NEC UPC8001GR

DATA SHEET
BIPOLAR ANALOG INTEGRATED CIRCUIT
µPC8001
IF AMPLIFIER IC
WITH ON-CHIP MIXER FOR DIGITAL CELLULAR PHONES
The µPC8001 is a 3-volt IF amplifier IC with an on-chip mixer developed for digital cellular phones.
The µPC8001 consists of a high-sensitivity limiter amplifier with an input frequency of 455 kHz, a high-speed
and high-precision linear RSSI (received signal strength indicator ), and a second mixer with an input frequency
of 80 to 150 MHz.
The µPC8001 features a low 3 mA (TYP.) and 2.2 µA (TYP.) current consumption at normal operation and
power-OFF, respectively. Its high-speed charge/discharge circuit enables fast power-ON/OFF switching.
The µPC8001 boasts an extremely small size packaged in a 14-pin plastic shrink SOP, and low external
capacitances of less than 0.01 µF, in addition to an on-chip RSSI output resistor, and is most suitable for
high-density mounting.
FEATURES
• Low-voltage operation…3 V ±10%
• Low power consumption…(VCC = 3 V)
Mixer
IF amp. + RSSI
During operation
2.1 mA (TYP.)
0.95 mA (TYP.)
At power-OFF
0 µA (TYP.)
2.2 µA (TYP.)
• High limiting sensitivity…–91 dBm (TYP.)
• High-precision RSSI linearity…±0.5 dB (TYP.) (VIF IN = –86 to –6 dBm)
• High-speed RSSI response time
RSSI output rise time
77µs (TYP.)
RSSI output fall time
113 µs (TYP.)
• High-speed power-ON/OFF switching time
Rise time at power-ON
174 µs (TYP.)
Fall time at power-OFF
3 µs (TYP.)
• External capacitors of less than 0.01 µF
• On-chip RSSI output resistor (34 kΩ)
• Ultra-compact package…14-pin plastic shrink SOP
The information in this document is subject to change without notice.
Document No. IC-3426
(O.D.No. IC-8949)
Date Published February 1995 P
Printed in Japan
The mark ★ shows revised points.
©
©
1994, 1995
1992
µPC8001
ORDERING INFORMATION
Part number
µPC8001GR
Package
14-pin plastic shrink SOP (225 mil)
14-pin plastic shrink SOP (225 mil)
µPC8001GR-E1
Embossed carrier taping (Pin 1 located toward tape unwind
direction)
14-pin plastic shrink SOP (225 mil)
µPC8001GR-E2
Embossed carrier taping (Pin 1 located toward tape wind
direction)
2
µPC8001
BLOCK DIAGRAM
Antenna
1 st L-osc
1.5 GHz
or 900 MHz
RF
Amp
1 st Mixer
130 MHz
BPF
455 kHz
BPF Note
2 nd L-osc
129.545 MHz
RM
1.4 kΩ
CIF
CFL3
0.01 µ F
0.01 µ F 0.01 µ F
0.01 µ F 0.01 µ F 0.01 µ F
0.01 µ F
11
13
9
8
4
6
14
IF IN
FIL3
FIL2
OSC IN MIX IN2 MIX IN1 MIX OUT
COS
CM2
CM1
CM0
2 nd
Mixer
CFL2
CFL1
0.01 µ F
7
FIL1
IF
Amp
1 IF OUT
RSSI
3
RSSI OUT
1000 pF
CRS
12
2
VCC1
PD
5
10
VCC2 GND
Note Input/output impedance of 455 kHz BPF: 1.5 k Ω
3
µPC8001
CONTENTS
1. PIN CONFIGURATION AND PIN FUNCTIONS ............................................................................... 5
2. I/O EQUIVALENT CIRCUIT ............................................................................................................... 7
3. ELECTRICAL SPECIFICATIONS ........................................................................................................ 8
4. CHARACTERISTIC CURVES ........................................................................................................... 14
5. TEST CIRCUIT EXAMPLE ............................................................................................................... 18
6. PACKAGE DRAWINGS .................................................................................................................... 19
7. RECOMMENDED SOLDERING CONDITIONS ............................................................................ 20
4
µPC8001
1.
