DATA SHEET BIPOLAR ANALOG INTEGRATED CIRCUIT µPC8001 IF AMPLIFIER IC WITH ON-CHIP MIXER FOR DIGITAL CELLULAR PHONES The µPC8001 is a 3-volt IF amplifier IC with an on-chip mixer developed for digital cellular phones. The µPC8001 consists of a high-sensitivity limiter amplifier with an input frequency of 455 kHz, a high-speed and high-precision linear RSSI (received signal strength indicator ), and a second mixer with an input frequency of 80 to 150 MHz. The µPC8001 features a low 3 mA (TYP.) and 2.2 µA (TYP.) current consumption at normal operation and power-OFF, respectively. Its high-speed charge/discharge circuit enables fast power-ON/OFF switching. The µPC8001 boasts an extremely small size packaged in a 14-pin plastic shrink SOP, and low external capacitances of less than 0.01 µF, in addition to an on-chip RSSI output resistor, and is most suitable for high-density mounting. FEATURES • Low-voltage operation…3 V ±10% • Low power consumption…(VCC = 3 V) Mixer IF amp. + RSSI During operation 2.1 mA (TYP.) 0.95 mA (TYP.) At power-OFF 0 µA (TYP.) 2.2 µA (TYP.) • High limiting sensitivity…–91 dBm (TYP.) • High-precision RSSI linearity…±0.5 dB (TYP.) (VIF IN = –86 to –6 dBm) • High-speed RSSI response time RSSI output rise time 77µs (TYP.) RSSI output fall time 113 µs (TYP.) • High-speed power-ON/OFF switching time Rise time at power-ON 174 µs (TYP.) Fall time at power-OFF 3 µs (TYP.) • External capacitors of less than 0.01 µF • On-chip RSSI output resistor (34 kΩ) • Ultra-compact package…14-pin plastic shrink SOP The information in this document is subject to change without notice. Document No. IC-3426 (O.D.No. IC-8949) Date Published February 1995 P Printed in Japan The mark ★ shows revised points. © © 1994, 1995 1992 µPC8001 ORDERING INFORMATION Part number µPC8001GR Package 14-pin plastic shrink SOP (225 mil) 14-pin plastic shrink SOP (225 mil) µPC8001GR-E1 Embossed carrier taping (Pin 1 located toward tape unwind direction) 14-pin plastic shrink SOP (225 mil) µPC8001GR-E2 Embossed carrier taping (Pin 1 located toward tape wind direction) 2 µPC8001 BLOCK DIAGRAM Antenna 1 st L-osc 1.5 GHz or 900 MHz RF Amp 1 st Mixer 130 MHz BPF 455 kHz BPF Note 2 nd L-osc 129.545 MHz RM 1.4 kΩ CIF CFL3 0.01 µ F 0.01 µ F 0.01 µ F 0.01 µ F 0.01 µ F 0.01 µ F 0.01 µ F 11 13 9 8 4 6 14 IF IN FIL3 FIL2 OSC IN MIX IN2 MIX IN1 MIX OUT COS CM2 CM1 CM0 2 nd Mixer CFL2 CFL1 0.01 µ F 7 FIL1 IF Amp 1 IF OUT RSSI 3 RSSI OUT 1000 pF CRS 12 2 VCC1 PD 5 10 VCC2 GND Note Input/output impedance of 455 kHz BPF: 1.5 k Ω 3 µPC8001 CONTENTS 1. PIN CONFIGURATION AND PIN FUNCTIONS ............................................................................... 5 2. I/O EQUIVALENT CIRCUIT ............................................................................................................... 7 3. ELECTRICAL SPECIFICATIONS ........................................................................................................ 8 4. CHARACTERISTIC CURVES ........................................................................................................... 14 5. TEST CIRCUIT EXAMPLE ............................................................................................................... 18 6. PACKAGE DRAWINGS .................................................................................................................... 