TI TPS22929DDBVT

TPS22929
SLVSB39 – DECEMBER 2011
www.ti.com
Ultra-Small, Low on Resistance Load Switch with Controlled Turn-on
Check for Samples: TPS22929
FEATURES
DESCRIPTION
•
•
•
•
The TPS22929 is a small, low rON load switch with
controlled turn on. The device contains a P-channel
MOSFET that can operate over an input voltage
range of 1.4 V to 5.5 V. The switch is controlled by an
on/off input (ON), which is capable of interfacing
directly with low-voltage control signals. The
TPS22929 is active high enable.
1
Integrated Single Load Switch
Small SOT23-6 package
Input Voltage Range: 1.4-V to 5.5-V
Low ON-Resistance
– rON = 115-mΩ at VIN = 5-V
– rON = 115-mΩ at VIN = 3.3-V
– rON = 118-mΩ at VIN = 2.5-V
– rON = 129-mΩ at VIN = 1.5-V
1.8-A Continuous Switch Current (25C)
Low Threshold Control Input
Controlled Slew-rate Options
Under-Voltage Lock Out
Quick Output Discharge Transistor
Reverse Current Protection
•
•
•
•
•
•
The TPS22929 contains a 150-Ω on-chip load
resistor for quick output discharge when the switch is
turned off. The rise time of the device is internally
controlled in order to avoid inrush current. The
TPS22929 family has various slew rate options
(see ).
The TPS22929 device provides circuit breaker
functionality by latching off the power-switch during
reverse voltage situations. An internal reverse voltage
comparator disables the power-switch when the
output voltage (VOUT) is driven higher than the input
(VIN) to quickly (10µs typ) stop the flow of current
towards the input side of the switch. Reverse current
is always active, even when the power-switch is
disabled. Additionally, under-voltage lockout (UVLO)
protection turns the switch off if the input voltage is
too low.
APPLICATIONS
•
•
•
•
•
•
•
•
Portable Industrial Equipment
Portable Medical Equipment
Portable Media Players
Point Of Sales Terminal
GPS Devices
Digital Cameras
Portable Instrumentation
Smartphones
The TPS22929 is available in an small, space-saving
6-pin SOT23-6 package and is characterized for
operation over the free-air temperature range
of –40°C to 85°C.
TYPICAL APPLICATION
Power
Supply
VIN
ON
CIN
VOUT
ON
CL
RL
OFF
TPS22929
GND
GND
Table 1. Feature List
rON (typ) at 3.3
V
Rise Time at 3.3 V
(typ)
QUICK OUTPUT
DISCHARGE (1)
MAXIMUM OUTPUT
CURRENT
(3.3 V and 25°C) (2)
ENABLE
TPS22929A (3)
115-mΩ
0.5 µs
Yes
1.8-A
Active High
(3)
115-mΩ
100 µs
Yes
1.8-A
Active High
TPS22929C (3)
115-mΩ
1000 µs
Yes
1.8-A
Active High
TPS22929D
115-mΩ
4500 µs
Yes
1.8-A
Active High
DEVICE
TPS22929B
(1)
(2)
(3)
This feature discharges the output of the switch to ground through an 150-Ω resistor, preventing the output from floating.
See “Thermal Considerations” section in Application Information to calculate maximum continuous current for a specific application.
Contact local sales/distributor or factory for availability.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2011, Texas Instruments Incorporated
TPS22929
SLVSB39 – DECEMBER 2011
www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
ORDERING INFORMATION
ORDERABLE PART
NUMBER
PACKAGE (1)
TA
TOP-SIDE MARKING
TPS22929ADBVT
TPS22929ADBVR
TPS22929BDBVT
Contact factory for
availability (2)
–40°C to 85°C
TPS22929BDBVR
DBV
Contact factory for
availability (2)
TPS22929CDBVT
TPS22929CDBVR
(1)
(2)
Tape of 3000
TPS22929DDBVT
Reel of 250
TPS22929DDBVR
_F4_
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
Contact factory for details and availability for PREVIEW devices, minimum order quantities may apply.
