CC8520, CC8521, CC8530 & CC8531 SWRS091D – JULY 2011 www.ti.com 2.4 GHz RF SoC FOR WIRELESS DIGITAL AUDIO STREAMING CC8520, CC8521, CC8530 & CC8531 - PurePath™ Wireless Development tools - PC-based PurePath™ Wireless Configurator for CC85xx configuration - CC85xx Family User Guide - CC85XXDK audio development kit - CC85XXDK-HEADSET development kit AVDD 31 GIOI2 34 SDA/ 33 GIO11 SCL/ 32 GIO10 36 GIOI3 35 IOVDD 37 xPAEN DCPL 39 xLNAEN 38 QFN-40 PIN CONFIGURATION (TOP VIEW) 3 xANTN /USBP xANTP /USBN CSN 4 SCLK AVDD 27 5 MOSI AVDD 26 6 MISO RF_N 25 7 GIO1 RF_P 24 8 GIO2 AVDD 23 9 GIO3 X0 10 IOVDD X1 22 21 AD2/ GIO9 AVDD 28 20 29 AVDD 19 30 VBAT IOVDD 17 16 15 14 11 RBIAS 18 CC85xx MCLK/ GIO4 BCLK/ GIO5 WCLK/ GIO6 AD0/ GIO7 AD1/ GIO8 2 13 1 RSTN RF section - 5 Mbps over-the-air data rate - Bandwidth-efficient modulation format - Excellent link budget with programmable output power up to +3.5 dBm and -83 dBm sensitivity - Seamless support for CC2590 range extender (+11dBm output power, -87dBm sensitivity) Digital audio support - Digital I2S audio interface supports 1 or 2 audio channels for the CC8520 and 1 to 4 audio channels for the CC8530 at sample rates of 32, 40.275, 44.1 and 48 kHz, and supports 16 bit word-widths - USB audio support for 32, 44.1 and 48 kHz, and supports 16 bit word-widths. - Audio latency down to 16 ms - Data side-channel allows data to be sent alongside the audio between external host controllers USB - Full-speed USB Audio device - USB Basic Audio Device Class: HT1, HS1 and MT topologies (headphone, headset and microphone) - USB Audio Device Class. Maximum 2 input channels. Maximum 2 output channels - Basic USB HID device class support for remote control functionality - Autonomous operation only. DVDD 40 External system - Can be used autonomously, or can be controlled by an external host MCU for greatest flexibility - Seamless connection and control of selected TI audio codecs, DACs/ADCs and digital audio amplifiers using I2S and I2C - HID functions like power control, binding, volume control, audio channel selection can be mapped to I/Os - RoHS compliant 6mm x 6mm QFN-40 package Suited for systems targeting compliance with worldwide radio frequency regulations: ETSI EN 300 328 and EN 300 440 class 2 (Europe), FCC CFR47 Part 15 (US) and ARIB STD-T66 (Japan) IOVDD FEATURES Built-in audio protocol - CD-quality uncompressed audio - Excellent robustness and co-existence through multiple techniques - Adaptive Frequency Hopping - Forward Error Correction - Buffering and Retransmission - Error Concealment - Optional high quality audio compression - No software development needed when used in autonomous mode - 12 APPLICATIONS - Wireless high-quality digital audio - Wireless point-to-point audio link - Wireless (USB) headphones / headsets - Wireless (USB) loudspeakers - Wireless 2.1 speaker systems - CC852x supports up to 2 channels - CC853x supports up to 4 channels - CC85x1 supports USB PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PurePath™ is a trademark for Texas Instruments All other trademarks are the property of their respective owners. Copyright © 2011, Texas Instruments Incorporated CC8520, CC8521, CC8530 & CC8531 SWRS091D – JULY 2011 WWW.TI.COM DESCRIPTION The PurePath™ Wireless platform is a cost-effective and low-power solution optimized for wireless transmission of high-quality