFERENTIAL CLASS-D AMPLIFIER The TPA2015D1 uses a fully differential amplifier with differential inputs and outputs. The differential output voltage equals the differential input multiplied by the amplifier gain. The TPA2015D1 can also be used with a single-ended input. However, using differential input signals when in a noisy environment, like a wireless handset, ensures maximum system noise rejection. Advantages of Fully Differential Amplifiers • Mid-supply bypass capacitor, CBYPASS, not required: – The fully differential amplifier does not require a mid-supply bypass capacitor. Any shift in the mid-supply affects both positive and negative channels equally and cancels at the differential output. • Improved RF-immunity: – GSM handsets save power by turning on and shutting off the RF transmitter at a rate of 217 Hz. This 217 Hz burst often couples to audio amplifier input and output traces causing frame-rate noise. Fully differential amplifiers cancel frame-rate noise better than non-differential amplifiers. • Input-coupling capacitors not required, but recommended: – The fully differential amplifier allows the inputs to be biased at voltages other than mid-supply (PVDD/2). The TPA2015D1 inputs can be biased anywhere within the common mode input voltage range, as listed in the OPERATING CHARACTERISTICS table. If the inputs are biased outside of that range, then input-coupling capacitors are required. – Note that without input coupling capacitors, any dc offset from the audio source will be modulated by the AGC. This could cause artifacts in the audio output signal. Perform listening tests to determine if direct input coupling is acceptable. The TPA2015D1 has 3 selectable fixed-gains: 6 dB, 15.5 dB, and 20 dB. Connect the GAIN pin as shown in Table 2. Table 2. Amplifier Fixed-Gain Connect GAIN Pin to Amplifier Gain GND 6 dB No Connection (Floating) 15.5 dB VBAT 20 dB Improved Class-D Efficiency The TPA2015D1 output stage uses a modulation technique that modulates the PWM output only on one side of the differential output, leaving the other side held at ground. Although the differential output voltage is undistorted, each output appears as a half-wave rectified signal. This technique reduces output switching losses and improves overall amplifier efficiency. Figure 25 shows how OUT+, OUT-, and the differential output voltages appear on an oscilloscope. 16 Submit Documentation Feedback Copyright © 2011, Texas Instruments Incorporated Product Folder Link(s): TPA2015D1 TPA2015D1 SLOS638A – NOVEMBER 2011 – REVISED NOVEMBER 2011 www.ti.com FILTERED OUTPUT WAVEFORMS Figure 25. ADAPTIVE BOOST CONVERTER The TPA2015D1 consists of an adaptive boost converter and a Class-D amplifier. The boost converter takes the supply voltage, VBAT, and increases it to a higher output voltage, PVOUT. PVOUT drives the supply voltage of the Class-D amplifier, PVDD. This improves loudness over non-boosted solutions. The boost converter is adaptive and activates automatically depending on the output audio signal amplitude. When the peak output audio signal exceeds a preset voltage threshold, the boost converter is enabled, and the voltage at PVOUT is 5.5 V. When the audio output voltage is lower than the threshold voltage, the boost deactivates automatically. The boost activation threshold voltage is not user programmable. It is optimized to prevent clipping while maximizing system efficiency. The boost converter can be forcibly deactivated by setting the ENB pin to logic-low. When the boost is deactivated, PVOUT is equal to the supply voltage (VBAT) minus the I x R drop across the inductor and boost converter pass transistor. A timer prevents the input signal from modulating the PVOUT voltage within the audio frequency range, eliminating the potential for audible artifacts on the Class-D output. Figure 26 shows how the adaptive boost modulates with a typical audio signal. By automatically deactivating the boost converter and passing VBAT to PVOUT, the TPA2015D1 efficiency is improved at low output power. 