DEVICE INFORMATION
DBV PACKAGE
VOUT
GND
1
6
VIN
2
5
GND
ON
3
4
VIN
PIN FUNCTIONS
TPS22929
DBV
2
PIN NAME
2, 5
GND
3
ON
1
VOUT
4, 6
VIN
DESCRIPTION
Ground
Switch control input, active high. Do not leave floating
Switch output
Switch input, bypass this input with a ceramic capacitor to
ground
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SLVSB39 – DECEMBER 2011
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BLOCK DIAGRAM
VIN
Reverse
Current
Protection
UVLO
Control
Logic
ON
VOUT
GND
Table 2. FUNCTION TABLE
(1)
ON
VIN to VOUT
VOUT to GND (1)
L
OFF
ON
H
ON
OFF
See Application section ‘Output Pull-Down’
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range (unless otherwise noted)
VALUE
UNIT
–0.3 to 6
V
VOUT Output voltage range
VIN + 0.3
V
VON
–0.3 to 6
V
VIN
Input voltage range
Input voltage range
Maximum continuous power dissipation @ 25°C
463
PMAX Maximum continuous power dissipation @ 70°C
254
Maximum continuous power dissipation @ 85°C
185
IMAX
Maximum continuous operating current
TA
Operating free-air temperature range
TJ
Maximum junction temperature
TSTG
Storage temperature range
ESD
Electrostatic discharge protection
mW
2
A
–40 to 85
°C
125
°C
–65 to 150
°C
Human-Body Model (HBM) (VIN, VOUT, GND
pins)
2000
Charged-Device Model (CDM) (VIN, VOUT, ON,
GND pins)
1000
V
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TPS22929
SLVSB39 – DECEMBER 2011
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THERMAL INFORMATION
TPS22929
THERMAL METRIC (1)
SOT23-6
UNITS
(6) PINS
θJA
Junction-to-ambient thermal resistance
216
θJCtop
Junction-to-case (top) thermal resistance
209
θJB
Junction-to-board thermal resistance
131
ψJT
Junction-to-top characterization parameter
52
ψJB
Junction-to-board characterization parameter
110
θJCbot
Junction-to-case (bottom) thermal resistance
N/A
(1)
°C/W
For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
RECOMMENDED OPERATING CONDITIONS
VIN
Input voltage range
VON
ON voltage range
VOUT
Output voltage range
VIH
High-level input voltage, ON
VIL
CIN
(1)
4
Low-level input voltage, ON
MIN
MAX
1.4
5.5
V
5.5
V
0
UNIT
VIN
VIN = 3.61 V to 5.5 V
1.1
5.5
V
VIN = 1.4 V to 3.6 V
1.1
5.5
V
VIN = 3.61 V to 5.5 V
0.6
V
VIN = 1.4 V to 3. 6V
0.4
V
Input Capacitor
1
(1)
µF
Refer to the application section.
