PREPARED BY:
Ln
DATE:
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DATE:
QtV’1,
ti eds
APPROVED BY:
37
ELECTRON-X COMPONENTS GROUP
SHARP CORPORATION
SPECIFICATION
KLA3-E
DEVICE SPECIFICATION
1 SPECNo.
Do996034
ISSUE
Jun/16/99
PAGE
REPRESENTATIVE
10 pages
Opto-Electronic
Devices Division
DIVISION:
FOR
Light Emitting Diode
MODEL No.
I
GL5ZV43
1. These specification sheets include materials protected under the copyright of Sharp Corporation (“Sharp”).
Please do not reproduce or cause anyone to reproduce them without Sharps consent.
2. When using this product, please observe the absolute maximum ratings and the instructions for use outlined
in these specification sheets, as well as the precautions mentioned below. Sharp assumes no responsibility
for any damage resulting from use of the product which does not comply with the absolute maximum ratings
and the instructions included in these specification sheets, and the precautions mentioned below.
(Precautions)
(1) This products is designed for use in the following application areas;
* OA equipment
* Audio visual equipment * Home appliance
* Telecommunication equipment (Terminal)
* Measuring equipment
*
Tooling
machines
*
Computers
I
r
If the use of the product in the above application areas is for equipment listed in paragraphs
(2) or (3), please be sure to observe the precautions given in those respective paragraphs.
(2) Appropriate measures, such as fail-safe design and redundant design considering
the safety design of the overall system and equipment, should be taken to ensure reliability
and safety when this product is used for equipment which demands high reliability and
safety in function and precision, such as ;
* Transportation control and safety equipment (aircraft, train, automobile etc.)
* Gas leakage sensor breakers
* Traffic signals
* Rescue and security equipment
I
C * Other safety equipment
(3) Please do not use this product for equipment which require extremely high reliability
and safety in function and precision, such as ;
* Space equipment
* Telecommunication equipment (for trunk lines)
* Medical equipment
I * Nuclear power control equipment
(4) Please contact and consult witha Sharp sales representative if there are any questions
regarding interpretation of the above three paragraphs.
1
3. Please contact and consult with a Sharp sales representative for any questions about this product.
CUSTOMER’S APPROVAL
DATE:
BY:
DATE:
PRESENTED BY:
J-i4x-4~/
72Lazz ,
M.Katoh,
Department General Manager of
Engineering Dept.,IlI
Opto-Electronic Devices Division
Electronic Components Group
SHARP CORPORATION
f?ry
DG996034
Jlln/16/%
PAGE
MODEL No.
GL5ZV43
GL52Y43
Snecification
1. Application
This specificationappliesto the light emitting diode&vice Model No. GL5ZV43.
[AlGaInP (dicing or scribe/braketype) Amber LED device]
2. Outline dimensionsandpin connections. . . . . . . . . . . . . . . . . . . . . . . . . . . .Refer to the attachedsheetPage2.
3. Ratingsandcharacteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Refer to the attachedsheetPage3-4.
3-l. Absolute maximumratings
3-2. Eleciro-optical characteristics
3-3. Derating Curve
3-4. CharacteristicsDiagram
4. Reliability . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Refer to the attachedsheetPage5.
4- 1. Test itemsand testconditions
4-2. MeasurementitemsandFailurejudgement criteria
5. Incoming inspection. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Refer to the attachedsheetPage6.
5- 1. Applied standard
5-2. Samplingmethodandlevel
5-3. Test items,judgementcriteria and classificaof defect
5-4. Test itemsthe surfaceis be appliedfor flat type, judgementcriteria andclassifxa of defect
6. Supplement.,...,................................*..............,
6- 1. Packing
6-2. Luminousintensity rank
6-3. Dominant wavelengthrank
6-4. Environment
Refer to the attachedsheetPage7-8.
7*lrecau~onsforuse . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Refer to the attachedsheetPage9- 10.
7-1. Lead forming method
7-2. Notice of installation
7-3. SolderingConditions
74. For cleaning
l/10
DC2996034
Jun/16i!W
PAGE
MODELNo.
I
2 outline dimensions and pin
GL5ZV43
I
co~ections
Colorless transparency
.