12 10 V − Voltage − V 8 VBAT = 3.6 V Gain = 20 dB AGC = Float RL = 8 Ω + 33 µH PVOUT VOUT+ − VOUT− 6 4 2 0 −2 −4 −6 0.0 0.5 1.0 t − Time − s 1.5 2.0 Figure 26. ADAPTIVE BOOST CONVERTER with TYPICAL MUSIC PLAYBACK The primary external components for the boost converter are the inductor and the boost capacitor. The inductor stores current, and the boost capacitor stores charge. As the Class-D amplifier depletes the charge in the boost capacitor, the boost inductor replenishes charge with its stored current. The cycle of charge and discharge occurs frequently enough to keep PVOUT within its minimum and maximum voltage specification. Submit Documentation Feedback Copyright © 2011, Texas Instruments Incorporated Product Folder Link(s): TPA2015D1 17 TPA2015D1 SLOS638A – NOVEMBER 2011 – REVISED NOVEMBER 2011 www.ti.com The boost converter design is optimized for driving the integrated Class-D amplifier only. It lacks protection circuitry recommended for driving loads other than the integrated Class-D amplifier. Boost Converter Overvoltage Protection The TPA2015D1 internal boost converter operates in a discontinuous mode to improve the efficiency at light loads. The boost converter has overvoltage protection that disables the boost converter if the output voltage exceeds 5.8 V. If current is forced into the PVOUT terminal, the voltage clamp will sink up to 10 mA. If more than 10 mA is forced into PVOUT, then the PVOUT voltage will increase. Refer to the SPEAKER LOAD LIMITATION section for details. Boost Converter Component Section Boost Terms The following is a list of terms and definitions used in the boost equations found later in this document. C Minimum boost capacitance required for a given ripple voltage on PVOUT. L Boost inductor. fBOOST Switching frequency of the boost converter. IPVDD Current pulled by the Class-D amplifier from the boost converter. IL Average current through the boost inductor. PVDD (PVOUT) Supply voltage for the Class-D amplifier. (Voltage generated by the boost converter output.) VBAT Supply voltage to the IC. ΔIL Ripple current through the inductor. ΔV Ripple voltage on PVOUT. Boost Converter Inductor Selection Working inductance decreases as inductor current and temperature increases. If the drop in working inductance is severe enough, it may cause the boost converter to become unstable, or cause the TPA2015D1 to reach its current limit at a lower output voltage than expected. Inductor vendors specify currents at which inductor values decrease by a specific percentage. This can vary by 10% to 35%. Inductance is also affected by dc current and temperature. Inductor Equations Inductor current rating is determined by the requirements of the load. The inductance is determined by two factors: the minimum value required for stability and the maximum ripple current permitted in the application. Use Equation 1 to determine the required current rating. Equation 1 shows the approximate relationship between the average inductor current, IL, to the load current, load voltage, and input voltage (IPVDD, PVDD, and VBAT, respectively). Insert IPVDD, PVDD, and VBAT into Equation 1 and solve for IL. The inductor must maintain at least 90% of its initial inductance value at this current. PVDD æ ö IL = IPVDD ´ ç ÷ è VBAT ´ 0.8 ø (1) WARNING Use a minimum working inductance of 1.3 μH. Lower values may damage the inductor. 