NEC UPC2794GS

DATA SHEET
BIPOLAR ANALOG INTEGRATED CIRCUIT
µPC2794GS
FREQUENCY DOWN CONVERTER FOR
VHF TO UHF BAND TV/VCR TUNER
DESCRIPTION
The µPC2794GS is a Silicon monolithic IC designed for TV/VCR tuner applications. This IC consists of a double
balanced mixer (DBM), local oscillator, preamplifier for precscaler operation, IF amplifier, regulator, UHF/VHF
switching circuit, and so on. This one-chip IC covers a wide frequency band from VHF to UHF bands. This IC is
packaged in 20-pin SOP (Small Outline Package) suitable for surface mounting.
FEATURES
• VHF to UHF bands operation.
• Low distortion
CM: VHF (@fRF = 470 MHz) 96 dBµ
• Supply voltage
: 9V
UHF (@fRF = 890 MHz) 92 dBµ
• Packaged in 20-pin SOP suitable for surface mounting
ORDERING INFORMATION
Part Number
µPC2794GS-E1
Package
Package Style
20-pin plastic SOP (300 mil)
Embossed tape 24 mm wide. 2.5 k/REEL.
Pin 1 indicates pull-out direction of tape
For evaluation sample order, please contact your local NEC office. (Part number for sample order: µPC2794GS)
Caution electro-static sensitive device
The information in this document is subject to change without notice. Before using this document, please
confirm that this is the latest version.
Not all devices/types available in every country. Please check with local NEC representative for availability
and additional information.
Document No. P11888EJ3V0DS00 (3rd edition)
Date Published October 1999 N CP(K)
Printed in Japan
The mark
shows major revised points.
©
1996,1999
µPC2794GS
PIN CONFIGURATION (Top View)
1
1.
2.
3.
4.
5.
6.
7.
8.
9.
10.
11.
12.
13.
14.
15.
16.
17.
18.
19.
20.
20
10
11
UHF OSC Collector
UHF OSC Base
UHF OSC Base
UHF OSC Collector
UB
OSC OUTPUT
GND
VHF OSC Base
VHF OSC Base
VHF OSC Collector
REG
IF OUTPUT
VCC
MIX OUTPUT
MIX OUTPUT
VHF RF INPUT
VHF RF INPUT
GND
UHF RF INPUT
UHF RF INPUT
INTERNAL BLOCK DIAGRAM
20
19
18
17
16
15
14
13
12
11
IF
Amp
REG.
U OSC
1
2
2
3
V OSC
4
5
6
7
Data Sheet P11888EJ3V0DS00
8
9
10
(Tr. 1)
(Tr. 2)
(Tr. 1)
(Tr. 2)
(Tr. 1)
(Tr. 2)
(Tr. 1)
µPC2794GS
PIN EXPLANATION
Pin No.
1
2
Symbol
Pin Voltage TYP.
above: VHF mode
below: UHF mode
UOSC
collector
(Tr. 1)
6.90
UOSC
base (Tr. 2)
6.00
6.25
3.90
3
UOSC
base (Tr. 1)
6.00
3.90
4
UOSC
collector
(Tr. 2)
6.90
6.25
5
UB
—
9.0
Function and Explanation
Equivalent Circuit
Collector pin of UHF oscillator.
Assemble LC resonator with 2
pin through capacitor ~ 1 pF to
oscillate with active feedback loop.
Base pin of UHF oscillator
with balance amplifier. Connected
to LC resonator through feedback
capacitor ~ 300 pF.
3
1
4
2
5
Base pin of UHF oscillator
with balance amplifier.
Connected to LC resonator
through feedback capacitor ~ 300 pF.
Collector pin of UHF oscillator
with balance amplifier. Assemble
LC resonator with 3 pin through
capacitor ~ 1 pF to oscillate with
active feedback loop.
Double balanced oscillator with
transistor 1 and transistor 2.
Switching pin for VHF or UHF
operation.
VHF operation = open
UHF operation = 9.0 V
6
OSC
output
5.40
UHF and VHF oscillator output
pin. In case of F/S tuner
application, connected PLL
symthesizer IC’s input pin.