digital audio. The CC85xx includes a robust built-in wireless audio transmission protocol and can control selected external audio devices. Utilizing numerous coexistence mechanisms allows the CC85xx to avoid interfering with, or being interfered by other 2.4 GHz radio systems. The CC85xx operates autonomously, and can be used with or without an external MCU. An external host processor can be connected through SPI and control some aspects of its operation. The CC85xx interfaces easily with other TI audio ICs and DSPs (using I2S and DSP/TDM interfaces). More details can be found in the CC85xx Family User Guide [2]. ABBREVIATIONS 2 ADC Analog to Digital Converter LED Light Emitting Diode ARIB Association of Radio Industries and Businesses LNA Low Noise Amplifier BER Bit Error Rate MISO Master In Slave Out CODEC Coder/Decoder MOSI Master Out Slave In DAC Digital to Analog Converter MCU Microcontroller DSP Digital Signal Processor PA Power Amplifier EHIF External Host Interface PCM Pulse Code Modulation ESD Electro Static Discharge PER Packet Error Rate ETSI European Telecommunications Standard Institute PLL Phase Lock Loop FCC Federal Communications Commission PM Protocol Master FEC Forward Error Correction PPW PurePath™ Wireless FSK Frequency Shift Keying PS Protocol Slave FW Firmware RoHS Restriction of Hazardous Substances HID Human Interface Device RF Radio Frequency I2C Inter-Integrated Circuit (serial communications bus) SLAC Slightly Lossy Compression Algorithm I2S Inter-IC Sound (serial bus for digital audio signals) SPI Serial Peripheral Interface IEEE Institute of Electrical and Electronics Engineers SoC System-on-Chip ISM Industrial, Scientific, Medical STD Standard JEDEC Joint Electron Device Engineering Council TDM Time-Division Multiplexing LDO Low-Dropout Regulator Copyright © 2011, Texas Instruments Incorporated CC8520, CC8521, CC8530 & CC8531 SWRS091D – JULY 2011 WWW.TI.COM This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. ABSOLUTE MAXIMUM RATINGS PARAMETER Supply voltage (2) (1) TEST CONDITIONS Min Max Unit All supply pins must have the same voltage –0.3 3.9 V –0.3 min(VDD + 0.3, 3.9) V 10 dBm 125 °C According to IPC/JEDEC J-STD-020 260 °C All pads, according to human-body model (HBM), JEDEC STD 22, method A114 2000 V According to charged-device model (CDM), JEDEC STD 22, method C101E 400 V Voltage on any digital pin Input RF level Storage temperature range Reflow soldering temperature ESD (3) -40 (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) For CC8521 and CC8531 running on USB power, a LDO is needed to comply with these ratings. (3) CAUTION: ESD sensitive device. Precaution should be used when handing the device in order to prevent permanent damage. RECOMMENDED OPERATING CONDITIONS, CC8520/CC8530 PARAMETER TEST CONDITIONS Min Max Unit Operating ambient temperature range, TA -40 +85 °C Operating supply voltage 2.0 3.6 V Min Max Unit -40 +85 °C 3.0 3.6 V RECOMMENDED OPERATING CONDITIONS, CC8521/CC8531 PARAMETER TEST CONDITIONS Operating ambient temperature range, TA Operating supply voltage (1) 3 (1) For CC8521 and CC8531 running on USB power, a LDO is needed to comply with these ratings. Copyright © 2011, Texas Instruments Incorporated CC8520, CC8521, CC8530 & CC8531 SWRS091D – JULY 2011 WWW.TI.COM GENERAL CHARACTERISTICS Measured on Texas Instruments CC85xxEM reference