TI TPS22910AYZVR

TPS22910
www.ti.com
SLVSB49B – NOVEMBER 2011 – REVISED APRIL 2012
Ultra-Small, Low on Resistance Load Switch with Controlled Turn-on
Check for Samples: TPS22910
FEATURES
DESCRIPTION
•
•
The TPS22910 is a small, low rON load switch with
controlled turn on. The device contains a P-channel
MOSFET that can operate over an input voltage
range of 1.4 V to 5.5 V. The switch is controlled by an
on/off input (ON), which is capable of interfacing
directly with low-voltage control signals. The
TPS22910 is active low enable.
1
•
•
•
•
•
•
•
Integrated Single Load Switch
Ultra Small CSP-4 Package 0.9mm × 0.9mm,
0.5mm Pitch
Input Voltage Range: 1.4-V to 5.5-V
Low ON-Resistance
– rON = 60-mΩ at VIN = 5-V
– rON = 61-mΩ at VIN = 3.3-V
– rON = 74-mΩ at VIN = 1.8-V
– rON = 84-mΩ at VIN = 1.5-V
2-A Maximum Continuous Switch Current
Low Threshold Control Input
Controlled Slew-rate Options
Under-Voltage Lock Out
Reverse Current Protection
APPLICATIONS
•
•
•
•
•
•
•
Portable Industrial / Medical Equipment
Portable Media Players
Point Of Sales Terminals
GPS Navigation Devices
Digital Cameras
Portable Instrumentation
Smartphones / Wireless Handsets
The slew rate of the device is internally controlled in
order to avoid inrush current. The TPS22910 family
has various rise time options (see Table 1).
The TPS22910 device provides circuit breaker
functionality by latching off the power-switch during
reverse voltage situations. An internal reverse voltage
comparator disables the power-switch when the
output voltage (VOUT) is driven higher than the input
(VIN) to quickly (10µs typ) stop the flow of current
towards the input side of the switch. Reverse current
protection is always active, even when the powerswitch is disabled. Additionally, under-voltage lockout
(UVLO) protection turns the switch off if the input
voltage is too low.
The TPS22910 is available in an ultra-small, spacesaving 4-pin CSP package and is characterized for
operation over the free-air temperature range of
–40°C to 85°C.
TYPICAL APPLICATION
Power
Supply
VOUT
VIN
OFF
CIN
CL
ON
RL
ON
TPS22910
GND
GND
Table 1. Feature List
DEVICE
rON (typ) at 3.3 V
QUICK OUTPUT
DISCHARGE (1)
MAXIMUM OUTPUT
CURRENT
ENABLE
TPS22910A
63 mΩ
1 µs
No
2-A
Active Low
TPS22910B (2)
63 mΩ
100 µs
No
2-A
Active Low
TPS22910C (2)
63 mΩ
1000 µs
No
2-A
Active Low
(2)
63 mΩ
4500 µs
No
2-A
Active Low
TPS22910D
(1)
(2)
RISE TIME at 3.3V
(typ)
This feature discharges the output of the switch to ground through an 150-Ω resistor, preventing the output from floating.
Contact local sales/distributor or factory for availability.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2011–2012, Texas Instruments Incorporated
TPS22910
SLVSB49B – NOVEMBER 2011 – REVISED APRIL 2012
www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
ORDERING INFORMATION
PACKAGE (1)
TA
(1)
(2)
ORDERABLE PART NUMBER
TOP-SIDE MARKING/
STATUS (2)
–40°C to 85°C
YZV (0.5mm pitch)
Tape and Reel
TPS22910AYZVR
_ _ _ _ 75
–40°C to 85°C
YZV (0.5mm pitch)
Tape and Reel
TPS22910BYZVR
Contact factory for availability
–40°C to 85°C
YZV (0.5mm pitch)
Tape and Reel
TPS22910CYZVR
Contact factory for availability
–40°C to 85°C
YZV (0.5mm pitch)
Tape and Reel
TPS22910DYZVR
Contact factory for availability
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
Contact factory for details and availability for PREVIEW devices, minimum order quantities may apply.
