TPS22910 www.ti.com SLVSB49B – NOVEMBER 2011 – REVISED APRIL 2012 Ultra-Small, Low on Resistance Load Switch with Controlled Turn-on Check for Samples: TPS22910 FEATURES DESCRIPTION • • The TPS22910 is a small, low rON load switch with controlled turn on. The device contains a P-channel MOSFET that can operate over an input voltage range of 1.4 V to 5.5 V. The switch is controlled by an on/off input (ON), which is capable of interfacing directly with low-voltage control signals. The TPS22910 is active low enable. 1 • • • • • • • Integrated Single Load Switch Ultra Small CSP-4 Package 0.9mm × 0.9mm, 0.5mm Pitch Input Voltage Range: 1.4-V to 5.5-V Low ON-Resistance – rON = 60-mΩ at VIN = 5-V – rON = 61-mΩ at VIN = 3.3-V – rON = 74-mΩ at VIN = 1.8-V – rON = 84-mΩ at VIN = 1.5-V 2-A Maximum Continuous Switch Current Low Threshold Control Input Controlled Slew-rate Options Under-Voltage Lock Out Reverse Current Protection APPLICATIONS • • • • • • • Portable Industrial / Medical Equipment Portable Media Players Point Of Sales Terminals GPS Navigation Devices Digital Cameras Portable Instrumentation Smartphones / Wireless Handsets The slew rate of the device is internally controlled in order to avoid inrush current. The TPS22910 family has various rise time options (see Table 1). The TPS22910 device provides circuit breaker functionality by latching off the power-switch during reverse voltage situations. An internal reverse voltage comparator disables the power-switch when the output voltage (VOUT) is driven higher than the input (VIN) to quickly (10µs typ) stop the flow of current towards the input side of the switch. Reverse current protection is always active, even when the powerswitch is disabled. Additionally, under-voltage lockout (UVLO) protection turns the switch off if the input voltage is too low. The TPS22910 is available in an ultra-small, spacesaving 4-pin CSP package and is characterized for operation over the free-air temperature range of –40°C to 85°C. TYPICAL APPLICATION Power Supply VOUT VIN OFF CIN CL ON RL ON TPS22910 GND GND Table 1. Feature List DEVICE rON (typ) at 3.3 V QUICK OUTPUT DISCHARGE (1) MAXIMUM OUTPUT CURRENT ENABLE TPS22910A 63 mΩ 1 µs No 2-A Active Low TPS22910B (2) 63 mΩ 100 µs No 2-A Active Low TPS22910C (2) 63 mΩ 1000 µs No 2-A Active Low (2) 63 mΩ 4500 µs No 2-A Active Low TPS22910D (1) (2) RISE TIME at 3.3V (typ) This feature discharges the output of the switch to ground through an 150-Ω resistor, preventing the output from floating. Contact local sales/distributor or factory for availability. 1 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2011–2012, Texas Instruments Incorporated TPS22910 SLVSB49B – NOVEMBER 2011 – REVISED APRIL 2012 www.ti.com These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. ORDERING INFORMATION PACKAGE (1) TA (1) (2) ORDERABLE PART NUMBER TOP-SIDE MARKING/ STATUS (2) –40°C to 85°C YZV (0.5mm pitch) Tape and Reel TPS22910AYZVR _ _ _ _ 75 –40°C to 85°C YZV (0.5mm pitch) Tape and Reel TPS22910BYZVR Contact factory for availability –40°C to 85°C YZV (0.5mm pitch) Tape and Reel TPS22910CYZVR Contact factory