DATA SHEET Bipolar Analog Integrated Circuit µPC1909 SWITCHING REGULATOR CONTROL IC The µPC1909 is a switching regulator control IC ideal for primary side control of active-clamp type Note DC/DC converters. This IC has 2 outputs employing a totem-pole circuit with peak output current 1.2 A, and is capable of directly driving a power MOS-FET. As a result, it has been possible to realize primary side control of an active-clamp type converter on a single chip. Note It is necessary to obtain license from Vicor Corporation before using the µPC1909 in an active-clamp type circuit. FEATURES • 2 on-chip outputs; for Q and Q • Capable of directly driving a power MOS-FET • Drive supply voltage range: 7 V to 24 V • On-chip remote control circuit • On-chip pulse-by-pulse overcurrent protection circuit • On-chip overvoltage latch circuit ORDERING INFORMATION Part Number Package µPC1909CX 16-pin plastic DIP (300 mils) µPC1909GS 16-pin plastic SOP (300 mils) The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version. Not all devices/types available in every country. Please check with local NEC representative for availability and additional information. Document No. G14309EJ1V0DS00 (1st edition) Date Published July 1999 N CP(K) Printed in Japan © 1999 µPC1909 BLOCK DIAGRAM CT RT VREF DTC1 FB OUT1 EMI1 VCC 16 15 14 13 12 11 10 9 Oscillator PWM comparator 1 Reference power supply – + + OLS ON/OFF control Overvoltage protection 2 + – – PWM comparator 2 Overcurrent protection 1 2 3 4 5 6 7 8 OV CT2 GND OC DTC2 OUT2 ON/OFF EMI2 Data Sheet G14309EJ1V0DS00 µPC1909 PIN CONFIGURATION (TOP VIEW) 16-pin plastic DIP (300 mils) µPC1909CX 16-pin plastic SOP (300 mils) µPC1909GS OV 1 16 CT CT2 2 15 RT GND 3 14 VREF OC 4 13 DTC1 DTC2 5 12 FB OUT2 6 11 OUT1 ON/OFF 7 10 EMI1 EMI2 8 9 VCC PIN FUNCTION LIST Pin Number Pin Name 1 OV 2 CT2 3 GND 4 Function Pin Number Pin Name Overvoltage protection 9 VCC Power supply OLS shift setting 10 EMI1 OUT1 emitter Ground 11 OUT1 OUT1 output OC Overcurrent protection 12 FB 5 DTC2 OUT2 dead-time setting 13 DTC1 OUT1 dead-time setting 6 OUT2 OUT2 output 14 VREF Reference voltage output 7 ON/OFF ON/OFF control 15 RT Timing resistance 8 EMI2 OUT2 emitter 16 CT Timing capacitance Data Sheet G14309EJ1V0DS00 Function Feedback input 3 µPC1909 ELECTRICAL SPECIFICATIONS Absolute Maximum Ratings (Unless otherwise specified, TA = 25°°C) Parameter Supply Voltage µPC1909CX Symbol µPC1909GS Unit VCC 26 V Output Current (DC, per output) IC (DC) 100 mA Output Current (peak, per output) IC (peak) 1.2 A Total Power Dissipation PT 1000 694 mW Operating Ambient Temperature TA −20 to +85 °C Operating Junction Temperature TJ −20 to +150 °C Storage Temperature Tstg −55 to +150 °C Caution Product quality may suffer if the absolute maximum rating is exceeded even momentarily for any parameter. That is, the absolute maximum ratings are rated values at which the product is on the verge of suffering physical damage, and therefore the product must be used under conditions that ensure that the absolute maximum ratings are not exceeded. Recommended Operating Conditions Parameter 4 Symbol MIN. TYP. MAX. Unit Supply Voltage VCC 7 10 24 V Oscillation Frequency fOSC 50 200 500 kHz Output Load Capacitance CL 2200 3000 pF Output Load Resistance RL 10 Operating Junction Temperature TJ −20 Data Sheet G14309EJ1V0DS00 kΩ +100 °C µPC1909 Electrical Characteristics (Unless otherwise specified, TA = 25°°C, VCC = 10 V, RT = 10 kΩ Ω , fosc = 200 kHz) Block Total Parameter Standby