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ELECTRICAL CHARACTERISTICS
VIN = 1.4 V to 5.5 V, TA = –40ºC to 85ºC (unless otherwise noted)
PARAMETER
IIN
IIN(off)
IIN(Leakage)
Quiescent current
Off supply current
Leakage current
TEST CONDITIONS
TA
MIN
2.2
10
IOUT = 0, VIN = VON = 4.2 V
2.1
7.0
IOUT = 0, VIN = VON = 3.6 V
2.0
7.0
IOUT = 0, VIN = VON = 2.5 V
1.0
5.0
IOUT = 0, VIN = VON = 1.5 V
0.8
5.0
VON = GND, VOUT = Open, VIN = 5.25 V
0.8
10
VON = GND, VOUT = Open, VIN = 4.2 V
0.3
7.0
VON = GND, VOUT = Open, VIN = 3.6 V
Full
0.2
7.0
VON = GND, VOUT = Open, VIN = 2.5 V
0.2
5.0
VON = GND, VOUT = Open, VIN = 1.5 V
0.1
5.0
VON = GND, VOUT = 0, VIN = 5.25 V
0.8
10
VON = GND, VOUT = 0, VIN = 4.2 V
0.3
7.0
0.2
7.0
0.2
5.0
VON = GND, VOUT = 0, VIN = 3.6 V
Full
Full
VON = GND, VOUT = 0, VIN = 1.5 V
VIN = 5.25 V, IOUT = –200 mA
VIN = 5.0 V, IOUT = –200 mA
VIN = 4.2 V, IOUT = –200 mA
On-resistance
VIN = 3.3 V, IOUT = –200 mA
VIN = 2.5 V, IOUT = –200 mA
VIN = 1.5 V, IOUT = –200 mA
RPD
UVLO
25°C
Full
Full
tDELAY
Reverse Current Response
Delay
VIN = 5V
150
150
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mΩ
Full
155
180
129
Full
170
200
150
200
1.4
Ω
V
0.50
Full
1
µA
77
mV
10
µs
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µA
175
118
25°C
VIN decreasing, VON 3.6 V, RL = 10 Ω
µA
150
175
115
25°C
Full
VRVP
115
25°C
Under voltage lockout
µA
175
25°C
25°C
VON = 1.4 V to 5.25 V or GND
115
Full
VIN increasing, VON = 3.6 V,
IOUT = –100 mA
Reverse Current Voltage
Threshold
5.0
150
UNIT
175
25°C
VIN = 3.3 V, VON = 0, IOUT = 30 mA
ON input leakage current
0.1
115
Full
Output pull down resistance
ION
MAX
IOUT = 0, VIN = VON = 5.25 V
VON = GND, VOUT = 0, VIN = 2.5 V
rON
TYP
5
TPS22929
SLVSB39 – DECEMBER 2011
www.ti.com
SWITCHING CHARACTERISTICS
PARAMETER
TPS22929D
TEST CONDITION
TYP
UNIT
VIN = 5 V, TA = 25ºC (unless otherwise noted)
tON
Turn-ON time
RL = 10 Ω, CL = 0.1 µF
tOFF
Turn-OFF time
RL = 10 Ω, CL = 0.1 µF
7.4
tR
VOUT rise time
RL = 10 Ω, CL = 0.1 µF
3660
tF
VOUT fall time
RL = 10 Ω, CL = 0.1 µF
6.1
3315
µs
VIN = 3.3 V, TA = 25ºC (unless otherwise noted)
tON
Turn-ON time
RL = 10 Ω, CL = 0.1 µF
4655
tOFF
Turn-OFF time
RL = 10 Ω, CL = 0.1 µF
9.5
tR
VOUT rise time
RL = 10 Ω, CL = 0.1 µF
4150
tF
VOUT fall time
RL = 10 Ω, CL = 0.1 µF
3.0
µs
VIN = 1.5 V, TA = 25ºC (unless otherwise noted)
tON
Turn-ON time
RL = 10 Ω, CL = 0.1 µF
tOFF
Turn-OFF time
RL = 10 Ω, CL = 0.1 µF
18.3
tR
VOUT rise time
RL = 10 Ω, CL = 0.1 µF
7812
tF
VOUT fall time
RL = 10 Ω, CL = 0.1 µF
3.0
10175
µs
PARAMETRIC MEASUREMENT INFORMATION
VOUT
VIN
CIN = 1µF
ON
+
-
(A)
ON
CL
RL
OFF
GND
TPS22929
GND
GND
TEST CIRCUIT
VON
50%
50%
tOFF
tON
VOUT
50%
50%
tf
tr
90%
VOUT
10%
90%
10%
tON /t OFF WAVEFORMS
A.