for availability –40°C to 85°C YZV (0.5mm pitch) Tape and Reel TPS22910DYZVR Contact factory for availability Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. Contact factory for details and availability for PREVIEW devices, minimum order quantities may apply. DEVICE INFORMATION YZV PACKAGE TERMINAL ASSIGNMENTS B ON GND A VIN VOUT 2 1 PIN FUNCTIONS TPS22910 YZV B1 2 PIN NAME GND B2 ON A1 VOUT A2 VIN DESCRIPTION Ground Switch control input, active low. Do not leave floating Switch output Switch input, bypass this input with a ceramic capacitor to ground Submit Documentation Feedback Copyright © 2011–2012, Texas Instruments Incorporated Product Folder Link(s) :TPS22910 TPS22910 www.ti.com SLVSB49B – NOVEMBER 2011 – REVISED APRIL 2012 BLOCK DIAGRAM VIN Reverse Current Protection UVLO ON Control Logic GND VOUT Table 2. FUNCTION TABLE ON VIN to VOUT L ON H OFF ABSOLUTE MAXIMUM RATINGS VALUE UNIT VIN Input voltage range –0.3 to 6 V VOUT Output voltage range –0.3 to 6 V VON Input voltage range –0.3 to 6 V IMAX Maximum continuous switch current 2 A IPLS Maximum pulsed switch current, pulse <300 µS, 2% duty cycle 2.5 A TA Operating free-air temperature range –40 to 85 °C TJ Maximum junction temperature 125 °C TSTG Storage temperature range –65 to 150 °C TLEAD Maximum lead temperature (10-s soldering time) 300 °C ESD Electrostatic discharge protection Human-Body Model (HBM) (VIN, VOUT, GND pins) 2000 Charged-Device Model (CDM) (VIN, VOUT, ON, GND pins) 1000 Submit Documentation Feedback Copyright © 2011–2012, Texas Instruments Incorporated Product Folder Link(s) :TPS22910 V 3 TPS22910 SLVSB49B – NOVEMBER 2011 – REVISED APRIL 2012 www.ti.com THERMAL INFORMATION TPS22910 THERMAL METRIC (1) CSP UNITS (4) PINS θJA Junction-to-ambient thermal resistance θJCtop Junction-to-case (top) thermal resistance 1.9 θJB Junction-to-board thermal resistance 36.8 ψJT Junction-to-top characterization parameter 11.3 ψJB Junction-to-board characterization parameter 36.8 θJCbot Junction-to-case (bottom) thermal resistance N/A (1) 189.1 °C/W For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. RECOMMENDED OPERATING CONDITIONS VIN Input voltage range VON ON voltage range VOUT Output voltage range VIH High-level input voltage, ON VIL CIN (1) 4 Low-level input voltage, ON MIN MAX 1.4 5.5 V 5.5 V 0 UNIT VIN VIN = 3.61 V to 5.5 V 1.1 5.5 V VIN = 1.4 V to 3.6 V 1.1 5.5 V VIN = 3.61 V to 5.5 V 0.6 V VIN = 1.4 V to 3. 6V 0.4 V Input Capacitor 1 (1) µF Refer to the application section. Submit Documentation Feedback Copyright © 2011–2012, Texas Instruments Incorporated Product Folder Link(s) :TPS22910 TPS22910 www.ti.com SLVSB49B – NOVEMBER 2011 – REVISED APRIL 2012 ELECTRICAL CHARACTERISTICS VIN = 1.4 V to 5.5 V, TA = –40ºC to 85ºC (unless otherwise noted) PARAMETER IIN IIN(off) IIN(Leakage) Quiescent current Off supply current Leakage current TEST CONDITIONS TA MIN 2 10 IOUT = 0, VIN = 4.2 V, VON = 0 V 2 7.0 IOUT = 0, VIN = 3.6 V, VON = 0 V 2 7.0 IOUT = 0, VIN = 2.5 V, VON = 0 V 0.9 5 IOUT = 0, VIN = 1.5 V, VON = 0 V 0.7 5 VOUT = Open, VIN = VON = 5.25 V 1.2 10 VOUT = Open, VIN = VON = 4.2 V 0.2 7.0 VOUT = Open, VIN = VON = 3.6 V Full 0.1 7.0 VOUT = Open, VIN = VON = 2.5 V 0.1 5 VOUT = Open, VIN = VON = 1.5 V 0.1 5 VOUT = 0 V, VIN = VON = 5.25 V 1.2 10 VOUT = 0 V, VIN = VON = 4.2 V 0.2 7.0 0.1 7.0 0.1 5 VOUT = 0 V, VIN = VON = 3.6 V Full Full VOUT = 0 V, VIN = VON = 1.5 V VIN = 5.25 V, IOUT = –200 mA VIN = 5.0 V, IOUT = –200 mA VIN = 4.2 V, IOUT = –200 mA On-resistance VIN = 3.3 V, IOUT = –200 mA VIN = 2.5 V, IOUT = –200 mA VIN = 1.8 V, IOUT = –200 mA VIN = 1.5 V, IOUT = –200 mA UVLO Under voltage lockout VIN increasing, VON = 0 V, IOUT = –100 mA 25°C ON input leakage current VRVP Reverse Current Voltage Threshold tDELAY Reverse Current Response Delay VON = 1.4 V to 5.25 V or GND VIN = 5V 0.1 5 60 80 Full 60 Full Product Folder Link(s) :TPS22910 µA µA µA 80 110 25°C 60 Full 80 110 25°C 60.7 Full 80 110 25°C 63.4 Full mΩ 90 120 25°C 74.2 Full 100 130 25°C 83.9 Full 120 150 1.2 Full V 0.50 Full 1 µA 44 mV 10 µs Submit Documentation Feedback Copyright © 2011–2012, Texas Instruments Incorporated UNIT 110 25°C VIN decreasing, VON = 0 V, RL = 10 Ω ION MAX IOUT = 0, VIN = 5.25 V, VON = 0 V VOUT = 0 V, VIN = VON = 2.5 V rON TYP 5 TPS22910 SLVSB49B – NOVEMBER 2011 – REVISED APRIL 2012 www.ti.com SWITCHING CHARACTERISTICS PARAMETER TPS22910A TEST CONDITION TYP UNIT VIN = 5 V, TA = 25ºC (unless otherwise noted) tON Turn-ON time RL = 10 Ω, CL = 0.1 µF 2 tOFF Turn-OFF time RL = 10 Ω, CL = 0.1 µF 5.5 tR VOUT rise time RL = 10 Ω, CL = 0.1 µF 1 tF VOUT fall time RL = 10 Ω, CL = 0.1 µF 3 µs VIN = 3.3 V, TA = 25ºC (unless otherwise noted) tON Turn-ON time RL = 10 Ω, CL = 0.1 µF 2.5 tOFF Turn-OFF time RL = 10 Ω, CL = 0.1 µF 7 tR VOUT rise time RL = 10 Ω, CL = 0.1 µF 1 tF VOUT fall time RL = 10 Ω, CL = 0.1 µF 3.5 µs VIN = 1.5 V, TA = 25ºC (unless otherwise noted) tON Turn-ON time RL = 10 Ω, CL = 0.1 µF 4.5 tOFF Turn-OFF time RL = 10 Ω, CL = 0.1 µF 16.5 tR VOUT rise time RL = 10 Ω, CL = 0.1 µF 2 tF VOUT fall time RL = 10 Ω, CL = 0.1 µF 7 µs PARAMETRIC MEASUREMENT INFORMATION VOUT VIN CIN = 1µF OFF + - (A) ON CL RL ON GND TPS22910 GND GND TEST CIRCUIT VON 50% 50% tOFF tON VOUT 50% 50% tf tr 90% VOUT 90% 10% 10% tON /t OFF WAVEFORMS (A) Rise and fall times of the control signal is 100ns. A. Rise and fall times of the control signal is 100 ns. Figure 1. Test Circuit and tON/tOFF Waveforms 6 Submit Documentation Feedback Copyright © 2011–2012, Texas Instruments Incorporated Product Folder Link(s) :TPS22910 TPS22910 www.ti.com SLVSB49B – NOVEMBER 2011 – REVISED APRIL 2012 TYPICAL CHARACTERISTICS ON-STATE RESISTANCE vs INPUT VOLTAGE ON INPUT THRESHOLD 120 6 −40C 25C 85C 100 5 4 VOUT (V) Ron (mΩ) 80 60 3 40 2 20 1 0 VIN = 5.0V VIN = 4.2V VIN = 3.3V VIN = 2.5V VIN = 1.8V VIN = 1.5V 0 0.5 1 1.5 2 2.5 3 3.5 Voltage (V) 4 4.5 5 5.5 0 6 0 0.2 0.4 0.6 0.8 VON (V) 1 1.2 1.4 G000 G000 Figure 2. Figure 3. INPUT CURRENT, QUIESCENT vs INPUT VOLTAGE INPUT CURRENT, LEAK vs INPUT VOLTAGE 3 3000 −40C 25C 85C 2.5 2500 2000 IIN_Leak (nA) IIN_Q (µA) 2 1.5 1500 1 1000 0.5 500 0 −40C 25C 85C 0 1 2 3 Voltage (V) 4 5 6 0 0 0.5 1 1.5 2 2.5 3 3.5 Voltage (V) 4 4.5 5 5.5 G000 Figure 4. 