PIN CONFIGURATION AND PIN FUNCTIONS
(1)
PIN CONFIGURATION (Top View)
•
14-pin plastic shrink SOP (225 mil)
1
14
MIX IN1
PD
2
13
MIX IN2
RSSI OUT
3
12
VCC1
FIL3
4
11
OSC IN
VCC2
5
10
GND
IF IN
6
9
MIX OUT
FIL1
7
8
FIL2
FIL1-FIL3
µ PC8001GR
IF OUT
: Filter
GND
: Ground
IF IN
: Intermediate Frequency Input
IF OUT
: Intermediate Frequency Output
MIX IN1, MIX IN2 : Mixer Input
MIX OUT
: Mixer Output
OSC IN
: Oscillator Input
PD
: Power Down
RSSI OUT
: Received Signal Strength Indicator Output
V CC1 , V CC2
: Power Supply
5
µPC8001
(2)
PIN FUNCTIONS
Number
6
Pin Name
I/O
Function
1
IF OUT
O
IF amplifier output
2
PD
I
Power-ON/OFF control signal input
High level: Power-ON; Low level: Power-OFF
3
PSSI OUT
O
RSSI output
4
FIL3
—
Connect capacitor for filter.
5
VCC2
—
IF amplifier and RSSI power pin
6
IF IN
I
7
FIL1
—
Connect capacitor for filter.
8
FIL2
—
Connect capacitor for filter.
9
MIX OUT
O
Mixer output
10
GND
—
Ground pin
11
OSC IN
12
VCC1
13
MIX IN2
I
Connect capacitor for filter.
14
MIX IN1
I
Mixer input
IF amplifier input
I
Oscillator input
—
Mixer power pin
µPC8001
2.
I/O EQUIVALENT CIRCUIT
Mixer input
IF amplifier output
5 kΩ
5 kΩ
1
75 µA
14
13
Oscillator input
RSSI output
V CC2
5 kΩ
34 kΩ
3
5 kΩ
500 Ω
11
IF amplifier input
Power-ON/OFF input
300 kΩ
6
4
150 kΩ
1.5 kΩ
2
7
8
50 kΩ
Mixer output
9
400 µA
7
µPC8001
3.
ELECTRICAL SPECIFICATIONS
Absolute Maximum Ratings (TA = 25°C)
Parameter
Symbol
Conditions
Rating
Unit
Supply voltage
VCC
7
V
Total power dissipation
PT
300
mW
Operating ambient temperature
TA
–30 to +85
°C
Storage temperature
Tstg
–40 to +125
°C
Caution
Exposure to Absolute Maximum Ratings for extended periods may affect device reliability;
exceeding the ratings could cause permanent damage. The parameters apply independently.
The device should be operated within the limits specified under DC and AC Characteristics.
Recommended Operating Conditions (TA = 25°C)
Parameter
Symbol
Supply voltage
VCC
Mixer input level
VMIX IN
Conditions
See Figure 3-1.
50 Ω termination
LC matching
TYP.
MAX.
Unit
2.7
3.0
3.3
V
–20
dBmNote1
–100
–113Note2
IF amplifier input level
VIF IN
–86
Oscillator input level
VOSC IN
–30
IF amplifier input frequency
fIF IN
Mixer input frequency
Mixer output frequency
–33Note2 dBmNote1
–6
dBmNote1
–15
–5
dBmNote1
400
455
500
kHz
fMIX IN
80
130
150
MHz
fMIX OUT
400
455
500
kHz
Notes 1. Assuming a conversion value of 50 Ω, 0 dBm = 0.2236 Vrms.
2. Depends on board wiring pattern, use as reference value.
8
MIN.
µPC8001
ELECTRICAL CHARACTERISTICS
(TA = 25°C, VCC1 = VCC2 = 3 V, fMIX IN = 130 MHz, fOSC IN = 129.545 MHz, fIF IN = 455 kHz, CRS = 1000pF, COS = CM1
= CM2 = CM0 = CIF = CFL1 = CFL2 = CFL3 = 0.01µF, 0 dBm = 0.2236 Vrms)
(1)
Mixer
Parameter
Supply current
Symbol
ICC1
Conditions
No signal
VMIN IN = –50dBm
Conversion gain
CG
–1dB compression output level
IC3
VOMIX
50Ω termination
TYP.
MAX.
Unit
2.1
3.0
mA
20
23
15
dB
VOSC IN = –15 dBm
See Figure 3-1.
Third order intercept
MIN.
LC matching
See Figure 3-2.
VOSC IN=–15dBm
33
Note 1
–13
–8
dBm
–5
0
dBm
200
470
MHz
See Figure 3-3.
Cut-off frequency
fC
Noise figure
NF
Local isolation
ISL
Mixer input impedance
–3 dB point
See Figure 3-6.
