NEC UPC2775GR-E1

DATA SHEET
BIPOLAR ANALOG INTEGRATED CIRCUIT
µPC2775GR/GS
FREQUENCY DOWN CONVERTER
FOR VHF-UHF BAND TV/VCR TUNER
DESCRIPTION
The µPC2775GR/GS are Silicon monolithic ICs designed for TV/VCR tuner applications. These ICs consist of
double balanced mixers (DBM), local oscillator, preamplifiers for prescaler operation, IF amplifier, regulator, UHF/
VHF switching circuit, and so on. These one chip ICs cover a wide frequency band from VHF to UHF bands. These
ICs are packaged in a 20 pins SSOP (shrink small outline package; µPC2775GR) or 20 pins SOP (small outline
package; µPC2775GS) suitable for surface mounting. So, these ICs enable to produce economical and physically
small or high-density VHF - UHF tuner and reduce the tuner development time.
FEATURES
• VHF to UHF band operation.
• Low oscillation frequency drift against supply voltage and temperature fluctuation due to balanced type UHF
oscillator.
• These ICs can be used in single ended or differential IF outputs.
• Supply voltage: 9 V
• Packaged in 20 pins SSOP or 20 pins SOP suitable for surface mounting
ORDERING INFORMATION
PART NUMBER
PACKAGE
PACKAGE STYLE
µPC2775GR-E1
20 pin plastic SSOP (225 mil)
Embossed tape 12 mm wide, 2.5 k/REEL
Pin 1 indicates pull-out direction of tape
µPC2775GS-E1
20 pin plastic SOP (300 mil)
Embossed tape 24 mm wide, 2.5 k/REEL
Pin 1 indicates pull-out direction of tape
Caution electro-static sensitive device
The information in this document is subject to change without notice. Before using this document, please
confirm that this is the latest version.
Not all devices/types available in every country. Please check with local NEC representative for availability
and additional information.
Document No. P10194EJ3V0DS00 (3rd edition)
Date Published October 1999 N CP(K)
Printed in Japan
The mark
shows major revised points.
©
1995, 1999
µPC2775GR/GS
PIN CONFIGURATION (Top View)
1
20
2
19
3
18
4
17
5
16
6
15
7
14
8
13
9
12
10
11
1.
2.
3.
4.
5.
6.
7.
8.
9.
10.
11.
12.
13.
14.
15.
16.
17.
18.
19.
20.
UOSC COLLECTOR (Tr.1)
UOSC BASE (Tr.2)
UOSC BASE (Tr.1)
UOSC COLLECTOR (Tr.2)
UB
OSC OUTPUT
GND
VHF OSC BASE (Tr.1)
VHF OSC BASE (Tr.2)
VHF OSC COLLECTOR (Tr.1)
IF OUTPUT
IF OUTPUT
VCC
MIXER OUTPUT1
MIXER OUTPUT2
VHF RF INPUT1
VHF RF INPUT2
GND
UHF RF INPUT1
UHF RF INPUT2
INTERNAL BLOCK DIAGRAM
20
19
18
17
16
15
14
13
11
IF Amp.
V-RF
Pre Amp.
U-RF
Pre Amp.
12
MIX.
REG.
U-OSC
1
2
2
3
4
U-OSC
Buff.
V-OSC
Buff.
U-PSC
Amp.
V-PSC
Amp.
5
6
7
Data Sheet P10194EJ3V0DS00
V-OSC
8
9
10
µPC2775GR/GS
PIN EXPLANATION
Pin No.
1
Symbol
Pin voltage TYP.
above: V mode (V)
below: U mode (U)
Function and Explanation
UOSC
collector
(Tr. 1)
Collector pin of UHF oscillator.
Assemble LC resonator with 2 pin
------------through capacitor ~ 1 pF to oscillate
6.25
with active feedback Loop.
2
UOSC
base (Tr. 2)
Base pin of UHF oscillator with
balance amplifier. Connected to LC
------------resonator through feedback capacitor
3.90
~ 300 pF.
3
UOSC
base (Tr. 1)
Base pin of UHF oscillator with
balance amplifier. Connected to LC
------------resonator through feedback capacitor
3.90
~ 300 pF.
