NTE NTE2388

NTE2388
MOSFET
N–Channel Enhancement Mode,
High Speed Switch
Description:
The NTE2388 is an N–Channel Enhancement Mode Power MOS Field Effect Transistor in a TO220
type package designed for low voltage, high speed power switching applications such as switching
regulators, converters, solenoid, and relay drivers.
Features:
D Silicon Gate for Fast Switching Speeds
D Low rDS(on) to Minimize On–Losses. Specified at Elevated Temperatures.
D Rugged – SOA is Power Dissipation Limited
D Source–to–Drain Diode Characterized for Use With Inductive Loads
Absolute Maximum Ratings:
Drain–Source Voltage, VDSS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 200V
Drain–Gate Voltage (RGS = 20kΩ), VDGR . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 200V
Gate–Source Voltage, VGS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±20V
Drain Current, ID
Continuous
TC = +25°C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18A
TC = +100°C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11A
Peak
TC = +25°C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 72A
Total Power Dissipation (TC = +25°C), PD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 125W
Derate Above 25°C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1W/°C
Maximum Operating Junction Temperature Range, TJ . . . . . . . . . . . . . . . . . . . . . . . . . –55° to +150°C
Storage Temperature Range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –55° to +150°C
Maximum Thermal Resistance, Junction–to–Case, RthJC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1°C/W
Maximum Thermal Resistance, Junction–to–Ambient, RthJA . . . . . . . . . . . . . . . . . . . . . . . . 62.5°C/W
Maximum Lead Temperature (During soldering, 1/8” from case for 5sec), TL . . . . . . . . . . . . +300°C
Electrical Characteristics: (TC = +25°C unless otherwise specified)
Parameter
Symbol
Test Conditions
Min
Typ
Max
Unit
200
–
–
V
VGS = 0, VDS = Max Rating
–
–
200
µA
VGS = 0, VDS = 160V,
TC = +125°C
–
–
1000
µA
OFF Characteristics
Drain–Source Breakdown Voltage
Zero–Gate Voltage Drain Current
V(BR)DSS ID = 250µA, VGS = 0
IDSS
Gate–Body Leakage Current, Forward
IGSSF
VDS = 0, VGSF = 20V
–
–
100
nA
Gate–Body Leakage Current, Reverse
IGSSR
VDS = 0, VGSR = 20V
–
–
100
nA
Gate Threshold Voltage
VGS(th)
VDS = VGS, ID = 250µA
2
–
4
V
Static Drain–Source On Resistance
RDS(on)
VGS = 10V, ID = 10A
–
–
0.18
Ω
VGS = 10V, VDS ≥ 3.2V
18
–
–
A
gfs
VDS ≥ 3.2V, ID = 10A
6
–
–
mhos
Input Capactiance
Ciss
–
–
1600
pf
Output Capacitance
Coss
VDS = 25V, VGS = 0,
f = 1MHz
–
–
750
pf
Reverse Transfer Capactiance
Crss
–
–
300
pf
–
–
30
ns
–
–
60
ns
td(off)
–
–
80
ns
tf
–
–
60
ns
–
38
60
nC
–
16
–
nC
–
22
–
nC
–
1.8
2.0
V
ON Characteristics (Note 1)
On–State Drain Current
Forward Transconductance
ID(on)
Dynamic Characteristics
Switching Characteristics (Note 1)
Turn–On Time
Rise Time
Turn–Off Delay Time
Fall Time
td(on)
tr
Total Gate Charge
Qg
Gate–Source Charge
Qgs
Gate–Drain Charge
Qgd
VDD [ 75V, ID = 10APEAK,
Rg = 4.7Ω
Ω
VDS = 160V, VGS = 10V,
ID = Rated ID
Source Drain Diode Characteristics (Note 1)
Forward ON Voltage
VSD
Forward Turn–On Time
ton
Reverse Recovery Time
trr
IS = Rated ID, VGS = 0
Limited by stray inductance
–
450
–
ns
Measured from the contact
screw on tab to center of die
–
3.5
–
nH
Measured from the drain lead
0.25” from package to center
of die
–
4.5
–
nH
Measured from the source
lead 0.25” from package to
source bond pad
–
7.5
–
nH
Internal Package Inductance
Internal Drain Inductance
Internal Source Inductance
Ld
Ls
Note 1. Pulse test: Pulse width ≤ 300µs, Duty cycle ≤ 2%.
.420 (10.67)
Max
.110 (2.79)
.147 (3.75) Dia Max
.500
(12.7)
Max
.250 (6.35)
Max
.500
(12.7)
Min
.070 (1.78) Max
Gate
.100 (2.54)
Source
Drain/Tab