PREPARED BY: I I DATE: Sdt3 I( &M Jti‘, DATE: / /Myy 7 (/Ledc APPROVED BY: SPECNo. Ix996046 ISSUE hut/l 6/99 ELECTRO~c CObiPONENTS GROUP SHARP CORPORATION SPECIJWATION 33’ J L&S& DEVICE SPECIFICATION FOR Light Emitting Diode MODEL No. \ GL6ZV27 1. Thesespecificationsheetsinclude materialsprotectedunderthe copyright of SharpCorporation (“Sharp”). Pleasedo not reproduceor causeanyone to reproducethemwithout Sharpsconsent. 2. When usingthis product, pleaseobservethe absolutemaximumratingsandthe instructionsfor useoutlined in thesespecificationsheets,aswell asthe precautionsmentionedbelow.Sharpassumes no responsibility for any damageresultingfrom useof the product which doesnot comply with the absolutemaximum ratings and the instructionsincluded in thesespecification sheets,andthe precautionsmentionedbelow. (Precautions) (1) This productsis designedfor usein the following applicationareas; * OA equipment * Audio visual equipment * Homeappliance * Telecommunicationequipment(Terminal) * Measuringequipment 1 L * Tooling machines * Computers If the useof the product in the above applicationareasis for equipmentlisted in paragraphs (2) or (3), pleasebe sureto observethe precautionsgiven in thoserespectiveparagraphs. (2) Appropriate measures.suchasfail-safe designandredundantdesignconsidering the safety designof the overall systemandequipment,shouldbe takento ensurereliability and safety when this product is usedfor equipmentwhichdemandshigh reliability and safety in function and precision,suchas ; * Transportationcontrol andsafety equipment(aircraft, train, automobileetc.) * Traffic signals * Gasleakagesensorbreakers * Rescueand security equipment [ * Other safety equipment (3) Pleasedo not usethis product for equipmentwhich requireextremely high reliability and safety in function andprecision,suchas ; * Spaceequipment * Telecommunicationequipment(for trunk lines) c * Nuclear power control equipment * Medical equipment 1 (4) Pleasecontact and consult with a Sharpsalesrepresentativeif there areany questions regardinginterpretation of the above three paragraphs. 3. Pleasecontact andconsult with a Sharpsalesrepresentativefor anyquestionsaboutthis product. CUSTOMER’S APPROVAL ‘DATE: BY: Jm /fC DATE: PRESENTED BY: , 3fQ@@ M.Katoh, DepartmentGeneralManager of EngineeringDeptJII Optc-Electronic Devices Division Electronic ComponentsGroup SHARP CORPORATION /Y ry DG996046 Jun/16/99 PAGE MODEL No. GL6ZV27 GL6ZV27 Snecifrcation 1. Application This specificationappliesto the light emitting diode deviceModel No. GL6ZV27. [AlGaInP (dicing or scribe/braketype> Amber LED device] 2. Outline dimensionsandpin COMeCtiOIIS . . . . . . . . . . . . . . . . . . . . . . . . . . . . Refer to the attachedsheetPage2. 3. Ratingsandcharacteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Refer to the attachedsheetPage3-4. 3- 1. Absolute maximumratings 3-2. Eleciro-optical characteristics 3-3. Derating Curve 3-4. CharacteristicsDiagram 4. Reliability . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Refer to the attachedsheetPage5. 4-1. Test itemsandtest conditions 4-2. MeasurementitemsandFailure judgementcriteria Refer to the attachedsheetPage6. 5. Incoming inspection. . . . . . . . . . . . . . . . . . . . . . . . . . . . . ..*.............o 5- 1. Applied standard 5-2. Samplingmethodandlevel 5-3. Test items,judgementcriteria andclassificaof defect 5-4. Test itemsthe surfaceis be appliedfor fiat type, judgementcriteria andclassifrcaof defect 6. Supplement. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ..~ Refer to the attachedsheetPage7-8. 6-l. Packing 6-2. Luminousintensity rank 6-3. Dominant wavelengthrank 64. Environment 7. Precautionsfor use. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Refer to the attachedsheetPage9- 10. 7- 1. Lead forming method 7-2. Notice of installation 7-3. Soldering Conditions .7-4. For cleaning l/10 DG996046 JllnA6/% MODELNo. I 2. Outline dimensions and pin PAGE GL6ZV27 I z/l0 COMeCtionS 5. 8 20. 2 9, Colorless transparency I I/ I l-t2.54 0 OM I %bI pin COMIXtiOIlS 0. Anode 0. cathode ote) Unspecified tol. to be ~0.2m-n ate) Cold rolled steel leads are plated with but the tie-bar cut portions have no plating do not solder this part of the product. unit mm Material Lead : (Fe) Cold rolled steel Package : Epoxy resin Finish Lead : Sn plated or wave soidering Drawing No. 51106027 Jun/16/99 PAGE DG996046 MODEL No. GL6ZV27 3. Ratings 3110 and characteristics (Note 1) Duty ratio=l/lO,Pulse width=O.lms (Note 2) At the position of 1.6m.m from the bottom resin package 3-2. Electra-optical Parameter Forward voltage characteristics Sylllbol Conditions MIN. - vF TYP. 2.1 (Ta=25”C MAX. unit 2.6 V Iv LLlminous interlsity (Note 3) Peak emission wavelength Dominantwavelength Spectrumradiationbandwidth Reversecurrent IF=2OmA J-P Ad A ;1 I, Ct 28 l/2 w VR=4V V=OV.f=lMHz IF=2OmA Terminal capacitance Viewing Xaxis Angle YilXiS (Note 3) Refer to the suplementitem 6. regarding the standardof rank cla ;ification. 3-3. DeratingCurve Peak Forward Current Derating Forward Curve 120 60 100 50 80 40 60 30 ii 40 20 i ,” 20 10 a .5 Current Derating Curve z g ,” 2 -0 : 0 ” -25 0 Ambient 25 50 Temperature 7585 100 Ta(“C) 125 -25 0 Ambient 25 50 Temperature 75 85 100 TarC) 125 Juni16i99 PAGE DG996046 MODEL No. GL6ZV27 Peak Forward Current vs. Duty 4ilO Ratio CTa=25oC) .lO l/l00 1 l/10 Duty Raito 10 DR 3-4. CharacteristicsDiagram&p) (Note 1) Forward Current vs.Forward Relative vs. Voltage Luminous Intensity Ambient Temperature CTa=25t) loo 0.1 ( I F=2ChnA) CL I Ii Ii iI iI iI irl i1 iI iI iI iI iI /I iI II III j 1 1.21.41.61.8 2 Forward Ralrtive Luminous Voltage Intensity .-z : E - 10 -60-40-20 2.22.42.6 VFW) vs. Frorard Voltue (Ta%?!.%) 1000 B 0. 01 0. 1 1 Forward 10 Current 0 Ambient 100 IFhA) (Note 1) Above characteristicdata are typical data andnot a guarantteeddata. 20 40 Temprature 60 80 100120 Ta (“C). I Jld16/95 DG996O46 MODEL No. 1 PAGE GL6ZV27 S/10 4. Reliability The reliability of productsshallbe satisfiedwith itemslisted below. Conlidencelevel: 9046 LTPD Samples(n) Defective (C) (%) ,-1. Test itemsandtest conditions Test items Test conditions Solderability 230t5”C. 5s Prior disposition: Dip in rosin flux n=ll, C=O 20 Soldering temperature 26Oc-5°C. 5s n=ll,C=O 20 Mechanicalshock 15 000m/s2,05ms. 3times/ iX.*Y,fz direction n=ll. C=O 20 Variable frequency vibration 2OOm/s*,100to 2 000 to 1OOHzJsweep for 4min. ,4timeskX,ktY&Z direction n=ll, C=0 20 Terminalstrength (Tension) Weight: 1ON,S/each terminal n=ll,C=O 20 Terminal strength (Bending) Weight:SN, 0” -+ 90” * 0” /each terminal n=ll,C=O 20 -90” -0” Temperaturecycling -40”c(30min)~+100”c(3Omin),30 cycles n=22, C=O 10 Hgh temp’andhigh humidity storage Ta=+6O”c, 9O%RH, t=100Oh n=22, C=0 10 igh temperaturestorageTa=lOO”C, t=lOOOh n=22, C=O 10 ow temperaturestorageTa=-40”C, t=lOOOh n=22, C=O 10 n=22, C=O 10 Operationlife Ta=25”C. &MAX, t=10O0h*3 4-2. Measurementitemsand Failurejudgementcriteria *l Measurement Symbol Failurejudgementcriteria *2 Forward voltage VF v, > U.S.L. x 1.2 Reversecurrent IR IR > u..