8
GND
VOSC
base
(Tr. 1)
9
10
VOSC
base
(Tr. 2)
VOSC
collector
(Tr. 1)
0.0
GND pin of VHF and UHF
0.0
oscillator.
3.50
Base pin of VHF oscillator.
Grounded through capacitor ~
5.90
3.50
5.90
6.20
6.90
 from
 OSC

6
5.40
7
REG
8
10
9
REG
10 pF.
Base pin of VHF oscillator.
Assemble LC resonator with
10 pin to oscillate with active
feedback loop.
Collector pin of VHF oscillator.
Connected to LC resonator
through feedback capacitor ~
3 pF.
Data Sheet P11888EJ3V0DS00
3
µPC2794GS
Pin No.
11
12
Symbol
REG
IF output
Pin Voltage TYP.
above: VHF mode
below: UHF mode
Function and Explanation
6.90
Monitor pin of regulator output
6.90
voltage.
2.60
IF output pin of VHF-UHF
band functions.
Equivalent Circuit
13
12
2.60
13
14
15
16
VCC
9.0
Power supply pin for VHF-
9.0
UHF band functions.
MIX
7.10
VHF and UHF MIX output pins.
output1
7.00
These pins should be
MIX
7.10
output2
7.00
VRF input
(bypass)
2.75
VRF input
2.75
14 15
equipped with tank circuit to
adjust intermediate frequency.
Bypass pin for VHF MIX input.
Grounded through capacitor.



17
2.80
17
13
from
VHF
OSC
16
VRF signal input pin from
antenna.
2.80
18
GND
0.0
GND pin of MIX, IF amplifier
13
and regulator.
14
15
0.0
19
URF input
(bypass)
–
Bypass pin for UHF MIX input.
Grounded through capacitor.
19
2.65
20
URF input
–
URF signal input pin from
antenna.
2.65
4



Data Sheet P11888EJ3V0DS00
20
from
UHF
OSC
µPC2794GS
ABSOLUTE MAXIMUM RATINGS (TA = 25 °C unless otherwise specified)
Parameter
Symbol
Supply Voltage 1
VCC
Supply Voltage 2
UB
Condition
TA = 80
°C*1
Rating
Unit
11.0
V
11.0
V
700
mW
Power dissipation
PD
Operating ambient temperature
TA
–40 to +80
°C
Storage temperature
Tstg
–60 to +150
°C
*1 Mounted on 50 × 50 × 1.6 mm double copper epoxy glass board.
RECOMMENDED OPERATING RANGE
Parameter
Symbol
MIN.
TYP.
MAX.
Unit
Supply voltage 1
VCC
8.0
9.0
10.0
V
Supply voltage 2
UB
8.0
9.0
10.0
V
Operating ambient temperature
TA
–20
+25
+80
°C
ELECTRICAL CHARACTERISTICS (TA = 25 °C, VCC = 9 V, fIF = 45 MHz, Posc = –10 dBm)
Parameter
Symbol
Test Conditions
MIN.
TYP.
MAX.