18 Submit Documentation Feedback Copyright © 2011, Texas Instruments Incorporated Product Folder Link(s): TPA2015D1 TPA2015D1 SLOS638A – NOVEMBER 2011 – REVISED NOVEMBER 2011 www.ti.com Ripple current, ΔIL, is peak-to-peak variation in inductor current. Smaller ripple current reduces core losses in the inductor and reduces the potential for EMI. Use Equation 2 to determine the value of the inductor, L. Equation 2 shows the relationship between inductance L, VBAT, PVDD, the switching frequency, fBOOST, and ΔIL. Insert the maximum acceptable ripple current into Equation 2 and solve for L. VBAT ´ (PVDD - VBAT) L= DIL ´ ¦BOOST ´ PVDD (2) ΔIL is inversely proportional to L. Minimize ΔIL as much as is necessary for a specific application. Increase the inductance to reduce the ripple current. Do not use greater than 4.7 μH, as this prevents the boost converter from responding to fast output current changes properly. If using above 3.3 µH, then use at least 10 µF capacitance on PVOUT to ensure boost converter stability. The typical inductor value range for the TPA2015D1 is 2.2 μH to 3.3 µH. Select an inductor with less than 0.5 Ω dc resistance, DCR. Higher DCR reduces total efficiency due to an increase in voltage drop across the inductor. Table 3. Sample Inductors L (μH) SUPPLIER COMPONENT CODE SIZE (L×W×H mm) DCR TYP (mΩ) ISAT MAX (A) 2.2 Chilisin Electronics Corp. CLCN252012T-2R2M-N 2.5 x 2.0 x 1.2 105 1.2 2.2 Toko 1239AS-H-2R2N=P2 2.5 × 2.0 × 1.2 96 2.3 2.2 Coilcraft XFL4020-222MEC 4.0 x 4.0 x 2.15 22 3.5 3.3 Toko 1239AS-H-3R3N=P2 2.5 × 2.0 × 1.2 160 2.0 3.3 Coilcraft XFL4020-332MEC 4.0 x 4.0 x 2.15 35 2.8 C RANGE 4.7 – 22 µF / 16 V 6.8 – 22 µF / 10 V 10 – 22 µF / 10 V Boost Converter Capacitor Selection The value of the boost capacitor is determined by the minimum value of working capacitance required for stability and the maximum voltage ripple allowed on PVDD in the application. Working capacitance refers to the available capacitance after derating the capacitor value for DC bias, temperature, and aging. Do not use any component with a working capacitance less than 4.7 μF. This corresponds to a 4.7 µF / 16 V capacitor, or a 6.8 µF / 10 V capacitor. Do not use above 22 µF capacitance as it will reduce the boost converter response time to large output current transients. Equation 3 shows the relationship between the boost capacitance, C, to load current, load voltage, ripple voltage, input voltage, and switching frequency (IPVDD, PVDD, ΔV, VBAT, and fBOOST respectively). Insert the maximum allowed ripple voltage into Equation 3 and solve for C. The 1.5 multiplier accounts for capacitance loss due to applied dc voltage and temperature for X5R and X7R ceramic capacitors. I ´ (PVDD - VBAT) C = 1.5 ´ PVDD DV ´ ¦BOOST ´ PVDD (3) Submit Documentation Feedback Copyright © 2011, Texas Instruments Incorporated Product Folder Link(s): TPA2015D1 19 TPA2015D1 SLOS638A – NOVEMBER 2011 – REVISED NOVEMBER 2011 www.ti.com COMPONENTS LOCATION AND SELECTION Decoupling Capacitors The TPA2015D1 is a high-performance Class-D audio amplifier that requires adequate power supply decoupling. Adequate power supply decoupling to ensures that the efficiency is high and total harmonic distortion (THD) is low. Place a low equivalent-series-resistance (ESR) ceramic capacitor, typically 0.1 μF, within 2 mm of the VBAT ball. This choice of capacitor and placement helps with higher frequency transients, spikes, or digital hash on the line. Additionally, placing this decoupling capacitor close to the TPA2015D1 is important, as any parasitic resistance or inductance between the device and the capacitor causes efficiency loss. In addition to the 0.1 µF ceramic capacitor, place a 2.2 μF to 10 μF capacitor on the VBAT supply trace. This larger capacitor acts as a charge reservoir, providing energy faster than the board supply, thus helping to prevent any droop in the supply voltage. Input Capacitors Input audio DC decoupling capacitors are recommended. The input audio DC decoupling capacitors prevents the AGC from changing the gain due to audio DAC output offset. The input capacitors and TPA2015D1 input impedance form a high-pass filter with the corner frequency, fC, determined in Equation 4. Any mismatch in capacitance between the two inputs will cause a mismatch in the corner frequencies. Severe mismatch may also cause turn-on pop noise. Choose capacitors with a tolerance of ±10% or better. 