10
dB
26
dB
ZIM
48-j383
Ω
Local input impedance
ZIL
80-j425
Ω
Output resistance
ROM
Power-ON rise time
Note2
tONM
20
Note 1
60
VON = 3 V
120
180
Ω
33
600
µs
3
200
µs
0
10
µA
Rise time of PD signal : 10 ns
Power-OFF fall time
Note3
tOFM
VOF = 0 V
Fall time of PD signal : 10 ns
Power-OFF supply current
ILM
VOF = 0 V
Notes 1. Depends on board wiring pattern, use as reference value.
2. Time until DC voltage of mixer output reaches ±10% of power-ON value.
3. Time until supply current reaches 10% of power-ON value.
(2)
Power-ON/OFF
Parameter
Symbol
Conditions
Power-ON input voltage
VON
Power-ON over VON and under VCC
Power-OFF input voltage
VOF
Power-OFF over GND and under VOF
Power-ON input current
ION
VON = 3 V
MIN.
TYP.
1.2
0.6
MAX.
2.4
1.2
48
Unit
V
V
75
µA
9
µPC8001
(3)
IF Amplifier/RSSI
Parameter
★
Symbol
Conditions
Supply current
ICC2
No signal
IF amplifier output amplitude
VO
VIF IN = –20 dBm
Limiting sensitivity
LS
–3dB point, see Figure 4-5.
IF amplifier input impedance
ZIN
IF amplifier phase variation
∆φ
VIF IN =–86 to –6 dBm
See Figure 4-6 Note1.
RSSI linearity
LRS
VIF IN = –86 to –6 dBm
Recursive calculation
with VIF IN = –60 to –6 dBm
RSSI slope
SLRS
Recursive calculation
with VIF IN = –60 to –6 dBm
RSSI intercept
ICRS
RSSI output voltage1
MIN.
1.2
1.2
TYP.
MAX.
Unit
0.95
1.3
mA
1.5
1.8
Vp-p
–91
–86
dBm
1.5
1.8
kΩ
11
deg
±0.5
±2
dB
22.3
24.4
30.1
mV/dB
Recursive calculation
with VIF IN = –60 to –6 dBm
See Figure 3-4.
–135
–118
–104
dBm
VR1
VIF IN = –86 dBm
0.50
0.79
0.98
V
RSSI output voltage 2
VR2
VIF IN = –46 dBm
1.60
1.79
1.90
V
RSSI output voltage 3
VR3
VIF IN = –6 dBm
2.70
2.75
2.82
V
RSSI output temperature stability
ST
VIF IN = –86 to –6 dBm,
TA = –30 to +85 °C
1
★
RSSI rise time
trRS
VIF IN = –6 dBm
See Figure 3-5.
77
300
µs
★
RSSI fall time
tfRS
VIF IN = –6 dBm
See Figure 3-5.
113
300
µs
★
RSSI output ripple
VRRS
VIF IN = –6 dBm
3
12
mVp-p
★
★
dB
ILI
VOF = 0 V
2.2
10
µA
Note2
tONI
VON = 3 V, VIF IN = –86 dBm
PD signal rise time: 10 ns
174
600
µs
Power-OFF fall time Note3
tOFI
VOF = 0 V
PD signal fall time: 10 ns
3
200
µs
IF amplifier output slew rate
SRO
Power-OFF supply current
Power-ON rise time
VIF IN = –20 dBm
Rise
Fall
RSSI output resistance
★
Note4
R OR
Notes 1. Use the network analyzer at RBW = 3 Hz.
2. Time until RSSI output reaches ±10% of power-ON value.
3. Time until supply current reaches 10% of power-ON value.
4. Rise: 10% to 90%
5. Fall:
10
90% to 10%
3.4
Note5
V/µs
3.8
27
34
41
kΩ
µPC8001
Figure 3-1.
Mixer Input
(a) 50Ω Termination
VMIX IN
0.01µ F
(b) LC Matching
VMIX IN
5 pF
Note
0.01µ F
14 MIX IN1
14 MIX IN1
Note
50Ω
107 nH
Note The values L and C are affected by the parasitic capacitance and inductance of the board. Therefore,
adjust L and C so that the impedance at the MIX IN pin from the signal source equals 50Ω.
Remark The signal source impedance is 50Ω.
Figure 3-2. Third Order Intercept
MIX IN1
MIX OUT
OSC IN
14
9
11
VOSC IN = –15 dBm
0.01µ F
0.01µ F
0.01µ F
50 Ω
1.5 kΩ
50 Ω
16.7 Ω
Measure 455 kHz component
level with spectrum analyzer
fOSC IN = 129.545 MHz
16.7 Ω
16.7 Ω
f1
f2
f1 = 130.1 MHz, f2 = 130.2 MHz
VMIX OUT [dBm]
f = 130 MHz
6 dB/OCT
f1 = 130.1 MHz
f2 = 130.2 MHz
18 dB/OCT
VMIX IN [dBm]
Third order intercept
Remark Signal source impedance is 50Ω.