designs with TA = 25°C and VDD = 3.3 V, unless otherwise noted. PARAMETER TEST CONDITION RF frequency range Data rate Shaped 8FSK Audio latency Latency between I2S interface on audio source and I2S interface on audio sink. Uncompressed 16 bit. Audio latency is programmable using the PurePath Wireless Configurator [1]. Audio sample rate Audio sample rate is programmable using the (1) PurePath Wireless Configurator [1] (1) (2) MIN TYP 2400 MAX UNIT 2483.5 MHz 5 Mbps 768 2048 48 44.1 (2) 40.275 32 Samples kHz ±2000ppm tolerance Not supported in USB mode. For USB Headset, dynamic sample rate change is not allowed. ELECTRICAL CHARACTERISTICS, CC8520/CC8521/CC8530/CC8531 Measured on Texas Instruments CC85xxEM reference designs with TA = 25°C and VDD = 3.3 V, unless otherwise noted. PARAMETER TEST CONDITION Current consumption, power down state Voltage regulator / crystal oscillator off – status lost (POWERED_DOWN state) 1 A Current consumption, headphone master(1) Average current for a PurePath Wireless master with I2S interface active, sourcing two PCM16 channels with maximum output power. Average current for a PurePath Wireless slave with I2S interface active, sinking two PCM16 channels with maximum output power 29 mA 25 mA Current consumption, headphone slave(1) (1) MIN TYP MAX UNIT Measured on Texas Instruments CC85xx EM reference designs and CC85XXDK. Sample rate 48 kHz, MCLK disabled. RF CHARACTERISTICS, CC8520/CC8521/CC8530/CC8531 Measured on Texas Instruments CC85xx EM reference designs with TA = 25°C and VDD = 3.3 V, unless otherwise noted. PARAMETER TEST CONDITION Output power MIN TYP MAX UNIT Maximum output power setting 3.5 dBm 5 Mbps, 0.1 % BER -83 dBm 5 Mbps, 0.1 % BER -2 dBm Adjacent channel, ±4MHz, wanted 3dB above sensitivity 8 dB Alternate channel, ±8MHz, wanted 3dB above sensitivity 35 dB Occupied bandwidth 99% energy bandwidth 3.8 MHz Optimum load impedance Differential impedance seen from the RF port (RF_P and RF_N) towards the antenna 70 + j30 Ω Spurious emission Suitable for systems targeting compliance with EN 300 328, EN 300 440(2), FCC CFR47 Part 15 and ARIB STD-T-66 Receiver sensitivity (1) Saturation (maximum input level) (1) Selectivity (1) Measured using data packets with 40 byte payload. Systems with external antenna connector: Margins for passing conducted requirements at sub 1GHz frequencies can be improved by using a simple band-pass filter connected between matching network and RF connector (1.6 pF in parallel with 1.6 nH); this filter must be connected to a good RF ground. (2) 4 Copyright © 2011, Texas Instruments Incorporated CC8520, CC8521, CC8530 & CC8531 SWRS091D – JULY 2011 WWW.TI.COM ELECTRICAL CHARACTERISTICS, CC8520/CC8521/CC8530/CC8531 +CC2590 Measured on Texas Instruments CC85xx+CC2590 EM reference designs with TA = 25°C and VDD = 3.3 V, unless otherwise noted. PARAMETER TEST CONDITION Current consumption, power down state(1) Voltage regulator / crystal oscillator off – status lost (POWERED_DOWN state) Average current for a PurePath Wireless master with I2S interface active, sourcing two PCM16 channels. Average current for a PurePath Wireless slave with I2S interface active, sinking two PCM16 channels Current consumption, headphone master(2) Current consumption, headphone slave(2) (1) (2) MIN TYP MAX UNIT 1 A 38 mA 28 mA CC2590 power down current is 100 nA[4] Measured