Current Circuit Current Symbol ICC (SB) Conditions MIN. VCC = 7 V MAX. 0.1 Unit mA 6 12 18 mA VCC (L to H) 8 9 10 V VH 3 4 5 V 4.7 4.9 5.1 V ICC Without load TYP. UnderVoltage Lockout Circuit Start-Up Threshold Voltage Reference Voltage Output Voltage VREF Line Regulation REGIN 8 V ≤ VCC ≤ 15 V, IREF = 0 A 1 10 mV Load Regulation REGL 1 mA ≤ IREF ≤ 4 mA 6 12 mV −10°C ≤ TA ≤ +85°C, IREF = 0 A 400 (700) µV/°C IREF = 0 A 15 Operating Voltage Hysteresis Width Output Voltage Temperature Coefficient Oscillation PWM Comparator Output Remote Control Short Circuit Current IO short Oscillation Frequency fOSC Overvoltage Latch 180 200 Frequency Line Regulation ∆f/∆V 8 V ≤ VCC ≤ 15 V 1 Frequency Temperature Coefficient ∆f/∆T −10°C ≤ TA ≤ +85°C 2 Input Bias Current mA 220 kHz % (5) % IB (COMP1) VCOMP1 = VREF 10 µA IB (COMP2) VCOMP2 = VREF 10 µA Low-level Threshold Voltage VTH (L) 1.5 V High-level Threshold Voltage VTH (H) 3.5 V 3 % Dead-time Temperature Coeficient ∆DT/∆T Low-level Output Voltage VOL ISINK = 3 mA High-level Output Voltage VOH ISOURCE = 30 mA −10°C ≤ TA ≤ +85°C, VD = 0.46 VREF 0.5 V VCC − 1.6 V Rise Time tr RL = 15 Ω, CL = 2200 pF 60 ns Fall Time tf RL = 15 Ω, CL = 2200 pF 40 ns Input Voltage at Output ON VIN (ON) 2.4 2.6 2.8 V Input Voltage at Output OFF VIN (OFF) 2.2 2.4 2.6 V VH 0.1 0.2 0.3 V VTH (OC) 190 210 230 mV Hysteresis Width Overcurrent Latch ∆VREF/∆T IREF = 0 A Overcurrent Threshold Voltage Input Bias Current IB (OC) Delay to Output td (OC) Overvoltage Threshold Voltage VCC = 0 V VTH (OV) 2 200 µA 150 ns 2.4 VOV = VREF 2.8 V 4 µA Input Bias Current IB (OV) OVL Reset Voltage VR (OV) 2 V Delay to Output td (OV) 750 ns Remark Values in parentheses ( ) represent reference values. Data Sheet G14309EJ1V0DS00 5 µPC1909 TYPICAL CHARACTERISTICS CURVES (UNLESS OTHERWISE SPECIFIED, TA = 25°°C, VCC = 10 V, REFERENCE VALUES) PT vs. TA Under-Voltage Lockout Circuit 1.2 15 12.5 125 °C/W 0.8 VOUT1 - Output voltage - V PT - Total Power Dissipation - W µ PC1909CX 1.0 µ PC1909GS 0.6 180 °C/W 0.4 0.2 10 7.5 5 2.5 0 25 50 75 100 125 TA - Ambient Temperature - °C VCC (H to L) 0 150 2.5 18 16 16 14 12 VH 10 0.8 0.4 0 5 5 7.5 10 12.5 VCC - Supply Voltage - V 10 15 20 VCC - Supply Voltage - V 14 12 VH 10 0.8 SB) ICC ( 25 0 fOSC = 200 kHz 5 10 15 20 VCC - Supply Voltage - V ICC(SB) vs. TA 20 200 VOUT1 - Output Voltage - V ICC(SB) - Standby Current - µA 25 VOUT1 vs. VIN 250 150 100 15 10 5 50 VIN (OFF) 0 −25 6 15 0.4 fOSC = 200 kHz Without load B) ICC (S VCC (L to H) ICC vs. VCC (During OVL Operation) 18 ICC - Circuit Current - mA ICC - Circuit Current - mA ICC vs. VCC VH 0 25 50 75 TA - Ambient Temperature - °C 100 0 Data Sheet G14309EJ1V0DS00 VIN (ON) 1 2 3 4 5 VIN - Remote Control Voltage - V 6 µPC1909 fosc vs. RT, CT 1000 20 500 fosc - Oscillation Frequency - kHz ∆VREF - Reference Voltage Deviation - mV ∆VREF vs. TA 30 10 0 −10 −20 −30 −25 0 25 50 75 TA - Ambient Temperature - °C 100 CT = 220 pF 100 50 CT = 1000 pF 10 fosc vs. TA 50 RT - Timing Resistance - kΩ VOH - High-Level Output Voltage - V 220 215 210 205 VCC −1 VCC − 1.5 VCC −2 VOL - Low-Level Output Voltage - V 200 195 190 185 180 175 −25 0 25 50 75 TA - Ambient Temperature - °C 100 1.53 1.49 1.45 –25 tf, tr vs. TA (OUT1) 0 25 50 75 TA - Ambient Temperature - °C 100 fOSC = 555 kHz tr - OUT2 Output Rise Time - ns tr - OUT2 Output Fall Time - ns fOSC = 555 kHz 80 tr 60 tf 40 20 0 −25 100 tf, tr vs. TA (OUT2) 100 tr - OUT1 Output Rise Time - ns tr - OUT1 Output Fall Time - ns 100 VOH, VOL