DEVICE INFORMATION
YZV PACKAGE
TERMINAL ASSIGNMENTS
B
ON
GND
A
VIN
VOUT
2
1
PIN FUNCTIONS
TPS22910
YZV
B1
2
PIN NAME
GND
B2
ON
A1
VOUT
A2
VIN
DESCRIPTION
Ground
Switch control input, active low. Do not leave floating
Switch output
Switch input, bypass this input with a ceramic capacitor to
ground
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TPS22910
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SLVSB49B – NOVEMBER 2011 – REVISED APRIL 2012
BLOCK DIAGRAM
VIN
Reverse
Current
Protection
UVLO
ON
Control
Logic
GND
VOUT
Table 2. FUNCTION TABLE
ON
VIN to VOUT
L
ON
H
OFF
ABSOLUTE MAXIMUM RATINGS
VALUE
UNIT
VIN
Input voltage range
–0.3 to 6
V
VOUT
Output voltage range
–0.3 to 6
V
VON
Input voltage range
–0.3 to 6
V
IMAX
Maximum continuous switch current
2
A
IPLS
Maximum pulsed switch current, pulse <300 µS, 2% duty cycle
2.5
A
TA
Operating free-air temperature range
–40 to 85
°C
TJ
Maximum junction temperature
125
°C
TSTG
Storage temperature range
–65 to 150
°C
TLEAD
Maximum lead temperature (10-s soldering time)
300
°C
ESD
Electrostatic discharge protection
Human-Body Model (HBM) (VIN, VOUT, GND pins)
2000
Charged-Device Model (CDM) (VIN, VOUT, ON, GND pins)
1000
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V
3
TPS22910
SLVSB49B – NOVEMBER 2011 – REVISED APRIL 2012
www.ti.com
THERMAL INFORMATION
TPS22910
THERMAL METRIC (1)
CSP
UNITS
(4) PINS
θJA
Junction-to-ambient thermal resistance
θJCtop
Junction-to-case (top) thermal resistance
1.9
θJB
Junction-to-board thermal resistance
36.8
ψJT
Junction-to-top characterization parameter
11.3
ψJB
Junction-to-board characterization parameter
36.8
θJCbot
Junction-to-case (bottom) thermal resistance
N/A
(1)
189.1
°C/W
For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
RECOMMENDED OPERATING CONDITIONS
VIN
Input voltage range
VON
ON voltage range
VOUT
Output voltage range
VIH
High-level input voltage, ON
VIL
CIN
(1)
4
Low-level input voltage, ON
MIN
MAX
1.4
5.5
V
5.5
V
0
UNIT
VIN
VIN = 3.61 V to 5.5 V
1.1
5.5
V
VIN = 1.4 V to 3.6 V
1.1
5.5
V
VIN = 3.61 V to 5.5 V
0.6
V
VIN = 1.4 V to 3. 6V
0.4
V
Input Capacitor
1
(1)
µF
Refer to the application section.
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SLVSB49B – NOVEMBER 2011 – REVISED APRIL 2012
ELECTRICAL CHARACTERISTICS
VIN = 1.4 V to 5.5 V, TA = –40ºC to 85ºC (unless otherwise noted)
PARAMETER
IIN
IIN(off)
IIN(Leakage)
Quiescent current
Off supply current
Leakage current
TEST CONDITIONS
TA
MIN
2
10
IOUT = 0, VIN = 4.2 V, VON = 0 V
2
7.0
IOUT = 0, VIN = 3.6 V, VON = 0 V
2
7.0
IOUT = 0, VIN = 2.5 V, VON = 0 V
0.9
5
IOUT = 0, VIN = 1.5 V, VON = 0 V
0.7
5
VOUT = Open, VIN = VON = 5.25 V
1.2
10
VOUT = Open, VIN = VON = 4.2 V
0.2
7.0
VOUT = Open, VIN = VON = 3.6 V
Full
0.1
7.0
VOUT = Open, VIN = VON = 2.5 V
0.1
5
VOUT = Open, VIN = VON = 1.5 V
0.1
5
VOUT = 0 V, VIN = VON = 5.25 V
1.2
