TI INA826AIDGK

INA826
SBOS562A – AUGUST 2011 – REVISED SEPTEMBER 2011
www.ti.com
Precision, 200-µA Supply Current, 2.7-V to 36-V Supply
Instrumentation Amplifier with Rail-to-Rail Output
Check for Samples: INA826
FEATURES
DESCRIPTION
• Input Common-Mode Range: Includes V–
• Common-Mode Rejection:
– 104 dB, min (G = 10)
– 100 dB, min at 5 kHz (G = 10)
• Power-Supply Rejection: 100 dB, min (G = 1)
• Low Offset Voltage: 150 µV, max
• Gain Drift: 1 ppm/°C (G = 1), 35 ppm/°C (G > 1)
• Noise: 18 nV/√Hz, G ≥ 100
• Bandwidth: 1 MHz (G = 1), 60 kHz (G = 100)
• Inputs Protected up to ±40 V
• Rail-to-Rail Output
• Supply Current: 200 µA
• Supply Range:
– Single Supply: +2.7 V to +36 V
– Dual Supply: ±1.35 V to ±18 V
• Specified Temperature Range:
–40°C to +125°C
• Packages: MSOP-8, SO-8 and DFN-8
The INA826 is a low-cost instrumentation amplifier
that offers extremely low power consumption and
operates over a very wide single or dual supply
range. A single external resistor sets any gain from 1
to 1000. It offers excellent stability over temperature,
even at G > 1, as a result of the low gain drift of only
35 ppm/°C (max).
1
234
APPLICATIONS
•
•
•
•
•
•
•
The INA826 is optimized to provide excellent
common-mode rejection ratio of over 100 dB (G = 10)
over frequencies up to 5 kHz. In G = 1, the
common-mode rejection ratio exceeds 84 dB across
the full input common-mode range from the negative
supply all the way up to 1 V of the positive supply.
Using a rail-to-rail output, the INA826 is well-suited
for low voltage operation from a 2.7 V single supply
as well as dual supplies up to ±18 V.
Additional circuitry protects the inputs against
overvoltage of up to ±40 V beyond the power
supplies by limiting the input currents to less than
8 mA.
The INA826 is available in SO-8, MSOP-8, and tiny
3-mm × 3-mm DFN-8 surface-mount packages. All
versions are specified for the –40°C to +125°C
temperature range.
Industrial Process Controls
Circuit Breakers
Battery Testers
ECG Amplifiers
Power Automation
Medical Instrumentation
Portable Instrumentation
RELATED PRODUCTS
DEVICE
DESCRIPTION
INA333
25-µV VOS, 0.1 µV/°C VOS drift, 1.8-V to 5-V, RRO,
50-µA IQ, chopper-stabilized INA
PGA280
20-mV to ±10-V programmable gain IA with 3-V or
5-V differential output; analog supply up to ±18 V
INA159
G = 0.2 V differential amplifier for ±10-V to 3-V and
5-V conversion
PGA112
Precision programmable gain op amp with SPI™
interface
-IN
1
8
+VS
RG
2
7
VOUT
RG
3
6
REF
+IN
4
5
-VS
MSOP-8, SO-8
1
2
3
4
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
SPI is a trademark of Motorola.
PhotoMOS is a registered trademark of Panasonic Electric Works Europe AG.
All other trademarks are the property of their respective owners.
UNLESS OTHERWISE NOTED this document contains
PRODUCTION DATA information current as of publication date.
Products conform to specifications per the terms of Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2011, Texas Instruments Incorporated
INA826
SBOS562A – AUGUST 2011 – REVISED SEPTEMBER 2011
www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
PACKAGE/ORDERING INFORMATION (1)
PRODUCT
PACKAGE-LEAD
PACKAGE DESIGNATOR
PACKAGE MARKING
INA826
MSOP-8
DGK
IPDI
SO-8 (2)
D
I826
DRG
IPEI
INA826
(1)
(2)
DFN-8
(2)
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or visit the
device product folder at www.ti.com.
Product preview device.
ABSOLUTE MAXIMUM RATINGS (1)
INA826
UNIT
Supply voltage
±20
V
Input voltage range
±40
V
REF input
±20
V
Output short-circuit
(2)
Continuous
Operating temperature range, TA
–50 to +150
°C
Storage temperature range, TA
–65 to +150
°C
+175
°C
Human body model (HBM)
2500
V
Charged device model (CDM)
1500
V
Machine model (MM)
150
V
Junction temperature, TJ
ESD rating
(1)
(2)
2
Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may
degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond
those specified is not implied.
Short-circuit to VS/2.
Submit Documentation Feedback
Copyright © 2011, Texas Instruments Incorporated
Product Folder Link(s): INA826
INA826
SBOS562A – AUGUST 2011 – REVISED SEPTEMBER 2011
www.ti.com
ELECTRICAL CHARACTERISTICS
At TA = +25°C, VS = ±15 V, RL = 10 kΩ, VREF = 0 V, and G = 1, unless otherwise noted.
INA826
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
RTI
40
150
vs temperature, TA = –40°C to +125°C
0.4
2
RTI
200
700
µV
2
10
µV/°C
INPUT
VOSI
Input stage offset voltage (1)
VOSO
Output stage offset
voltage (1)
PSRR
vs temperature, TA = –40°C to +125°C
Power supply rejection
µV
µV/°C
G = 1, RTI
100
124
dB
G = 10, RTI
115
130
dB
G = 100, RTI
120
140
dB
G = 1000, RTI
120
140
dB
ZIN
Differential impedance
20 || 1
GΩ || pF
ZIN
Common-mode impedance
10 || 5
GΩ || pF
RFI filter, –3-dB frequency
VCM
Operating input range
20
VS = ±1.35 V to ±18 V, TA = –40°C to +125°C
DC to
60 Hz, RTI
CMRR
At 5 kHz,
RTI
V
±40
V
G = 1, VCM = (V–) to (V+) – 1 V
84
95
dB
G = 10, VCM = (V–) to (V+) – 1 V
104
115
dB
G = 100, VCM = (V–) to (V+) – 1 V
120
130
dB
G = 1000, VCM = (V–) to (V+) – 1 V
120
130
dB
G = 1, VCM = (V–) to (V+) – 1 V,
TA = –40°C to +125°C
Common-mode rejection
V
See Figure 41 to Figure 44
TA = –40°C to +125°C
Input overvoltage range
MHz
(V+) – 1
V–
(2)
80
dB
G = 1, VCM = (V–) to (V+) – 1 V
84
dB
G = 10, VCM = (V–) to (V+) – 1 V
100
dB
G = 100, VCM = (V–) to (V+) – 1 V
105
dB
G = 1000, VCM = (V–) to (V+) – 1 V
105
dB
BIAS CURRENT
IB
IOS
VCM = VS/2
Input bias current
35
TA = –40°C to +125°C
VCM = VS/2
Input offset current
0.7
TA = –40°C to +125°C
65
nA
95
nA
5
nA
10
nA
20
nV/√Hz
115
nV/√Hz
NOISE VOLTAGE
eNI
eNO
iN
(1)
(2)
f = 1 kHz, G = 100, RS = 0 Ω
Input stage voltage noise (3)
Output stage voltage noise
Noise current
(3)
18
fB = 0.1 Hz to 10 Hz, G = 100, RS = 0 Ω
0.52
f = 1 kHz, G = 1, RS = 0 Ω
110
µVPP
fB = 0.1 Hz to 10 Hz, G = 1, RS = 0 Ω
3.3
µVPP
f = 1 kHz
100
fA/√Hz
fB = 0.1 Hz to 10 Hz
5
pAPP
Total offset, referred-to-input (RTI): VOS = (VOSI) + (VOSO/G).
Input voltage range of the INA826 input stage. The input range depends on the common-mode voltage, differential voltage, gain, and
reference voltage. See Typical Characteristic curves Figure 9 through Figure 16 and Figure 41 through Figure 44 for more information.
(3)
(eNI)2 +
eNO
Total RTI voltage noise =
G
2
.
Submit Documentation Feedback
Copyright © 2011, Texas Instruments Incorporated
Product Folder Link(s): INA826
3
INA826
SBOS562A – AUGUST 2011 – REVISED SEPTEMBER 2011
www.ti.com
ELECTRICAL CHARACTERISTICS (continued)
At TA = +25°C, VS = ±15 V, RL = 10 kΩ, VREF = 0 V, and G = 1, unless otherwise noted.
