DATA SHEET MOS FIELD EFFECT TRANSISTOR 2SK1959 N-CHANNEL MOS FET FOR HIGH-SPEED SWITCHING The 2SK1959 is an N-channel vertical MOS FET. Because PACKAGE DIMENSIONS (in mm) it can be driven by a voltage as low as 1.5 V and it is not necessary to consider a drive current, this FET is ideal as an 4.5 ±0.1 actuator for low-current portable systems such as headphone 1.6 ±0.2 1.5 ±0.1 • Gate can be driven by 1.5 V • Low ON resistance RDS(on) = 3.2 Ω MAX. @ VGS = 1.5 V, ID = 50 mA RDS(on) = 0.5 Ω MAX. @ VGS = 4.0 V, ID = 1.0 A D S G 0.42 ±0.06 4.0 ±0.25 0.8 MIN. FEATURES 2.5 ±0.1 stereos and video cameras. 0.42 ±0.06 0.47 ±0.06 3.0 1.5 0.41 +0.03 –0.05 Marking: NQ EQUIVALENT CURCUIT Drain (D) Internal diode Gate (G) Gate protection diode Source (S) PIN CONNECTIONS S: Source D: Drain G: Gate ABSOLUTE MAXIMUM RATINGS (TA = 25 ˚C) PARAMETER SYMBOL TEST CONDITIONS RATING UNIT Drain to Source Voltage VDSS VGS = 0 16 V Gate to Source Voltage VGSS VDS = 0 ±7.0 V Drain Current (DC) ID(DC) ±2.0 A Drain Current (Pulse) ID(pulse) ±4.0 A 2.0 W PW ≤ 10 ms, duty cycle ≤ 50 % × 0.7 mm ceramic substrate used Total Power Dissipation PT Channel Temperature Tch 150 ˚C Storage Temperature Tstg –55 to +150 ˚C Document No. D11222EJ2V0DS00 (2nd edition) Date Published June 1996 P Printed in Japan 16 cm2 © 1996 2SK1959 ELECTRICAL CHARACTERISTICS (TA = 25 ˚C) PARAMETER TEST CONDITIONS MIN. TYP. MAX. UNIT Drain Cut-Off Current IDSS VDS = 16 V, VGS = 0 1.0 µA Gate Leakage Current IGSS VGS = ±7.0 V, VDS = 0 ±3.0 µA Gate Cut-Off Voltage VGS(off) VDS = 3 V, ID = 100 µA 0.5 1.1 V VDS = 3 V, ID = 1.0 A 1.0 Forward Transfer Admittance |yfs| 0.8 S Drain to Source On-State Resistance RDS(on)1 VGS = 1.5 V, ID = 50 mA 0.8 3.2 Ω Drain to Source On-State Resistance RDS(on)2 VGS = 2.5 V, ID = 0.5 A 0.36 0.6 Ω Drain to Source On-State Resistance RDS(on)3 VGS = 4.0 V, ID = 1.0 A 0.28 0.5 Ω VDS = 3 V, VGS = 0, f = 1.0 MHz 160 pF Input Capacitance Ciss Output Capacitance Coss 150 pF Reverse Transfer Capacitance Crss 50 pF Turn-ON Delay Time td(on) VDD = 3 V, ID = 0.5 A, VGS(on) = 3 V, 45 ns RG = 10 Ω, RL = 6 Ω 190 ns td(off) 180 ns tf 210 ns Rise Time Turn-OFF Delay Time Fall Time 2 SYMBOL tr 2SK1959 TYPICAL CHARACTERISTICS (TA = 25 ˚C) DERATING FACTOR OF FORWARD BIAS SAFE OPERATING AREA FORWARD BIAS SAFE OPERATING AREA 100 10 m ID - Drain Current - A s 20 s 40 m 60 10 dT - Derating Factor - % 1 5 80 2 PW 1 10 0 m s DC 0.5 0.2 0 30 60 90 120 TA - Ambient Temperature - ˚C 0.1 150 Single pulse 1 2 5 10 20 VDS - Drain to Source Voltage - V DRAIN CURRENT vs. DRAIN TO SOURCE VOLTAGE 50 TRANSFER CHARACTERISTICS 10 VDS = 3 V V 2.0 0 3. V 2.5 1.2 ID - Drain Current - A 4. 