4
UOSC
collector
(Tr. 2)
Collector pin of UHF oscillator with
balance amplifier. Assemble LC
resonator with 3 pin through capacitor
------------~ 1 pF to oscillate with active feedback
6.25
Loop. Double balanced oscillator with
transistor 1 and transistor 2.
5
UB
Switching pin for VHF or UHF
operation.
------------UHF operation = 9.0 V
9.0
VHF operation = GND
6
OSC
output
Equivalent circuit
6.90
3
1
4 2
5
6.00
6.00
6.90
0.0
5.40
-------------
UHF and VHF oscillator output pin.
In case of F/S tuner application,
connected PLL synthesizer IC’s input
pin.
REG.
 From

 OSC
6
5.40
7
GND
0.0
-------------
VHF and UHF oscillators’ GND pin.
0.0
8
VOSC
base (Tr. 1)
3.50
Base pin of VHF oscillator with
- - - - - - - - - - - - - balance amplifier.
5.90
8 10
9
REG.
Grounded through capacitor ~ 10 pF.
9
VOSC
base (Tr. 2)
Base pin of VHF oscillator with
balance amplifier. Assemble LC
------------resonator with 10 pin to oscillate with
5.90
active feedback Loop.
10
VOSC
collector
(Tr. 1)
Base pin of VHF oscillator with
balance amplifier. Connected to LC
------------resonator through feedback capacitor
6.90
~ 3 pF.
3.50
6.20
Data Sheet P10194EJ3V0DS00
3
µPC2775GR/GS
Pin No.
11
12
Symbol
Pin voltage TYP.
above: V mode (V)
below: U mode (U)
IF
output
5.80
-------------
Equivalent circuit
Function and Explanation
IF output pins of VHF-UHF band
functions.
Higher output power can be obtained
by connecting registor (ex. 470 Ω) to
the ground.
13
11
12
5.65
13
VCC
9.0
------------9.0
14
15
16
-------------
MIX
output 2
-------------
VRF
input
(bypass)
17
7.05
MIX
output 1
VRF input
6.95
7.05
GND
20
URF input
(bypass)
URF input
From
2.75
VRF signal input pin from antenna.
17
16

 VHF
 OSC
2.80
2.75
------------0
------------–
------------2.65
–
-------------
Bypass pin for VHF MIX input.
Grounded through capacitor.
GND pin of MIX, IF amplifier and
regulator.
13
14 15
Bypass pin for UHF MIX input.
Grounded through capacitor.
URF signal input pin from antenna.
2.65
4
13 14 15
-------------
0
19
VHF and UHF MIX output pin.
These pins should be equipped with
tank circuit to adjust frequency.
6.95
2.80
18
Power supply for VHF-UHF band
functions.
Data Sheet P10194EJ3V0DS00
From
19
20

 UHF

OSC
µPC2775GR/GS
ABSOLUTE MAXIMUM RATINGS (TA = 25 °C)
µPC2775GR
PARAMETER
SYMBOL
RATING
UNIT
Supply voltage 1
VCC
11.0
V
Supply voltage 2
UB
11.0
V
Power dissipation
PD
500
mW
Operating temperature range
TA
–40 to +75
°C
Storage temperature range
Tstg
–60 to +150
°C
SYMBOL
RATING
UNIT
Supply voltage 1
VCC
11.0
V
Supply voltage 2
UB
11.0
V
Power dissipation
PD
700
mW
Operating temperature range
TA
–40 to +80
°C
Storage temperature range
Tstg
–60 to +150
°C
TEST CONDITION
TA = 75 °CNote 1
µPC2775GS
PARAMETER
TEST CONDITION
TA = 80 °CNote 1
Note 1 Mounted on 50 × 50 × 1.6 mm double copper epoxy glass board.
RECOMMENDED OPERATING RANGE
µPC2775GR
PARAMETER
SYMBOL
MIN.
TYP.
MAX.
UNIT
Supply voltage 1
VCC
8.0
9.0
10.0
V
Supply voltage 2
UB
8.0
9.0
10.0
V
Operating temperature range
TA
–20
+25
+75
°C
MIN.
TYP.
MAX.