%. x 2.0 Luminousintensity Iv Iv > The first stagevalue X 2.0 or The first stagevalueX 0.5 > Iv s Solderability : Soldershallbe adhereat the areaof 95% or moreof dippedportion. z Terminal strength: Packageis not destroyed,and terminal is not slack. *l: Measuringcondition is in accordancewith specification. *2: U.S.L. is shownby Upper Specification Limit. *3: IF m.is shownby forward current of absolutemaximumratings. DG996046 Jlud16/9!I MODEL No. PAGE GL6ZV27 5. Incoming inspection 5-1. Applied standard: IS0 2859-l 5-2. Samplingmethodand level : A singlesamplingpIan,normalinspectionlevel II : AQL Major defect : 0.065% Minor defect : 0.4% . T-3 -. Tmt * -“- itwr~c .--..“* idwmrnt - ----- m-it&a -. .-. -- and -- chxnifica ------- nf defect -- ----- YO. Test items judgementcriteria 1 Disconnection Not emit light 2 Positionof Cutting off rim Different from dimension 3 Reverseterminal Different from dimension 4 Outline dimensions Not satisfy outlinespecification 5 characteristics 6 Cutofftherim classifica of defec Major defect Over the limit value of specificationat V,, Ia, andIv Exceed -0.2mm 7 Foreignsubstance White point : Exceed 4 0.3mm (on top view) Black point : Exceed 4 0.3nun (on top view) String form : Exceed 3.Omm(on top view) 8 Scratch Exceed # 0.3mm or O.lmm x l.Omm(on top view) 9 Void Exceed 4 0.3mm (ontop view) 10 Unevendensityof materialfor scattering Extremely unevendensity 11 Unbalancedcenter Exceed fo.25mm from packagecenter 12 Burr Exceed +0.2mm againstprovideddimension 13 Insertionpositionof terminal Insertion positionof terminal Minor defect 5-4. Test itemsthe surfaceis be applied for flat type, judgementcriteria andclassificaof defect No. Test items judgementcriteria classificaof defec 14 Chappedthe surface The surfacechappedis striking for seethe lamptop Minor defect 15 Hollow the surface The surfacehollow is striking for seethe lamptop 6110 DG996046 MODEL No. GL6ZV27 Jun/16/!x PAGE 7110 6. Supplement 6-l. Packing 6-l-l. Inner package Put 25Opcs the same luminous intensity rank products into pack and put following label by pack. Product weight : 0.28g (One Product,Typ.) (Tdication label sample) SHIPUENT TABLE PART No. GL6ZV27 + Model number *clcl clclclclcl QUANTITY 250 + Quantity of products -~-KA99B19 + Lot number * LOT No. Q@ 0 a -0 R-0 tLuminous intensity rank dominant wavelength rank SHARP’ MADE IN JAPAN + Production country 0 @ @ @ @ Production plant code(to be indicated alphabetically) Support code Year of production(the last two figures of the year) (to be indicated alphabetically with January corresponding to A) Month of production Date of production(Ol-31) 6-l-2. Outer package Put 8 packs (the same luminous intensity rank) into outer package. (approximately 670g per one outer package) 6-l-3. Outer package out line dimension Width: 14Omm, Depth : 225mm. Hight : 90mm 6-2.Luminous intensity rank (Note 1) Rank Luminous intensity I 185 360 J 266 518 K 383 746 I L 552 ( 1075 I (Ta=25”c ) unit Condition mcd 1~2omA j (Note 1) Tolersnce:flS% In regard to luminous intensity , the following ranking shall be carried out. However the quantity of each rank shall not be pre scribed. In case of the distribution of the luminous intensity shift to high, at that point new upper rank is prescribed and lower rank is delete. 