Unit
Circuit Current 1
ICC1
@VHF, no input signal
*1
36.0
48.0
56.0
mA
Circuit Current 2
ICC2
@UHF, no input signal
*1
37.0
50.0
60.0
mA
Conversion Gain 1
CG1
fRF = 55 MHz, PRF = –30 dBm
*2
19.5
23.0
26.5
dB
Conversion Gain 2
CG2
fRF = 200 MHz, PRF = –30 dBm
*2
19.5
23.0
26.5
dB
Conversion Gain 3
CG3
fRF = 470 MHz, PRF = –30 dBm
*2
20.5
24.0
27.5
dB
Conversion Gain 4
CG4
fRF = 470 MHz, PRF = –30 dBm
*2
28.5
32.0
35.5
dB
Conversion Gain 5
CG5
fRF = 890 MHz, PRF = –30 dBm
*2
28.5
32.0
35.5
dB
Noise Figure 1
NF1
fRF = 55 MHz
*3
—
11.0
14.0
dB
Noise Figure 2
NF2
fRF = 200 MHz
*3
—
11.0
14.0
dB
Noise Figure 3
NF3
fRF = 470 MHz
*3
—
11.0
14.0
dB
Noise Figure 4
NF4
fRF = 470 MHz
*3
—
9.0
12.0
dB
Noise Figure 5
NF5
fRF = 890 MHz
*3
—
10.0
13.0
dB
Maximum Output Power 1
PO (sat)1
fRF = 55 MHz, PRF = 0 dBm
*2
10.0
13.0
—
dBm
Maximum Output Power 2
PO (sat)2
fRF = 200 MHz, PRF = 0 dBm
*2
10.0
13.0
—
dBm
Maximum Output Power 3
PO (sat)3
fRF = 470 MHz, PRF = 0 dBm
*2
10.0
13.0
—
dBm
Maximum Output Power 4
PO (sat)4
fRF = 470 MHz, PRF = 0 dBm
*2
10.0
13.0
—
dBm
Maximum Output Power 5
PO (sat)5
fRF = 890 MHz, PRF = 0 dBm
*2
10.0
13.0
—
dBm
*1 By measurement circuit 1
*2 By measurement circuit 2
*3 By measurement circuit 3
Data Sheet P11888EJ3V0DS00
5
µPC2794GS
STANDARD CHARACTERISTICS (Reference Values) (TA = 25 °C, VCC = 9 V)
Parameter
1 % cross-modulation distortion 1
1 % cross-modulation distortion 2
1 % cross-modulation distortion 3
1 % cross-modulation distortion 4
1 % cross-modulation distortion 5
Symbol
CM1
CM2
CM3
CM4
CM5
Test Conditions
fdes = 55 MHz, fundes = fdes + 6 MHz,
Pdes = –30 dBm, fIF = 45 MHz,
Posc = –10 dBm, AM 100 kHz, 30 %
modulation, DES/CM = 46 dBc
fdes = 200 MHz, fundes = f des + 6 MHz,
Pdes = –30 dBm, fIF = 45 MHz,
Posc = –10 dBm, AM 100 kHz, 30 %
modulation, DES/CM = 46 dBc
fdes = 470 MHz, fundes = f des + 6 MHz,
Pdes = –30 dBm, fIF = 45 MHz,
Posc = –10 dBm, AM 100 kHz, 30 %
modulation, DES/CM = 46 dBc
fdes = 470 MHz, fundes = f des + 6 MHz,
Pdes = –30 dBm, fIF = 45 MHz,
Posc = –10 dBm, AM 100 kHz, 30 %
modulation, DES/CM = 46 dBc
fdes = 890 MHz, fundes = f des + 6 MHz,
Pdes = –30 dBm, fIF = 45 MHz,
Posc = –10 dBm, AM 100 kHz, 30 %
modulation, DES/CM = 46 dBc
*1 By measurement circuit 4
6
Data Sheet P11888EJ3V0DS00
Value for Reference
Unit
100
dBµ
100
dBµ
96
dBµ
94
dBµ
92
dBµ
*1
*1
*1
*1
*1
µPC2794GS
TYPICAL CHARACTERISTICS
ICC vs. VCC
ICC vs. VCC
50
VHF no
input signal
70
measurement
circuit 1
60
ICC - Circuit Current - mA
ICC - Circuit Current - mA
80
50
40
30
20
10
0
0
2
4
6
8
TA = 80 °C
TA = 25 °C
TA = –20 °C
10
12
UHF no
input signal
70
measurement
circuit 1
60
50
40
30
20
10
0
0
VCC - Supply Voltage - V
2
4
6