UNIT
µPC2775GS
PARAMETER
SYMBOL
Supply voltage 1
VCC
8.0
9.0
10.0
V
Supply voltage 2
UB
8.0
9.0
10.0
V
Operating temperature range
TA
–20
+25
+80
°C
Data Sheet P10194EJ3V0DS00
5
µPC2775GR/GS
ELECTRICAL CHARACTERISTICS (TA = 25 °C, V CC = 9 V, Note 2)
µPC2775GR/GS
PARAMETER
SYMBOL
MIN.
TYP.
MAX.
UNIT
TEST CONDITIONS
Circuit Current 1
(VHF)
ICC1
27.0
35.0
44.0
mA
no input signal Note 3
Circuit Current 2
(UHF)
ICC2
28.0
36.0
45.0
mA
no input signal Note 3
Conversion Gain 1
(VHF(L))
CG1
18.5
22.0
25.5
dB
fRF = 55 MHz, Pin = –30 dBm
Conversion Gain 2
(VHF(M))
CG2
18.5
22.0
25.5
dB
fRF = 200 MHz, Pin = –30 dBm
Conversion Gain 3
(VHF(H))
CG3
18.5
22.0
25.5
dB
fRF = 470 MHz, Pin = –30 dBm
Conversion Gain 4
(UHF(L))
CG4
24.5
28.0
31.5
dB
fRF = 470 MHz, Pin = –30 dBm
Conversion Gain 5
(UHF(H))
CG5
24.5
28.0
31.5
dB
fRF = 890 MHz, Pin = –30 dBm
Noise Figure 1
(VHF(L))
NF1
–
10.0
13.0
dB
fRF = 55 MHz
Noise Figure 2
(VHF(M))
NF2
–
10.0
13.0
dB
fRF = 200 MHz
Noise Figure 3
(VHF(H))
NF3
–
10.0
13.0
dB
fRF = 470 MHz
Noise Figure 4
(UHF(L))
NF4
–
9.0
12.0
dB
f RF = 470 MHz
Noise Figure 5
(UHF(H))
NF5
–
10.0
13.0
dB
fRF = 890 MHz
Maximum Output Level 1
(VHF(L))
PO(SAT)1
4.0
7.0
–
dBm
fRF = 55 MHz, Pin = 0 dBm
Maximum Output Level 2
(VHF(M))
PO(SAT)2
4.0
7.0
–
dBm
fRF = 200 MHz, Pin = 0 dBm
Maximum Output Level 3
(VHF(H))
PO(SAT)3
4.0
7.0
–
dBm
fRF = 470 MHz, Pin = 0 dBm
Maximum Output Level 4
(UHF(L))
PO(SAT)4
3.5
6.5
–
dBm
fRF = 470 MHz, Pin = 0 dBm
Maximum Output Level 5
(UHF(H))
PO(SAT)5
3.5
6.5
–
dBm
fRF = 890 MHz, Pin = 0 dBm
Notes 2 By measurement circuit
3 no resistance of IF output
In case of R = 470 Ω;
VHF: 45.2 mA (TYP.),
UHF: 46.7 mA (TYP.)
STANDARD CHARACTERISTICS (TA = 25 °C, V CC = 9 V)
µPC2775GR/GS
PARAMETER
6
1 % Cross-Modulation
Distortion 1
(VHF(L))
1 % Cross-Modulation
Distortion 2
(VHF(M))
1 % Cross-Modulation
Distortion 3
(VHF(H))
1 % Cross-Modulation
Distortion 4
(UHF(L))
1 % Cross-Modulation
Distortion 5
(UHF(H))
SYMBOL
MIN.
TYP.
MAX.