on Texas Instruments CC85xx+CC2590 EM reference designs and CC85XXDK. Sample rate 48 kHz, MCLK disabled. RF CHARACTERISTICS, CC8520/CC8521/CC8530/CC8531 +CC2590 Measured on Texas Instruments CC85xx+CC2590 EM reference designs with TA = 25°C and VDD = 3.3 V, unless otherwise noted. PARAMETER TEST CONDITION MIN TYP Output power Maximum output power setting 11 dBm Receiver sensitivity(1) 5 Mbps, 0.1 % BER -87 dBm Saturation (maximum input level) 5 Mbps, 0.1 % BER -12 dBm Adjacent channel, ±4MHz, wanted 3dB above sensitivity 9 Alternate channel, ±8MHz, wanted 3dB above sensitivity 34 MAX Selectivity dB Suitable for systems targeting compliance with EN 300 328, EN 300 440(2), FCC CFR47 Part 15 and ARIB STD-T-66 Spurious emission (1) UNIT Measured using data packets with 40 byte payload. 48-MHz CRYSTAL REQUIREMENTS General parameters with TA = 25°C and VDD = 3.3 V, unless otherwise noted. PARAMETER TEST CONDITION MIN Crystal frequency Crystal frequency accuracy requirement TYP MAX 48 (1) UNIT MHz -50 50 ppm ESR Equivalent series resistance - 60 ohm C0 Crystal shunt capacitance - 3 pF CL Crystal load capacitance 15 16 17 pF MIN TYP MAX UNIT (1) Including aging and temperature dependency AUDIO CLOCK CHARACTERISTICS TA = 25°C and VDD = 3.3 V, unless otherwise noted. PARAMETER MCLK Frequency range BCLK Frequency range TEST CONDITION Programmable using the PurePath Wireless Configurator [1] Programmable using the PurePath Wireless Configurator [1] WCLK Frequency range RMS jitter (Output clocks) 5 RMS period jitter for 1000 periods 32·FWCLK 512·FWCLK 32·FWCLK 256·FWCLK 31.936 48.096 kHz 200 ps 80 Copyright © 2011, Texas Instruments Incorporated CC8520, CC8521, CC8530 & CC8531 SWRS091D – JULY 2011 WWW.TI.COM SPI INTERFACE CHARACTERISTICS TA = 25°C and VDD = 3.3 V, unless otherwise noted. PARAMETER TEST CONDITION MIN TYP MAX UNIT SCLK frequency 0 SCLK low 25 ns SCLK high 25 ns 20 MHz CSN high Minimum time CSN must be high, if brought high, between commands (it is not necessary to bring CSN high between commands). 50 ns CSN falling edge to SCLK rising edge Distance from CSN asserted until first rising edge on SCLK. 25 ns SCLK falling edge to CSN rising edge Distance from last negative edge of SCLK in last word until CSN can be de-asserted. 100 ns Inter-word spacing Minimum distance in time from rising edge of SCLK for last bit in word n and the rising edge of SCLK for the first bit in word n+1. 50 ns Properly handles abutting words. Hysteresis on SCLK Hysteresis around trigger point of input buffer using a Schmitt trigger Slew rate on SCLK Slew rate from 0.1·IOVDD to 0.9·IOVDD 10 mV V/ s AVDD 31 SDA/ GIO11 33 SCL/ 32 GIO10 36 GIOI2 34 7 GIOI3 35 6 xPAEN MOSI IOVDD 37 SCLK 5 DCPL 39 4 RBIAS 30 VBAT 29 AVDD 28 AVDD 27 AVDD 26 MISO RF_N 25 GIO1 RF_P 24 8 GIO2 AVDD 23 9 GIO3 X0 10 IOVDD X1 22 21 IOVDD AD2/ GIO9 AVDD 18 19 20 17 16 15 14 MCLK/ GIO4 BCLK/ GIO5 WCLK/ GIO6 AD0/ GIO7 AD1/ GIO8 IOVDD 12 13 RSTN CC85xx 11 2 DVDD 3 xANTN /USBN xANTP /USBP CSN 1 xLNAEN 38 PIN DESCRIPTION 40 1 100 Figure 1 - CC85xx QFN-40 PIN CONFIGURATION 6 Copyright © 2011, Texas Instruments Incorporated CC8520, CC8521, CC8530 & CC8531 SWRS091D – JULY 2011 WWW.TI.COM PIN PIN NAME PIN TYPE DESCRIPTION - GND Ground The exposed die attach pad must be connected to a solid ground plane underneath the chip 1 xANTN USBN Digital I/O1 CC85x0: DO NOT CONNECT (Future FW: Controlling external antenna switch) CC85x1: USB D- data line 2 xANTP USBP Digital I/O1 CC85x0: DO NOT CONNECT (Future FW: Controlling external antenna switch) CC85x1: USB D+ data line 3 CS_N Digital Input (pull-up) Serial SPI configuration interface, active low chip select 4 SCLK Digital I/O1 Serial SPI configuration interface, clock input/output MOSI Digital I/O 1 Serial SPI configuration interface, master data output, slave data input 1 Serial SPI configuration interface, master data input, slave data output. 5 6 MISO Digital I/O 7 GIO1 Digital I/O1 GIO2 Digital I/O 1 General-purpose digital I/O pin 2 Digital I/O 2 General-purpose digital I/O pin 3 General-purpose digital I/O pin 1 Configurable with PurePath™ Wireless Configurator 8 9 GIO3 Configurable with PurePath™ Wireless Configurator 10 IOVDD Power (I/O pads) Digital power supply for the digital I/Os in the SPI interface and GIO1-GIO3. 11 RSTN Digital Input (pull-up) Active-low device reset 12 IOVDD Power (I/O pins) Digital power supply for the RSTN and MCLK digital I/O pins. 13 MCLK Digital I/O1 Master clock output for external audio devices GIO4 14 BCLK General-purpose digital I/O pin 4 Digital I/O 1 Digital I/O 1 Digital I/O 1 GIO5 15 WCLK General-purpose digital I/O pin 5 GIO6 16 AD0 AD1 I2S/DSP audio interface word clock (in/out) General-purpose digital I/O pin 6 GIO7 17 I2S/DSP audio interface bit clock (in/out) I2S/DSP audio interface data line 0 (in/out) General-purpose digital I/O pin 7 Digital I/O1 GIO8 I2S/DSP audio interface data line 1 (in/out) General-purpose digital I/O pin 8 18 IOVDD Power (I/O pins) Digital power supply for the digital I/Os in audio interface (BCLK-AD2). 19 AD2 Digital I/O2 I2S/DSP audio interface data line 2 (in/out) Configurable with PurePath™ Wireless Configurator GIO9 20 AVDD Power (Analog) 2.0-3.6V analog power supply connection 21 X1 Analog I/O Crystal oscillator pin input, or external clock input (48 MHz) 22 X0 Analog I/O Crystal oscillator pin output (48 MHz) 23 AVDD Power (Analog) Analog power supply connection 24 RF_P RF I/O Positive differential RF input signal to LNA in receive mode Positive differential RF output signal from PA in transmit mode 25 RF_N RF I/O Negative differential RF input signal to LNA in receive mode Negative differential RF output signal from PA in transmit mode 7 Copyright © 2011, Texas Instruments Incorporated CC8520, CC8521, CC8530 & CC8531 SWRS091D – JULY 2011 WWW.TI.COM PIN PIN NAME PIN TYPE DESCRIPTION 26 AVDD Power (Analog) Analog power supply connection 27 AVDD Power (Analog) Analog power supply connection 28 AVDD Power (Analog) Analog power supply connection 29 VBAT Analog input Battery voltage supervisor (threshold level programmable by external resistor to positive battery terminal) 30 RBIAS Analog output External precision bias resistor for reference current. 56 k , 1% 31 AVDD Power (Analog) Analog power supply connection (Guard ring AVDD connection for digital noise isolation) 32 SCL Digital I/O 1 Digital I/O 1 Digital I/O 1 General-purpose digital I/O pin 12 Digital I/O 1 General-purpose digital I/O pin 13 2 Control external PA GIO10 33 SDA General-purpose digital I/O pin 10 GIO11 34 35 GIO12 GIO13 I2C master clock line. Must be connected to external pull-up I2C master data line. Must be connected to external pull-up General-purpose digital I/O pin 11 36 xPAEN