11
µPC8001
Figure 3-4. RSSI Intercept
RSSI output VORS [V]
VMIX OUT [dBm]
Figure 3-3. –1 dB Compression Output Level
1 dB
VOMIX
V MIX IN [dBm]
IF input level VIF IN [dBm]
RSSI intercept
Figure 3-5. RSSI Response Time
IF output
90%
RSSI output
10%
t rRS
12
t fRS
µPC8001
Figure 3-6.
28 V
Noise Figure Measurement
5 pF 0.01µF
SW
Noise source
HP346B
14
MIX IN1
11
OSC IN
107 nH
0.01µF
50 Ω
47 dB
Spectrum
analyzer
RF
Amp
3 kΩ 0.01µF
9
MIX OUT
HP8447F
The noise figure is calculated as follows:
NF = ENR – 10 log (Y – 1)
NF (dB):
Noise figure
ENR (dB): ENR of noise source
N 2 –N 1
10
Y: Y = 10
N 1 (dBm): Spectrum analyzer indication value at SW OFF.
N 2 (dBm): Spectrum analyzer indication value at SW ON.
Remark This measurement measures DSB. To measure SSB, add 3 dB to NF above.
13
µPC8001
4.
CHARACTERISTIC CURVES
Figure 4-1.
Mixer Supply Current vs. Supply Voltage
4
Supply current ICC1 [mA]
3
2
1
Recommended operating range
0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
Supply voltage VCC1 [V]
Figure 4-2.
Mixer Output Level vs. Mixer Input Level
(fMIX IN= 130 MHz, fOSC IN = 129.545 MHz, fMIX OUT = 455 kHz, VOSC IN = –15 dBm)
+20
+10
Mixer output level VMIX OUT [dBm]
0
–10
–20
–30
–40
–50
–60
–70
–80
–80
–70
–60
–50
–40
–30
Mixer input level VMIX IN [dBm]
14
–20
–10
0
µPC8001
Figure 4-3.
Mixer Conversion Gain vs. Mixer Input Frequency
(VMIX IN= –30 dBm, VOSC IN = –15 dBm, fOSC IN = fMIX IN – fMIX OUT, fMIX OUT = 455 kHz)
20
3 dB
10
10
100
200
500
700
1000
Mixer input frequency fMIX IN [MHz]
Figure 4-4. IF Amplifier/RSSI Supply Current vs. Supply Voltage
2.0
1.8
1.6
Supply current ICC2 [mA]
Mixer conversion gain CG [dB]
30
1.4
1.2
1.0
0.8
0.6
Recommended operating range
0.4
0.2
0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
Supply voltage VCC2 [V]
15
µPC8001
Figure 4-5.
IF Amplifier Output Level vs. IF Amplifier Input Level
+30
IF amplifier output level VIF OUT [dBm]
+20
+10
3dB
0
–10
–20
–30
Limitting sensitivity (–91 dBm)
–110
–100
–90
–80
–70
–60
–50
–40
–30
–20
–10
0
–10 –6
0
IF amplifier input level VIF IN [dBm]
Figure 4-6.
IF Amplifier Output Phase vs. IF Amplifier Input Level
IF amplifier output phase φ
IF OUT
[deg]
250
∆ φ = 11 deg TYP.
240
230
–90 –86
–80
–70
–60
–50
–40
–30
IF amplifier input level VIF IN [dBm]
16
–20
µPC8001
Figure 4-7.
★
RSSI Output Voltage vs. IF Amplifier Input Level
(The temperature characteristics curves)
3.0
2.5
RSSI output voltage VORS [V]
2.0
1.5
1.0
0.5
0
–120
–110
–100
–90
–80
–70
–60
–50
–40
–30
–20
–10
0
IF amplifier input level VIF IN [dBm]
TA = –30 °C
TA = +25 °C
TA = +85 °C
2. The three temperature characteristic curves are virtually identical.
Remarks 1.
17
µPC8001
★
5. TEST CIRCUIT EXAMPLE
50 Ω
50 Ω
1µF
0.01µF
1.5 kΩ
1000 +
pF
3V
0.01µ F
0.01µ F
0.01µ F
0.01µ F
14
13
12
11
10
9
8
MIX IN1
MIX IN2
VCC1
OSC IN
GND
MIX OUT
FIL2
IF IN
FIL1
6
7
µ PC8001GR
IF OUT
PD
1
2
RSSI OUT
FIL3
3
V
4
CC2
5
0.01µ F
0.01µ F
50 kΩ
3V
Note
10 pF
1000 pF
0.01µ F
+
1000 1µF
pF
3V
0.01µ F
50 Ω
Note The value of the capacitance connected to the IF OUT pin (No. 1) includes the capacitances of PCB
wiring patterns and the tester.
