M TC56 150mA, 10V LDO with Shutdown Features Package Type • Low Dropout Voltage: 200mV typ. at 80mA, 380mV typ. at 160mA • High Output Current: 180mA (VOUT = 5.0V) • High Accuracy Output Voltage (±2%) • Low Power Consumption: 11µA (Oper.), 0.1µA (Shutdown) • Low Temperature Drift (±100ppm/°C typ.) • Excellent Line Regulation (0.2%/V typ.) • Space Saving 5-Pin SOT-23A Package • Short Circuit Protection • Standard 2.5V, 3.0V and 3.3V Output Voltages 5-Pin SOT-23A VOUT NC 5 4 TC56 1 2 3 VSS VIN SHDN Applications • • • • • Battery Powered Devices Cameras and Portable Video Equipment Pagers and Cellular Phones Solar Powered Instruments Consumer Products Device Selection Table Output Part Number Voltage (V)* Package Temperature Range TC562502ECT 2.5 5-Pin SOT-23A -40°C to +85°C TC563002ECT 3.0 5-Pin SOT-23A -40°C to +85°C TC563302ECT 3.3 5-Pin SOT-23A -40°C to +85°C *Other output voltages are available. Please contact Microchip Technology Inc. for details. General Description The TC56 is a low supply current (11µA typical at VOUT = 3V), low dropout CMOS linear regulator, with a 10V maximum input voltage range. CMOS construction eliminates wasted ground current, typical of bipolar regulators, for greater system efficiencies and longer operating time in battery-powered systems. The TC56 enters shutdown mode when the shutdown control input (SHDN) is low. During shutdown, the regulator is shut off, and supply current falls to 0.1µA maximum. Normal operation is restored when SHDN is returned to a logic high. Low current consumption, 10V supply tolerance and space-saving 5-Pin SOT-23A packaging makes the TC56 ideal for a wide variety of applications. Functional Block Diagram VOUT 10µF Tantalum 5 4 VOUT (NC) TC56 VIN 2002 Microchip Technology Inc. VSS VIN 1 2 SHDN 3 ON OFF Shutdown Control 4.7µF Tantalum DS21436B-page 1 TC56 1.0 ELECTRICAL CHARACTERISTICS *Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions above those indicated in the operation sections of the specifications is not implied. Exposure to Absolute Maximum Rating conditions for extended periods may affect device reliability. Absolute Maximum Ratings* Input Voltage ........................................................+12V Output Current ..................................................500mA Output Voltage.......................VSS – 0.3V to VIN + 0.3V SHDN Input Voltage ..............VSS – 0.3V to VIN + 0.3V Power Dissipation (SOT-23).............................150mW Operating Temperature Range.............-40°C to +85°C Storage Temperature Range ..............-40°C to +125°C TC56 ELECTRICAL SPECIFICATIONS Electrical Characteristics: VIN = VOUT +1V, TA = 25°C, CIN = 4.7µF, COUT = 10µF, unless otherwise noted. Symbol Parameter VIN Input Voltage VOUT Output Voltage IOUTMAX Maximum Output Current ∆VOUT Min Typ Max Units — — 10 V 0.98 x VR VR ±0.5% 1.02 x VR V Test Conditions IOUT = 40mA (Note 1) 150 180 — — — — mA VR ≥ 2.7V, VOUT = 3V (Note 1) VR ≥ 4.5V, VOUT = 5V (Note 1) Load Regulation — — 45 40 90 80 mV 1mA ≤ IOUT ≤ 80mA, VOUT = 3V 1mA ≤ IOUT ≤ 