INA826
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
GAIN
49.4 kW
G
Gain equation
G
Range of gain
GE
Gain error
Gain vs temperature (4)
Gain nonlinearity
1+
V/V
RG
1
1000
V/V
G = 1, VO = ±10 V
±0.003
±0.015
%
G = 10, VO = ±10 V
±0.03
±0.15
%
G = 100, VO = ±10 V
±0.04
±0.15
%
G = 1000, VO = ±10 V
±0.04
±0.15
G = 1, TA = –40°C to +125°C
±0.1
±1
ppm/°C
G > 1, TA = –40°C to +125°C
ppm/°C
%
±10
±35
G = 1 to 100, VO = –10 V to +10 V
1
5
ppm
G = 1000, VO = –10 V to +10 V
5
20
ppm
OUTPUT
Voltage swing
RL = 10 kΩ
1000
Open loop output impedance
Short-circuit current
(V+) – 0.15
(V–) + 0.1
Load capacitance stability
V
pF
See Figure 56
Continuous to VS/2
±16
mA
FREQUENCY RESPONSE
G=1
BW
SR
tS
tS
(4)
4
Bandwidth, –3 dB
Slew rate
Settling time to 0.01%
Settling time to 0.001%
1
MHz
G = 10
500
kHz
G = 100
60
kHz
G = 1000
6
kHz
G = 1, VO = ±14.5 V
1
V/µs
G = 100, VO = ±14.5 V
1
V/µs
G = 1, VSTEP = 10 V
12
µs
G = 10, VSTEP = 10 V
12
µs
G = 100, VSTEP = 10 V
24
µs
G = 1000, VSTEP = 10 V
224
µs
G = 1, VSTEP = 10 V
14
µs
G = 10, VSTEP = 10 V
14
µs
G = 100, VSTEP = 10 V
31
µs
G = 1000, VSTEP = 10 V
278
µs
The values specified for G > 1 do not include the effects of the external gain-setting resistor, RG.
Submit Documentation Feedback
Copyright © 2011, Texas Instruments Incorporated
Product Folder Link(s): INA826
INA826
SBOS562A – AUGUST 2011 – REVISED SEPTEMBER 2011
www.ti.com
ELECTRICAL CHARACTERISTICS (continued)
At TA = +25°C, VS = ±15 V, RL = 10 kΩ, VREF = 0 V, and G = 1, unless otherwise noted.
INA826
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
REFERENCE INPUT
RIN
Input impedance
100
Voltage range
kΩ
(V–)
Gain to output
(V+)
V
1
Reference gain error
V/V
0.01
%
POWER SUPPLY
VS
Power-supply voltage
IQ
Quiescent current
Single
Dual
+2.7
+36
±1.35
±18
V
V
VIN = 0 V
200
250
µA
vs temperature, TA = –40°C to +125°C
250
300
µA
TEMPERATURE RANGE
Specified
–40
+125
°C
Operating
–50
+150
°C
THERMAL INFORMATION
THERMAL METRIC (1)
INA826
INA826
INA826
D (SOIC)
DGK (MSOP)
DRG (DFN)
8 PINS
8 PINS
8 PINS
θJA
Junction-to-ambient thermal resistance
141.4
215.4
50.9
θJCtop
Junction-to-case (top) thermal resistance
75.4
66.3
60.0
θJB
Junction-to-board thermal resistance
59.6
97.8
25.4
ψJT
Junction-to-top characterization parameter
27.4
10.5
1.2
ψJB
Junction-to-board characterization parameter
59.1
96.1
25.5
θJCbot
Junction-to-case (bottom) thermal resistance
N/A
N/A
7.2
(1)
UNITS
°C/W
For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
Submit Documentation Feedback
Copyright © 2011, Texas Instruments Incorporated
Product Folder Link(s): INA826
5
INA826
SBOS562A – AUGUST 2011 – REVISED SEPTEMBER 2011
www.ti.com
PIN CONFIGURATIONS
DGK PACKAGE
MSOP-8, SO-8
(TOP VIEW)
DRG PACKAGE
3-mm × 3-mm DFN-8
(TOP VIEW)
-IN
1
8
+VS
RG
2
7
VOUT
RG
3
6
REF
+IN
4
5
-VS
-IN
1
RG
2
RG
3
+IN
4
Exposed
Thermal
Die Pad
on
Underside
8
+VS
7
VOUT
6
REF
5
-VS
(1) SO-8 and DFN-8 packages are product preview.
PIN DESCRIPTIONS
6
NAME
NO.
–IN
1
Negative input
DESCRIPTION
RG
2
Gain setting pin. Place a gain resistor between pin 2 and pin 3.
RG
3
Gain setting pin. Place a gain resistor between pin 2 and pin 3.
+IN
4
Positive input
–VS
5
Negative supply
REF
6
Reference input. This pin must be driven by low impedance.
VOUT
7
Output
+VS
8
Positive supply
Submit Documentation Feedback
Copyright © 2011, Texas Instruments Incorporated
Product Folder Link(s): INA826
INA826
SBOS562A – AUGUST 2011 – REVISED SEPTEMBER 2011
www.ti.com
TYPICAL CHARACTERISTICS
At TA = +25°C, VS = ±15 V, RL = 10 kΩ, VREF = 0 V, and G = 1, unless otherwise noted.
TYPICAL DISTRIBUTION OF
INPUT OFFSET VOLTAGE
TYPICAL DISTRIBUTION OF
INPUT OFFSET VOLTAGE DRIFT
1600
25
1400
20
1200
Count
Count
1000
800
15
10
600
400
5
200
−2
−1.8
−1.6
−1.4
−1.2
−1
−0.8
−0.6
−0.4
−0.2
0
0.2
0.4
0.6
0.8
1
1.2
1.4
1.6
1.8
2
0
−200
−180
−160
−140
−120
−100
−80
−60
−40
−20
0
20
40
60
80
100
120
140
160
180
200
0
VOSI (µV)
VOSI Drift (µV/°C)
G026
Figure 1.
Figure 2.
TYPICAL DISTRIBUTION OF
OUTPUT OFFSET VOLTAGE
TYPICAL DISTRIBUTION OF
OUTPUT OFFSET VOLTAGE DRIFT
1600
G029
25
1400
20
1200
Count
Count
1000
800
15
10
600
400
5
200
0
VOSO (µV)
−10
−9
−8
−7
−6
−5
−4
−3
−2
−1
0
1
2
3
4
5
6
7
8
9
10
−1000
−900
−800
−700
−600
−500
−400
−300
−200
−100
0
100
200
300
400
500
600
700
800
900
1000
0
VOSO Drift (µV/°C)
G025
Figure 3.
Figure 4.
TYPICAL DISTRIBUTION OF
INPUT BIAS CURRENT
TYPICAL DISTRIBUTION OF
INPUT OFFSET CURRENT
2000
G030
3000
2500
1500
Count
Count
2000
1000
1500
1000
500
500
−5
−4.5
−4
−3.5
−3
−2.5
−2
−1.5
−1
−0.5
0
0.5
1
1.5
2
2.5
3
3.5
4
4.5
5
0
17
19
21
23
25
27
29
31
33
35
37
39
41
43
45
47
49
51
53
55
0
IB (nA)
IOS (nA)
G027
Figure 5.
G028
Figure 6.
Submit Documentation Feedback
Copyright © 2011, Texas Instruments Incorporated
Product Folder Link(s): INA826
7
INA826
SBOS562A – AUGUST 2011 – REVISED SEPTEMBER 2011
www.ti.com
TYPICAL CHARACTERISTICS (continued)
At TA = +25°C, VS = ±15 V, RL = 10 kΩ, VREF = 0 V, and G = 1, unless otherwise noted.
TYPICAL GAIN ERROR DRIFT DISTRIBUTION
(G = 1)
TYPICAL GAIN ERROR DRIFT DISTRIBUTION
(G > 1)
32000
16000
Wafer Probe Data
14000
24000
12000
20000
10000
Count
28000
16000
8000
12000
6000
8000
4000
4000
2000
0
0
Gain Error Drift (ppm/°C)
−20
−19
−18
−17
−16
−15
−14
−13
−12
−11
−10
−9
−8
−7
−6
−5
−4
−3
−2
−1
0
−1
−0.9
−0.8
−0.7
−0.6
−0.5
−0.4
−0.3
−0.2
−0.1
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1
Count
Wafer Probe Data
Gain Error Drift (ppm/°C)
G052
Figure 8.