VCC - Supply Voltage - V
Pout vs. Pin
Pout vs. Pin
20
20
VCC = 9 V
fRF = 470 MHz
fIF = 45 MHz
POSC = –10 dBm
10 measurement
circuit 2
Pout - Output Power - dBm
Pout - Output Power - dBm
8
0
–10
VCC = 9 V
fRF = 890 MHz
fIF = 45 MHz
POSC = –10 dBm
10 measurement
circuit 2
0
–10
TA = 80 °C
TA = 25 °C
TA = –20 °C
–20
–40
–30
–20
–10
0
TA = 80 °C
TA = 25 °C
TA = –20 °C
–20
–40
10
–30
–20
CM - 1 % Cross-modulation Distortion - dBµ
NF - Noise Figure - dB
CG - Conversion Gain - dB
VCC = 9 V
fIF = 45 MHz
PRF = –30 dBm
POSC = –10 dBm
30 measurement
circuit 2, 3
20
10
TA = 80 °C
TA = 25 °C
TA = –20 °C
400
600
0
10
800
1 000
CM vs. fRF
CG, NF vs. fRF
40
200
–10
Pin - Input Power - dBm
Pin - Input Power - dBm
0
0
TA = 80 °C
TA = 25 °C
TA = –20 °C
10
12
800
1 000
120
VCC = 9 V
fundes = fRF + 6 MHz
PRF = –30 dBm
fIF = 45 MHz
110 POSC = –10 dBm
measurement
circuit 4
100
90
TA = 80 °C
TA = 25 °C
TA = –20 °C
80
0
200
400
600
fRF - Input Frequency - MHz
fRF - Input Frequency - MHz
Data Sheet P11888EJ3V0DS00
7
µPC2794GS
STANDARD CHARACTERISTICS (by application circuit example)
Pout vs. Pin
CG, NF vs. fRF
20
VCC = 9 V
fIF = 45 MHz
PRF = –30 dBm
Pout - Output Power - dBm
CG - Conversion Gain - dB
NF - Noise Figure - dB
40
30
20
10
VCC = 9 V
fIF = 45 MHz
fRF = 802 MHz
10
fRF = 362 MHz
0
–10
VCC = 9 V
fIF = 45 MHz
0
0
200
400
600
800
–20
–40
1 000
fRF - Input Frequency - MHz
–30
–20
–10
0
10
Pin - Input Power - dBm
CM vs. fRF
6 Channel Beat
110
20
Pout - Output Power - dBm
CM - 1 % Cross Modulation
Distortion - dBµ
10
100
90
VCC = 9 V
fundes = fRF + 6 MHz
fIF = 45 MHz
PRF = –30 dBm
80
0
200
400
0
–10
–20
–30
–40
VCC = 9 V
fP = 83.25 MHz
fS = 87.75 MHz
fOSC = 129 MHz
–50
–60
600
800
–70
–40
1 000
fRF - Input Frequency - MHz
–30
Vtu vs. fOSC
30
Vtu - Tuning Voltage - V
25
20
VL
VH
U
15
10
5
0
0
200
400
600
800
fOSC - OSC Frequency - MHz
8
–20
–10
Pin - Input Power - dBm
Data Sheet P11888EJ3V0DS00
1 000
0
µPC2794GS
INPUT IMPEDANCE (by measurement circuit 5)
<VRF INPUT: 17 PIN>
1 45 MHz
931.31Ω −247.16Ω
2 200 MHz
358.08Ω −395.55Ω
3 470 MHz
95.062Ω −184.34Ω
3
START
STOP
1
2
0.045000000 GHz
0.500000000 GHz
<URF INPUT: 20 PIN>
1 400 MHz
71.531Ω −178.98Ω
2 600 MHz
31.352Ω −96.094Ω
3 890 MHz
10.85Ω −42.965Ω
1
3
START
STOP
2
0.400000000 GHz
1.000000000 GHz
Data Sheet P11888EJ3V0DS00
9
µPC2794GS
OUTPUT IMPEDANCE (by measurement circuit 5)
<IF OUTPUT: 12 PIN>
1 45 MHz
28.862Ω 13.361Ω
1
START
STOP
10
0.045000000 GHz
0.065000000 GHz
Data Sheet P11888EJ3V0DS00
µPC2794GS
MEASUREMENT CIRCUIT 1
OPEN
VCC(9V)
OPEN
1000
pF
1000
pF
1000
pF
20
1000
pF
19
18
17
OPEN
1000
1000
pF
pF
20T
27 pF
16
15
1000
pF
14
13
12
11
REG
1
2
3
4
5
6
7
9
1000
pF
1000
pF
1000
pF
8
1000
pF
10
1000
pF
1000
pF
OPEN