80mA, VOUT = 5V VIN - VOUT Dropout Voltage — — — — 200 380 165 330 395 770 330 660 mV IOUT = 80mA, VOUT = 3V IOUT = 160mA, VOUT = 3V IOUT = 100mA, VOUT = 5V IOUT = 200mA, VOUT = 5V (Note 2) IDD Supply Current — — 11 13 19 21 µA VSHDN = VIN = 4V VSHDN = VIN = 6V ISHDN Shutdown Supply Current — — 0.1 µA ∆VOUT/∆VIN Line Regulation — 0.2 0.3 %/V ∆VOUT/∆T VOUT Temperature Coefficient — ±100 — ppm/°C VIH SHDN Input High Logic Threshold 1.5 — — V VIL SHDN Input Low Logic Threshold — — 0.25 V IIH SHDN Input Current @VIH — — 5.0 µA VSHDN = VIN SHDN Input Current @VIL -0.2 -0.05 0 µA VSHDN = GND IIL Note 1: 2: VSHDN = GND IOUT = 40mA, 4V ≤ VIN ≤ 10V IOUT = 10mA, -40°C < TJ < +85°C VR is the regulator output voltage setting. Dropout voltage is defined as the input to output differential at which the output voltage drops 2% below its nominal value measured at a 1V differential. DS21436B-page 2 2002 Microchip Technology Inc. TC56 2.0 PIN DESCRIPTIONS The descriptions of the pins are listed in Table 2-1. TABLE 2-1: PIN FUNCTION TABLE Pin No. (5-Pin SOT-23A) Symbol 1 VSS Ground. 2 VIN Supply voltage input. 3 SHDN Shutdown input. 4 (NC) No connection. 5 VOUT Regulated voltage output. 3.0 Description DETAILED DESCRIPTION The TC56 is a precision, fixed output LDO. Unlike bipolar regulations, the TC56 supply current does not increase with load current. 3.1 Output Capacitor A 10µF tantalum capacitor from VOUT to ground is recommended. The output capacitor should have an effective series resistance greater than 0.1Ω and less than 5.0Ω, and a resonant frequency above 1MHz. It is recommended that a 4.7µF capacitor be connected from VIN to GND. When operating from sources other than batteries, supply noise rejection and transient response can be improved by increasing the value of the input and output capacitors and employing passive filtering techniques. 2002 Microchip Technology Inc. 3.2 Shutdown Input The TC56 enters a low power shutdown mode when the shutdown control input (SHDN) is low. During shutdown, the regulator is disabled and supply current is reduced to 0.1µA (max). Normal operation is restored when SHDN is driven high. If not required, the SHDN input can be tied to VIN. DS21436B-page 3 TC56 4.0 THERMAL CONSIDERATIONS 4.1 Power Dissipation The amount of power the regulator dissipates is primarily a function of input and output voltage, and output current. The following equation is used to calculate worst case actual power dissipation. Equation 4-1 can be used in conjunction with Equation 4-2 to ensure regulator thermal operation is within limits. For example: Given: VINMAX VOUTMIN = 2.7V – 2% ILOADMAX = 98mA EQUATION 4-1: PD ≈ (VINMAX – VOUTMIN)ILOADMAX Where: PD VINMAX VOUTMIN ILOADMAX = Worst case actual power dissipation = Maximum voltage on VIN = Minimum regulator output voltage = Maximum output (load) current = 3.0V ±10% TJMAX = 125°C TAMAX = 55°C Find: 1. Actual power dissipation 2. Maximum allowable dissipation Actual power dissipation: PD ≈ (VINMAX – VOUTMIN)ILOADMAX = [(3.0 x 1.1) – (2.7 x .98)]98 x 10-3 The maximum