vs. TA 225 fosc - Oscillation Frequency - kHz CT = 470 pF 0 25 50 75 TA - Ambient Temperature - °C 100 80 60 40 tr tf 20 0 −25 Data Sheet G14309EJ1V0DS00 0 25 50 75 TA - Ambient Temperature - °C 100 7 µPC1909 Duty vs. TA 45 44 Duty-ON Duty - % 43 42 41 40 39 38 37 36 35 −25 8 0 25 50 75 TA - Ambient Temperature - °C 100 Data Sheet G14309EJ1V0DS00 µPC1909 TIMING CHART Feedback input FB Oscillation waveform CT Oscillation waveform CT’ Vd tqc tqd OUT1 output waveform OUT2 output waveform (1) Oscillation waveform (CT) This waveform is determined by the external capacitor connected to the CT pin (pin 16) and the external resistor connected to the RT pin (pin 15). It is usually a 1.5-V to 3.5-V triangle waveform (the rise and fall times are the same). (2) Output waveform (OUT1) Whichever is the lower of the DTC1 pin (pin 13) and FB pin (pin 12) voltages is compared with the triangle wave of the CT pin (pin 16). The OUT1 pin (pin 11) is high level while the triangle wave is low. (3) Output waveform (OUT2) Whichever is the higher of the DTC2 pin (pin 5) and FB pin (pin 12) voltages is compared with the level-shifted triangle wave (CT’). The OUT2 pin (pin 6) is high level while the level-shifted triangle wave is high. (4) Triangle wave level shift The triangle wave that controls OUT2 is the original triangle wave of the CT pin (pin 16) shifted to a lower potential via the level shift circuit (OLS). The amount of shift (Vd) can be adjusted using the resistor (RCT2) connected between the CT2 pin (pin 2) and the VREF pin. The relationship between the shift amount (Vd) and the resistance value (kΩ) of the resistor RCT2 connected to the CT2 pin (pin 2) is as follows. Vd = 4.3 × 2 [V] RCT2[kΩ] + 10 (5) Dead-time (tqc, tqd) adjustment The dead time between the fall of OUT1 and the rise of OUT2 (tqc) and the dead time between the fall of OUT2 and the rise of OUT1 (tqd) is determined by the oscillation frequency and the amount of level shift of the triangle wave. Although usually tqc = tqd, if setting these independently, connect a suitable resistor between the CT pin and the VREF pin, as well as between the CT pin and GND, and adjust the dead time by making the oscillation waveform asymmetrical. Data Sheet G14309EJ1V0DS00 9 µPC1909 PACKAGE DRAWINGS 16 PIN PLASTIC DIP (300 mil) 16 9 1 8 A I K L H G J P F C D N R M B M NOTES 1) Each lead centerline is located within 0.25 mm (0.01 inch) of its true position (T.P.) at maximum material condition. 2) Item "K" to center of leads when formed parallel. ITEM MILLIMETERS INCHES A 20.32 MAX. 0.800 MAX. B 1.27 MAX. 0.050 MAX. C 2.54 (T.P.) D 0.50±0.10 0.100 (T.P.) +0.004 0.020 –0.005 F 1.1 MIN. 0.043 MIN. G 3.5±0.3 0.138±0.012 H 0.51 MIN. 0.020 MIN. I 4.31 MAX. 0.170 MAX. J 5.08 MAX. 0.200 MAX. K L 7.62 (T.P.) 6.5 0.300 (T.P.) 0.256 M 0.25 +0.10 –0.05 0.010 +0.004 –0.003 N 0.25 0.01 P 1.1 MIN. 0.043 MIN. R 0∼15° 0∼15° P16C-100-300B-1 10 Data Sheet G14309EJ1V0DS00 µPC1909 16 PIN PLASTIC SOP (300 mil) 16 9 detail of lead end P 1 8 A H F I G J S B N S L K C D M M E NOTE ITEM Each lead centerline is located within 0.12 mm of its true position (T.P.) at maximum material condition. MILLIMETERS A 10.2±0.2 B 0.78 MAX. C 1.27 (T.P.) D 0.42 +0.08 −0.07 E 0.1±0.1 F 1.65±0.15 G 1.55 H 7.7±0.3 I 5.6±0.2 J 1.1±0.2 K 0.22 +0.08 −0.07 L 0.6±0.2 M 0.12 N 0.10 P +7° 3° −3° P16GM-50-300B-5 Data Sheet G14309EJ1V0DS00 11 µPC1909 RECOMMENDED SOLDERING CONDITIONS The µPC1909 should be soldered and mounted under the following recommended