5pin Voltage
OPEN
OPEN
UB(9V)
VHF
OPEN
UHF
9V
MEASUREMENT CIRCUIT 2
SG1
VHF
Spectrum
Analyzer
UHF
1000
pF
1000
pF
1000
pF
20
19
1000
pF
18
17
16
1000
pF
20T
27 pF
15
14
13
1000
pF
1000
pF
12
11
REG
1
1000
pF
2
3
4
5
6
7
1000
pF
1000
pF
8
9
1000
pF
1000
pF
OPEN
10
5pin Voltage
1000
pF
VHF
OPEN
UHF
9V
VHF
SG2
UHF
Data Sheet P11888EJ3V0DS00
11
µPC2794GS
MEASUREMENT CIRCUIT 3
Noise
Meter
VCC(9V)
Noise
Source
VHF
1000
pF
UHF
1000
pF
1000
pF
20
1000
pF
19
18
17
BPF
1000
1000
pF
pF
1000
pF
20T
27 pF
16
15
14
13
12
11
REG
1
2
3
4
5
6
7
8
9
1000
pF
1000
pF
1000
pF
1000
pF
1000
pF
10
OPEN
5pin Voltage
VHF
OPEN
UHF
9V
VHF
SG1
UB(9V)
UHF
MEASUREMENT CIRCUIT 4
MIX PAD
VHF
Spectrum
Analyzer
UHF
1000
pF
SG1
desire
SG2
1000
pF
1000
pF
20
19
1000
pF
18
17
16
1000
1000
pF
pF
1000
pF
20T
27 pF
15
14
13
12
11
undesire
REG
1
2
3
4
5
6
7
8
1000
pF
1000
pF
1000
pF
1000
pF
9
10
5pin Voltage
1000
pF
OPEN
VHF
SG3
UHF
12
Data Sheet P11888EJ3V0DS00
VHF
OPEN
UHF
9V
µPC2794GS
MEASUREMENT CIRCUIT 5
Network
Analyzer
VCC(9V)
1000
pF
1000
pF
1000
pF
20
19
1000
pF
1000
pF
18
17
1000
pF
1000
pF
16
15
14
13
12
11
REG
1
2
3
4
5
6
7
8
1000
pF
1000
pF
1000
pF
1000
pF
9
10
1000
pF
5pin Voltage
OPEN
OPEN
OPEN
UB(9V)
Data Sheet P11888EJ3V0DS00
VHF
OPEN
UHF
9V
13
µPC2794GS
APPLICATION CIRCUIT EXAMPLE
URF IN
VRF IN
VCC
1 000
pF
1 000
pF
1 000
pF
19
18
17
1 000
pF
20T
1 000
pF
27pF
1 000
pF
20
IF OUT
16
15
14
1 000
pF
13
12
11
REG.
1
4 pF
2
1 pF
360 pF
Vtu
47 k
3
3 pF
6 pF
4
5
6
7
1 pF
9
10
10 pF 200 pF
3 pF
1 000
pF
360 pF
8 pF
8
47 k
75
47 k
47 k
0.5 pF
4T
OSC
OUT
2T
1T363
1T363 × 2
1 000
pF
Vtu
47 k
82 pF
1 000 pF
HB
47 k
UB
7T
1 000 pF
LB
1 000 pF
2.7 k
The application circuits and their parameters are for reference only and are not intended for use in actual design-ins.
14
Data Sheet P11888EJ3V0DS00
µPC2794GS
OSC OUT
VLO IN
URF IN
µPC2794GS
IF OUT
VRF IN
ILLUSTRATION OF THE EVALUATION BOARD FOR APPLICATION CIRCUIT EXAMPLE (Surface)
A
ULO IN
1
1000p
B
Data Sheet P11888EJ3V0DS00
15
µPC2794GS
ILLUSTRATION OF THE EVALUATION BOARD FOR APPLICATION CIRCUIT EXAMPLE (Back side)
Vtu
A
B
1000p
1000p
1000p
6p,8p
4p
47k
1p
360p
1T363
3p
0.5p
1p
20T
360p
47k
2T
1000p
27p
1000p
VCC
10p
1T363×2
3p
200p
47k 82p
75
1000p
47k
4T
47k
1000p
7T
2.7k 1000p
1000p
47k
1000p
16
⋅
represents cutout
⋅
represents short-circuit strip
1000p
LB
HB
Data Sheet P11888EJ3V0DS00
UB
µPC2794GS
PACKAGE DIMENSIONS
20 PIN PLASTIC SOP (300 mil) (UNIT: mm)
20
11
detail of lead end
3° +7°
–3°
1
10
12.7±0.3
7.7±0.3
5.6±0.2
1.55±0.1
0.78 MAX.
1.27
1.1
0.6±0.2
+0.10
0.4±0.1
0.12
M
0.10
0.20 –0.05
0.1±0.1
1.8 MAX.
NOTE Each lead centerline is located within 0.12 mm of its true position (T.P.) at maximum material condition.