19 7. RECOMMENDED SOLDERING CONDITIONS ............................................................................ 20 4 µPC8001 1. PIN CONFIGURATION AND PIN FUNCTIONS (1) PIN CONFIGURATION (Top View) • 14-pin plastic shrink SOP (225 mil) 1 14 MIX IN1 PD 2 13 MIX IN2 RSSI OUT 3 12 VCC1 FIL3 4 11 OSC IN VCC2 5 10 GND IF IN 6 9 MIX OUT FIL1 7 8 FIL2 FIL1-FIL3 µ PC8001GR IF OUT : Filter GND : Ground IF IN : Intermediate Frequency Input IF OUT : Intermediate Frequency Output MIX IN1, MIX IN2 : Mixer Input MIX OUT : Mixer Output OSC IN : Oscillator Input PD : Power Down RSSI OUT : Received Signal Strength Indicator Output V CC1 , V CC2 : Power Supply 5 µPC8001 (2) PIN FUNCTIONS Number 6 Pin Name I/O Function 1 IF OUT O IF amplifier output 2 PD I Power-ON/OFF control signal input High level: Power-ON; Low level: Power-OFF 3 PSSI OUT O RSSI output 4 FIL3 — Connect capacitor for filter. 5 VCC2 — IF amplifier and RSSI power pin 6 IF IN I 7 FIL1 — Connect capacitor for filter. 8 FIL2 — Connect capacitor for filter. 9 MIX OUT O Mixer output 10 GND — Ground pin 11 OSC IN 12 VCC1 13 MIX IN2 I Connect capacitor for filter. 14 MIX IN1 I Mixer input IF amplifier input I Oscillator input — Mixer power pin µPC8001 2. I/O EQUIVALENT CIRCUIT Mixer input IF amplifier output 5 kΩ 5 kΩ 1 75 µA 14 13 Oscillator input RSSI output V CC2 5 kΩ 34 kΩ 3 5 kΩ 500 Ω 11 IF amplifier input Power-ON/OFF input 300 kΩ 6 4 150 kΩ 1.5 kΩ 2 7 8 50 kΩ Mixer output 9 400 µA 7 µPC8001 3. ELECTRICAL SPECIFICATIONS Absolute Maximum Ratings (TA = 25°C) Parameter Symbol Conditions Rating Unit Supply voltage VCC 7 V Total power dissipation PT 300 mW Operating ambient temperature TA –30 to +85 °C Storage temperature Tstg –40 to +125 °C Caution Exposure to Absolute Maximum Ratings for extended periods may affect device reliability; exceeding the ratings could cause permanent damage. The parameters apply independently. The device should be operated within the limits specified under DC and AC Characteristics. Recommended Operating Conditions (TA = 25°C) Parameter Symbol Supply voltage VCC Mixer input level VMIX IN Conditions See Figure 3-1. 50 Ω termination LC matching TYP. MAX. Unit 2.7 3.0 3.3 V –20 dBmNote1 –100 –113Note2 IF amplifier input level VIF IN –86 Oscillator input level VOSC IN –30 IF amplifier input frequency fIF IN Mixer input frequency Mixer output frequency –33Note2 dBmNote1 –6 dBmNote1 –15 –5 dBmNote1 400 455 500 kHz fMIX IN 80 130 150 MHz fMIX OUT 400 455 500 kHz Notes 1. Assuming a conversion value of 50 Ω, 0 dBm = 0.2236 Vrms. 2. Depends on board wiring pattern, use as reference value. 8 MIN. µPC8001 ELECTRICAL CHARACTERISTICS (TA = 25°C, VCC1 = VCC2 = 3 V, fMIX IN = 130 MHz, fOSC IN = 129.545 MHz, fIF IN = 455 kHz, CRS = 1000pF, COS = CM1 = CM2 = CM0 = CIF = CFL1 = CFL2 = CFL3 = 0.01µF, 0 dBm = 0.2236 Vrms) (1) Mixer Parameter Supply current Symbol ICC1 Conditions No signal VMIN IN = –50dBm Conversion gain CG –1dB compression output level IC3 VOMIX 50Ω termination TYP. MAX. Unit 2.1 3.0 mA 20 23 15 dB VOSC IN = –15 dBm See Figure 3-1. Third order intercept MIN. LC matching See Figure 3-2. VOSC IN=–15dBm 33 Note 1 –13 –8 dBm –5 0 dBm 200 470 MHz See Figure 3-3. Cut-off frequency fC Noise figure NF Local isolation ISL Mixer input impedance –3 dB point See Figure 3-6. 