NTE NTE2988

NTE2988
MOSFET
N–Channel, Enhancement Mode
High Speed Switch
Description:
The NTE2988 is an N–Channel, enhancement mode, power field effect transistor in a TO52 type
package designed especially for low power inverters, interface to CMOS and TTL logic, and line drivers.
Features:
D High Input Impedance
D Extremely Fast Switching
D Rugged–Dissipation Limited SOA
D Internal Drain–Source Diode
Benefits:
D Reduced Component Count
D Simpler Designs – Directly Interfaces CMOS & TTL
D Improved Circuit Performance
D Increased Reliability
Absolute Maximum Ratings: (TA = +25°C unless otherwise specified)
Drain–Source Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60V
Drain–Gate Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60V
Peak Gate Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 100mA
Gate–Source Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +15V, –0.3V
Drain Current
Continuous (Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±0.2A
Pulsed (Note 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±1.0A
Maximum Dissipation (TC = +25°C) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 315mW
Linear Derating Factor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2.5mW/°C
Operating Temperature Range, Topr . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –55° to +150°C
Storage Temperature Range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –55° to +150°C
Lead Temperature (During Soldering, 1/16” from case, 10sec), TL . . . . . . . . . . . . . . . . . . . . . +300°C
Note 1. Limited by package dissipation.
Note 2. Pulse test – 80µs to 300µs, 1% duty cycle.
Electrical Characteristics: (TC = +25°C unless otherwise specified)
Parameter
Symbol
Test Conditions
Min
Typ
Max
Unit
Static Characteristics
Drain–Source Breakdown Voltage
BVDSS
ID = 1000µA, VGS = 0
60
–
–
V
Gate Threshold Voltage
VGS(th)
VDS = VGS, ID = 1mA
0.8
–
2.5
V
Gate–Body Leakage
IGSS
VGS = 15V, VDS = 0
–
–
100
nA
Zero Gate Voltage Drain Current
IDSS
VDS = 50V, VGS = 0
–
–
10
µA
On–State Drain Current
ID(on)
VGS = 5V, ID = 0.2A, Note 2
–
–
1.5
V
VGS = 10V, ID = 0.5A, Note 2
–
–
2.5
V
VGS = 5V, ID = 0.2A, Note 2
–
–
7.5
Ω
VGS = 10V, ID = 0.5A, Note 2
–
–
5.0
Ω
200
–
–
mS
–
–
60
pF
Static–Drain–Source On–State
Resistance
rDS(on)
Dynamic Characteristics
Forward Transconductance
gfs
VDS = 15V, ID = 0.5A, Note 2
Input Capacitance
Ciss
VDS = 25V, f = 1MHz
Reverse Transfer Capacitance
Crss
–
–
5
pF
Common Source Output Capacitance
Coss
–
–
25
pF
Turn–On Time
tON
–
–
10
ns
Turn–Off Time
tOFF
VDD = 15V, RL = 23Ω, Rg = 25Ω,
ID = 0.6A
–
–
10
ns
IS = –0.5A, VGS = 0, Note 2
–
–0.85
–
V
VGS = 0, IF = IR = 0.5A
–
160
–
ns
Drain–Source Diode Characteristics
Forward ON Voltage
Reverse Recovery Time
VSD
trr
Note 2. Pulse test – 80µs to 300µs, 1% duty cycle.
.230 (5.84) Dia Max
195 (4.95) Dia Max
.150 (3.81)
Max
.500 (12.7)
Min
.019 (0.5) Dia
Gate
Source
Drain/Case
45°
.040 (1.01)