Data Sheet P11888EJ3V0DS00
17
µPC2794GS
NOTE ON CORRECT USE
(1) Observe precautions for handling because of electro-static sensitive devices.
(2) Form a ground pattern as widely as possible to minimize ground impedance (to prevent undesires oscillation).
(3) Keep the track length of the ground pins as short as possible.
(4) A low pass filter must be attached to VCC line.
(5) A matching circuit must be externally attached to output port.
RECOMMENDED SOLDERING CONDITIONS
The following conditions (see table below) must be met when soldering this product.
Please consult with our sales officers in case other soldering process is used or in case soldering is done under
different conditions.
For details of recommended soldering conditions for surface mounting, refer to information document
SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL (C10535E).
µPC2794GS
Soldering Process
Soldering Conditions
Symbol
Infrared ray reflow
Peak package’s surface temperature: 235 °C or below,
Reflow time: 30 seconds or below (210 °C or higher),
Number of reflow process: 3, Exposure limit*1: None
IR35-00-3
VPS
Peak package’s surface temperature: 215 °C or below,
Reflow time: 40 seconds or below (200 °C or higher),
VP15-00-3
Number of reflow process: 3, Exposure limit*1: None
Partial heating method
*1
Terminal temperature: 300 °C or below,
Flow time: 3 seconds or below,
Exposure limit*1: None
Exposure limit before soldering after dry-pack package is opened.
Storage conditions: 25 °C and relative humidity at 65 % or less.
Caution Do not apply more than single process at once, except for “Partial heating method”.
18
Data Sheet P11888EJ3V0DS00
µPC2794GS
[MEMO]
Data Sheet P11888EJ3V0DS00
19
µPC2794GS
NESAT (NEC Silicon Advanced Technology) is a trademark of NEC Corporation.
• The information in this document is subject to change without notice. Before using this document, please
confirm that this is the latest version.
• No part of this document may be copied or reproduced in any form or by any means without the prior written
consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in
this document.
• NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual
property rights of third parties by or arising from use of a device described herein or any other liability arising
from use of such device. No license, either express, implied or otherwise, is granted under any patents, copyrights
or other intellectual property rights of NEC Corporation or others.
• Descriptions of circuits, software, and other related information in this document are provided for illustrative
purposes in semiconductor product operation and application examples. The incorporation of these circuits,
software, and information in the design of the customer's equipment shall be done under the full responsibility
of the customer. NEC Corporation assumes no responsibility for any losses incurred by the customer or third
parties arising from the use of these circuits, software, and information.
• While NEC Corporation has been making continuous effort to enhance the reliability of its semiconductor devices,
the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or
property arising from a defect in an NEC semiconductor device, customers must incorporate sufficient safety
measures in its design, such as redundancy, fire-containment, and anti-failure features.
• NEC devices are classified into the following three quality grades:
"Standard", "Special", and "Specific". The Specific quality grade applies only to devices developed based on a
customer designated “quality assurance program“ for a specific application. The recommended applications of
a device depend on its quality grade, as indicated below. Customers must check the quality grade of each device
before using it in a particular application.
Standard: Computers, office equipment, communications equipment, test and measurement equipment,
audio and visual equipment, home electronic appliances, machine tools, personal electronic
equipment and industrial robots
Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster
systems, anti-crime systems, safety equipment and medical equipment (not specifically designed
for life support)
Specific: Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life
support systems or medical equipment for life support, etc.
The quality grade of NEC devices is "Standard" unless otherwise specified in NEC's Data Sheets or Data Books.
If customers intend to use NEC devices for applications other than those specified for Standard quality grade,
they should contact an NEC sales representative in advance.
M7 98.8