10
VOUT = 0 V, VIN = VON = 4.2 V
0.2
7.0
0.1
7.0
0.1
5
VOUT = 0 V, VIN = VON = 3.6 V
Full
Full
VOUT = 0 V, VIN = VON = 1.5 V
VIN = 5.25 V, IOUT = –200 mA
VIN = 5.0 V, IOUT = –200 mA
VIN = 4.2 V, IOUT = –200 mA
On-resistance
VIN = 3.3 V, IOUT = –200 mA
VIN = 2.5 V, IOUT = –200 mA
VIN = 1.8 V, IOUT = –200 mA
VIN = 1.5 V, IOUT = –200 mA
UVLO
Under voltage lockout
VIN increasing, VON = 0 V,
IOUT = –100 mA
25°C
ON input leakage current
VRVP
Reverse Current Voltage
Threshold
tDELAY
Reverse Current Response
Delay
VON = 1.4 V to 5.25 V or GND
VIN = 5V
0.1
5
60
80
Full
60
Full
Product Folder Link(s) :TPS22910
µA
µA
µA
80
110
25°C
60
Full
80
110
25°C
60.7
Full
80
110
25°C
63.4
Full
mΩ
90
120
25°C
74.2
Full
100
130
25°C
83.9
Full
120
150
1.2
Full
V
0.50
Full
1
µA
44
mV
10
µs
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UNIT
110
25°C
VIN decreasing, VON = 0 V, RL = 10 Ω
ION
MAX
IOUT = 0, VIN = 5.25 V, VON = 0 V
VOUT = 0 V, VIN = VON = 2.5 V
rON
TYP
5
TPS22910
SLVSB49B – NOVEMBER 2011 – REVISED APRIL 2012
www.ti.com
SWITCHING CHARACTERISTICS
PARAMETER
TPS22910A
TEST CONDITION
TYP
UNIT
VIN = 5 V, TA = 25ºC (unless otherwise noted)
tON
Turn-ON time
RL = 10 Ω, CL = 0.1 µF
2
tOFF
Turn-OFF time
RL = 10 Ω, CL = 0.1 µF
5.5
tR
VOUT rise time
RL = 10 Ω, CL = 0.1 µF
1
tF
VOUT fall time
RL = 10 Ω, CL = 0.1 µF
3
µs
VIN = 3.3 V, TA = 25ºC (unless otherwise noted)
tON
Turn-ON time
RL = 10 Ω, CL = 0.1 µF
2.5
tOFF
Turn-OFF time
RL = 10 Ω, CL = 0.1 µF
7
tR
VOUT rise time
RL = 10 Ω, CL = 0.1 µF
1
tF
VOUT fall time
RL = 10 Ω, CL = 0.1 µF
3.5
µs
VIN = 1.5 V, TA = 25ºC (unless otherwise noted)
tON
Turn-ON time
RL = 10 Ω, CL = 0.1 µF
4.5
tOFF
Turn-OFF time
RL = 10 Ω, CL = 0.1 µF
16.5
tR
VOUT rise time
RL = 10 Ω, CL = 0.1 µF
2
tF
VOUT fall time
RL = 10 Ω, CL = 0.1 µF
7
µs
PARAMETRIC MEASUREMENT INFORMATION
VOUT
VIN
CIN = 1µF
OFF
+
-
(A)
ON
CL
RL
ON
GND
TPS22910
GND
GND
TEST CIRCUIT
VON
50%
50%
tOFF
tON
VOUT
50%
50%
tf
tr
90%
VOUT
90%
10%
10%
tON /t OFF WAVEFORMS
(A) Rise and fall times of the control signal is 100ns.
A.
Rise and fall times of the control signal is 100 ns.
Figure 1. Test Circuit and tON/tOFF Waveforms
6
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SLVSB49B – NOVEMBER 2011 – REVISED APRIL 2012
TYPICAL CHARACTERISTICS
ON-STATE RESISTANCE
vs
INPUT VOLTAGE
ON INPUT THRESHOLD
120
6
−40C
25C
85C
100
5
4
VOUT (V)
Ron (mΩ)
80
60
3
40
2
20
1
0
VIN = 5.0V
VIN = 4.2V
VIN = 3.3V
VIN = 2.5V
VIN = 1.8V
VIN = 1.5V
0
0.5
1
1.5
2
2.5 3 3.5
Voltage (V)
4
4.5
5
5.5
0
6
0
0.2
0.4
0.6
0.8
VON (V)
1
1.2
1.4
G000
G000
Figure 2.
Figure 3.
INPUT CURRENT, QUIESCENT
vs
INPUT VOLTAGE
INPUT CURRENT, LEAK
vs
INPUT VOLTAGE
3
3000
−40C
25C
85C
2.5
2500
2000
IIN_Leak (nA)
IIN_Q (µA)
2
1.5
1500
1
1000
0.5
500
0
−40C
25C
85C
0
1
2
3
Voltage (V)
4
5
6
0
0
0.5
1
1.5
2
2.5 3 3.5
Voltage (V)
4
4.5
5
5.5
G000
Figure 4.
6
G000
Figure 5.