Rise and fall times of the control signal is 100 ns.
Figure 1. Test Circuit and tON/tOFF Waveforms
6
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TYPICAL CHARACTERISTICS
ON-STATE RESISTANCE
vs
INPUT VOLTAGE
ON INPUT THRESHOLD
180
6
−40C
25C
85C
160
5
140
4.5
120
4
VOUT (V)
Ron (mΩ)
VIN = 5.0V
VIN = 4.2V
VIN = 3.3V
VIN = 2.5V
VIN = 1.8V
VIN = 1.5V
5.5
100
80
60
3.5
3
2.5
2
1.5
40
1
20
0
0.5
0
0.5
1
1.5
2
2.5 3 3.5
Voltage (V)
4
4.5
5
5.5
0
6
0
0.2
0.4
0.6
0.8
VON (V)
1
1.2
1.4
G000
G000
Figure 2.
Figure 3.
INPUT CURRENT, QUIESCENT
vs
INPUT VOLTAGE
INPUT CURRENT, LEAK
vs
INPUT VOLTAGE
3000
3.5
−40C
25C
85C
3
−40C
25C
85C
2500
2.5
IIN_Leak (nA)
IIN_Q (µA)
2000
2
1.5
1500
1000
1
500
0.5
0
0
1
2
3
Voltage (V)
4
5
6
0
0
0.5
1
1.5
2
2.5 3 3.5
Voltage (V)
4
4.5
5
5.5
G000
Figure 4.
6
G000
Figure 5.
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TYPICAL CHARACTERISTICS (continued)
ON-STATE RESISTANCE
vs
TEMPERATURE
INPUT CURRENT, OFF
vs
INPUT VOLTAGE
3000
250
225
200
−40C
25C
85C
2500
2000
150
IIN_Off (nA)
Ron (mΩ)
175
VIN = 1.4V
VIN = 1.5V
VIN = 1.8V
VIN = 2.5V
VIN = 3.3V
VIN = 4.2V
VIN= 5.0V
VIN = 5.5V
125
100
1500
1000
75
50
500
25
0
−40
−15
10
35
Temperature (°C)
60
0
85
0
0.5
1
1.5
2
2.5 3 3.5
Voltage (V)
G000
4
4.5
5
5.5
6
G000
Figure 6.
Figure 7.
0.8
0.7
Max Power Dissipation (W)
0.6
0.5
0.4
0.3
0.2
0.1
0
−40
−15
10
35
Temperature (°C)
60
85
G000
Figure 8. Allowable Power Dissipation
8
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TYPICAL CHARACTERISTICS (continued)
Figure 9. ULVO Response IOUT = -100mA
Figure 10. Reverse Current Protection VOUT = 3.3V, VIN =
3.3V Decreasing to 0V
TYPICAL AC CHARACTERISTICS FOR tps22929B
RISE TIME
vs
TEMPERATURE
FALL TIME
vs
TEMPERATURE
4500
4
VIN =5.0V, CL = 0.1 µF, RL = 10 Ohms
4000
3500
3
tFall (µs)
tRise (µs)
3000
2500
2000
2
1500
1
1000
500
VIN =5V, CL = 0.1 µF, RL = 10 Ohms
0
−40
−15
10
35
Temperature (°C)
60
85
0
−40
−15
10
35
Temperature (°C)
60
G000
Figure 11.
85
G000
Figure 12.
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TYPICAL CHARACTERISTICS (continued)
RISE TIME
vs
TEMPERATURE
FALL TIME
vs
TEMPERATURE
10000
10
VIN =1.5V, CL = 0.1 µF, RL = 10 Ohms
9
8000
8
7
6
tFall (µs)
tRise (µs)
6000
5
4
4000
3
2
2000
1
VIN = 1.5V, CL = 0.1 µF, RL = 10 Ohms
0
−40
−15
10
35
Temperature (°C)
60
0
−40
85
−15
10
35
Temperature (°C)
60
G000
85
G000
Figure 13.