Pin coMectiona
0. Lode
0. cathode
unspec*ed to1. to be +0.2Mll
Cold rblkd steel.leadsareplated with but
unit
mm
Material
Lead : (Fe) Cold rolled steel
Package: Epoxy resin
’ this part of the product
Finish
Lead : Sn platedor wave soldering
Drawing No.
51106015
2/10
I Jun/l6/!39
DG996034
MODEL No.
1PAGE
GL5ZV43
I
3. Ratingsandcharacteristics
3- 1. Absolutemaximumratings
Parameter
Power dissipation
Continuousforward current
Peakforward current(Note 1)
Derating factor/
DC
!
Pulse
I
Symbol
P
Value
130
50
100
IF
IFhi
I
(Ta=25”C)
Unit
mW
!
0.67
I
1.33
5
-
mA
mA
!mApcl
Reversevoltage
Vll
Operating temperature
Topr
-40
85
Storagetemperature
Tstg
-40
100
Solderingtemperature(Note2)
Tsol
260(within5seconds)
(Note 1) Duty ratio=l/lO,Pulse width=O.lms
(Note 2) At the positionof 1.6mmfrom the bottom resinpackage
T
OC
“C
Terminal capacitance
Ct
V=OV,f=lMHz
60
Viewing Angle
281/2
lF=2omA
8
(Note 3) Refer to the suplementitem 6. regardingthe standardof rank classifidation.
I
3110
-
pF
deg.
3-3. Derating Curve
Peak
Forward
Current
Derating
Curve
Forward
120
Current
Derating
Curve
60
a
.5
100
Z2
2
2
3!A
-
80
60
50
40
30
20
10
0
-25
0
Ambient
25
50
Temperature
75 OJIOO
Ta(“CI
125
-25
0
Ambient
25
50
Temperature
7585100
Ta(“C)
125
DG996034
MODEL No.
I
Peak
Forward
Current
vs.
Jun/16/99
PAGE
GL5ZV43
4/10
Duty
Ratio
cTa=250C1
I I I/Ii//III II/I/j/lI iIlll[
10
l/100
1
l/10
Duty
3-4. Characteristics
Raito
DR
Diagram(m)
Forward
Current
10
(Note 1)
vs.Forward
Relative
Luminous
Intensity
vs. Ambient
Temperature
Voltage
(Ta=25%)
(IF=2OmA)
1oDo
.-$
E
;
2
100
Oh
.f E
5
A
.-z
CI
m
2ot
0. 1
1
1.2
1.4
1.6
Forward
Relative
Luminous
1.6
2
Voltage
Intensity
vs.
2.2
2.4
VF(V)
Frorard
10
-60-40-20
Ambient
2.6
Voltage
'a=25'C)
0.01
1
I
I
l(l!/l/
0. 1
I
I
1
Forward
lllllli
I
10
Current
I
l!illjJ
100
IFhA)
(Note 1) Above characteristic data are typical data and
not a
guarantteed data.
0
20 40
Temprature
60 80
Ta("C)
100120
DG996034
Jud16/99
MODEL No.
I
PAGE
GL5ZV43
s/10
4. Reliability
The reliability of productsshahbe satisfiedwith itemslisted below.
4-l. Test itemsandtestconditions
Test items
Confidencelevel: 90%
Samples(n)
LTPD
Defective (C)
(%)
Test conditions
Solderability
230*5C, 5s
Prior disposition: Dip in rosin flux
n=ll, C=O
20
Soldering
temperature
26Oir5”c. 5s
n=ll, C=O
20
15 00&1/s*, 05ms,
3times/ 3XkY,kZ direction
n=ll, C=O
20
n=ll, C=O
20
Mechanicalshock
Variable frequency 2OOm/s*,100to 2 Oooto lOOHz/sweepfor 4min.