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TPS22910
SLVSB49B – NOVEMBER 2011 – REVISED APRIL 2012
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TYPICAL CHARACTERISTICS (continued)
ON-STATE RESISTANCE
vs
TEMPERATURE
INPUT CURRENT, OFF
vs
INPUT VOLTAGE
5400
180
140
Ron (mΩ)
120
−40C
25C
85C
4500
3600
IIN_Off (nA)
160
VIN = 1.4V
VIN = 1.5V
VIN = 1.8V
VIN = 2.5V
VIN = 3.3V
VIN = 4.2V
VIN= 5.0V
VIN = 5.5V
100
80
60
2700
1800
40
900
20
0
−40
−15
10
35
Temperature (°C)
60
85
0
0
0.5
1
1.5
2
2.5 3 3.5
Voltage (V)
4
4.5
5
G000
5.5
6
G000
Figure 6.
Figure 7.
Maximum Power Dissipation (W)
1
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
−40 −30 −20 −10 0 10 20 30 40 50
Ambient Temperature (°C)
60
70
G001
Figure 8. Allowable Power Dissipation
8
80
Figure 9. ULVO Response IOUT = -100mA
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SLVSB49B – NOVEMBER 2011 – REVISED APRIL 2012
TYPICAL CHARACTERISTICS (continued)
Figure 10. Reverse Current Protection VOUT = 3.3V, VIN = 3.3V Decreasing to 0V
TYPICAL AC CHARACTERISTICS FOR TPS22910A
RISE TIME
vs
TEMPERATURE
FALL TIME
vs
TEMPERATURE
4
1
VIN =5.0V, CL = 0.1 µF, RL = 10 Ohms
0.8
3
tFall (µs)
tRise (µs)
0.6
2
0.4
1
0.2
VIN =5V, CL = 0.1 µF, RL = 10 Ohms
0
−40
−15
10
35
Temperature (°C)
60
85
0
−40
−15
10
35
Temperature (°C)
60
G000
Figure 11.
85
G000
Figure 12.
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TYPICAL CHARACTERISTICS (continued)
RISE TIME
vs
TEMPERATURE
FALL TIME
vs
TEMPERATURE
4
10
VIN =1.5V, CL = 0.1 µF, RL = 10 Ohms
9
8
3
7
tFall (µs)
tRise (µs)
6
2
5
4
3
1
2
1
VIN = 1.5V, CL = 0.1 µF, RL = 10 Ohms
0
−40
−15
10
35
Temperature (°C)
60
0
−40
85
−15
10
35
Temperature (°C)
60
G000
85
G000
Figure 13.
Figure 14.
TURN-ON TIME
vs
TEMPERATURE
TURN-OFF TIME
vs
TEMPERATURE
4
8
VIN = 5.0V, CL = 0.1 µF, RL = 10 Ohms
6
tOff (µs)
tOn (µs)
3
2
1
4
2
VIN = 5.0V, CL = 0.1 µF, RL = 10 Ohms
0
−40
−15
10
35
Temperature (°C)
60
85
0
−40
−15
10
35
Temperature (°C)
G000
Figure 15.
10
60
85
G000
Figure 16.
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TYPICAL CHARACTERISTICS (continued)
TURN-ON TIME
vs
TEMPERATURE
TURN-OFF TIME
vs
TEMPERATURE
7
25
VIN = 1.5V, CL = 0.1 µF, RL = 10 Ohms
6
20
15
4
tOff (µs)
tOn (µs)
5
3
10
2
5
1
VIN = 1.5V, CL = 0.1 µF, RL = 10 Ohms
0
−40
−15
10
35
Temperature (°C)
60
0
−40
85
−15
10
35
Temperature (°C)
60
G000
85
G000
Figure 17.
Figure 18.
RISE TIME
vs
INPUT VOLTAGE
2.5
25C
−40C
85C
2.0
tRise (µs)
1.5
1.0
0.5
CL = 0.1uF, RL = 10 Ohms, VON = 1.8V
0.0
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0
Vin (V)
G001
Figure 19.
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TPS22910
SLVSB49B – NOVEMBER 2011 – REVISED APRIL 2012
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TYPICAL CHARACTERISTICS (continued)
12
TURN-ON RESPONSE
VIN = 5V, TA = 25°C, CIN = 10µF, CL = 0.1µF, RL = 10Ω
TURN-OFF RESPONSE
VIN = 5V, TA = 25°C, CIN = 10µF, CL = 0.1µF, RL = 10Ω
Figure 20.
Figure 21.
TURN-ON RESPONSE TIME
VIN = 5V, TA = 25°C, CIN =10µF, CL = 1µF, RL = 10Ω
TURN-OFF RESPONSE TIME
VIN = 5V, TA = 25°C, CIN = 10µF, CL = 1µF, RL = 10Ω
Figure 22.
Figure 23.