10 dB 26 dB ZIM 48-j383 Ω Local input impedance ZIL 80-j425 Ω Output resistance ROM Power-ON rise time Note2 tONM 20 Note 1 60 VON = 3 V 120 180 Ω 33 600 µs 3 200 µs 0 10 µA Rise time of PD signal : 10 ns Power-OFF fall time Note3 tOFM VOF = 0 V Fall time of PD signal : 10 ns Power-OFF supply current ILM VOF = 0 V Notes 1. Depends on board wiring pattern, use as reference value. 2. Time until DC voltage of mixer output reaches ±10% of power-ON value. 3. Time until supply current reaches 10% of power-ON value. (2) Power-ON/OFF Parameter Symbol Conditions Power-ON input voltage VON Power-ON over VON and under VCC Power-OFF input voltage VOF Power-OFF over GND and under VOF Power-ON input current ION VON = 3 V MIN. TYP. 1.2 0.6 MAX. 2.4 1.2 48 Unit V V 75 µA 9 µPC8001 (3) IF Amplifier/RSSI Parameter ★ Symbol Conditions Supply current ICC2 No signal IF amplifier output amplitude VO VIF IN = –20 dBm Limiting sensitivity LS –3dB point, see Figure 4-5. IF amplifier input impedance ZIN IF amplifier phase variation ∆φ VIF IN =–86 to –6 dBm See Figure 4-6 Note1. RSSI linearity LRS VIF IN = –86 to –6 dBm Recursive calculation with VIF IN = –60 to –6 dBm RSSI slope SLRS Recursive calculation with VIF IN = –60 to –6 dBm RSSI intercept ICRS RSSI output voltage1 MIN. 1.2 1.2 TYP. MAX. Unit 0.95 1.3 mA 1.5 1.8 Vp-p –91 –86 dBm 1.5 1.8 kΩ 11 deg ±0.5 ±2 dB 22.3 24.4 30.1 mV/dB Recursive calculation with VIF IN = –60 to –6 dBm See Figure 3-4. –135 –118 –104 dBm VR1 VIF IN = –86 dBm 0.50 0.79 0.98 V RSSI output voltage 2 VR2 VIF IN = –46 dBm 1.60 1.79 1.90 V RSSI output voltage 3 VR3 VIF IN = –6 dBm 2.70 2.75 2.82 V RSSI output temperature stability ST VIF IN = –86 to –6 dBm, TA = –30 to +85 °C 1 ★ RSSI rise time trRS VIF IN = –6 dBm See Figure 3-5. 77 300 µs ★ RSSI fall time tfRS VIF IN = –6 dBm See Figure 3-5. 113 300 µs ★ RSSI output ripple VRRS VIF IN = –6 dBm 3 12 mVp-p ★ ★ dB ILI VOF = 0 V 2.2 10 µA Note2 tONI VON = 3 V, VIF IN = –86 dBm PD signal rise time: 10 ns 174 600 µs Power-OFF fall time Note3 tOFI VOF = 0 V PD signal fall time: 10 ns 3 200 µs IF amplifier output slew rate SRO Power-OFF supply current Power-ON rise time VIF IN = –20 dBm Rise Fall RSSI output resistance ★ Note4 R OR Notes 1. Use the network analyzer at RBW = 3 Hz. 2. Time until RSSI output reaches ±10% of power-ON value. 3. Time until supply current reaches 10% of power-ON value. 4. Rise: 10% to 90% 5. Fall: 10 90% to 10% 3.4 Note5 V/µs 3.8 27 34 41 kΩ µPC8001 Figure 3-1. Mixer Input (a) 50Ω Termination VMIX IN 0.01µ F (b) LC Matching VMIX IN 5 pF Note 0.01µ F 14 MIX IN1 14 MIX IN1 Note 50Ω 107 nH Note The values L and C are affected by the parasitic capacitance and inductance of the board. Therefore, adjust L and C so that the impedance at the MIX IN pin from the signal source equals 50Ω. Remark The signal source impedance is 50Ω. Figure 3-2. Third Order Intercept MIX IN1 MIX OUT OSC IN 14 9 11 VOSC IN = –15 dBm 0.01µ F 0.01µ F 0.01µ F 50 Ω 1.5 kΩ 50 Ω 16.7 Ω Measure 455 kHz component level with spectrum analyzer fOSC IN = 129.545 MHz 16.7 Ω 16.7 Ω f1 f2 f1 = 130.1 MHz, f2 = 130.2 MHz VMIX OUT [dBm] f = 130 MHz 6 dB/OCT f1 = 130.1 MHz f2 = 130.2 MHz 18 dB/OCT VMIX IN [dBm] Third order intercept Remark Signal source impedance is 50Ω. 11 µPC8001 Figure 3-4. RSSI Intercept RSSI output VORS [V] VMIX OUT [dBm] Figure 3-3. –1 dB Compression Output Level 1 dB VOMIX V MIX IN [dBm] IF input level VIF IN [dBm] RSSI intercept Figure 3-5. RSSI Response Time IF output 90% RSSI output 10% t rRS 12 t fRS µPC8001 Figure 3-6. 