UNIT
CM1
–
88.0
–
dBµ
fRF = 55 MHz, Pin = –30 dBm
CM2
–
88.0
–
dBµ
fRF = 200 MHz, Pin = –30 dBm
CM3
–
88.0
–
dBµ
fRF = 470 MHz, Pin = –30 dBm
CM4
–
83.0
–
dBµ
fRF = 470 MHz, Pin = –30 dBm
CM5
–
83.0
–
dBµ
fRF = 890 MHz, Pin = –30 dBm
Data Sheet P10194EJ3V0DS00
TEST CONDITIONS
µPC2775GR/GS
TYPICAL CHARACTERISTICS (TA = 25 °C) - on Measurement Circuit VCC - ICC
VCC - ICC
60
VHF
no input
signal
50
ICC – Circuit Current – mA
ICC – Circuit Current – mA
60
R = 470 Ω
40
30
R=∞
20
UHF
no input
signal
50
R = 470 Ω
40
30
R =∞
20
10
10
0
0
2
4
6
8
10
0
0
12
2
4
CG - fRF
CG – Conversion Gain – dB
NF – Noise Figure – dB
35
VCC = 9 V
fIF = 45 MHz
Pin = –30 dBm
CG
12
25
20
15
NF
10
0
UHF
–10
VHF
–20
VCC = 9 V
fIF = 45 MHz
POSC = –5 dBm
– 30
5
200
400
600
800
–40
–60
1 000
–50
–40
–30
–20
–10
0
10
Pin – Input Power – dBm
fRF – RF Frequency – MHz
fOSC - Vtu
CM - fRF
30
Vtu – Tuning Voltage – V
100
CM – 1% Cross-Modulation
Distortion – dBc
10
Pin - Pout
30
0
0
8
10
Pout – Output Power – dBm
40
6
VCC – Supply Voltage – V
VCC – Supply Voltage – V
90
80
VCC = 9 V
fIF = 45 MHz
PRF = –30 dBm
PLOC = –5 dBm
70
60
20
VL
VH
10
on application
circuit
0
0
200
400
600
800
1 000
U
0
fRF – RF Frequency – MHz
200
400
600
800
1 000
fOSC – OSC Frequency – MHz
Data Sheet P10194EJ3V0DS00
7
µPC2775GR/GS
MEASUREMENT CIRCUIT
URF IN
VRF IN
VCC
IF OUT
1 000
pF
470
1 000
pF
20
10 000
pF
1 000
pF
19
18
17
1 000
pF
16
1 000
pF
15
14
13
11
IF Amp.
V-RF
Pre Amp.
U-RF
Pre Amp.
12
MIX.
REG.
U-OSC
1
2
1 000
pF
3
1 000
pF
U-OSC
Buff.
V-OSC
Buff.
U-PSC
Amp.
V-PSC
Amp.
4
1 000
pF
5
6
1 000
pF
7
1 000
pF
V-OSC
8
9
1 000
pF
10
10 000
pF
VHF
UHF
1 000
pF
UOSC IN
8
UB
OSC OUT
Data Sheet P10194EJ3V0DS00
VOSC IN
1 000
pF
µPC2775GR/GS
APPLICATION CIRCUIT EXAMPLE
URF IN
VRF IN
VCC IF OUT
470
1000
pF
1.2 µH
470
50
1 000
pF
20
1 000
pF
19
1 000
pF
18
17
6 pF
1 000
pF
16
15
1 000
pF
14
13
12
11
IF Amp.
V-RF
Pre Amp.
U-RF
Pre Amp.
1 000
pF
MIX.
REG.
U-OSC
1
2
3
4
U-OSC
Buff.
V-OSC
Buff.
U-PSC
Amp.
V-PSC
Amp.
5
6
7
V-OSC
8
9
10
µ PC2775GR
1 pF
3 pF
1 pF
47 k
300
pF
300
pF
1T
363
6 pF
3T
1 000 10 pF
pF
200
pF
VHF
UHF
3T
1 000
pF
47 k
UB OSC OUT
Vtu
3 pF
1T
363
1T
363
47 k
3T
47 k
Vtu
1 000
pF
HB
47 k
5T
0.1 µF 1 000
pF
µ PC2775GS
LB
2.7 k
1
2
3
0.1 µF 1 000
pF
4
1 pF 12 pF 1 pF
47 k
300
pF
300
pF
12 pF
Data Sheet P10194EJ3V0DS00
9
µPC2775GR/GS
PACKAGE DIMENSIONS
20 PIN PLASTIC SSOP (225 mil) (UNIT: mm)
20
11
detail of lead end
+7˚
3˚–3˚
1
10
6.7 ± 0.3
6.4 ± 0.2
1.8 MAX.
4.4 ± 0.1
1.5 ± 0.1
1.0 ± 0.2
0.5 ± 0.2
0.15
0.65
+0.10
0.22 –0.05
0.10 M
0.15
+0.10
–0.05
0.575 MAX.
0.1 ± 0.1
NOTE Each lead centerline is located within 0.10 mm of its true position (T.P.) at maximum material condition.