TURN-ON RESPONSE TIME
VIN = 1.5V, TA = 25°C, CIN = 10µF, CL = 0.1µF, RL = 10Ω
TURN-OFF RESPONSE TIME
VIN = 1.5V, TA = 25°C, CIN = 10µF, CL = 0.1µF, RL = 10Ω
Figure 24.
Figure 25.
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TYPICAL CHARACTERISTICS (continued)
VIN
TURN-ON RESPONSE TIME
= 1.5V, TA = 25°C, CIN = 10µF, CL = 1µF, RL = 10Ω
TURN-OFF RESPONSE TIME
VIN = 1.5V, TA = 25°C, CIN = 10µF, CL = 1µF, RL = 10Ω
Figure 26.
Figure 27.
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TPS22910
SLVSB49B – NOVEMBER 2011 – REVISED APRIL 2012
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APPLICATION INFORMATION
On/Off Control
The ON pin controls the state of the switch. Asserting ON low enables the switch. ON is active low and has a low
threshold, making it capable of interfacing with low-voltage signals. The ON pin is compatible with standard GPIO
logic threshold. It can be used with any microcontroller with 1.2-V, 1.8-V, 2.5-V or 3.3-V GPIO.
Input Capacitor
To limit the voltage drop on the input supply caused by transient inrush currents, when the switch turns on into a
discharged load capacitor or short-circuit, a capacitor needs to be placed between VIN and GND. A 1-μF ceramic
capacitor, CIN, placed close to the pins is usually sufficient. Higher values of CIN can be used to further reduce
the voltage drop.
Output Capacitor
A CIN to CL ratio of 10 to 1 is recommended for minimizing VIN dip caused by inrush currents during startup.
Devices with faster rise times may require a larger ratio to minimize VIN dip.
Under-Voltage Lockout
Under-voltage lockout protection turns off the switch if the input voltage drops below the under-voltage lockout
threshold. During under-voltage lockout (UVLO), if the voltage level at VOUT exceeds the voltage level at VIN by
the Reverse Current Voltage Threshold (VRVP), the body diode will be disengaged to prevent any current flow to
VIN. With the ON pin active, the input voltage rising above the under-voltage lockout threshold will cause a
controlled turn-on of the switch to limit current over-shoot.
Reverse Current Protection
In a scenario where VOUT is greater than VIN, there is potential for reverse current to flow through the pass FET
or the body diode. The TPS22910 monitors VIN and VOUT voltage levels. When the reverse current voltage
threshold (VRVP) is exceeded, the switch is disabled (within 10μs typ). Additionally, the body diode is disengaged
so as to prevent any reverse current flow to VIN. The FET, and the output (VOUT), will resume normal operation
when the reverse current scenario is no longer present.
Use the following formula to calculate the amount of reverse current for a particular application:
IRC =
0.044V
RON( VIN)
Where,
IRC is the amount of reverse current,
RON(VIN) is the on-resistance at the VIN of the reverse current condition.
Board Layout
For best performance, all traces should be as short as possible. To be most effective, the input and output
capacitors should be placed close to the device to minimize the effects that parasitic trace inductances may have
on normal operation. Using wide traces for VIN, VOUT, and GND helps minimize the parasitic electrical effects
along with minimizing the case to ambient thermal impedance.
14
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REVISION HISTORY
Changes from Original (November 2011) to Revision A
•
Page
Deleted Quick Output Discharge Transistor from FEATURES. ............................................................................................ 1
Changes from Revision A (March 2012) to Revision B
•
Page
Changed "active high" description for ON pin to "active low" in PIN FUNCTIONS table. .................................................... 2
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PACKAGE OPTION ADDENDUM
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25-Apr-2012
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package
Drawing
Pins
Package Qty
Eco Plan
(2)
Lead/
Ball Finish
MSL Peak Temp
(3)
Samples
(Requires Login)
TPS22910AYZVR
ACTIVE
DSBGA
YZV
4
3000
Green (RoHS
& no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
TPS22910AYZVT
ACTIVE
DSBGA
YZV
4
250
Green (RoHS
& no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
25-Apr-2012
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
TPS22910AYZVR
DSBGA
YZV
4
3000
178.0
9.2
TPS22910AYZVT
DSBGA
YZV
4
250
178.0
9.2
Pack Materials-Page 1
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
1.0
1.0
0.63
4.0
8.0
Q1
1.0
1.0
0.63
4.0
8.0
Q1
PACKAGE MATERIALS INFORMATION
www.ti.com
25-Apr-2012
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
TPS22910AYZVR
DSBGA
YZV
4
3000
220.0
220.0
35.0
TPS22910AYZVT
DSBGA
YZV
4
250
220.0
220.0
35.0
Pack Materials-Page 2
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