Digital I/O 37 IOVDD Power (I/O pads) 2 38 xLNAEN Digital I/O 39 DCPL Power (Digital) Digital power supply for SCL-GIO15 pins. Control external LNA 1.7V-1.85 V linear voltage regulator output to which a 1 uF decoupling capacitor should be attached. For test-purposes an external digital supply voltage (1.62-1.98 V) can be applied here, bypassing the voltage regulator. NOTE: The voltage regulator is intended for use with the CC85xx chip only. It cannot be used to provide supply voltage to other devices. 40 1 2 8 DVDD Power (Digital) Digital power supply for the linear voltage regulator. Digital I/O pad with 4 mA source/sink capability. Digital I/O pad with 20 mA source/sink capability. Copyright © 2011, Texas Instruments Incorporated CC8520, CC8521, CC8530 & CC8531 SWRS091D – JULY 2011 WWW.TI.COM 2 APPLICATION CIRCUIT 2.0V-3.6V Power Supply R101 xANTP VBAT 29 CSN AVDD 28 4 SCLK AVDD 27 5 MOSI AVDD 26 6 MISO RF_N 25 7 GIO1 RF_P 24 8 GIO2 AVDD 23 9 GIO3 X0 10 IOVDD X1 22 21 AVDD 20 Alternative: CC2590 External LNA/PA Antenna (50 Ohm) C301 C306 L302 L303 C305 L304 C302 L301 C303 C401 AD2/ GIO9 19 18 17 16 15 14 IOVDD MCLK/ GIO4 BCLK/ GIO5 WCLK/ GIO6 AD0/ GIO7 AD1/ GIO8 IOVDD 12 13 RSTN 11 CC8520/30 Antenna (50 Ohm) XTAL 30 C402 AVDD 31 GIOI2 34 36 GIOI3 35 DCPL 39 SDA/ GIO11 33 SCL/ 32 GIO10 3 IOVDD 37 2 xPAEN xANTM CC2590 + Matching/ Filtering RBIAS Audio Device 1 xLNAEN 38 DVDD 40 C391 Figure 2 - CC8520/CC8530 Application Circuit 2.0V-3.6V Power Supply USB D+ CC2590 + Matching/ Filtering R101 AVDD 31 GIOI2 34 GIOI3 35 36 SDA/ 33 GIO11 SCL/ 32 GIO10 3 IOVDD 37 2 xPAEN USBN 30 USBP VBAT 29 CSN AVDD 28 4 SCLK AVDD 27 5 MOSI AVDD 26 6 MISO RF_N 25 7 GIO1 RF_P 24 8 GIO2 Antenna (50 Ohm) Alternative: CC2590 External LNA/PA 47 pF AVDD L302 L303 C305 23 22 21 L304 C302 L301 C303 C401 GIO9/ AD2 20 18 17 16 15 14 13 19 X1 MCLK/ GIO4 BCLK/ GIO5 WCLK/ GIO6 AD0/ GIO7 AD1/ GIO8 IOVDD X0 IOVDD IOVDD GIO3 RSTN 9 10 C306 C402 AVDD Antenna (50 Ohm) C301 XTAL CC8521/31 12 1.5k ohm RBIAS 11 33 ohm 1 xLNAEN 38 47 pF 33 ohm USB D- DCPL 39 DVDD 40 C391 Figure 3 - CC8521/CC8531 Application Circuit 9 Copyright © 2011, Texas Instruments Incorporated CC8520, CC8521, CC8530 & CC8531 SWRS091D – JULY 2011 WWW.TI.COM 3 SYSTEM DESCRIPTION By employing proprietary technology, referred to as PurePath Wireless, the CC85xx device family provides robust, high-quality, short-range 2.4 GHz wireless digital audio streaming in low-cost single chip solutions. Two or more devices form a PurePath Wireless audio network. Great care has been taken to ensure that this audio network provides gap-less and robust audio streaming in varied environments and that it can coexist amicably with existing wireless technologies in the crowded 2.4 GHz ISM band. Most applications can be implemented without any software development and only require the CC85xx to be connected to an external audio source or sink (such as an audio codec, S/PDIF interface or class-D amplifier) and a few push buttons, switches or LED for human interaction. Advanced applications can interface a host processor or DSP directly to the CC85xx and directly stream audio and control most aspects of device and audio network operation. The complete list of supported audio devices can be found in the PurePath Wireless Configurator [1]. The PurePath Wireless Configurator [1], a PC-based configuration tool, is used to set up the desired functionality and parameters of the target system and then produces firmware images that subsequently must be programmed into the embedded flash memory of each CC85xx. All devices in the CC85xx family interface seamlessly with the CC2590 RF range extender device to allow for even wider RF coverage and improved robustness in difficult environments. 