vibration
.4timesiH~Y,EZ direction
Terminal strength
Weight:lUN
- ^-- , 3-s/each terminal
(Tension)
I
---f 0O-t -90’ -0”
Terminal strength WeightzSN.0” -90”
(Bendma
/each terminal
Temperaturecycling
-4O”c(30mirt)~+l~C(3~in).30
I
High temp*andhigh
humidity storage
Ta=+60”C, 9O%RH, t=lOOOh
cycles
I
n=ll, C=O
I
I n=ll, C=O I
I
n=22, C=O
.I
10
n=22, C=O
10
H:ightemperaturestorageTa=lOO”c, t=lOOOh
n=22, C=O
10
L ow temperaturestorageTa=-40”C, t=lOOOh
n=22, C=O
10
n=22, C=O
10
Operationlife
Ta=25”C, IrMAX,
t=lOOOh*3
4-2. MeasurementitemsandFailure judgementcriteria * 1
Measurement
Splbd
Failurejudgementcriteria *2
Forward voltage
VF
v, > U.S.L. x 1.2
Reversecurrent
IR
Ia > U.S.L. x 2.0
Luminousintensity
Iv
Iv > The first stagevalueX 2.0 or The first stagevalue X 0.5 > Iv
z Solderability : Soldershall be adhereat the areaof 95% or moreof dippedportion.
s Terminal strength: Packageis not destroyed,and terminal is not slack.
*l: Measuring conditionis in accordancewith specification.
*2: U.S.L. is shownby Upper Specification Limit.
*3: I, MAX.is shownby forward current of absolutemaximumratings.
I
JuId16/99
DG996034
PAGE
MODEL No.
I
GL5ZV43
6/10
5. Incominginspection
5- 1. Applied standard: IS0 2859-1
5-2. Samplingmethodand level : A single samplingplan,.nonnalinspectionlevel II
: AQL Major defect : 0.065%
Minor defect : 0.4%
iudeement
criteria
- -. Test
---_items.
___-__.
__ _- ___--------and
--- classifica
--- ---- - of-- defect
-_--_
No.
Testitems
judgementcriteria
5-3.
1
Disconnection
classifica of defer
Not emit light
2
Positionof Cutting off
rim
Different from dimension
3
Reverseterminal
Different from dimension
4
Outline dimensions
Not satisfy outlinespecification
5
characteristics
6
Cut off the rim
Major defect
Over the limit value of specificationat V,, I,, andIv
Exceed-0.2mm
7
Foreignsubstance
White point : Exceed @0.3mm (on top view)
Black point : Exceed 4 0.3mm (on top view)
String form : Exceed 3.Omm(on top view)
8
Scratch
Exceed 4 0.3mm or O.lmm x I.Omm(on top view)
9
Void
Exceed 4 0.3mm (on top view)
10
Unevendensityof
materialfor scattering
Extremely unevendensity
11
Unbalancedcenter
12
Burr
Exceed +0.2mm againstprovided
dimension
13
Insertionpositionof
terminal
Insertion positionof terminal
Exceed
Minor defect
M.25mm from packagecenter
5-4. Test itemsthe surfaceis be applied for flat type, judgementcriteria andclassificaof defect
No.
Test items
judgementcriteria
classifica of defer
14
Chappedthe surface
The surfacechappedis striking for seethe lamp top
Minor defect
15
Hollow the surface
The surface hollow is striking for seethe lamp top
DG996034
MODEL
No.
I
GLSZV43
1 Jun/16/99
1 PAGE
1
7110
6. Supplement
6-1. Packing
6- 1- 1. Inner package
Put 25Opcsthe sameluminousintensity rank productsinto pack andput following label by pack.
Productweight : 0.28g (One Product,Typ.)
(Indicationlabel sample)
SHIPENT TABLE
PART No.
GLSZV43
+ Model number
*clEl
clclclclcl
CJlJAhT1l-Y
250
- Quantity of products
---LOT No.
KA99B19
tLotnumber*
0
0
CD@
0
u-u+Luminousintensity rank
dominantwavelengthrank
SHARP\
WE IN JAPAN
- Production country
1
0
@
@
@
@
Productionplant code(to be indicated alphabetically)
Supportcode
Year of production(thelast two figures of the year)
Month of production
(to be indicatedalphabeticallywith Januarycorrespondingto A)
Date of production(Ol-31)
6-l-2. Outer package
Put 8 packs (the sameluminousintensity rank) into outerpackage.
(approximately670g per one outer package)
6-l-3. Outer packageout line dimension
Width : 14Omm.Depth : 225mm, Hight : 9Omm
(Note 1) Tolerance:flS%
ln regardto luminousintensity , the following rankingshallbe carriedout.