INPUT COMMON-MODE VOLTAGE vs OUTPUT VOLTAGE
(Single Supply, VS = +2.7 V, G = 1)
INPUT COMMON-MODE VOLTAGE vs OUTPUT VOLTAGE
(Single Supply, VS = +2.7 V, G = 100)
3
3
VREF = 0 V
VREF = 1.35 V
2.5
2
1.5
1
0.5
0
−0.5
−1
VREF = 0 V
VREF = 1.35 V
VS = 2.7 V, G = 100
Common−Mode Voltage (V)
Common−Mode Voltage (V)
VS = 2.7 V, G = 1
2.5
2
1.5
1
0.5
0
−0.5
0
0.5
1
1.5
2
Output Voltage (V)
2.5
−1
3
0
0.5
1
G035
1.5
2
Output Voltage (V)
2.5
3
G036
Figure 9.
Figure 10.
INPUT COMMON-MODE VOLTAGE vs OUTPUT VOLTAGE
(Single Supply, VS = +5 V, G = 1)
INPUT COMMON-MODE VOLTAGE vs OUTPUT VOLTAGE
(Single Supply, VS = +5 V, G = 100)
4
3.5
3
2.5
2
1.5
1
0.5
0
−0.5
−1
0
0.5
1
1.5
5
4.5
VREF = 0 V
VREF = 2.5 V
VS = 5 V, G = 1
2
2.5
3
3.5
Output Voltage (V)
4
4.5
Common−Mode Voltage (V)
Common−Mode Voltage (V)
5
4.5
5
4
3.5
3
2.5
2
1.5
1
0.5
0
−0.5
−1
VREF = 0 V
VREF = 2.5 V
VS = 5 V, G = 100
0
G034
Figure 11.
8
G051
Figure 7.
0.5
1
1.5
2
2.5
3
3.5
Output Voltage (V)
4
4.5
5
G037
Figure 12.
Submit Documentation Feedback
Copyright © 2011, Texas Instruments Incorporated
Product Folder Link(s): INA826
INA826
SBOS562A – AUGUST 2011 – REVISED SEPTEMBER 2011
www.ti.com
TYPICAL CHARACTERISTICS (continued)
At TA = +25°C, VS = ±15 V, RL = 10 kΩ, VREF = 0 V, and G = 1, unless otherwise noted.
INPUT COMMON-MODE VOLTAGE vs OUTPUT VOLTAGE
(Dual Supply, VS = ±3.3 V)
INPUT COMMON-MODE VOLTAGE vs OUTPUT VOLTAGE
(Dual Supply, VS = ±5 V)
5
3
VS = ±3.3 V
VREF= 0 V
VS = ±5 V
VREF= 0 V
4
Common−Mode Voltage (V)
Common−Mode Voltage (V)
2
G=1
G = 100
1
0
−1
−2
−3
3
G=1
G = 100
2
1
0
−1
−2
−3
−4
−5
−4
−3
−2
−1
0
1
Output Voltage (V)
2
3
−6
4
−6
−5
−4
G039
−3
−2 −1 0
1
2
Output Voltage (V)
3
4
5
6
G038
Figure 13.
Figure 14.
INPUT COMMON-MODE VOLTAGE vs OUTPUT VOLTAGE
(Dual Supply, VS = ±15 V, ±12 V, G = 1)
INPUT COMMON-MODE VOLTAGE vs OUTPUT VOLTAGE
(Dual Supply, VS = ±15 V, ±12 V, G = 100)
VS= ±15 V
VS= ±12 V
8 10 12 14 16
G040
16
G = 100, VREF= 0 V
14
12
10
8
6
4
2
0
−2
−4
−6
−8
−10
−12
−14
−16
−16−14−12−10 −8 −6 −4 −2 0 2 4 6
Output Voltage (V)
VS= ±15 V
VS= ±12 V
8 10 12 14 16
G040
Figure 15.
Figure 16.
INPUT OVERVOLTAGE vs INPUT CURRENT
(G = 1, VS = ±15 V)
INPUT OVERVOLTAGE vs INPUT CURRENT
WITH 10-kΩ RESISTANCE
(G = 1, VS = ±15 V)
16
8m
9m
12
6m
12
6m
8
4m
8
3m
4
2m
4
0
0
0
0
−8
−6m
−9m
IIN
VOUT
RS = 0 Ω
Input Current (A)
−4
−3m
Output Voltage (V)
12m
−4
−2m
−8
−4m
−12
−16
−12m
−40−35−30−25−20−15−10 −5 0 5 10 15 20 25 30 35 40
Input Voltage (V)
16
RS = 10k Ω
IIN
VOUT
−6m
G065
−12
−16
−8m
−40−35−30−25−20−15−10 −5 0 5 10 15 20 25 30 35 40
Input Voltage (V)
Figure 17.
Output Voltage (V)
16
G = 1, VREF= 0 V
14
12
10
8
6
4
2
0
−2
−4
−6
−8
−10
−12
−14
−16
−16−14−12−10 −8 −6 −4 −2 0 2 4 6
Output Voltage (V)
Common−Mode Voltage (V)
Common−Mode Voltage (V)
Input Current (A)
−4
G064
Figure 18.
Submit Documentation Feedback
Copyright © 2011, Texas Instruments Incorporated
Product Folder Link(s): INA826
9
INA826
SBOS562A – AUGUST 2011 – REVISED SEPTEMBER 2011
www.ti.com
TYPICAL CHARACTERISTICS (continued)
At TA = +25°C, VS = ±15 V, RL = 10 kΩ, VREF = 0 V, and G = 1, unless otherwise noted.
CMRR vs FREQUENCY
(RTI)
CMRR vs FREQUENCY
(RTI, 1-kΩ Source Imbalance)
140
Common−Mode Rejection Ratio (dB)
Common−Mode Rejection Ratio (dB)
160
140
120
100
80
60
G=1
G = 10
G = 100
G = 1000
40
20
0
10
100
1k
Frequency (Hz)
10k
120
100
80
60
40
G=1
G = 10
G = 100
G = 1000
20
0
100k
10
100
G001
Figure 19.
140
140
120
100
80
60
0
G=1
G = 10
G = 100
G = 1000
10
1k
Frequency (Hz)
10k
100
80
60
G=1
G = 10
G = 100
G = 1000
40
0
100k
10
100
G003
1k
Frequency (Hz)
10k
100k
G004
Figure 21.
Figure 22.
GAIN vs FREQUENCY
VOLTAGE NOISE SPECTRAL DENSITY
vs FREQUENCY (RTI)
1k
70
50
40
Voltage Noise (nV/ Hz)
G=1
G = 10
G = 100
G = 1000
60
Gain (dB)
G002
120
20
100
100k
NEGATIVE PSRR vs FREQUENCY (RTI)
160
Negative Power−Supply
Rejection Ratio (dB)
Positive Power−Supply
Rejection Ratio (dB)
POSITIVE PSRR vs FREQUENCY (RTI)
20
10k
Figure 20.
160
40
1k
Frequency (Hz)
30
20
10
0
−10
G=1
G = 10
G = 100
G = 1000
100
−20
−30
10
100
1k
10k
100k
Frequency (Hz)
1M
10M
10
1
G005
Figure 23.
10
10
100
1k
Frequency (Hz)
10k
100k
G019
Figure 24.
Submit Documentation Feedback
Copyright © 2011, Texas Instruments Incorporated
Product Folder Link(s): INA826
INA826
SBOS562A – AUGUST 2011 – REVISED SEPTEMBER 2011
www.ti.com
TYPICAL CHARACTERISTICS (continued)
At TA = +25°C, VS = ±15 V, RL = 10 kΩ, VREF = 0 V, and G = 1, unless otherwise noted.
CURRENT NOISE SPECTRAL DENSITY vs FREQUENCY
(RTI)
0.1-Hz TO 10-Hz RTI VOLTAGE NOISE (G = 1)
1k
3
Noise (µV/div)
Current Noise (fA/ Hz)
2
100
1
0
−1
−2
10
1
10
100
Frequency (Hz)
1k
−3
10k
0
1
2
3
G020
Figure 25.
4
5
6
Time (s/div)
7
8
9
10
G007
Figure 26.
0.1-Hz TO 10-Hz RTI VOLTAGE NOISE (G = 1000)
0.1-Hz TO 10-Hz RTI CURRENT NOISE
400
15
300
10
Noise (pA/div)
Noise (nV/div)
200
100
0
−100
5
0
−5
−200
−10
−300
−400
0
1
2
3
4
5
6
Time (s/div)
7
8
9
−15
10
1
2
3
4
5
6
Time (s/div)
7
8
9
10
G008
Figure 27.
