PREPARED BY:
DATE:
S,,m
/16/4?
I
I
-UAW30
ELECTRONIC
a-
COMFWENTS
LUKruKn
lx994049
GROUP
1 lUl-4
Opto-Electronic
SPiKIFICATION
DEVICE SPECIFICATION
SPEC.No.
Devices
Division
FOR
Light Emitting Diode
MODEL No.
GL6ZR27
1. These specification sheets include materials protected under the copyright of Sharp Corporation (“Sharp”).
Please do not reproduce or cause. anyone to reproduce them without Sharp’s consent.
2. When using this product, please observe the absolute maximum ratings and the instructions for use outlined
in these speciiication sheets, as well as the precautions mentioned below. Sharp assumes no responsibility
for any damage resulting from use of the product which does not comply with the absolute maximum ratings
and the instructions included in these speciftcation sheets, and the precautions mentioned below.
(Precautions)
(1) This products is designed for use in the following application areas;
* OA equipment * Audio visual equipment * Home appliance
* Telecommunication equipment (Terminal)
* Measuring equipment
*
Computers
*
Tooling
machines
L
If the use of the product in the above application areas is for equipment listed in .paragraphs
(2) or (3), please be sure to observe the precautions given in those respective paragraphs.
1
(2) Appropriate measures, such as fail-safe design and redundant design considering
the safety design of the overall system and equipment, should be taken to ensure reliability
and safety when this product is used for equipment which demands high reliability and
safety in function and precision, such as ;
* Transportation control and safety equipment (aircraft, train, automobile etc.)
* Traffic signals
* Gas leakage sensor breakers
* Rescue and security equipment
*
Other
safety
equipment
[
(3) Please do not use this product for equipment which require extremely high reliability
and safety in function and precision, such as ;
* Space equipment
* Telecommunication equipment (for trunk lines)
* Medical equipment
C * Nuclear power control equipment
1
1
(4) Please contact and consult with a Sharp sales representative if there are any questions
regarding interpretation of the above three paragraphs.
3. Please contact and consult with a Sharp sales representative for any questions about this product.
CUSTOMERS
DATE:
BY:
APPROVAL
DATE:
PRESENTED BY:
JL4%
I
M.Katoh,
Department General Manager of
Engineering Dept.Jll
Opto-Electronic Devices Division
Electronic Components Group
SHARP CORPORATION
f9?q
/
1
DO996049
Jun/16/9!9
PAGE
IMODEL, No.
GL6ZR27
GL6ZR27 Specification
1. Application
This specificationappliesto the light emitting diodedevice Model No. GL6ZR27.
[AlGaIS (dicing or scribe/braketype> Red LED device]
2. Outline dimensionsandpin connections
. . . . . . . . . . . . . . . . . . . . . . . . . . . . Refer to the attachedsheetPage2.
3. Ratingsandcharacteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Refer to the attachedsheetPage3-4.
3-l. Absolute maximumratings
3-2. Electra-optical characteristics
3-3. Dewing Curve
3-4. CharacteristicsDiagram
4. Reliability . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Refer to the attachedsheetPage5.
4- 1. Test itemsandtest conditions
4-2. MeasurementitemsandFailure judgementcriteria
5. Incoming inspection. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Refer to the attached sheetPage6.
5-1. Applied standard
5-2. Samplingmethodandlevel
5-3. Test items,judgementcriteria and classificaof defect
5-4. Test itemsthe surfaceis be appliedfor flat type, judgementcriteria and classificaof defect
6. Supplement. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ..~ Refer to tbe attachedsheetPage7-8.
6-l. Packing
6-2. Luminousintensity rank
6-3. