DATA SHEET E.S.D NOISE CLIPPING DIODES NNCD3.3F to NNCD12F ELECTROSTATIC DISCHARGE NOISE CLIPPING DIODES (DOUBLE TYPE, ANODE COMMON) 3PIN MINI MOLD PACKAGE DIMENSIONS This product series is a diode developed for E.S.D (Electrostatic Discharge) noise protection. Based on the IEC1000-4-2 test on (in millimeters) electromagnetic interference (EMI), the diode assures an endur- 2.8 ± 0.2 0.4 –0.05 +0.1 ance of no less than 30 kV, thus making itself most suitable for external interface circuit protection. +0.1 1.5 0.65 –0.15 2 1 3 +0.1 FEATURES • Based on the electrostatic discharge immunity test (IEC1000-40.3 +0.1 0.16 –0.06 a series over a wide range (15 product name lined up). 0 to 0.1 • Based on the reference supply of the set, the product achieves Marking 1.1 to 1.4 2), the product assures the minimum endurance of 30 kV. APPLICATIONS • External interface circuit E.S.D protection. PIN CONNECTION SC-59 (EIAJ) 1. K1: Cathode 1 2. K2: Cathode 2 3. A : Anode (common) • Circuits for Waveform clipper, Surge absorber. K2 2 MAXIMUM RATINGS (TA = 25 °C) Power Dissipation P 200 mW Surge Reverse Power PRSM 100 W (tT = 10 µs 1 pulse) Junction Temperature Tj 150 °C Storage Temperature Tstg –55 °C to +150 °C Document No. D11774EJ2V0DS00 (2nd edition) Date Published December 1996 N Printed in Japan 0.4 –0.05 0.95 0.95 200 mW. 2.9 ± 0.2 Type NNCD3.3F to NNCD12F Series include two elements in 3PIN Mini Mold Package having allowable power dissipation of (Total) Fig. 6 A 3 K1 1 © 1996 NNCD3.3F to NNCD12F ELECTRICAL CHARACTERISTICS (TA = 25 ˚C) (A-K1, A-K2) Breakdown VoltageNote 1 VBR (V) Type Number Dynamic ImpedanceNote 2 Zz (Ω) Capacitance Ct (pF) TEST CONDITION E.S.D Voltage (kV) MIN. MAX. IT (mA) MAX. IT (mA) MAX. VR (V) TYP. NNCD3.3F 3.10 3.50 5 130 5 20 1.0 220 30 NNCD3.6F 3.40 3.80 5 130 5 10 1.0 210 30 NNCD3.9F 3.70 4.10 5 130 5 10 1.0 200 30 NNCD4.3F 4.01 4.48 5 130 5 10 1.0 180 30 NNCD4.7F 4.42 4.90 5 130 5 10 1.0 170 30 NNCD5.1F 4.84 5.37 5 130 5 5 1.5 160 30 NNCD5.6F 5.31 5.92 5 80 5 5 2.5 140 VR = 0 V f = 1 MHz MIN. C = 150 pF R = 330 Ω 30 (IEC1000 -4-2) 5.86 6.53 5 50 5 2 3.0 120 NNCD6.8F 6.47 7.14 5 30 5 2 3.5 110 30 NNCD7.5F 7.06 7.84 5 30 5 2 4.0 90 30 NNCD8.2F 7.76 8.64 5 30 5 2 5.0 90 30 NNCD9.1F 8.56 9.55 5 30 5 2 6.0 90 30 NNCD10F 9.45 10.55 5 30 5 2 7.0 80 30 NNCD11F 10.44 11.56 5 30 5 2 8.0 70 30 NNCD12F 11.42 12.60 5 35 5 2 9.0 70 30 2. Zz is measured at IT give a small A.C. signal. TEST CONDITION 30 NNCD6.2F Notes 1. Tested with pulse (40 ms) 2 Reverse Leakage IR (µA) NNCD3.3F to NNCD12F TYPICAL CHARACTERISTICS (TA = 25 °C) Fig. 1 POWER DISSIPATION vs. AMBIENT TEMPERATURE 250 P - Power Dissipation - mW 200 150 100 50 0 25 0 50 75 100 125 150 TA - Ambient Temperature - °C Fig. 2 IT - VBR CHARACTERISTICS NNCD7.5F NNCD8.2F NNCD6.8F NNCD9.1F 100 m Fig. 3 IT - VBR CHARACTERISTICS NNCD10F 1m NNCD4.7F 100 µ 10 µ 1µ NNCD5.1F 1n 0 1 2 3 1m 100 µ 10 µ 1µ 100 n NNCD5.6F NNCD6.2F 10 n NNCD12F 10 m IT - On State Current - A IT - On State Current - A NNCD3.3F NNCD3.3F 10 m NNCD3.9F NNCD4.3F 100 n NNCD11F 100 m 4 5 10 n 6 7 8 9 10 VBR - Breakdown Voltage - V 1n 0 7 8 9 10 11 12 13 14 15 VBR - Breakdown Voltage - V 3 NNCD3.3F to NNCD12F Fig. 4 ZZ - IT CHARACTERISTICS ZZ - Dynamic Impedance - Ω 1 000 100 TYP. NNCD3.9F NNCD4.7F NNCD5.1F NNCD5.6F NNCD10F 10 NNCD7.5F 1 0.1 1 10 100 IT - On State Current - mA Fig. 5 TRANSIENT THERMAL IMPEDANCE Zth - Transient Thermal Impedance - °C/W 5 000 1 000 100 625 °C/W NNCD [ ] F 10 5 1m 10 m 100 m 1 10 100 t - Time - s Fig. 6 SURGE REVERSE POWER RATING TA = 25 °C Non-repetitive PRSM PRSM - Surge Reverse Power - W 1 000 tT 100 NNCD [ ] F 10 1 1µ 10 µ 100 µ 1m tT - Pulse Width - s 4 10 m 100 m NNCD3.3F to NNCD12F Sample Application Circuits SetNote Conecter Micro com. PC (CD ROM) Di Palallel Interface Di Interface Cable Note Set Printer, P.D.C, T.V Game etc. 5 NNCD3.3F to NNCD12F REFERENCE Document Name 6 Document No. NEC semiconductor device reliability/quality control system C11745E NEC semiconductor device reliability/quality control system MEI-1201 Quality grade on NEC semiconductor device C11531E Semiconductor device mounting technology manual C10535E Guide to quality assurance for semiconductor device MEI-1202 NNCD3.3F to NNCD12F [MEMO] 7 NNCD3.3F to NNCD12F [MEMO] No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in this document. NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from use of a device described herein or any other liability arising from use of such device. No license, either express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC Corporation or others. While NEC Corporation has been making continuous effort to enhance the reliability of its semiconductor devices, the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or property arising from a defect in an NEC semiconductor device, customers must incorporate sufficient safety measures in its design, such as redundancy, fire-containment, and anti-failure features. NEC devices are classified into the following three quality grades: "Standard", "Special", and "Specific". The Specific quality grade applies only to devices developed based on a customer designated "quality assurance program" for a specific application. The recommended applications of a device depend on its quality grade, as indicated below. Customers must check the quality grade of each device before using it in a particular application. Standard: Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) Specific: Aircrafts, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems or medical equipment for life support, etc. The quality grade of NEC devices is "Standard" unless otherwise specified in NEC's Data Sheets or Data Books. If customers intend to use NEC devices for applications other than those specified for Standard quality grade, they should contact an NEC sales representative in advance. Anti-radioactive design is not implemented in this product. M4 96.5 8