Figure 28.
INPUT BIAS CURRENT vs COMMON-MODE VOLTAGE
(VS = +2.7 V)
INPUT BIAS CURRENT vs COMMON-MODE VOLTAGE
(VS = ±15 V)
0
0
−40°C
+25°C
+125°C
−20
−10
Input Bias Current (nA)
−10
Input Bias Current (nA)
0
G006
−30
−40
−50
−60
−70
−80
−20
−40°C
+25°C
+125°C
−30
−40
−50
−60
−70
−1
−0.5
0
0.5
1
1.5
2
Common Mode Voltage (V)
2.5
3
−80
−16
G056
Figure 29.
−12
−8
−4
0
4
8
Common Mode Voltage (V)
12
16
G055
Figure 30.
Submit Documentation Feedback
Copyright © 2011, Texas Instruments Incorporated
Product Folder Link(s): INA826
11
INA826
SBOS562A – AUGUST 2011 – REVISED SEPTEMBER 2011
www.ti.com
TYPICAL CHARACTERISTICS (continued)
At TA = +25°C, VS = ±15 V, RL = 10 kΩ, VREF = 0 V, and G = 1, unless otherwise noted.
INPUT BIAS CURRENT vs TEMPERATURE
INPUT OFFSET CURRENT vs TEMPERATURE
100
Representative Data
Input Offset Current − IOS (nA)
Input Bias Current − IB (nA)
90
10
80
70
60
50
40
30
20
10
0
−50
4
2
0
−2
−4
−6
−8
−25
0
25
50
75
Temperature (°C)
100
125
−10
−50
150
0
GAIN ERROR vs TEMPERATURE
(G > 1)
Gain Error (ppm)
0
−10
−20
−30
500
0
−500
−1000
Representative Data
Normalized at +25°C
−25
0
25
50
75
Temperature (°C)
−1500
100
125
150
−2000
−50
Representative Data
Normalized at +25°C
−25
0
G031
Figure 33.
25
50
75
Temperature (°C)
100
125
150
G054
Figure 34.
CMRR vs TEMPERATURE (G = 1)
SUPPLY CURRENT vs TEMPERATURE
300
10
8
250
Supply Current (µA)
6
CMRR (µV/V)
150
1000
10
−40
4
2
0
−2
−4
−6
0
25
50
75
Temperature (°C)
150
100
50
Representative Data
Normalized at +25°C
−25
VS = 2.7 V
VS = ±15 V
200
100
125
150
0
−50
G032
Figure 35.
12
125
G053
GAIN ERROR vs TEMPERATURE
(G = 1)
1500
−10
−50
100
Figure 32.
2000
−8
25
50
75
Temperature (°C)
Figure 31.
30
−60
−50
−25
G033
20
Gain Error (ppm)
6
40
−50
Max Data
Min Data
Unit 1
Unit 2
Unit 3
8
−25
0
25
50
75
Temperature (°C)
100
125
150
G043
Figure 36.
Submit Documentation Feedback
Copyright © 2011, Texas Instruments Incorporated
Product Folder Link(s): INA826
INA826
SBOS562A – AUGUST 2011 – REVISED SEPTEMBER 2011
www.ti.com
TYPICAL CHARACTERISTICS (continued)
At TA = +25°C, VS = ±15 V, RL = 10 kΩ, VREF = 0 V, and G = 1, unless otherwise noted.
GAIN NONLINEARITY (G = 10)
4
3
3
Nonlinearity (ppm)
Nonlinearity (ppm)
GAIN NONLINEARITY (G = 1)
4
2
1
2
1
0
−10
−8
−6
−4
−2
0
2
4
Output Voltage (V)
6
8
0
−10
10
−8
−6
−4
G021
Figure 37.
−11
−2
−12
−4
−13
−14
−15
−16
−17
−12
−14
−18
6
8
−20
−10
10
−6
−4
−2
0
2
4
Output Voltage (V)
6
8
10
G024
Figure 39.
Figure 40.
OFFSET VOLTAGE vs
NEGATIVE COMMON-MODE VOLTAGE
(VS = ±15 V)
OFFSET VOLTAGE vs
POSITIVE COMMON-MODE VOLTAGE
(VS = ±15 V)
100
VS = ±15 V
−50°C
−40°C
+25°C
+85°C
+125°C
+150°C
300
250
200
50
150
100
50
−50
−100
−150
−200
−250
0
−300
−50
−350
−100
−15.5
−15.3
−15.1
−14.9
−14.7
Common Mode Voltage (V)
VS = ±15 V
0
Offset Voltage (µV)
350
−8
G023
400
Offset Voltage (µV)
−8
−16
−2
0
2
4
Output Voltage (V)
G022
−10
−19
−4
10
−6
−18
−6
8
GAIN NONLINEARITY (G = 1000)
0
Nonlinearity (ppm)
Nonlinearity (ppm)
GAIN NONLINEARITY (G = 100)
−8
6
Figure 38.
−10
−20
−10
−2
0
2
4
Output Voltage (V)
−14.5
−400
13.8
G057
Figure 41.
−50°C
−40°C
+25°C
+85°C
+125°C
+150°C
13.9
14
14.1
14.2
Common Mode Voltage (V)
14.3
14.4
G058
Figure 42.
Submit Documentation Feedback
Copyright © 2011, Texas Instruments Incorporated
Product Folder Link(s): INA826
13
INA826
SBOS562A – AUGUST 2011 – REVISED SEPTEMBER 2011
www.ti.com
TYPICAL CHARACTERISTICS (continued)
At TA = +25°C, VS = ±15 V, RL = 10 kΩ, VREF = 0 V, and G = 1, unless otherwise noted.
OFFSET VOLTAGE vs
NEGATIVE COMMON-MODE VOLTAGE
(VS = +2.7 V)
OFFSET VOLTAGE vs
POSITIVE COMMON-MODE VOLTAGE
(VS = +2.7 V)
300
200
VS = 2.7 V
200
150
100
50
0
−50
0.3
0.4
−50
−100
1
1.4
1.6
1.8
2
2.2
Common Mode Voltage (V)
2.4
2.6
G060
Figure 44.
POSITIVE OUTPUT VOLTAGE SWING
vs OUTPUT CURRENT (VS = ±15 V)
NEGATIVE OUTPUT VOLTAGE SWING
vs OUTPUT CURRENT (VS = ±15 V)
−14
−50°C
−40°C
+25°C
+85°C
+125°C
+150°C
−14.2
14.6
−50°C
−40°C
+25°C
+85°C
+125°C
+150°C
14.4
14.2
0
2
4
−14.4
−14.6
−14.8
6
8
10
Output Current (mA)
12
14
−15
16
0
2
4
G045
6
8
10
Output Current (mA)
12
14
16
G046
Figure 45.
Figure 46.
POSITIVE OUTPUT VOLTAGE SWING
vs OUTPUT CURRENT (VS = 2.7 V)
NEGATIVE OUTPUT VOLTAGE SWING
vs OUTPUT CURRENT (VS = 2.7 V)
2.7
1
25°C
2.6
25°C
0.9
0.8
Output Voltage (V)
2.5
2.4
2.3
2.2
2.1
2
1.9
0.7
0.6
0.5
0.4
0.3
0.2
1.8
0.1
VS = 2.7 V
0
2
4
6
8
10
Output Current (mA)
12
14
16
0
VS = 2.7 V
0
G048
Figure 47.
14
1.2
Figure 43.
Output Voltage (V)
Output Voltage (V)
0
G059
14.8
Output Voltage (V)
50
−200
0.5
15
1.7
100
−150
−100
−0.5 −0.4 −0.3 −0.2 −0.1 0
0.1 0.2
Common Mode Voltage (V)
14
−50°C
−40°C
+25°C
+85°C
+125°C
+150°C
150
Offset Voltage (µV)
250
Offset Voltage (µV)
VS = 2.7 V
−50°C
−40°C
+25°C
+85°C
+125°C
+150°C
2
4
6
8
10
Output Current (mA)
12
14
16
G049
Figure 48.
Submit Documentation Feedback
Copyright © 2011, Texas Instruments Incorporated
Product Folder Link(s): INA826
INA826
SBOS562A – AUGUST 2011 – REVISED SEPTEMBER 2011
www.ti.com
TYPICAL CHARACTERISTICS (continued)
At TA = +25°C, VS = ±15 V, RL = 10 kΩ, VREF = 0 V, and G = 1, unless otherwise noted.
