NTE NTE3035A

NTE3035A
Phototransistor Detector
Description:
The NTE3035A is designed for a wide variety of industrial processing and control applications requiring a sensitive detector. The NTE3034A is is an identical package and is designed to be used with
the NTE3029A infrared emitter.
Features:
D Miniature, Low Profile, Clear Plastic Package
D Designed for Automatic Handling and Accurate Positioning
D Side Looking, with Molded Lens
D High Volume, Economical
Absolute Maximum Ratings: (TA = +25°C unless otherwise specified)
Collector–Emitter Voltage, VCEO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60V
Total Device Dissipation (TA = +25°C), PD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 150mW
Derate Above 25°C (Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2mW/°C
Operating Junction Temperature Range, TJ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –40° to +100°C
Storage Temperature Range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –40° to +100°C
Lead Temperature (During Soldering, 1/16” from case, 5sec max., Note 2), TL . . . . . . . . . . +260°C
Electrical Characteristics: (TA = +25°C unless otherwise specified)
Parameter
Symbol
Min
Typ Max Unit
VCE = 10V, H [ 0
–
–
100
nA
V(BR)CEO IC = 10mA, H [ 0
60
–
–
V
–
3.9
–
pF
Collector Dark Current
ID
Collector–Emitter Breakdown Voltage
Test Conditions
Capacitance
Cce
VCC = 5V, f = 1MHz
Optical Characteristics: (TA = +25°C unless otherwise specified)
Parameter
Symbol
Test Conditions
Min
Typ Max Unit
Collector Light Current
IL
VCE = 5V, H = 500µW/cm2,
λ = 940nm
5
25
–
mA
Turn–On Time
ton
–
125
–
µs
Turn–Off Time
toff
H = 500µW/cm2, VCC = 5V,
RL = 100Ω
Ω
–
150
–
µs
H=
λ = 940nm,
IC = 2mA, VCC = 5V
–
0.75
1.0
V
–
0.8
–
µm
Saturation Voltage
Wavelength of Maximum Sensitivity
VCE(sat)
λs
500µW/cm2,
Note 1. Measured with device soldered into a typical PC board.
Note 2. Heat sink should be applied to leads during soldering to prevent case temperature from exceeding +100°C.
.160 (4.06)
.045 (1.14) Dia
.120
(3.04)
.125
(3.17)
.168
(4.27)
.750
(19.05)
Max
.020 (.508)
E
C
.100 (2.54)
.060 (1.52)
.103
(2.62)