0 1.6 ID - Drain Current - A = V 0.8 2.0 V 1 TA = 75 ˚C 25 ˚C 0.1 –25 ˚C 0.01 0.4 1.8 V VGS = 1.5 V 0 0.2 0.4 0.6 0.8 VDS - Drain to Source Voltage - V RDS(on) - Drain to Source On-State Resistance - Ω FORWARD TRANSFER ADMITTANCE vs. DRAIN CURRENT |yfs| - Forward Transfer Admittance - S 10 VDS = 3 V 3 TA = –25 ˚C 25 ˚C 1 75 ˚C 0.3 0.1 0.01 0.03 0.1 0.3 ID - Drain Current - A 1 0.001 1.0 3 0 1 2 3 VGS - Gate to Source Voltage - V 4 DRAIN TO SOURCE ON-STATE RESISTANCE vs. DRAIN CURRENT 1.2 1 0.8 VGS = 1.5 V TA = 75 ˚C 25 ˚C –25 ˚C 0.6 TA = 75 ˚C 25 ˚C –25 ˚C 0.4 VGS = 2.5 V 0.2 0 0.01 0.03 0.1 0.3 1 ID - Drain Current - A 3 3 SOURCE TO DRAIN DIODE FORWARD VOLTAGE DRAIN TO SOURCE ON-STATE RESISTANCE vs. GATE TO SOURCE VOLTAGE 1 10 ISD - Diode Forward Current - A RDS(on) - Drain to Source On-State Resistance - Ω 2SK1959 0.8 ID = 50 mA 0.5 A 0.6 1A 0.4 0.2 0 2 4 6 8 VGS - Gate to Source Voltage - V 1 0.1 0.01 0.001 0.2 10 CAPACITANCE vs. DRAIN TO SOURCE VOLTAGE 1 000 VGS = 0 f = 1 MHz 500 td(on), tr, td(off), tf - Switching Time - ns Ciss, Crss, Coss - Capacitance - pF 4 1.2 SWITCHING CHARACTERISTICS 1 000 200 Ciss 100 Coss 50 Crss 20 10 0.4 0.6 0.8 1 VSD - Source to Drain Voltage - V 1 2 5 10 20 50 VDS - Drain to Source Voltage - V 100 500 VDD = 3 V VGS(on) = 3 V tr 200 tf 100 td(off) td(on) 50 20 10 0.1 0.2 0.5 1 2 ID - Drain Current - A 5 10 2SK1959 REFERENCE Document Name Document No. NEC semiconductor device reliability/quality control system TEI-1202 Quality grade on NEC semiconductor devices IEI-1209 Semiconductor device mounting technology manual C10535E Guide to quality assurance for semiconductor devices MEI-1202 Semiconductor selection guide X10679E 5 2SK1959 [MEMO] No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in this document. NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from use of a device described herein or any other liability arising from use of such device. No license, either express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC Corporation or others. While NEC Corporation has been making continuous effort to enhance the reliability of its semiconductor devices, the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or property arising from a defect in an NEC semiconductor device, customer must incorporate sufficient safety measures in its design, such as redundancy, fire-containment, and anti-failure features. NEC devices are classified into the following three quality grades: “Standard“, “Special“, and “Specific“. The Specific quality grade applies only to devices developed based on a customer designated “quality assurance program“ for a specific application. The recommended applications of a device depend on its quality grade, as indicated below. Customers must check the quality grade of each device before using it in a particular application. Standard: Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) Specific: Aircrafts, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems or medical equipment for life support, etc. The quality grade of NEC devices in “Standard“ unless otherwise specified in NEC's Data Sheets or Data Books. If customers intend to use NEC devices for applications other than those specified for Standard quality grade, they should contact NEC Sales Representative in advance. Anti-radioactive design is not implemented in this product. M4 94.11