Figure 14.
TURN-ON TIME
vs
TEMPERATURE
TURN-OFF TIME
vs
TEMPERATURE
4500
10
VIN = 5.0V, CL = 0.1 µF, RL = 10 Ohms
4000
8
3500
3000
tOff (µs)
tOn (µs)
6
2500
2000
4
1500
1000
2
500
VIN = 5.0V, CL = 0.1 µF, RL = 10 Ohms
0
−40
−15
10
35
Temperature (°C)
60
85
0
−40
−15
10
35
Temperature (°C)
G000
Figure 15.
10
60
85
G000
Figure 16.
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TYPICAL CHARACTERISTICS (continued)
TURN-ON TIME
vs
TEMPERATURE
TURN-OFF TIME
vs
TEMPERATURE
15000
25
VIN = 1.5V, CL = 0.1 µF, RL = 10 Ohms
12500
20
10000
tOff (µs)
tOn (µs)
15
7500
10
5000
5
2500
VIN = 1.5V, CL = 0.1 µF, RL = 10 Ohms
0
−40
−15
10
35
Temperature (°C)
60
0
−40
85
−15
10
35
Temperature (°C)
60
85
G000
G000
Figure 17.
Figure 18.
RISE TIME
vs
INPUT VOLTAGE
RISE TIME
vs
INPUT VOLTAGE
12000
12000
10000
10000
8000
tRise (µs)
tRise (µs)
7500
5000
6000
4000
2500
CL = 1 µF, RL = 10 Ohms, VON = 1.8V
0
0
0.5
1
1.5
2
2.5 3 3.5
VIN (V)
4
2000
−40C
25C
85C
4.5
5
5.5
−40C
25C
85C
CL = 0.1 µF, RL = 10 Ohms, VON = 1.8V
6
0
0
0.5
1
1.5
2
2.5 3 3.5
VIN (V)
4
4.5
5
5.5
G000
Figure 19.
6
G000
Figure 20.
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TYPICAL CHARACTERISTICS (continued)
VIN
12
TURN-ON RESPONSE
= 5V, TA = 25°C, CIN = 10µF, CL = 1µF, RL = 10Ω
TURN-OFF RESPONSE
VIN = 5V, TA = 25°C, CIN = 10µF, CL = 1µF, RL = 10Ω
Figure 21.
Figure 22.
TURN-ON RESPONSE TIME
VIN = 5V, TA = 25°C, CIN =1µF, CL = 0.1µF, RL = 10Ω
TURN-OFF RESPONSE TIME
VIN = 5V, TA = 25°C, CIN = 1µF, CL = 0.1µF, RL = 10Ω
Figure 23.
Figure 24.
TURN-ON RESPONSE TIME
VIN = 1.5V, TA = 25°C, CIN = 10µF, CL = 1µF, RL = 10Ω
TURN-OFF RESPONSE TIME
VIN = 1.5V, TA = 25°C, CIN = 10µF, CL = 1µF, RL = 10Ω
Figure 25.
Figure 26.
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TYPICAL CHARACTERISTICS (continued)
VIN
TURN-ON RESPONSE TIME
= 1.5V, TA = 25°C, CIN = 1µF, CL = 0.1µF, RL = 10Ω
TURN-OFF RESPONSE TIME
VIN = 1.5V, TA = 25°C, CIN = 1µF, CL = 0.1µF, RL = 10Ω
Figure 27.
Figure 28.
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APPLICATION INFORMATION
On/Off Control
The ON pin controls the state of the switch. Asserting ON high enables the switch. ON is active high and has a
low threshold, making it capable of interfacing with low-voltage signals. The ON pin is compatible with standard
GPIO logic threshold. It can be used with any microcontroller with 1.2-V, 1.8-V, 2.5-V or 3.3-V GPIOs.