1 L 1 591.0 - 594.5 1 I I (Note 2) The condition of measurement : The measurement of the light emission from the front side of lamp. This rank value is the setting value of when that classifies it the rank and be not a guarantee value. Also I shall not ask the delivery ratio of each rank. Do996046 GL6ZV27 6-4. Environment 641. Ozonosphere destructive chemicals. (1) The &vice does& contain following substance. (2) The &vice doesn’t have a production line whose process requires following substance. Restricted part: CF~on~CC~o~~~e~yc~o~fo~) 642. Bromic non-burning materials The &vice doesn’t contain bromic non-burning materials(PBBOs,PBBs) Jun/16/!39 PAGE MODEL. No. 8110 IX996046 GL6ZV27 7. Precautions Jud16/99 PAGE MODEL No. g/10 for use 7 - 1. Lead forming method Avoid fowing a lead pin with the lead pin base as a fulcrum:be sure to hold a lead pin firmly when forming. Lead pins should be formed before soldering. 7 - 2. Notice of installation 7-Z-l installation on a P W B &en mounting an LED lamp on a PIIB.do not apply physical stress to the lead pins. *The lead pin pitch should match the PYBpin-hole pitch:absolutely avoid widening or narrowing the lead pins. Ihen positioning an LED lamp,basically employ an LEDwith tie-bar cut or use a spacer. 7-2-2 Whenan LED 1 is mounted directly on a P WB If the bottom face of an LED lamp is mounted directly on single-sided PVBthe base of the lead pins way be subjected to physical stress due to PWBwarp.cutting or clinching of lead pins. Prior to use, be sure to check that no disconnection inside of the resin or damageto resin etc., is found. when an LED lamp is mounted on a double-sided PWB,theheat during soldering affects the resin;therefore.keep the LED lamp more that 1.6nunafloat above the PRI. 7-2-3 Installation using a holder During an LED lamp positioning,when a holder is used, a holder should be designed not to subject lead pins to any undue stress. (Note)Pay attention to the themal expansion coefficient of the material used for the holder.Since the holder expands and contracts due to preheat and soldering heat, mechanical stress may be applied to the lead pins, resulting in disconnection. 7-2-4 Installation to the case Do not fix part C with adhesives when fixed to the case as shown in Figure.A hole of the case should be designed not to subject the inside of resin to any undue stress. l Good Do6046 Jud16/99 PAGE iMODEL No. I GL6ZV27 7 - 3. S oldering Conditions Solder the lead pins under the following conditions Conditions Type of Soldering 1 I 1. Manual soldering 295”C*YC, within 3 seconds 26O”c+5‘C. within 5 seconds 2. Wave soldering 3. Auto soldering Preheating 70°C to 80°C. within 30 seconds Soldering 245”c+5”c, within 5 seconds (Note) Avoid dipping resin into soldering bath. Avoid applying stress to lead pins while they are heated-For example , when the LED lamp is moved with the heat applied to the lead pins during manual soldering or solder repair,disconnection may occur. 7 - 4. For cleaning ( 1) Solvent cleaning : Solvent temperature 45°C or less Immersion for 3 min or less (2) Ultrasonic cleaning : The effect to device by ultrasonic cleaning differs by cleaning bath size,ultrasonic power output,cleaning time,PIB size or device mounting condition etc. Please test it in actual using condition and confirm that doesn’t occur any defect before starting the ultrasonic cleaning. ( 3 > Applicable solvent : Ethyl alcohol, Methyl alcohol, Isopropyl alcohol In case when the other solvent is u&there are cases that the packaging resin is eroded. Please use the other solvent after thorough confirmation is performed in actual using condition. I lO/lO