1 fc = (2 x p x RICI ) (4) EFFICIENCY AND THERMAL INFORMATION It is important to operate the TPA2015D1 at temperatures lower than its maximum operating temperature. The maximum ambient temperature depends on the heat-sinking ability of the PCB system. The derating factor for the package is shown in the dissipation rating table. Converting this to θJA for the WCSP package: 1 1 θ JA = = = 153°C/W Derating Factor 0.0065 (5) Given θJA of 153°C/W, the maximum allowable junction temperature of 150°C, and the internal dissipation of 0.34 W for 1.7 W, 8 Ω load, 3.6 V supply, the maximum ambient temperature is calculated as: qJA MAX = TJMAX = qJA PDmax = 150 - 153(0.34) = 97.98°C (6) Equation 6 shows that the calculated maximum ambient temperature is 98°C at maximum power dissipation with at 3.6 V supply and 8 Ω a load. The TPA2015D3 is designed with thermal protection that turns the device off when the junction temperature surpasses 150°C to prevent damage to the IC. 20 Submit Documentation Feedback Copyright © 2011, Texas Instruments Incorporated Product Folder Link(s): TPA2015D1 TPA2015D1 SLOS638A – NOVEMBER 2011 – REVISED NOVEMBER 2011 www.ti.com OPERATION WITH DACS AND CODECS Large ripple voltages can be present at the output of ΔΣ DACs and CODECs, just above the audio frequency (e.g: 80 kHz with a 300 mVPP). This out-of-band noise is due to the noise shaping of the delta-sigma modulator in the DAC. Some Class-D amplifiers have higher output noise when used in combination with these DACs and CODECs. This is because out-of-band noise from the CODEC/DAC mixes with the Class-D switching frequencies in the audio amplifier input stage. The TPA2015D1 has a built-in low-pass filter that reduces the out-of-band noise and RF noise, filtering out-of-band frequencies that could degrade in-band noise performance. This built-in filter also prevents AGC errors due to out-of-band noise. The TPA2015D1 AGC calculates gain based on input signal amplitude only. If driving the TPA2015D1 input with 4th-order or higher ΔΣ DACs or CODECs, add an R-C low pass filter at each of the audio inputs (IN+ and IN-) of the TPA2015D1 to ensure best performance. The recommended resistor value is 100 Ω and the capacitor value of 47 nF. Connected to Supply 2.2 mH 2.2 mF – 10 mF 6.8 mF – 22 mF VDD Differential Audio Inputs SW PVOUT PVDD IN100 W IN+ OUT+ 47 nF Gain Control GAIN AGC Control AGC Boost Enable ENB Class-D Enable END TPA2015D1 OUT- GND Figure 27. Reducing Out-of-Band DAC Noise with External Input Filter FILTER FREE OPERATION AND FERRITE BEAD FILTERS The TPA2015D1 is designed to minimize RF emissions. For more information about RF emissions and filtering requirements, See SLOA145 for further information. PACKAGE DIMENSIONS The TPA2015D1 uses a 16-ball, 0.5 mm pitch WCSP package. The die length (D) and width (E) correspond to the package mechanical drawing at the end of the datasheet. Table 4. Package Dimensions Dimension D E Max 1984 µm 1984 µm Typ 1954 µm 1954 µm Min 1924 µm 1924 µm Submit Documentation Feedback Copyright © 2011, Texas Instruments Incorporated Product Folder Link(s): TPA2015D1 21 TPA2015D1 SLOS638A – NOVEMBER 2011 – REVISED NOVEMBER 2011 www.ti.com BOARD LAYOUT In making the pad size for the WCSP balls, it is recommended that the layout use nonsolder mask defined (NSMD) land. With this method, the solder mask opening is made larger than the desired land area, and the opening size is defined by the copper pad width. Figure 28 and Table 5 show the appropriate diameters for a WCSP layout. Copper Trace Width Solder Pad Width Solder Mask Opening Copper Trace Thickness Solder Mask Thickness Figure 28. Land Pattern Dimensions Table 5. Land Pattern Dimensions (1) SOLDER PAD DEFINITIONS COPPER PAD Nonsolder mask defined (NSMD) 275 μm (+0.0, -25 μm) (1) (2) (3) (4) (5) (6) (7) SOLDER MASK OPENING (5) 375 μm (+0.0, -25 μm) (2) (3) (4) COPPER THICKNESS STENCIL (6) (7) OPENING STENCIL THICKNESS 1 oz max (32 μm) 275 μm x 275 μm Sq. (rounded corners) 125 μm thick Circuit traces from NSMD defined PWB lands should be 75 μm to 100 μm wide in the exposed area inside the solder mask