Input Capacitor
To limit the voltage drop on the input supply caused by transient inrush currents, when the switch turns on into a
discharged load capacitor or short-circuit, a capacitor needs to be placed between VIN and GND. A 1-μF ceramic
capacitor, CIN, placed close to the pins is usually sufficient. Higher values of CIN can be used to further reduce
the voltage drop.
Output Capacitor
A CIN to CL ratio of 10 to 1 is recommended for minimizing VIN dip caused by inrush currents during startup.
Output Pull-Down
The output pulldown is active when the user is turning off the main pass FET. The pulldown discharges the
output rail to approximately 10% of the rail, and then the output pulldown is automatically disconnected to
optimize the shutdown current.
Under-Voltage Lockout
The under-voltage lockout turns-off the switch if the input voltage drops below the under-voltage lockout
threshold. During under-voltage lockout (UVLO), if the voltage level at VOUT exceeds the voltage level at VIN by
the Reverse Current Voltage Threshold (VRVP), the body diode will be disengaged to prevent any current flow to
VIN. With the ON pin active the input voltage rising above the under-voltage lockout threshold will cause a
controlled turn-on of the switch which limits current over-shoots.
Reverse Current Protection
In a scenario where VOUT is greater than VIN, there is potential for reverse current through the pass FET or the
body diode. The TPS22929 monitors VIN and VOUT voltage levels. When the reverse current voltage threshold
(VRVP) is exceeded, the switch is disabled (within 10µs typ). Additionally, the body diode is disengaged so as to
prevent any reverse current flow to VIN. The FET, and the output (VOUT), will resume normal operation when the
reverse current scenario is no longer present.
Use the following formula to calculate the amount of reverse current for a particular application:
IRC =
0.077V
RON( VIN)
Where,
IRC is the amount of reverse current,
RON(VIN) is the on-resistance at the VIN of the reverse current condition.
Board Layout
For best performance, all traces should be as short as possible. To be most effective, the input and output
capacitors should be placed close to the device to minimize the effects that parasitic trace inductances may have
on normal operation. Using wide traces for VIN, VOUT, and GND helps minimize the parasitic electrical effects
along with minimizing the case to ambient thermal impedance.
14
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Thermal Considerations
For best device performance, be sure to follow the thermal guidelines in the Thermal Information table on page
4. To calculate max allowable continuous current for your application for a specific VIN and ambient temperature,
use the following formula:
IMAX =
TJ - TA
qJA
RON
Where:
IMAX= Max allowable continuous current
TJ= Max thermal junction temperature (125°C)
TA= Ambient temperature of the application
θJA= Junction-to-air thermal impedance (216°C/W)
RON= RON at a specified input voltage VIN (see Electrical Characteristics table on page 5)
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Copyright © 2011, Texas Instruments Incorporated
Product Folder Link(s) :TPS22929
15
PACKAGE OPTION ADDENDUM
www.ti.com
26-Dec-2011
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package
Drawing
Pins
Package Qty
Eco Plan
(2)
Lead/
Ball Finish
MSL Peak Temp
TPS22929DDBVR
ACTIVE
SOT-23
DBV
6
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
TPS22929DDBVT
ACTIVE
SOT-23
DBV
6
250
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
(3)
Samples
(Requires Login)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
20-Dec-2011
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
TPS22929DDBVR
SOT-23
DBV
6
3000
178.0
9.0
TPS22929DDBVT
SOT-23
DBV
6
250
178.0
9.0
Pack Materials-Page 1
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
3.23
3.17
1.37
4.0
8.0
Q3
3.23
3.17
1.37
4.0
8.0
Q3
PACKAGE MATERIALS INFORMATION
www.ti.com
20-Dec-2011
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
TPS22929DDBVR
SOT-23
DBV
6
3000
180.0
180.0
18.0
TPS22929DDBVT
SOT-23
DBV
6
250
180.0
180.0
18.0
Pack Materials-Page 2
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