allowable power dissipation (Equation 4-2) is a function of the maximum ambient temperature (TAMAX), the maximum allowable die temperature (TJMAX) and the thermal resistance from junction-to-air (θJA). The 5-Pin SOT-23A package has a θJA of approximately 220°C/Watt. = 64mW Maximum allowable power dissipation: PDMAX = (TJMAX – TAMAX) θJA = (125 – 55) 220 = 318mW EQUATION 4-2: PDMAX = (TJMAX – TAMAX) θJA Where all terms are previously defined. In this example, the TC56 dissipates a maximum of 64mW; below the allowable limit of 318mW. In a similar manner, Equation 4-1 and Equation 4-2 can be used to calculate maximum current and/or input voltage limits. 4.2 Layout Considerations The primary path of heat conduction out of the package is via the package leads. Therefore, layouts having a ground plane, wide traces at the pads, and wide power supply bus lines combine to lower θJA and therefore, increase the maximum allowable power dissipation limit. DS21436B-page 4 2002 Microchip Technology Inc. TC56 5.0 Note: TYPICAL CHARACTERISTICS The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range. 1. OUTPUT VOLTAGE vs. OUTPUT CURRENT TC565002 (5V) 5.1 TOPR = 25°C 5.0 -30°C VIN = 4V 80°C 4.9 4.8 CIN = 4.7µF, CL = 10µ 3.1 OUTPUT VOLTAGE VOUT (V) OUTPUT VOLTAGE VOUT (V) TC563002 (3V) VIN = 6V CIN = 4.7µF, CL = 10µF (Tantalum) 4.7 TOPR = 25°C C 3.0 -30°C 80°C C 2.9 2.8 2.7 0 20 40 60 80 100 120 140 160 180 0 20 40 60 80 100 120 140 160 180 OUTPUT CURRENT IOUT (mA) OUTPUT CURRENT IOUT (mA) 2. OUTPUT VOLTAGE vs. INPUT VOLTAGE TC565002 (5V) 5.0 40mA IOUT = 1mA A 4.8 4.6 10mA 4.4 4.2 4.5 µ CIN = 4.7µF, CL 5.10 OUTPUT VOLTAGE VOUT (V) OUTPUT VOLTAGE VOUT (V) 5.2 TC565002 (5V) TOPR = 25°C CIN = 4.7µF, CL = 10µF (Tantalum) 5.05 IOUT = 1mA, 10m mA 5.00 4.95 40mA 4.90 4.85 5 INPUT VOLTAGE VIN (V) 5 5.5 8 9 6 7 INPUT VOLTAGE VIN (V) TC563002 (3V) CIN = 4.7µF, CL = 10µ µ CIN = 4.7µF, CL TOPR = 25°C 3.10 OUTPUT VOLTAGE VOUT (V) OUTPUT VOLTAGE VOUT (V) 10 TC563002 (3V) TOPR = 25°C 3.2 TOPR = 25°C 3.0 IOUT = 1mA A 40mA 2.8 2.6 10mA 2.4 2.2 2.5 3.0 INPUT VOLTAGE VIN (V) 2002 Microchip Technology Inc. 3.5 3.05 IOUT = 1mA 3.00 40mA 2.95 2.90 2.85 3 4 5 6 7 8 9 10 INPUT VOLTAGE VIN (V) DS21436B-page 5 TC56 5.0 TYPICAL CHARACTERISTICS (CONTINUED) 3. INPUT/OUTPUT VOLTAGE DIFFERENTIAL vs. OUTPUT CURRENT CIN = 4.7µF, CL = 10µF (Tantalum) CIN = 4.7µF, CL = 10µF (Tantalum) 1.0 INPUT/OUTPUT DIFF. VDIF (V) INPUT/OUTPUT DIFF. VDIF (V) 1.0 0.8 0.6 80°C TOPR = 25°C 0.4 0.2 -30°C 0.0 0.8 80°C 0.6 TOPR = 25°C 0.4 -30°C 0.2 0.0 0 20 40 60 80 100 120 140 160 180 0 OUTPUT CURRENT IOUT (mA) 20 40 60 80 100 120 140 160 180 OUTPUT CURRENT IOUT (mA) 4. SHDN PIN THRESHOLD VOLTAGE vs. INPUT VOLTAGE TC565002 (5V) TC563002 (3V) 0.7 TOPR = 30°C 0.6 25°C 0.5 80°C 0.4 0.3 "L" Level Voltage "H" Level Voltage SHDN PIN THRE. VOL. VIH, VIL (V) SHDN PIN THRE. VOL.VIH, VIL (V) 0.7 0.2 0 2 4 6 8 INPUT VOLTAGE VIN (V) TOPR = 30°C 0.6 25°C 0.5 80°C 0.4 0.3 "L" Level Voltage "H" Level Voltage 0.2 10 0 6 8 4 2 INPUT VOLTAGE VIN (V) 10 5. SUPPLY CURRENT vs. INPUT VOLTAGE TC565002 (5V) TC565002 (5V) 16 SUPPLY CURRENT IDD (µA) SUPPLY CURRENT IDD (µA) 20 TOPR = 80°C C 15 10 -30°C 25°C 5.0 0 0 DS21436B-page 6 2 6 4 8 INPUT VOLTAGE VIN (V) TOPR = 80°C C 14 25°C 12 -30°C 10 8 6 10 5 8 6 7 9 INPUT VOLTAGE VIN (V) 10 2002 Microchip Technology Inc. TC56 5.0 TYPICAL CHARACTERISTICS (CONTINUED) 5. SUPPLY CURRENT vs. INPUT VOLTAGE (CONT.) TC563002 (3V) TC563002 (3V) 16 SUPPLY CURRENT IDD (µA) SUPPLY CURRENT IDD (µA) 20 15 80°C 10 5.0 -30°C 25°C 0 14 12 80°C 25°C 10 -30°C 8.0 6.0 0 2 4 8 6 INPUT VOLTAGE VIN (V) 10 3 4 5 7 8 9 6 INPUT VOLTAGE VIN (V) 10 6. OUTPUT VOLTAGE vs. AMBIENT TEMPERATURE TC565002 (5V) 3.10 OUTPUT VOLTAGE VOUT (V) OUTPUT VOLTAGE VOUT (V) 5.10 TC563002 (3V) VIN = 6V CIN = 4.7µF, CL = 10µF (Tantalum) 5.05 IOUT = 10mA A 5.00 40mA 4.95 4.90 -40 -20 0 20 40 60 3.05 IOUT = 10mA 3.00 40mA 2.95 2.90 -40 80 VIN = 4V CIN = 4.7µF, CL = 10µ -20 0 20 40 60 80 AMBIENT TEMP. TOPR (°C) AMBIENT TEMP. TOPR (°C) 7. SUPPLY CURRENT vs. AMBIENT TEMPERATURE TC565002 (5V) 16 SUPPLY CURRENT IDD (µA) SUPPLY CURRENT IDD (µA) 14 12 10 8.0 6.0 -40 TC563002 (3V) VIN = 6V 16 -20 0 20 40 60 AMBIENT TEMP. TOPR (°C) 2002 Microchip Technology Inc. 80 VIN = 4V 14 12 10 8.0 6.0 -40 -20 0 20 40 60 80 AMBIENT TEMP. TOPR (°C) DS21436B-page 7 TC56 5.0 TYPICAL CHARACTERISTICS (CONTINUED) 8. INPUT TRANSIENT RESPONSE 1 TC565002 (5V) 7 6 Input Voltage 8 7 Input Voltage 6 4 6 2 5 2 4 0 -2 3 -2 3 -4 2 -4 2 -6 1 -6 1 0 -8 Output Voltage 4 TIME: (0.1 msec/div) 6 2 4 Output Voltage 0 3 –2 2 –4 1 –6 IOUT = 10mA, CL = 10µF (Tantalum) 6 5 4 IN (V) 5 6 OUTPUT VOLTAGE VOUT (V) Input Voltage 0 TC563002 (3V) IOUT = 1mA, CL = 10µF (Tantalum) 4 4 Output Voltage TIME: (0.1 msec/div) TC563002 (3V) 6 5 Input Voltage 4 2 Output Voltage 0 0 3 –2 2 –4 1 0 –6 TIME: (0.1 msec/div) OUTPUT VOLTAGE VOUT (V) 0 -8 INPUT VOLTAGE VIN (V) IOUT = 10mA, CL = 10µF (Tantalum) OUTPUT VOLTAGE VOUT (V) 8 IN (V) INPUT VOLTAGE VIN (V) 6 8 OUT (V) 8 IOUT = 1mA, CL = 10µF (Tantalum) TIME: (0.1 msec/div) 9. INPUT TRANSIENT RESPONSE 2 TC565002 (5V) 5.3 6 5.2 5 5.1 Output Voltage 4 5.0 3 4.9 TIME: (0.1 msec/div) DS21436B-page 8 5.4 Input Voltage INPUT VOLTAGE VIN (V) INPUT VOLTAGE VIN (V) Input Voltage 7 8 IOUT = 10mA, CL = 10µF (Tantalum) 7 5.3 6 5.2 5 5.1 Output Voltage 4 5.0 3 OUTPUT VOLTAGE VOUT (V) 5.4 OUTPUT VOLTAGE VOUT (V) 8 IOUT = 1mA, CL = 10µF (Tantalum) 4.9 TIME: (0.1 msec/div) 2002 Microchip Technology Inc. TC56 5.0 TYPICAL CHARACTERISTICS (CONTINUED) 9. INPUT TRANSIENT RESPONSE 2 (CONT.) TC563002 (3V) 5 3.15 4 3.10 3.05 Output Voltage 2 3.00 1 2.95 IN (V) INPUT VOLTAGE VIN (V) Input Voltage 3 6 3.20 OUTPUT VOLTAGE VOUT (V) 6 3.20 Input Voltage 5 3.15 4 3.10 3 3.05 Output Voltage 2 3.00 1 2.95 0 2.90 0 IOUT = 10mA, CL = 10µF (Tantalum) OUTPUT VOLTAGE VOUT (V) TC563002 (3V) IOUT = 1mA, CL = 10µF (Tantalum) 2.90 TIME (1 msec/div) TIME (1 msec/div) 10. LOAD TRANSIENT RESPONSE 3.2 200 Output Voltage 5.0 160 4.9 120 4.8 80 40mA Output Current 4.7 40 240 3.1 200 Output Voltage 3.0 160 2.9 120 2.8 80 40mA Output Current 2.7 1mA 40 OUTPUT CURRENT IOUT (mA) 5.1 OUTPUT VOLTAGE VOUT (V) 240 OUTPUT CURRENT IOUT (mA) OUTPUT VOLTAGE VOUT (V) VIN = 4V, CL = 10µF (Tantalum) VIN = 6V, CL = 10µF (Tantalum) 5.2 1mA 4.6 0 2.6 0 TIME (2 msec/div) TIME (2 msec/div) 11. SHDN PIN TRANSIENT RESPONSE TC565002 (5V) OUTPUT VOLTAGE VOUT (V) 7 V 6 5 4 8 = 1.5V VIL = 0.25V 3 Output Voltage 2 1 0 OUTPUT VOLTAGE VOUT (V) 8 TC565002 (5V) VIN = 6V IOUT = 1mA, CL = 10µF (Tantalum) 7 VIN = 6V IOUT = 10mA, CL = 10µF (Tantalum) IH 6 5 4 VIL = 0.25V 3 Output Voltage 2 1 0 TIME (0.1 msec/div) 2002 Microchip Technology Inc. TIME (0.1 msec/div) DS21436B-page 9 TC56 5.0 TYPICAL CHARACTERISTICS (CONTINUED) 11. SHDN PIN TRANSIENT RESPONSE (CONT.) TC563002 (3V) 6 VIH = 1.5V 5 6 OUTPUT VOLTAGE VOUT (V) OUTPUT VOLTAGE VOUT (V) TC563002 (3V) VIN = 4V IOUT = 1mA, CL = 10µF (Tantalum) SHDN HDN Pin Input Voltage 4 VIL = 0.25V 3 2 Output Current 1 0 VIN = 4V IOUT = 10mA, CL = 10µF (Tantalum) VIH = 1.5V 5 SHDN HDN Pin Input Voltage 4 VIL = 0.25V 3 2 Output Current 1 0 TIME: (0.1 msec/div) TIME: (0.1 msec/div) 12. RIPPLE REJECTION RATE RIPPLE REJECTION RATE RR (dB) TC565002 (5V) 80 V IOUT = 40mA, L V = 6VDC + 1 Vp–pAC, IOUT = 40mA, CL µ µ 80 70 70 60 60 50 50 40 40 30 30 20 20 10 10 0 0.01 0.1 1 RIPPLE FREQUENCY f (kHz) DS21436B-page 10 TC563002 (3V) DC + 1 Vp–pAC, 10 0 0.01 0.1 1 10 RIPPLE FREQUENCY f (kHz) 2002 Microchip Technology Inc. TC56 6.0 PACKAGING INFORMATION 6.1 Package Marking Information 2 3 1 6.2 represents the integer of the output voltage Symbol Voltage A B C D E F H 0. 1. 2. 3. 4. 5. 6. 3 represents the integer of the output voltage Symbol Voltage Symbol Voltage A B C D E .0 .1 .2 .3 .4 F H K L M .5 .6 .7 .8 .9 represents the transition response Symbol — 4 REGULAR represents assembly lot code Taping Form Component Taping Orientation for 5-Pin SOT-23A (EIAJ SC-74A) Devices User Direction of Feed Device Marking W PIN 1 P Standard Reel Component Orientation TR Suffix Device (Mark Right Side Up) Carrier Tape, Number of Components Per Reel and Reel Size Package 5-Pin SOT-23A 2002 Microchip Technology Inc. Carrier Width (W) Pitch (P) Part Per Full Reel Reel Size 8 mm 4 mm 3000 7 in DS21436B-page 11 TC56 6.3 Package Dimensions SOT-23A-5 .075 (1.90) REF. .071 (1.80) .059 (1.50) .122 (3.10) .098 (2.50) .020 (0.50) .012 (0.30) PIN 1 .037 (0.95) REF. .122 (3.10) .106 (2.70) .057 (1.45) .035 (0.90) .006 (0.15) .000 (0.00) .010 (0.25) .004 (0.09) 10° MAX. .024 (0.60) .004 (0.10) Dimensions: inches (mm) DS21436B-page 12 2002 Microchip Technology Inc. TC56 Sales and Support Data Sheets Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and recommended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following: 1. 2. 3. Your local Microchip sales office The Microchip Corporate Literature Center U.S. FAX: (480) 792-7277 The Microchip Worldwide Site (www.microchip.com) Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using. New Customer Notification System Register on our web site (www.microchip.com/cn) to receive the most current information on our products. 