SETTLING TIME vs STEP SIZE
(VS = ±15-V)
LARGE-SIGNAL FREQUENCY RESPONSE
25
30
VS = ±15 V
VS = +5 V
27
0.01%
0.001%
21
21
Settling Time (µs)
Output Voltage (V)
24
18
15
12
9
17
13
9
6
3
1k
10k
5
1M
2
4
6
8
G014
10
12
14
Step Size (V)
16
Figure 50.
SMALL-SIGNAL RESPONSE OVER
CAPACITIVE LOADS (G = 1)
SMALL-SIGNAL RESPONSE
(G = 1, RL = 1 kΩ, CL = 100 pF)
100
100
80
80
60
60
40
0 pF
20
0
100 pF
−20
220 pF
500 pF
−40
1 nF
20
0
−20
−40
−60
−80
−100
−100
8
16
20
40
−80
0
18
G061
Figure 49.
−60
24
Time (ps)
32
40
48
0
5
10
15
G013
20
25
time (us)
30
Figure 51.
Figure 52.
SMALL-SIGNAL RESPONSE
(G = 10, RL = 10 kΩ, CL = 100 pF)
SMALL-SIGNAL RESPONSE
(G = 100, RL = 10 kΩ, CL = 100 pF)
100
100
80
80
60
60
40
40
Amplitude (mV)
Amplitude (mV)
100k
Frequency (Hz)
Amplitude (mV)
Amplitude (mV)
0
20
0
−20
−40
−60
35
40
G009
20
0
−20
−40
−60
−80
−80
−100
−100
0
5
10
15
20
25
time (us)
30
35
40
0
G010
Figure 53.
20
40
60
80
100 120 140 160 180 200
time (us)
G011
Figure 54.
Submit Documentation Feedback
Copyright © 2011, Texas Instruments Incorporated
Product Folder Link(s): INA826
15
INA826
SBOS562A – AUGUST 2011 – REVISED SEPTEMBER 2011
www.ti.com
TYPICAL CHARACTERISTICS (continued)
At TA = +25°C, VS = ±15 V, RL = 10 kΩ, VREF = 0 V, and G = 1, unless otherwise noted.
SMALL-SIGNAL RESPONSE
(G = 1000, RL = 10 kΩ, CL = 100 pF)
OPEN-LOOP OUTPUT IMPEDANCE
100
100k
80
40
10k
20
ZO (Ω)
Amplitude (mV)
60
0
−20
1k
−40
−60
−80
−100
0
100
100 200 300 400 500 600 700 800 900 1000
time (us)
G012
1
10
100
Figure 55.
1k
10k
Frequency (Hz)
100k
1M
10M
G062
Figure 56.
CHANGE IN INPUT OFFSET VOLTAGE vs WARM-UP TIME
Change in Input Offset Voltage (µV)
15
10
5
0
−5
−10
−15
0
2
4
6
8
10
Warm−up Time (s)
12
14
16
G063
Figure 57.
16
Submit Documentation Feedback
Copyright © 2011, Texas Instruments Incorporated
Product Folder Link(s): INA826
INA826
SBOS562A – AUGUST 2011 – REVISED SEPTEMBER 2011
www.ti.com
APPLICATION INFORMATION
Figure 58 shows the basic connections required for operation of the INA826. Good layout practice mandates the
use of bypass capacitors placed as close to the device pins as possible.
The output of the INA826 is referred to the output reference (REF) terminal, which is normally grounded. This
connection must be low-impedance to assure good common-mode rejection. Although 5 Ω or less of stray
resistance can be tolerated while maintaining specified CMRR, small stray resistances of tens of ohms in series
with the REF pin can cause noticeable degradation in CMRR.
V+
0.1 mF
8
(1)
RS
1
RFI Filter
-IN
50 kW
50 kW
A1
VO = G ´ (VIN+ - VIN-)
2
24.7 kW
RG
G=1+
7
A3
24.7 kW
+
3
Load VO
50 kW
(1)
RS
+IN
49.4 kW
RG
50 kW
A2
4
6
REF
RFI Filter
Device
5
0.1 mF
V-
Also drawn in simplified form:
-IN
RG
+IN
Device
VO
REF
(1) This resistor is optional if the input voltage stays above [(V–) – 2 V] or the signal source current drive capability is limited to less than 3.5
mA. See the Input Protection section for more details.
Figure 58. Basic Connections
Submit Documentation Feedback
Copyright © 2011, Texas Instruments Incorporated
Product Folder Link(s): INA826
17
INA826
SBOS562A – AUGUST 2011 – REVISED SEPTEMBER 2011
www.ti.com
SETTING THE GAIN
Gain of the INA826 is set by a single external resistor, RG, connected between pins 2 and 3. The value of RG is
selected according to Equation 1:
G=1+
49.4 kW
RG
(1)
Table 1 lists several commonly-used gains and resistor values. The 49.4-kΩ term in Equation 1 comes from the
sum of the two internal 24.7-kΩ feedback resistors. These on-chip resistors are laser-trimmed to accurate
absolute values. The accuracy and temperature coefficients of these resistors are included in the gain accuracy
and drift specifications of the INA826.
Table 1. Commonly-Used Gains and Resistor Values
DESIRED GAIN (V/V)
RG (Ω)
NEAREST 1% RG (Ω)
1
—
—
2
49.4k
49.9k
5
12.35k
12.4k
10
5.489k
5.49k
20
2.600k
2.61k
50
1.008k
1k
100
499
499
200
248
249
500
99
100
1000
49.5
49.9
Gain Drift
The stability and temperature drift of the external gain setting resistor, RG, also affects gain. The contribution of
RG to gain accuracy and drift can be directly inferred from the gain of Equation 1.
The best gain drift of 1 ppm/℃ can be achieved when the INA826 uses G = 1 without RG connected. In this case,
the gain drift is limited only by the slight mismatch of the temperature coefficient of the integrated 50-kΩ resistors
in the differential amplifier (A3). At G greater than 1, the gain drift increases as a result of the individual drift of the
24.7-kΩ resistors in the feedback of A1 and A2, relative to the drift of the external gain resistor RG. Process
improvements of the temperature coefficient of the feedback resistors now make it possible to specify a
maximum gain drift of the feedback resistors of 35 ppm/℃, thus significantly improving the overall temperature
stability of applications using gains greater than 1.
Low resistor values required for high gain can make wiring resistance important. Sockets add to the wiring
resistance and contribute additional gain error (such as a possible unstable gain error) at gains of approximately
100 or greater. To ensure stability, avoid parasitic capacitance of more than a few picofarads at RG connections.
Careful matching of any parasitics on both RG pins maintains optimal CMRR over frequency; see Typical
Characteristics curves (Figure 19 and Figure 20).
18
Submit Documentation Feedback
Copyright © 2011, Texas Instruments Incorporated
Product Folder Link(s): INA826
INA826
SBOS562A – AUGUST 2011 – REVISED SEPTEMBER 2011
www.ti.com
OFFSET TRIMMING
Most applications require no external offset adjustment; however, if necessary, adjustments can be made by
applying a voltage to the REF terminal. Figure 59 shows an optional circuit for trimming the output offset voltage.
The voltage applied to the REF terminal is summed at the output. The op amp buffer provides low impedance at
the REF terminal to preserve good common-mode rejection.
VIN-
V+
RG
VIN+
INA826
VO
100 mA
1/2 REF200
REF
OPA333
±10 mV
Adjustment Range
100 W
10 kW
100 W
100 mA
1/2 REF200
V-
Figure 59. Optional Trimming of Output Offset Voltage
INPUT COMMON-MODE RANGE
The linear input voltage range of the INA826 input circuitry extends from the negative supply voltage to 1 V
below the positive supply, while maintaining 84-dB (minimum) common-mode rejection throughout this range.
The common-mode range for most common operating conditions is described in the typical characteristic curves
(Input Common-Mode Voltage vs Output Voltage, Figure 9 through Figure 16) and Offset Voltage vs
Common-Mode Voltage (Figure 41 through Figure 44). The INA826 can operate over a wide range of power
supplies and VREF configurations, making it impractical to provide a comprehensive guide to common-mode
range limits for all possible conditions.