Remark In three cases of Mixer Input, Third Order Intercept and Noise Figure Measurement, refer to
Figures 3-1, 3-2, and 3-6.
18
µPC8001
PACKAGE DRAWINGS
14 PIN PLASTIC SHRINK SOP (225 mil)
14
8
5˚±5˚
detail of lead end
1
7
A
H
I
G
J
E
K
F
6.
B
C
D
L
N
M M
P14GM-65-225B-2
NOTE
Each lead centerline is located within 0.10
mm (0.004 inch) of its true position (T.P.) at
maximum material condition.
ITEM
MILLIMETERS
INCHES
A
5.40 MAX.
0.213 MAX.
B
0.75 MAX.
0.030 MAX.
C
0.65 (T.P.)
0.026 (T.P.)
D
0.30 +0.10
–0.05
0.012+0.004
–0.003
E
0.125 ± 0.075
0.005 ± 0.003
F
1.8 MAX.
0.071MAX.
G
1.44
0.057
H
6.2 ± 0.3
0.244 ± 0.012
I
4.4
0.173
J
0.9
0.035
K
0.15 +0.10
–0.05
0.006+0.004
–0.002
L
0.5 ± 0.2
0.020 –0.009
M
0.10
0.004
N
0.10
+0.008
0.004
19
µPC8001
7.
RECOMMENDED SOLDERING CONDITIONS
The following conditions must be met for soldering conditions of the
µ PC8001. For more details,
refer to our document “SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL” (IEI-1207).
Please consolt with our sales offices in case other soldering process is used, or in case the soldering is
done under different conditions.
Types of Surface Mount Device
µ PC8001GR: 14-pin plastic shrink SOP (225 mil)
Soldedering process
Infrared ray reflow
Soldering conditions
Peak temperature of package surface: 235 ˚C or below,
Reflow time: 30 seconds or below (210 ˚C or higher),
Number of reflow processes: MAX. 2
Symbol
IR35-107-2
[Remark]
(1) Please start the second reflow process after the temperature,
raised by the first reflow process, returns to normal.
(2) Please avoid removing the residual flux with water after the
first reflow process.
Partial heating
method
20
Terminal temperature: 300 ˚C or below,
Time: 3 seconds or below (Per one side of the device).
———
µPC8001
Precautions Against Static Electricity
Caution
When handling the device, be careful to protect it from static electricity. exposure to a strong
static electricity charge may destroy internal transistor junctions. During transportation and
storage, place the device in the conductive tray or case originally provided by NEC for shipping,
or conductive shock absorbing material, metal case, etc. During assembly, be sure to ground
the device. Be careful not to place the device on a plastic board and do not touch the device's
pins.
21
µPC8001
[MEMO]
No part of this document may be copied or reproduced in any form or by any means without the prior written
consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in this
document.
NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual
property rights of third parties by or arising from use of a device described herein or any other liability arising
from use of such device. No license, either express, implied or otherwise, is granted under any patents,
copyrights or other intellectual property rights of NEC Corporation or others.
While NEC Corporation has been making continuous effort to enhance the reliability of its semiconductor devices,
the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or
property arising from a defect in an NEC semiconductor device, customer must incorporate sufficient safety
measures in its design, such as redundancy, fire-containment, and anti-failure features.
NEC devices are classified into the following three quality grades:
“Standard“, “Special“, and “Specific“. The Specific quality grade applies only to devices developed based on
a customer designated “quality assurance program“ for a specific application. The recommended applications
of a device depend on its quality grade, as indicated below. Customers must check the quality grade of each
device before using it in a particular application.
Standard: Computers, office equipment, communications equipment, test and measurement equipment,
audio and visual equipment, home electronic appliances, machine tools, personal electronic
equipment and industrial robots
Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster
systems, anti-crime systems, safety equipment and medical equipment (not specifically designed
for life support)
Specific: Aircrafts, aerospace equipment, submersible repeaters, nuclear reactor control systems, life
support systems or medical equipment for life support, etc.
The quality grade of NEC devices in “Standard“ unless otherwise specified in NEC's Data Sheets or Data Books.
If customers intend to use NEC devices for applications other than those specified for Standard quality grade,
they should contact NEC Sales Representative in advance.
Anti-radioactive design is not implemented in this product.
M4 94.11
22