28 V Noise Figure Measurement 5 pF 0.01µF SW Noise source HP346B 14 MIX IN1 11 OSC IN 107 nH 0.01µF 50 Ω 47 dB Spectrum analyzer RF Amp 3 kΩ 0.01µF 9 MIX OUT HP8447F The noise figure is calculated as follows: NF = ENR – 10 log (Y – 1) NF (dB): Noise figure ENR (dB): ENR of noise source N 2 –N 1 10 Y: Y = 10 N 1 (dBm): Spectrum analyzer indication value at SW OFF. N 2 (dBm): Spectrum analyzer indication value at SW ON. Remark This measurement measures DSB. To measure SSB, add 3 dB to NF above. 13 µPC8001 4. CHARACTERISTIC CURVES Figure 4-1. Mixer Supply Current vs. Supply Voltage 4 Supply current ICC1 [mA] 3 2 1 Recommended operating range 0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 Supply voltage VCC1 [V] Figure 4-2. Mixer Output Level vs. Mixer Input Level (fMIX IN= 130 MHz, fOSC IN = 129.545 MHz, fMIX OUT = 455 kHz, VOSC IN = –15 dBm) +20 +10 Mixer output level VMIX OUT [dBm] 0 –10 –20 –30 –40 –50 –60 –70 –80 –80 –70 –60 –50 –40 –30 Mixer input level VMIX IN [dBm] 14 –20 –10 0 µPC8001 Figure 4-3. Mixer Conversion Gain vs. Mixer Input Frequency (VMIX IN= –30 dBm, VOSC IN = –15 dBm, fOSC IN = fMIX IN – fMIX OUT, fMIX OUT = 455 kHz) 20 3 dB 10 10 100 200 500 700 1000 Mixer input frequency fMIX IN [MHz] Figure 4-4. IF Amplifier/RSSI Supply Current vs. Supply Voltage 2.0 1.8 1.6 Supply current ICC2 [mA] Mixer conversion gain CG [dB] 30 1.4 1.2 1.0 0.8 0.6 Recommended operating range 0.4 0.2 0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 Supply voltage VCC2 [V] 15 µPC8001 Figure 4-5. IF Amplifier Output Level vs. IF Amplifier Input Level +30 IF amplifier output level VIF OUT [dBm] +20 +10 3dB 0 –10 –20 –30 Limitting sensitivity (–91 dBm) –110 –100 –90 –80 –70 –60 –50 –40 –30 –20 –10 0 –10 –6 0 IF amplifier input level VIF IN [dBm] Figure 4-6. IF Amplifier Output Phase vs. IF Amplifier Input Level IF amplifier output phase φ IF OUT [deg] 250 ∆ φ = 11 deg TYP. 240 230 –90 –86 –80 –70 –60 –50 –40 –30 IF amplifier input level VIF IN [dBm] 16 –20 µPC8001 Figure 4-7. ★ RSSI Output Voltage vs. IF Amplifier Input Level (The temperature characteristics curves) 3.0 2.5 RSSI output voltage VORS [V] 2.0 1.5 1.0 0.5 0 –120 –110 –100 –90 –80 –70 –60 –50 –40 –30 –20 –10 0 IF amplifier input level VIF IN [dBm] TA = –30 °C TA = +25 °C TA = +85 °C 2. The three temperature characteristic curves are virtually identical. Remarks 1. 17 µPC8001 ★ 5. TEST CIRCUIT EXAMPLE 50 Ω 50 Ω 1µF 0.01µF 1.5 kΩ 1000 + pF 3V 0.01µ F 0.01µ F 0.01µ F 0.01µ F 14 13 12 11 10 9 8 MIX IN1 MIX IN2 VCC1 OSC IN GND MIX OUT FIL2 IF IN FIL1 6 7 µ PC8001GR IF OUT PD 1 2 RSSI OUT FIL3 3 V 4 CC2 5 0.01µ F 0.01µ F 50 kΩ 3V Note 10 pF 1000 pF 0.01µ F + 1000 1µF pF 3V 0.01µ F 50 Ω Note The value of the capacitance connected to the IF OUT pin (No. 1) includes the capacitances of PCB wiring patterns and the tester. Remark In three cases of Mixer Input, Third Order Intercept and Noise Figure Measurement, refer to Figures 3-1, 3-2, and 3-6. 