4 DOCUMENT HISTORY Revision Date Description/Changes SWRC09D July 2011 March 2011 Added info on CC8521 and CC8531 Added info on CC8530. Updated current consumption numbers and how they are measured. Storage temperature updated. Info on supported codecs now in PurePath Wireless Configurator. Add RF Characteristics for CC8520+CC2590EM. Moved the sections; Network topology, Coexistence, Audio Interface, Human Interaction drivers and external host interface to the CC85xx Family User’s Guide [2]. Updated pin-out table and fig 1. First release SWRS09C Sept 2010 SWRS09B SWRS09A 5 March 2010 REFERENCES [1] PurePath™ Wireless Configurator [2] CC85xx Family User Guide [3] CC-Debugger [4] CC2590 Product folder 10 Copyright © 2011, Texas Instruments Incorporated PACKAGE OPTION ADDENDUM www.ti.com 25-Jul-2011 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/ Ball Finish MSL Peak Temp (3) CC8520RHAR ACTIVE VQFN RHA 40 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR CC8520RHAT ACTIVE VQFN RHA 40 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR CC8521RHAR ACTIVE VQFN RHA 40 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR CC8521RHAT ACTIVE VQFN RHA 40 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR CC8530RHAR ACTIVE VQFN RHA 40 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR CC8530RHAT ACTIVE VQFN RHA 40 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR CC8531RHAR ACTIVE VQFN RHA 40 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR CC8531RHAT ACTIVE VQFN RHA 40 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR Samples (Requires Login) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Addendum-Page 1 PACKAGE OPTION ADDENDUM www.ti.com 25-Jul-2011 Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 22-Jul-2011 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing CC8520RHAR VQFN RHA 40 SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant 2500 330.0 16.4 6.3 6.3 1.5 12.0 16.0 Q2 CC8520RHAT VQFN RHA 40 250 330.0 16.4 6.3 6.3 1.5 12.0 16.0 Q2 CC8521RHAR VQFN RHA 40 2500 330.0 16.4 6.3 6.3 1.5 12.0 16.0 Q2 CC8521RHAT VQFN RHA 40 250 330.0 16.4 6.3 6.3 1.5 12.0 16.0 Q2 CC8530RHAR VQFN RHA 40 2500 330.0 16.4 6.3 6.3 1.5 12.0 16.0 Q2 CC8530RHAT VQFN RHA 40 250 330.0 16.4 6.3 6.3 1.5 12.0 16.0 Q2 CC8531RHAR VQFN RHA 40 2500 330.0 16.4 6.3 6.3 1.5 12.0 16.0 Q2 CC8531RHAT VQFN RHA 40 250 330.0 16.4 6.3 6.3 1.5 12.0 16.0 Q2 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 22-Jul-2011 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) CC8520RHAR VQFN RHA 40 2500 333.2 345.9 28.6 CC8520RHAT VQFN RHA 40 250 333.2 345.9 28.6 CC8521RHAR VQFN RHA 40 2500 333.2 345.9 28.6 CC8521RHAT VQFN RHA 40 250 333.2 345.9 28.6 CC8530RHAR VQFN RHA 40 2500 333.2 345.9 28.6 CC8530RHAT VQFN RHA 40 250 333.2 345.9 28.6 CC8531RHAR VQFN RHA 40 2500 333.2 345.9 28.6 CC8531RHAT VQFN RHA 40 250 333.2 345.9 28.6 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. 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