conditions. For the details of the recommended soldering conditions, refer to the document Semiconductor Device Mounting Technology Manual (C10535E). For soldering methods and conditions other than those recommended below, contact your NEC sales representative. Insertion Type µPC1909CX: 16-pin plastic DIP (300 mils) Soldering Method Soldering Conditions Wave soldering (pins only) Solder bath temperature: 260°C Max., Time: 10 seconds max. Partial heating Pin temperature: 300°C max., Time: 3 seconds max. (per pin) Caution Apply wave soldering only to the pins and be careful not to bring solder into direct contact with the package. Surface Mounting Type µPC1909GS: 16-pin plastic SOP (300 mils) Soldering Method Soldering Conditions Recommended Condition symbol Infrared reflow Package peak temperature: 235°C, Time: 30 seconds max. (at 210°C or higher), Count: Twice or less IR35-00-2 VPS Package peak temperature: 215°C, Time: 40 seconds max. (at 200°C or higher), Count: Twice or less VP15-00-2 Wave soldering Soldering bath temperature: 260°C or less, Time: 10 seconds max., Count: Once, Preheating temperature: 120°C MAX. (package surface temperature) WS60-00-1 Caution Do not use different soldering methods together. 12 Data Sheet G14309EJ1V0DS00 µPC1909 [MEMO] Data Sheet G14309EJ1V0DS00 13 µPC1909 [MEMO] 14 Data Sheet G14309EJ1V0DS00 µPC1909 [MEMO] Data Sheet G14309EJ1V0DS00 15 µPC1909 • The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version. • No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in this document. • NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from use of a device described herein or any other liability arising from use of such device. No license, either express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC Corporation or others. • Descriptions of circuits, software, and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. The incorporation of these circuits, software, and information in the design of the customer's equipment shall be done under the full responsibility of the customer. NEC Corporation assumes no responsibility for any losses incurred by the customer or third parties arising from the use of these circuits, software, and information. • While NEC Corporation has been making continuous effort to enhance the reliability of its semiconductor devices, the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or property arising from a defect in an NEC semiconductor device, customers must incorporate sufficient safety measures in its design, such as redundancy, fire-containment, and anti-failure features. • NEC devices are classified into the following three quality grades: "Standard", "Special", and "Specific". The Specific quality grade applies only to devices developed based on a customer designated "quality assurance program" for a specific application. The recommended applications of a device depend on its quality grade, as indicated below. Customers must check the quality grade of each device before using it in a particular application. Standard: Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) Specific: Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems or medical equipment for life support, etc. The quality grade of NEC devices is "Standard" unless otherwise specified in NEC's Data Sheets or Data Books. If customers intend to use NEC devices for applications other than those specified for Standard quality grade, they should contact an NEC sales representative in advance. M7 98. 8