6 G000 Figure 5. Submit Documentation Feedback Copyright © 2011–2012, Texas Instruments Incorporated Product Folder Link(s) :TPS22910 7 TPS22910 SLVSB49B – NOVEMBER 2011 – REVISED APRIL 2012 www.ti.com TYPICAL CHARACTERISTICS (continued) ON-STATE RESISTANCE vs TEMPERATURE INPUT CURRENT, OFF vs INPUT VOLTAGE 5400 180 140 Ron (mΩ) 120 −40C 25C 85C 4500 3600 IIN_Off (nA) 160 VIN = 1.4V VIN = 1.5V VIN = 1.8V VIN = 2.5V VIN = 3.3V VIN = 4.2V VIN= 5.0V VIN = 5.5V 100 80 60 2700 1800 40 900 20 0 −40 −15 10 35 Temperature (°C) 60 85 0 0 0.5 1 1.5 2 2.5 3 3.5 Voltage (V) 4 4.5 5 G000 5.5 6 G000 Figure 6. Figure 7. Maximum Power Dissipation (W) 1 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 −40 −30 −20 −10 0 10 20 30 40 50 Ambient Temperature (°C) 60 70 G001 Figure 8. Allowable Power Dissipation 8 80 Figure 9. ULVO Response IOUT = -100mA Submit Documentation Feedback Copyright © 2011–2012, Texas Instruments Incorporated Product Folder Link(s) :TPS22910 TPS22910 www.ti.com SLVSB49B – NOVEMBER 2011 – REVISED APRIL 2012 TYPICAL CHARACTERISTICS (continued) Figure 10. Reverse Current Protection VOUT = 3.3V, VIN = 3.3V Decreasing to 0V TYPICAL AC CHARACTERISTICS FOR TPS22910A RISE TIME vs TEMPERATURE FALL TIME vs TEMPERATURE 4 1 VIN =5.0V, CL = 0.1 µF, RL = 10 Ohms 0.8 3 tFall (µs) tRise (µs) 0.6 2 0.4 1 0.2 VIN =5V, CL = 0.1 µF, RL = 10 Ohms 0 −40 −15 10 35 Temperature (°C) 60 85 0 −40 −15 10 35 Temperature (°C) 60 G000 Figure 11. 85 G000 Figure 12. Submit Documentation Feedback Copyright © 2011–2012, Texas Instruments Incorporated Product Folder Link(s) :TPS22910 9 TPS22910 SLVSB49B – NOVEMBER 2011 – REVISED APRIL 2012 www.ti.com TYPICAL CHARACTERISTICS (continued) RISE TIME vs TEMPERATURE FALL TIME vs TEMPERATURE 4 10 VIN =1.5V, CL = 0.1 µF, RL = 10 Ohms 9 8 3 7 tFall (µs) tRise (µs) 6 2 5 4 3 1 2 1 VIN = 1.5V, CL = 0.1 µF, RL = 10 Ohms 0 −40 −15 10 35 Temperature (°C) 60 0 −40 85 −15 10 35 Temperature (°C) 60 G000 85 G000 Figure 13. Figure 14. TURN-ON TIME vs TEMPERATURE TURN-OFF TIME vs TEMPERATURE 4 8 VIN = 5.0V, CL = 0.1 µF, RL = 10 Ohms 6 tOff (µs) tOn (µs) 3 2 1 4 2 VIN = 5.0V, CL = 0.1 µF, RL = 10 Ohms 0 −40 −15 10 35 Temperature (°C) 60 85 0 −40 −15 10 35 Temperature (°C) G000 Figure 15. 10 60 85 G000 Figure 16. Submit Documentation Feedback Copyright © 2011–2012, Texas Instruments Incorporated Product Folder Link(s) :TPS22910 TPS22910 www.ti.com SLVSB49B – NOVEMBER 2011 – REVISED APRIL 2012 TYPICAL CHARACTERISTICS (continued) TURN-ON TIME vs TEMPERATURE TURN-OFF TIME vs TEMPERATURE 7 25 VIN = 1.5V, CL = 0.1 µF, RL = 10 Ohms 6 20 15 4 tOff (µs) tOn (µs) 5 3 10 2 5 1 VIN = 1.5V, CL = 0.1 µF, RL = 10 Ohms 0 −40 −15 10 35 Temperature (°C) 60 0 −40 85 −15 10 35 Temperature (°C) 60 G000 85 G000 Figure 17. Figure 18. RISE TIME vs INPUT VOLTAGE 2.5 25C −40C 85C 2.0 tRise (µs) 1.5 1.0 0.5 CL = 0.1uF, RL = 10 Ohms, VON = 1.8V 0.0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 Vin (V) G001 Figure 19. Submit Documentation Feedback Copyright © 2011–2012, Texas Instruments Incorporated Product Folder Link(s) :TPS22910 11 TPS22910 SLVSB49B – NOVEMBER 2011 – REVISED APRIL 2012 www.ti.com TYPICAL CHARACTERISTICS (continued) 