The most commonly overlooked overload condition occurs when a circuit exceeds the output swing of A1 and A2,
which are internal circuit nodes that cannot be measured. Calculating the expected voltages at the output of A1
and A2 (see Figure 60) provides a check for the most common overload conditions. The designs of A1 and A2 are
identical and the outputs can swing to within approximately 100 mV of the power-supply rails. For example, when
the A2 output is saturated, A1 may continue to be in linear operation, responding to changes in the noninverting
input voltage. This difference may give the appearance of linear operation but the output voltage is invalid.
A single-supply instrumentation amplifier has special design considerations. To achieve a common-mode range
that extends to single-supply ground, the INA826 employs a current-feedback topology with PNP input
transistors; see Figure 60. The matched PNP transistors Q1 and Q2 shift the input voltages of both inputs up by a
diode drop, and through the feedback network, shift the output of A1 and A2 by approximately +0.8 V. With both
inputs and VREF at single-supply ground (negative power supply), the output of A1 and A2 is well within the linear
range, allowing users to make differential measurements at the GND level. As a result of this input level-shifting,
the voltages at pin 2 and pin 3 are not equal to the respective input terminal voltages (pin 1 and pin 4). For most
applications, this inequality is not important because only the gain-setting resistor connects to these pins.
Submit Documentation Feedback
Copyright © 2011, Texas Instruments Incorporated
Product Folder Link(s): INA826
19
INA826
SBOS562A – AUGUST 2011 – REVISED SEPTEMBER 2011
www.ti.com
INSIDE THE INA826
See Figure 58 for a simplified representation of the INA826. A more detailed diagram (shown in Figure 60)
provides additional insight into the INA826 operation.
Each input is protected by two field-effect transistors (FETs) that provide a low series resistance under normal
signal conditions, and preserve excellent noise performance. When excessive voltage is applied, these
transistors limit input current to approximately 8 mA.
The differential input voltage is buffered by Q1 and Q2 and is impressed across RG, causing a signal current to
flow through RG, R1, and R2. The output difference amp, A3, removes the common-mode component of the input
signal and refers the output signal to the REF terminal.
The equations shown in Figure 60 describe the output voltages of A1 and A2. The VBE and voltage drop across
R1 and R2 produce output voltages on A1 and A2 that are approximately 0.8 V higher than the input voltages.
V+
V+
RG
(External)
50 kW
R1
24.7 kW
A1 Out = VCM + VBE + 0.125 V - VD/2 ´ G
A2 Out = VCM + VBE + 0.125 V + VD/2 ´ G
Output Swing Range A1, A2, (V+) - 0.1 V to (V-) + 0.1 V
V-
R2
24.7 kW
V-
V+
50 kW
VOUT
A3
50 kW
V+
VO = G ´ (VIN+ - VIN-) + VREF
Linear Input Range A3 = (V+) - 0.9 V to (V-) + 0.1 V
V-
50 kW
REF
VV+
V+
-IN
Q1
VD/2
Overvoltage
Protection
Q2
C1
V-
A1
A2
RB
VCM
C2
VB
V-
Overvoltage
Protection
RB
VD/2
V+IN
Figure 60. INA826 Simplified Circuit Diagram
INPUT PROTECTION
The inputs of the INA826 are individually protected for voltages up to ±40 V. For example, a condition of –40 V
on one input and +40 V on the other input does not cause damage. However, if the input voltage exceeds (V–) –
2 V and the signal source current drive capability exceeds 3.5 mA, the output voltage switches to the opposite
polarity; see typical characteristic curve Input Overvoltage vs Input Current (Figure 17). This polarity reversal can
easily be avoided by adding resistance of 10 kΩ in series with both inputs.
Internal circuitry on each input provides low series impedance under normal signal conditions. If the input is
overloaded, the protection circuitry limits the input current to a safe value of approximately 8 mA. The typical
characteristic curves Input Current vs Input Overvoltage (Figure 17 and Figure 18) illustrate this input current limit
behavior. The inputs are protected even if the power supplies are disconnected or turned off.
20
Submit Documentation Feedback
Copyright © 2011, Texas Instruments Incorporated
Product Folder Link(s): INA826
INA826
SBOS562A – AUGUST 2011 – REVISED SEPTEMBER 2011
www.ti.com
INPUT BIAS CURRENT RETURN PATH
The input impedance of the INA826 is extremely high—approximately 20 GΩ. However, a path must be provided
for the input bias current of both inputs. This input bias current is typically 35 nA. High input impedance means
that this input bias current changes very little with varying input voltage.
Input circuitry must provide a path for this input bias current for proper operation. Figure 61 shows various
provisions for an input bias current path. Without a bias current path, the inputs float to a potential that exceeds
the common-mode range of the INA826, and the input amplifiers saturate. If the differential source resistance is
low, the bias current return path can be connected to one input (as shown in the thermocouple example in
Figure 61). With higher source impedance, using two equal resistors provides a balanced input with possible
advantages of lower input offset voltage as a result of bias current and better high-frequency common-mode
rejection.
Microphone,
Hydrophone,
etc.
Device
47 kW
47 kW
Thermocouple
Device
10 kW
Device
Center tap provides
bias current return.
Figure 61. Providing an Input Common-Mode Current Path
Submit Documentation Feedback
Copyright © 2011, Texas Instruments Incorporated
Product Folder Link(s): INA826
21
INA826
SBOS562A – AUGUST 2011 – REVISED SEPTEMBER 2011
www.ti.com
REFERENCE TERMINAL
The output voltage of the INA826 is developed with respect to the voltage on the reference terminal. Often, in
dual-supply operation, the reference pin (pin 6) is connected to the low-impedance system ground. In
single-supply operation, it can be useful to offset the output signal to a precise mid-supply level (for example,
2.5 V in a 5-V supply environment). To accomplish this, a voltage source can be tied to the REF pin to level-shift
the output so that the INA826 can drive a single-supply ADC, for example.
For the best performance, source impedance to the REF terminal should be kept below 5 Ω. As can be seen in
Figure 58, the reference resistor is at one end of a 50-kΩ resistor. Additional impedance at the REF pin adds to
this 50-kΩ resistor. The imbalance in the resistor ratios results in degraded common-mode rejection ratio
(CMRR).
Figure 62 shows two different methods of driving the reference pin with low impedance. The OPA330 is a
low-power, chopper-stabilized amplifier, and therefore offers excellent stability over temperature. It is available in
the space-saving SC70 and even smaller chip-scale package. The REF3225 is a precision reference in the small
SOT23-6 package.
+5 V
VIN-
+5 V
RG
VOUT
INA826
VIN-
REF
VIN+
+5 V
RG
VOUT
INA826
REF
+5 V
VIN+
+2.5 V
OPA330
a) Level shifting using the OPA330 as a low-impedance buffer
REF3225
+5 V
b) Level shifting using the low-impedance output of the REF3225
Figure 62. Options for Low-Impedance Level Shifting
DYNAMIC PERFORMANCE
The typical characteristic curve Gain vs Frequency (Figure 23) illustrates that, despite its low quiescent current of
only 200 µA, the INA826 achieves much wider bandwidth than other INAs in its class. This achievement is a
result of using TI’s proprietary high-speed precision bipolar process technology. The current-feedback topology
provides the INA826 with wide bandwidth even at high gains. Settling time also remains excellent at high gain
because of a high slew rate of 1 V/µs.
22
Submit Documentation Feedback
Copyright © 2011, Texas Instruments Incorporated
Product Folder Link(s): INA826
INA826
SBOS562A – AUGUST 2011 – REVISED SEPTEMBER 2011
www.ti.com
OPERATING VOLTAGE
The INA826 operates over a power-supply range of +2.7 V to +36 V (±1.35 V to ±18 V). Supply voltages higher
than 40 V (±20 V) can permanently damage the device. Parameters that vary over supply voltage or temperature
are shown in the Typical Characteristics section of this data sheet.
Low-Voltage Operation
The INA826 can operate on power supplies as low as ±1.35 V. Most parameters vary only slightly throughout this
supply voltage range; see the Typical Characteristics section. Operation at very low supply voltage requires
careful attention to assure that the input voltages remain within the linear range. Voltage swing requirements of
internal nodes limit the input common-mode range with low power-supply voltage. The typical characteristic
curves Typical Common-Mode Range vs Output Voltage (Figure 9 to Figure 16) and Offset Voltage vs
Common-Mode Voltage (Figure 41 to Figure 44) describe the range of linear operation for various supply
voltages, reference connections, and gains.