10
Data Sheet P10194EJ3V0DS00
µPC2775GR/GS
20 PIN PLASTIC SOP (300 mil) (UNIT: mm)
20
11
detail of lead end
3° +7°
–3°
1
10
12.7±0.3
7.7±0.3
5.6±0.2
1.55±0.1
0.78 MAX.
1.27
1.1
0.6±0.2
+0.10
0.4±0.1
0.12
M
0.10
0.20 –0.05
0.1±0.1
1.8 MAX.
NOTE Each lead centerline is located within 0.12 mm of its true position (T.P.) at maximum material condition.
Data Sheet P10194EJ3V0DS00
11
µPC2775GR/GS
RECOMMENDED SOLDERING CONDITIONS
The following conditions (see table below) must be met when soldering this product.
Please consult with our sales offices in case other soldering process is used or in case soldering is done under
different conditions.
For details of recommended soldering conditions for surface mounting, refer to information document SEMICONDUCTOR
DEVICE MOUNTING TECHNOLOGY MANUAL (C10535E).
µPC2775GR/GS
Soldering process
Soldering conditions
Symbol
Infrared ray reflow
Peak package’s surface temperature: 235 °C or below,
Reflow time: 30 seconds or below (210 °C or higher),
Number of reflow process: 2, Exposure limitNote: None
IR35-00-2
VPS
Peak package’s surface temperature: 215 °C or below,
Reflow time: 40 seconds or below (200 °C or higher),
Number of reflow process: 2, Exposure limitNote: None
VP15-00-2
Partial heating method
Terminal temperature: 300 °C or below,
Flow time: 3 seconds or below,
Exposure limitNote: None
Note Exposure limit before soldering after dry-pack package is opened.
Storage conditions: 25 °C and relative humidity at 65 % or less.
Caution Do not apply more than single process at once, except for “Partial heating method”.
12
Data Sheet P10194EJ3V0DS00
µPC2775GR/GS
[MEMO]
Data Sheet P10194EJ3V0DS00
13
µPC2775GR/GS
[MEMO]
14
Data Sheet P10194EJ3V0DS00
µPC2775GR/GS
[MEMO]
Data Sheet P10194EJ3V0DS00
15
µPC2775GR/GS
NESAT (NEC Silicon Advanced Technology) is a trademark of NEC Corporation.
• The information in this document is subject to change without notice. Before using this document, please
confirm that this is the latest version.
• No part of this document may be copied or reproduced in any form or by any means without the prior written
consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in
this document.
• NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual property
rights of third parties by or arising from use of a device described herein or any other liability arising from use
of such device. No license, either express, implied or otherwise, is granted under any patents, copyrights or other
intellectual property rights of NEC Corporation or others.
• Descriptions of circuits, software, and other related information in this document are provided for illustrative
purposes in semiconductor product operation and application examples. The incorporation of these circuits,
software, and information in the design of the customer's equipment shall be done under the full responsibility
of the customer. NEC Corporation assumes no responsibility for any losses incurred by the customer or third
parties arising from the use of these circuits, software, and information.
• While NEC Corporation has been making continuous effort to enhance the reliability of its semiconductor devices,
the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or
property arising from a defect in an NEC semiconductor device, customers must incorporate sufficient safety
measures in its design, such as redundancy, fire-containment, and anti-failure features.
• NEC devices are classified into the following three quality grades:
"Standard", "Special", and "Specific". The Specific quality grade applies only to devices developed based on a
customer designated “quality assurance program“ for a specific application. The recommended applications of
a device depend on its quality grade, as indicated below. Customers must check the quality grade of each device
before using it in a particular application.
Standard: Computers, office equipment, communications equipment, test and measurement equipment,
audio and visual equipment, home electronic appliances, machine tools, personal electronic
equipment and industrial robots
Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster
systems, anti-crime systems, safety equipment and medical equipment (not specifically designed
for life support)
Specific: Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life
support systems or medical equipment for life support, etc.
The quality grade of NEC devices is "Standard" unless otherwise specified in NEC's Data Sheets or Data Books.
If customers intend to use NEC devices for applications other than those specified for Standard quality grade,
they should contact an NEC sales representative in advance.
M7 98.8