12 TURN-ON RESPONSE VIN = 5V, TA = 25°C, CIN = 10µF, CL = 0.1µF, RL = 10Ω TURN-OFF RESPONSE VIN = 5V, TA = 25°C, CIN = 10µF, CL = 0.1µF, RL = 10Ω Figure 20. Figure 21. TURN-ON RESPONSE TIME VIN = 5V, TA = 25°C, CIN =10µF, CL = 1µF, RL = 10Ω TURN-OFF RESPONSE TIME VIN = 5V, TA = 25°C, CIN = 10µF, CL = 1µF, RL = 10Ω Figure 22. Figure 23. TURN-ON RESPONSE TIME VIN = 1.5V, TA = 25°C, CIN = 10µF, CL = 0.1µF, RL = 10Ω TURN-OFF RESPONSE TIME VIN = 1.5V, TA = 25°C, CIN = 10µF, CL = 0.1µF, RL = 10Ω Figure 24. Figure 25. Submit Documentation Feedback Copyright © 2011–2012, Texas Instruments Incorporated Product Folder Link(s) :TPS22910 TPS22910 www.ti.com SLVSB49B – NOVEMBER 2011 – REVISED APRIL 2012 TYPICAL CHARACTERISTICS (continued) VIN TURN-ON RESPONSE TIME = 1.5V, TA = 25°C, CIN = 10µF, CL = 1µF, RL = 10Ω TURN-OFF RESPONSE TIME VIN = 1.5V, TA = 25°C, CIN = 10µF, CL = 1µF, RL = 10Ω Figure 26. Figure 27. Submit Documentation Feedback Copyright © 2011–2012, Texas Instruments Incorporated Product Folder Link(s) :TPS22910 13 TPS22910 SLVSB49B – NOVEMBER 2011 – REVISED APRIL 2012 www.ti.com APPLICATION INFORMATION On/Off Control The ON pin controls the state of the switch. Asserting ON low enables the switch. ON is active low and has a low threshold, making it capable of interfacing with low-voltage signals. The ON pin is compatible with standard GPIO logic threshold. It can be used with any microcontroller with 1.2-V, 1.8-V, 2.5-V or 3.3-V GPIO. Input Capacitor To limit the voltage drop on the input supply caused by transient inrush currents, when the switch turns on into a discharged load capacitor or short-circuit, a capacitor needs to be placed between VIN and GND. A 1-μF ceramic capacitor, CIN, placed close to the pins is usually sufficient. Higher values of CIN can be used to further reduce the voltage drop. Output Capacitor A CIN to CL ratio of 10 to 1 is recommended for minimizing VIN dip caused by inrush currents during startup. Devices with faster rise times may require a larger ratio to minimize VIN dip. Under-Voltage Lockout Under-voltage lockout protection turns off the switch if the input voltage drops below the under-voltage lockout threshold. During under-voltage lockout (UVLO), if the voltage level at VOUT exceeds the voltage level at VIN by the Reverse Current Voltage Threshold (VRVP), the body diode will be disengaged to prevent any current flow to VIN. With the ON pin active, the input voltage rising above the under-voltage lockout threshold will cause a controlled turn-on of the switch to limit current over-shoot. Reverse Current Protection In a scenario where VOUT is greater than VIN, there is potential for reverse current to flow through the pass FET or the body diode. The TPS22910 monitors VIN and VOUT voltage levels. When the reverse current voltage threshold (VRVP) is exceeded, the switch is disabled (within 10μs typ). Additionally, the body diode is disengaged so as to prevent any reverse current flow to VIN. The FET, and the output (VOUT), will resume normal operation when the reverse current scenario is no longer present. Use the following formula to