2002 Microchip Technology Inc. DS21436B-page13 TC56 NOTES: DS21436B-page14 2002 Microchip Technology Inc. TC56 Information contained in this publication regarding device applications and the like is intended through suggestion only and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. No representation or warranty is given and no liability is assumed by Microchip Technology Incorporated with respect to the accuracy or use of such information, or infringement of patents or other intellectual property rights arising from such use or otherwise. Use of Microchip’s products as critical components in life support systems is not authorized except with express written approval by Microchip. No licenses are conveyed, implicitly or otherwise, under any intellectual property rights. Trademarks The Microchip name and logo, the Microchip logo, FilterLab, KEELOQ, microID, MPLAB, PIC, PICmicro, PICMASTER, PICSTART, PRO MATE, SEEVAL and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. dsPIC, ECONOMONITOR, FanSense, FlexROM, fuzzyLAB, In-Circuit Serial Programming, ICSP, ICEPIC, microPort, Migratable Memory, MPASM, MPLIB, MPLINK, MPSIM, MXDEV, MXLAB, PICC, PICDEM, PICDEM.net, rfPIC, Select Mode and Total Endurance are trademarks of Microchip Technology Incorporated in the U.S.A. Serialized Quick Turn Programming (SQTP) is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. © 2002, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper. Microchip received QS-9000 quality system certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona in July 1999 and Mountain View, California in March 2002. The Company’s quality system processes and procedures are QS-9000 compliant for its PICmicro® 8-bit MCUs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, non-volatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001 certified. 2002 Microchip Technology Inc. DS21436B-page 15 M WORLDWIDE SALES AND SERVICE AMERICAS ASIA/PACIFIC Japan Corporate Office Australia 2355 West Chandler Blvd. Chandler, AZ 85224-6199 Tel: 480-792-7200 Fax: 480-792-7277 Technical Support: 480-792-7627 Web Address: http://www.microchip.com Microchip Technology Australia Pty Ltd Suite 22, 41 Rawson Street Epping 2121, NSW Australia Tel: 61-2-9868-6733 Fax: 61-2-9868-6755 Microchip Technology Japan K.K. Benex S-1 6F 3-18-20, Shinyokohama Kohoku-Ku, Yokohama-shi Kanagawa, 222-0033, Japan Tel: 81-45-471- 6166 Fax: 81-45-471-6122 Rocky Mountain China - Beijing 2355 West Chandler Blvd. Chandler, AZ 85224-6199 Tel: 480-792-7966 Fax: 480-792-7456 Microchip Technology Consulting (Shanghai) Co., Ltd., Beijing Liaison Office Unit 915 Bei Hai Wan Tai Bldg. No. 6 Chaoyangmen Beidajie Beijing, 100027, No. China Tel: 86-10-85282100 Fax: 86-10-85282104 Atlanta 500 Sugar Mill Road, Suite 200B Atlanta, GA 30350 Tel: 770-640-0034 Fax: 770-640-0307 Boston 2 Lan Drive, Suite 120 Westford, MA 01886 Tel: 978-692-3848 Fax: 978-692-3821 Chicago 333 Pierce Road, Suite 180 Itasca, IL 60143 Tel: 630-285-0071 Fax: 630-285-0075 Dallas 4570 Westgrove Drive, Suite 160 Addison, TX 75001 Tel: 972-818-7423 Fax: 972-818-2924 Detroit