ERROR SOURCES
Most modern signal conditioning systems calibrate errors at room temperature. However, calibration of errors
that result from a change in temperature is normally difficult and costly. Therefore, it is important to minimize
these errors by choosing high-precision components such as the INA826 that have improved specifications in
critical areas that impact the precision of the overall system. Figure 63 shows an example application.
RS+ = 10 kW
VDIFF = 1 V
5.49 kW
+15 V
VOUT
Device
REF
VCM = 10 V
RS- = 9.9 kW
Signal Bandwidth: 5 kHz
- 15 V
Figure 63. Example Application with G = 10 V/V and 1-V Differential Voltage
Submit Documentation Feedback
Copyright © 2011, Texas Instruments Incorporated
Product Folder Link(s): INA826
23
INA826
SBOS562A – AUGUST 2011 – REVISED SEPTEMBER 2011
www.ti.com
Resistor-adjustable INAs such as the INA826 show the lowest gain error in G = 1 because of the inherently
well-matched drift of the internal resistors of the differential amplifier. At gains greater than 1 (for instance, G =
10 V/V or G = 100 V/V) the gain error becomes a significant error source because of the contribution of the
resistor drift of the 24.7-kΩ feedback resistors in conjunction with the external gain resistor. Except for very high
gain applications, the gain drift is by far the largest error contributor compared to other drift errors, such as offset
drift. The INA826 offers the lowest gain error over temperature in the marketplace for both G > 1 and G = 1 (no
external gain resistor). Table 2 summarizes the major error sources in common INA applications and compares
the two cases of G = 1 (no external resistor) and G = 10 (5.49-kΩ external resistor). As can be seen in Table 2,
while the static errors (absolute accuracy errors) in G = 1 are almost twice as great as compared to G = 10, there
are much fewer drift errors because of the much lower gain error drift. In most applications, these static errors
can readily be removed during calibration in production. All calculations refer the error to the input for easy
comparison and system evaluation.
Table 2. Error Calculation
INA826
ERROR SOURCE
ERROR CALCULATION
SPEC
G = 10 ERROR
(ppm)
G = 1 ERROR
(ppm)
ABSOLUTE ACCURACY AT +25°C
Input offset voltage (μV)
VOSI/VDIFF
150
150
150
Output offset voltage (μV)
VOSO/(G × VDIFF)
700
70
700
Input offset current (nA)
IOS × maximum (RS+, RS–)/VDIFF
5
50
50
104 (G = 10),
84 (G = 1)
63
631
333
1531
35 (G = 10),
1 (G = 1)
2800
80
CMRR (dB)
VCM/(10CMRR/20 × VDIFF)
Total absolute accuracy error (ppm)
DRIFT TO +105°C
Gain drift (ppm/°C)
GTC × (TA – 25)
Input offset voltage drift (μV/°C)
(VOSI_TC/VDIFF) × (TA – 25)
2
160
160
Output offset voltage drift (μV/°C)
[VOSO_TC/( G × VDIFF)] × (TA – 25)
10
80
800
Offset current drift (pA/°C)
IOS_TC × maximum (RS+, RS–) ×
(TA – 25)/VDIFF
60
48
48
3088
1088
5
5
5
eNI = 18,
eNO = 110
10
10
15
15
3436
2634
Total drift error (ppm)
RESOLUTION
Gain nonlinearity (ppm of FS)
Voltage noise (1 kHz)
BW ´
(eNI2 +
eNO
G
2
6
´
VDIFF
Total resolution error (ppm)
TOTAL ERROR
Total error
Total error = sum of all error sources
LAYOUT GUIDELINES
Attention to good layout practices is always recommended. Keep traces short and, when possible, use a printed
circuit board (PCB) ground plane with surface-mount components placed as close to the device pins as possible.
Place 0.1-μF bypass capacitors close to the supply pins. These guidelines should be applied throughout the
analog circuit to improve performance and provide benefits such as reducing the electromagnetic-interference
(EMI) susceptibility.
CMRR vs Frequency
The INA826 pinout has been optimized for achieving maximum CMRR performance over a wide range of
frequencies. However, care must be taken to ensure that both input paths are well-matched for source
impedance and capacitance to avoid converting common-mode signals into differential signals. In addition,
parasitic capacitance at the gain-setting pins can also affect CMRR over frequency. For example, in applications
that implement gain switching using switches or PhotoMOS® relays to change the value of RG, the component
should be chosen so that the switch capacitance is as small as possible.
24
Submit Documentation Feedback
Copyright © 2011, Texas Instruments Incorporated
Product Folder Link(s): INA826
INA826
SBOS562A – AUGUST 2011 – REVISED SEPTEMBER 2011
www.ti.com
APPLICATION IDEAS
Circuit Breaker
Figure 64 showns the INA826 used in a circuit breaker application.
+3 V
AVDD
DVDD
SCLK
Serial
Interface
(SPI)
Passive
Integrator
100 kW
RG
DIO
MSP430
Microcontroller
CS
INA826
IP
Mux
Ch 1
ADC
REF
G=1
Rogowski
Coil
100 kW
PGA112
PGA113
+3 V
GND
REF3312
REF
1.2 V
Figure 64. Circuit Breaker Example
Programmable Logic Controller (PLC) Input
The INA826 used in an example programmable logic controller (PLC) input application is shown in Figure 65.
±10 V
100 kW
+15 V
4.87 kW
4 mA to 20 mA
±20 mA
12.4 kW
VOUT = 2.5 V ± 2.3 V
Device
20 W
REF
-15 V
+2.5 V
REF3225
+5 V
Figure 65. ±10-V, 4-mA to 20-mA PLC Input
Additional application ideas are shown in Figure 66 to Figure 70.
Submit Documentation Feedback
Copyright © 2011, Texas Instruments Incorporated
Product Folder Link(s): INA826
25
INA826
SBOS562A – AUGUST 2011 – REVISED SEPTEMBER 2011
www.ti.com
TINA-TI (FREE DOWNLOAD SOFTWARE)
Using TINA-TI SPICE-Based Analog Simulation Program with the INA826
TINA is a simple, powerful, and easy-to-use circuit simulation program based on a SPICE engine. TINA-TI is a
free, fully functional version of the TINA software, preloaded with a library of macromodels in addition to a range
of both passive and active models. It provides all the conventional dc, transient, and frequency domain analysis
of SPICE as well as additional design capabilities.
Available as a free download from the Analog eLab Design Center, TINA-TI offers extensive post-processing
capability that allows users to format results in a variety of ways.
Virtual instruments offer users the ability to select input waveforms and probe circuit nodes, voltages, and
waveforms, creating a dynamic quick-start tool.
Figure 66 and Figure 68 show example TINA-TI circuits for the INA826 that can be used to develop, modify, and
assess the circuit design for specific applications. Links to download these simulation files are given below.
NOTE: These files require that either the TINA software (from DesignSoft) or TINA-TI software be installed.
Download the free TINA-TI software from the TINA-TI folder.
The circuit in Figure 66 is used to convert inputs of ±10 V, ±5 V, or ±20 mA to an output voltage range from 0.5 V
to 4.5 V. The input selection depends on the settings of SW1 and SW2. Further explanation as well as the
TINA-TI simulation circuit is provided in the compressed file that can be downloaded at the following link: PLC
Circuit.
+Vs
V1 15
CurrentInput
V2 15
Source_Switch
Vin
Iin
+ Terminal
Iin
-Vs
Sen
se
-
+Vs
Amp Out
Vin
SW1
Ref
RG 49.9k
VoltageInput
INA Out
+
+
Rg
R4 250
SW2
Rg
-
+
U2 INA826
Vs 5
- Terminal
+ Ref
1
U1 INA159
Ref
2
+
ADC_Diff
-
Vref 2.5
-Vs
Figure 66. Two Terminal Programmable Logic Controller (PLC) Input
26
Submit Documentation Feedback
Copyright © 2011, Texas Instruments Incorporated
Product Folder Link(s): INA826
INA826
SBOS562A – AUGUST 2011 – REVISED SEPTEMBER 2011
www.ti.com
Figure 67 is an example of a LEAD I ECG circuit. The input signals come from leads attached to the right arm
(RA) and left arm (LA). These signals are simulated with the circuitry in the corresponding boxes. Protection
resistors (RPROT1 and RPROT2) and filtering are also provided. The OPA333 is used as an integrator to remove the
gained-up dc offsets and servo the INA826 outputs to VREF. Finally, the right leg drive is biased to a potential
(+VS/2) and it inverts and amplifies the average common-mode signal back into the patient's right leg. This
architecture reduces the 50-/60-Hz noise pickup. Click the following link to download the TINA-TI file: ECG
Circuit.