However the quantity of eachrank shallnot bepre scribed.
In caseof the distribution of the luminousintensity shift to high, at that
point new upper rank is prescribedandlower rank isdelete.
6-3.Dominantwavelengthrank (Note 2)
Rank
Dominant wavelength
H
581.0
-
Unit
(Ta=25”C)
Condition
584.5
(Note 2) The condition of measurement: The measurement
of the light em&on from the front sideof lamp.
This rank value is the setting value of whenthat classifiesit the rank and be not a guaranteevalue.
Also I shall not ask the delivery ratio of eachrank.
DG996034
MODEL No.
GL5ZV43
6-4. Environment
641. Ozonosphere destructive chemicals.
(1) The &vice doesn’t contain following substance.
(2) The &vice doesn’t have a production line whose process requires following substance.
Restricted part: CFCs,halones,CC&,Trichloroetbane(Methychloroform)
642. Bromic non-burning materiah
The &vice doesn’t contain bromic non-burning materials(PBBOs,PBBs)
JIud16/99
PAGE
8110
I Jun/16/!w
IX996034
1PAGE
MODEL No.
I
GL5ZV43
9110
7. Precautionsfor use
7 - 1. Lead forming method
Avoid forming a lead pin with the lead pin base as
a fulcrum:be sure to hold a lead pin firmly when
forming. Lead pins should be forned before soldering
7 - 2. Notice of installation
7-2-l installation on a P WB
Whenmounting an LED lamp on a PVB,do not apply
physical stress to the lead pins.
The lead pin pitch should match the PWBpin-hole
pitch:absolutely avoid widening or narrowing
the lead pins.
Whenpositioning an LED lamp,basically employ
an LEDwith tie-bar cut or use a spacer.
7-2-2 Whenan LED 1 is mounted directly on a P W B
If the bottom face of an LED lamp is mounted
directly on single-sided PWB,the base of the
lead pins may be subjected to physical stress
due to PTBwarp, cutting or clinching of lead
pins. Prior to use, be sure to check that no
disconnection inside of the resin or damage to
resin etc., is found. when an LED lamp is mounted
on a double-sided PWB,theheat during soldering
affects the resin;therefore,keep
the LED lamp
more that 1.6mmafloat above the Pm.
7-2-3 Installation using a holder
During an LEDlamp positioning,when a holder is
used,a holder should be designed not to subject
lead pins to any undue stress.
(Note)Pay attention to the thermal expansion coefficient
of the material used for the holder.Since the
holder expands and contracts due to preheat and
soldering heat.mechanical stress may be applied to
the lead pins, resulting in disconnection.
7-2-4 Installation to the case
Do not fix part C with adhesives when fixed to the
case as shown in Figure-A hole of the case should
be designed not to subject the inside of resin
to any undue stress.
l
NG
l
L
Aih
0
I
I.611
DC996034
MODEL No.
GL5ZV43
7 - 3. S oldering Conditions
Solder the lead pins under the following conditions
Conditions
Type of S oldering
295Tk5T,
within 3 seconds
1. Manual soldering
2603c
r5”C.
within 5 seconds
2. Wave soldering
P
reheating
70°C
to 8O”c, within 30 seconds
3. Auto soldering
Soldering 245”ci:5”c, within 5 seconds
(Note) Avoid dipping resin into soldering bath.
Avoid applying stress to lead pins while they are heated. For example ,
when the LED lamp is moved with the heat applied to the lead pins during
manual soldering or solder repair,disconnection may occur.
7-4
For cleaning
(1)
Solvent cleaning : Solvent temperature 45°C or less
Immersion
for 3 min or less
(2)
Ultrasonic cleaning : The effect to device by-ultrasonic cleaning differs
by cleaning bath size,ultrasonic power
output, cleaning time. PIB size or device mounting
condition etc. Please test it in actual using condition
and confirm that doesn’t occur any defect before starting
the ultrasonic cleaning.
(3)
Applicable solvent : Ethyl alcohoLMethyl alcohol, Isopropyl alcohol
In case when the other solvent is used,there are cases that
the packaging resin is eroded. Please use the other solvent
after thorough confirmation is performed in actual using condition.
Jun/16/!B
PAGE
lo/lo