Tri-Atria Office Building 32255 Northwestern Highway, Suite 190 Farmington Hills, MI 48334 Tel: 248-538-2250 Fax: 248-538-2260 Kokomo 2767 S. Albright Road Kokomo, Indiana 46902 Tel: 765-864-8360 Fax: 765-864-8387 Los Angeles 18201 Von Karman, Suite 1090 Irvine, CA 92612 Tel: 949-263-1888 Fax: 949-263-1338 China - Chengdu Microchip Technology Consulting (Shanghai) Co., Ltd., Chengdu Liaison Office Rm. 2401, 24th Floor, Ming Xing Financial Tower No. 88 TIDU Street Chengdu 610016, China Tel: 86-28-86766200 Fax: 86-28-86766599 China - Fuzhou Microchip Technology Consulting (Shanghai) Co., Ltd., Fuzhou Liaison Office Unit 28F, World Trade Plaza No. 71 Wusi Road Fuzhou 350001, China Tel: 86-591-7503506 Fax: 86-591-7503521 China - Shanghai Microchip Technology Consulting (Shanghai) Co., Ltd. Room 701, Bldg. B Far East International Plaza No. 317 Xian Xia Road Shanghai, 200051 Tel: 86-21-6275-5700 Fax: 86-21-6275-5060 China - Shenzhen 150 Motor Parkway, Suite 202 Hauppauge, NY 11788 Tel: 631-273-5305 Fax: 631-273-5335 Microchip Technology Consulting (Shanghai) Co., Ltd., Shenzhen Liaison Office Rm. 1315, 13/F, Shenzhen Kerry Centre, Renminnan Lu Shenzhen 518001, China Tel: 86-755-2350361 Fax: 86-755-2366086 San Jose China - Hong Kong SAR Microchip Technology Inc. 2107 North First Street, Suite 590 San Jose, CA 95131 Tel: 408-436-7950 Fax: 408-436-7955 Microchip Technology Hongkong Ltd. Unit 901-6, Tower 2, Metroplaza 223 Hing Fong Road Kwai Fong, N.T., Hong Kong Tel: 852-2401-1200 Fax: 852-2401-3431 New York Toronto 6285 Northam Drive, Suite 108 Mississauga, Ontario L4V 1X5, Canada Tel: 905-673-0699 Fax: 905-673-6509 India Microchip Technology Inc. India Liaison Office Divyasree Chambers 1 Floor, Wing A (A3/A4) No. 11, O’Shaugnessey Road Bangalore, 560 025, India Tel: 91-80-2290061 Fax: 91-80-2290062 Korea Microchip Technology Korea 168-1, Youngbo Bldg. 3 Floor Samsung-Dong, Kangnam-Ku Seoul, Korea 135-882 Tel: 82-2-554-7200 Fax: 82-2-558-5934 Singapore Microchip Technology Singapore Pte Ltd. 200 Middle Road #07-02 Prime Centre Singapore, 188980 Tel: 65-6334-8870 Fax: 65-6334-8850 Taiwan Microchip Technology Taiwan 11F-3, No. 207 Tung Hua North Road Taipei, 105, Taiwan Tel: 886-2-2717-7175 Fax: 886-2-2545-0139 EUROPE Denmark Microchip Technology Nordic ApS Regus Business Centre Lautrup hoj 1-3 Ballerup DK-2750 Denmark Tel: 45 4420 9895 Fax: 45 4420 9910 France Microchip Technology SARL Parc d’Activite du Moulin de Massy 43 Rue du Saule Trapu Batiment A - ler Etage 91300 Massy, France Tel: 33-1-69-53-63-20 Fax: 33-1-69-30-90-79 Germany Microchip Technology GmbH Gustav-Heinemann Ring 125 D-81739 Munich, Germany Tel: 49-89-627-144 0 Fax: 49-89-627-144-44 Italy Microchip Technology SRL Centro Direzionale Colleoni Palazzo Taurus 1 V. Le Colleoni 1 20041 Agrate Brianza Milan, Italy Tel: 39-039-65791-1 Fax: 39-039-6899883 United Kingdom Microchip Ltd. 505 Eskdale Road Winnersh Triangle Wokingham Berkshire, England RG41 5TU Tel: 44 118 921 5869 Fax: 44-118 921-5820 05/01/02 '! #' DS21436B-page 16 2002 Microchip Technology Inc.