+Vs
U1 OPA333
LA Electrode
+
R4 52k
+
Vref
ECGp
C2 47n
+Vs
Rprot1 100k
+
C10 1u
ECG_LA
C5 33p
RG1 6.1k
RG2 6.1k
C6 1n
+
C4 47n
+
+
Rg
U4 INA826
Vout
Rg
-
C7 33p
Rprot2 100k
ECG_RA
+Vs
R7 52k
ECGn
R1 1M
C_RLD 47n
R_RLD 52k
RA Electrode
RL Electrode
R12 500k
Ref
Vref
V1 5
R6 10k
C11 1n
R9 1M
R3 10k
R5 10M
+
U3 OPA2314
-
Rprot3 100k
U2 OPA2314
+
+
+
+Vs
Vref
+Vs
Figure 67. ECG Circuit
Submit Documentation Feedback
Copyright © 2011, Texas Instruments Incorporated
Product Folder Link(s): INA826
27
INA826
SBOS562A – AUGUST 2011 – REVISED SEPTEMBER 2011
www.ti.com
Figure 68 shows an example of how the INA826 can be used for low-side current sensing. The load current
(ILOAD) creates a voltage drop across the shunt resistor (RSHUNT). This voltage is amplified by the INA826, with
gain set to 100. The output swing of the INA826 is set by the common-mode voltage (which is 0 V in low-side
current sensing) and power supplies. Therefore, a dual-supply circuit is implemented. The load current was set
from 1 A to 10 A, which corresponds to an output voltage range from 350 mV to 3.5 V. The output range can be
adjusted by changing the shunt resistor and/or the gain of the INA826. Click the following link to download the
TINA-TI file: Current Sensing Circuit.
+Vs
+Vs
Iload 10
V1 5
Vbus 10
+
U2 INA826
+
Rg
Rshunt 3.5m
Ref
RG 499
Vout
Rg
V2 5
Rout 10k
-
-Vs
-Vs
Figure 68. Low-Side Current Sensing
28
Submit Documentation Feedback
Copyright © 2011, Texas Instruments Incorporated
Product Folder Link(s): INA826
INA826
SBOS562A – AUGUST 2011 – REVISED SEPTEMBER 2011
www.ti.com
Figure 69 shows an example of how the INA826 can be used for RTD signal conditioning. This circuit creates an
excitation current (ISET) by forcing +2.5 V from the REF5025 across RSET. The zero-drift, low-noise OPA188
creates the virtual ground that maintains a constant differential voltage across RSET with changing common-mode
voltage. This voltage is necessary because the voltage on the positive input of the INA826 fluctuates over
temperature as a result of the changing RTD resistance. Click the following link to download the TINA-TI file:
RTD Circuit.
+Vs
Vref5025
U2 REF5025
NC
Vin
Vout
Temp
Trim
GND
R2 1.5M
+
Vset
Rset 2.5k
-
VirtualGND
-Vs
+Vs
-
+
+
V1 15
U1 OPA188
+
+Vs
A
Iset
V2 15
+Vs
+
Rg
-Vs
+
U4 INA826
Ref
RTD 100
Rg 5k
+
Rg
Vout
-
Rparasitic 5
-Vs
Figure 69. RTD Signal Conditioning
Submit Documentation Feedback
Copyright © 2011, Texas Instruments Incorporated
Product Folder Link(s): INA826
29
INA826
SBOS562A – AUGUST 2011 – REVISED SEPTEMBER 2011
www.ti.com
The circuit in Figure 70 creates a precision current ISET by forcing the INA826 VDIFF across RSET. The input
voltage VIN is amplified to the output of the INA826 and then divided down by the gain of the INA826 to create
VDIFF. ISET can be controlled either by changing the value of the gain-set resistor RG, the set resistor RSET, or by
changing VOUT through the gain of the composite loop. Care must be taken to ensure that the changing load
resistance RL does not create a voltage on the negative input of the INA826 that violates the compliance of the
common-mode input range. Likewise, the voltage on the output of the OPA170 must remain compliant
throughout the changing load resistance for this circuit to work properly. Click the following link to download the
TINA-TI file: Current Source.
R1 10k
R2 10k
C1 100p
-Vs
+Vs
U2 OPA170
+
+
Rg
Vin
+
+
+
+
Vdiff
Ref
Vout
RG 1k
Rset 10k
-
+Vs
U4 INA826
Rg
-
+Vs
-Vs
+
A
V1 15
Iset
RL 1k
V2 15
-Vs
Figure 70. Precision Current Source
30
Submit Documentation Feedback
Copyright © 2011, Texas Instruments Incorporated
Product Folder Link(s): INA826
INA826
SBOS562A – AUGUST 2011 – REVISED SEPTEMBER 2011
www.ti.com
EVALUATION MODULE (EVM)
The INA826EVM is intended to provide basic functional evaluation of the INA826. A diagram of the INA826EVM
is provided in Figure 71.
Figure 71. INA826 Evaluation Module
The INA826 provides the following features:
• Intuitive evaluation with silkscreen schematic
• Easy access to nodes with surface-mount test points
• Advanced evaluation with two prototype areas
• Reference voltage source flexibility
• Convenient input and output filtering
The INA826EVM User Guide (SBOU115) available for download at www.ti.com provides instructions on how to
set up the device for dual- and single-supply operation. The user guide also includes schematics, layout, and a
bill of material (BOM).
Submit Documentation Feedback
Copyright © 2011, Texas Instruments Incorporated
Product Folder Link(s): INA826
31
PACKAGE OPTION ADDENDUM
www.ti.com
14-Nov-2011
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package
Drawing
Pins
Package Qty
Eco Plan
(2)
Lead/
Ball Finish
MSL Peak Temp
(3)
INA826AID
PREVIEW
SOIC
D
8
75
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR
INA826AIDGK
ACTIVE
MSOP
DGK
8
80
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR
INA826AIDGKR
ACTIVE
MSOP
DGK
8
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR
INA826AIDR
PREVIEW
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR
INA826AIDRGR
PREVIEW
SON
DRG
8
1000
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR
INA826AIDRGT
PREVIEW
SON
DRG
8
250
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR
Samples
(Requires Login)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
14-Nov-2011
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
30-Sep-2011
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
INA826AIDGKR
Package Package Pins
Type Drawing
MSOP
DGK
8
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
2500
330.0
12.4
Pack Materials-Page 1
5.3
B0
(mm)
K0
(mm)
P1
(mm)
3.4
1.4
8.0
W
Pin1
(mm) Quadrant
12.0
Q1
PACKAGE MATERIALS INFORMATION
www.ti.com
30-Sep-2011
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
INA826AIDGKR
MSOP
DGK
8
2500
358.0
335.0
35.0
Pack Materials-Page 2
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements,
and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should
obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are
sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard
warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where
mandated by government requirements, testing of all parameters of each product is not necessarily performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and
applications using TI components. To minimize the risks associated with customer products and applications, customers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right,
or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information
published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a
warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual
property of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied
by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive
business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional
restrictions.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all
express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not
responsible or liable for any such statements.
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably
be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing
such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products
and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be
provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in
such safety-critical applications.
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are
specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at
the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are
designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated
products in automotive applications, TI will not be responsible for any failure to meet such requirements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products
Applications
Audio
www.ti.com/audio
Communications and Telecom www.ti.com/communications
Amplifiers
amplifier.ti.com
Computers and Peripherals
www.ti.com/computers
Data Converters
dataconverter.ti.com
Consumer Electronics
www.ti.com/consumer-apps
DLP® Products
www.dlp.com
Energy and Lighting
www.ti.com/energy
DSP
dsp.ti.com
Industrial
www.ti.com/industrial
Clocks and Timers
www.ti.com/clocks
Medical
www.ti.com/medical
Interface
interface.ti.com
Security
www.ti.com/security
Logic
logic.ti.com
Space, Avionics and Defense
www.ti.com/space-avionics-defense
Power Mgmt
power.ti.com
Transportation and Automotive www.ti.com/automotive
Microcontrollers
microcontroller.ti.com
Video and Imaging
RFID
www.ti-rfid.com
OMAP Mobile Processors
www.ti.com/omap
Wireless Connectivity
www.ti.com/wirelessconnectivity
TI E2E Community Home Page
www.ti.com/video
e2e.ti.com
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2011, Texas Instruments Incorporated