calculate the amount of reverse current for a particular application: IRC = 0.044V RON( VIN) Where, IRC is the amount of reverse current, RON(VIN) is the on-resistance at the VIN of the reverse current condition. Board Layout For best performance, all traces should be as short as possible. To be most effective, the input and output capacitors should be placed close to the device to minimize the effects that parasitic trace inductances may have on normal operation. Using wide traces for VIN, VOUT, and GND helps minimize the parasitic electrical effects along with minimizing the case to ambient thermal impedance. 14 Submit Documentation Feedback Copyright © 2011–2012, Texas Instruments Incorporated Product Folder Link(s) :TPS22910 TPS22910 www.ti.com SLVSB49B – NOVEMBER 2011 – REVISED APRIL 2012 REVISION HISTORY Changes from Original (November 2011) to Revision A • Page Deleted Quick Output Discharge Transistor from FEATURES. ............................................................................................ 1 Changes from Revision A (March 2012) to Revision B • Page Changed "active high" description for ON pin to "active low" in PIN FUNCTIONS table. .................................................... 2 Submit Documentation Feedback Copyright © 2011–2012, Texas Instruments Incorporated Product Folder Link(s) :TPS22910 15 PACKAGE OPTION ADDENDUM www.ti.com 25-Apr-2012 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/ Ball Finish MSL Peak Temp (3) Samples (Requires Login) TPS22910AYZVR ACTIVE DSBGA YZV 4 3000 Green (RoHS & no Sb/Br) SNAGCU Level-1-260C-UNLIM TPS22910AYZVT ACTIVE DSBGA YZV 4 250 Green (RoHS & no Sb/Br) SNAGCU Level-1-260C-UNLIM (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 25-Apr-2012 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) TPS22910AYZVR DSBGA YZV 4 3000 178.0 9.2 TPS22910AYZVT DSBGA YZV 4 250 178.0 9.2 Pack Materials-Page 1 B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant 1.0 1.0 0.63 4.0 8.0 Q1 1.0 1.0 0.63 4.0 8.0 Q1 PACKAGE MATERIALS INFORMATION www.ti.com 25-Apr-2012 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TPS22910AYZVR DSBGA YZV 4 3000 220.0 220.0 35.0 TPS22910AYZVT DSBGA YZV 4 250 220.0 220.0 35.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed. TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. To minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in such safety-critical applications. TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions: Products Applications Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers DLP® Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps DSP dsp.ti.com Energy and Lighting www.ti.com/energy Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial Interface interface.ti.com Medical www.ti.com/medical Logic logic.ti.com Security www.ti.com/security Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video RFID www.ti-rfid.com OMAP Mobile Processors www.ti.com/omap Wireless Connectivity www.ti.com/wirelessconnectivity TI E2E Community Home Page e2e.ti.com Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2012, Texas Instruments Incorporated