18 µPC8001 PACKAGE DRAWINGS 14 PIN PLASTIC SHRINK SOP (225 mil) 14 8 5˚±5˚ detail of lead end 1 7 A H I G J E K F 6. B C D L N M M P14GM-65-225B-2 NOTE Each lead centerline is located within 0.10 mm (0.004 inch) of its true position (T.P.) at maximum material condition. ITEM MILLIMETERS INCHES A 5.40 MAX. 0.213 MAX. B 0.75 MAX. 0.030 MAX. C 0.65 (T.P.) 0.026 (T.P.) D 0.30 +0.10 –0.05 0.012+0.004 –0.003 E 0.125 ± 0.075 0.005 ± 0.003 F 1.8 MAX. 0.071MAX. G 1.44 0.057 H 6.2 ± 0.3 0.244 ± 0.012 I 4.4 0.173 J 0.9 0.035 K 0.15 +0.10 –0.05 0.006+0.004 –0.002 L 0.5 ± 0.2 0.020 –0.009 M 0.10 0.004 N 0.10 +0.008 0.004 19 µPC8001 7. RECOMMENDED SOLDERING CONDITIONS The following conditions must be met for soldering conditions of the µ PC8001. For more details, refer to our document “SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL” (IEI-1207). Please consolt with our sales offices in case other soldering process is used, or in case the soldering is done under different conditions. Types of Surface Mount Device µ PC8001GR: 14-pin plastic shrink SOP (225 mil) Soldedering process Infrared ray reflow Soldering conditions Peak temperature of package surface: 235 ˚C or below, Reflow time: 30 seconds or below (210 ˚C or higher), Number of reflow processes: MAX. 2 Symbol IR35-107-2 [Remark] (1) Please start the second reflow process after the temperature, raised by the first reflow process, returns to normal. (2) Please avoid removing the residual flux with water after the first reflow process. Partial heating method 20 Terminal temperature: 300 ˚C or below, Time: 3 seconds or below (Per one side of the device). ——— µPC8001 Precautions Against Static Electricity Caution When handling the device, be careful to protect it from static electricity. exposure to a strong static electricity charge may destroy internal transistor junctions. During transportation and storage, place the device in the conductive tray or case originally provided by NEC for shipping, or conductive shock absorbing material, metal case, etc. During assembly, be sure to ground the device. Be careful not to place the device on a plastic board and do not touch the device's pins. 21 µPC8001 [MEMO] No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in this document. NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from use of a device described herein or any other liability arising from use of such device. No license, either express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC Corporation or others. While NEC Corporation has been making continuous effort to enhance the reliability of its semiconductor devices, the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or property arising from a defect in an NEC semiconductor device, customer must incorporate sufficient safety measures in its design, such as redundancy, fire-containment, and anti-failure features. NEC devices are classified into the following three quality grades: “Standard“, “Special“, and “Specific“. The Specific quality grade applies only to devices developed based on a customer designated “quality assurance program“ for a specific application. The recommended applications of a device depend on its quality grade, as indicated below. Customers must check the quality grade of each device before using it in a particular application. Standard: Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) Specific: Aircrafts, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems or medical equipment for life support, etc. The quality grade of NEC devices in “Standard“ unless otherwise specified in NEC's Data Sheets or Data Books. If customers intend to use NEC devices for applications other than those specified for Standard quality grade, they should contact NEC Sales Representative in advance. Anti-radioactive design is not implemented in this product. M4 94.11 22