opening. Wider trace widths reduce device stand off and impact reliability. Best reliability results are achieved when the PWB laminate glass transition temperature is above the operating the range of the intended application. Recommend solder paste is Type 3 or Type 4. For a PWB using a Ni/Au surface finish, the gold thickness should be less 0.5 mm to avoid a reduction in thermal fatigue performance. Solder mask thickness should be less than 20 μm on top of the copper circuit pattern Best solder stencil performance is achieved using laser cut stencils with electro polishing. Use of chemically etched stencils results in inferior solder paste volume control. Trace routing away from WCSP device should be balanced in X and Y directions to avoid unintentional component movement due to solder wetting forces. TRACE WIDTH Recommended trace width at the solder balls is 75 μm to 100 μm to prevent solder wicking onto wider PCB traces. For high current pins (SW, GND, OUT+, OUT–, PVOUT, and PVDD) of the TPA2015D1, use 100 μm trace widths at the solder balls and at least 500 μm PCB traces to ensure proper performance and output power for the device. For low current pins (IN–, IN+, END, ENB, GAIN, AGC, VBAT) of the TPA2015D1, use 75 μm to 100 μm trace widths at the solder balls. Run IN- and IN+ traces side-by-side (and if possible, same length) to maximize common-mode noise cancellation. 22 Submit Documentation Feedback Copyright © 2011, Texas Instruments Incorporated Product Folder Link(s): TPA2015D1 TPA2015D1 SLOS638A – NOVEMBER 2011 – REVISED NOVEMBER 2011 www.ti.com REVISION HISTORY Changes from Original (May 2010) to Revision A • Page Changed the Boost Converter, PVOUT entry in the Operating Conditions Table ................................................................ 5 Submit Documentation Feedback Copyright © 2011, Texas Instruments Incorporated Product Folder Link(s): TPA2015D1 23 PACKAGE OPTION ADDENDUM www.ti.com 11-Nov-2011 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/ Ball Finish MSL Peak Temp (3) Samples (Requires Login) TPA2015D1YZHR ACTIVE DSBGA YZH 16 3000 Green (RoHS & no Sb/Br) SNAGCU Level-1-260C-UNLIM TPA2015D1YZHT ACTIVE DSBGA YZH 16 250 Green (RoHS & no Sb/Br) SNAGCU Level-1-260C-UNLIM (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 10-Nov-2011 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) TPA2015D1YZHR DSBGA YZH 16 3000 180.0 8.4 TPA2015D1YZHT DSBGA YZH 16 250 180.0 8.4 Pack Materials-Page 1 B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant 2.07 2.07 0.81 4.0 8.0 Q1 2.07 2.07 0.81 4.0 8.0 Q1 PACKAGE MATERIALS INFORMATION www.ti.com 10-Nov-2011 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TPA2015D1YZHR DSBGA YZH 16 3000 210.0 185.0 35.0 TPA2015D1YZHT DSBGA YZH 16 250 210.0 185.0 35.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed. TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. To minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in such safety-critical applications. TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions: Products Applications Audio www.ti.com/audio Communications and Telecom www.ti.com/communications Amplifiers amplifier.ti.com Computers and Peripherals www.ti.com/computers Data Converters dataconverter.ti.com Consumer Electronics www.ti.com/consumer-apps DLP® Products www.dlp.com Energy and Lighting www.ti.com/energy DSP dsp.ti.com Industrial www.ti.com/industrial Clocks and Timers www.ti.com/clocks Medical www.ti.com/medical Interface interface.ti.com Security www.ti.com/security Logic logic.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense Power Mgmt power.ti.com Transportation and Automotive www.ti.com/automotive Microcontrollers microcontroller.ti.com Video and Imaging RFID www.ti-rfid.com OMAP Mobile Processors www.ti.com/omap Wireless Connectivity www.ti.com/wirelessconnectivity TI E2E Community Home Page www.ti.com/video e2e.ti.com Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2011, Texas Instruments Incorporated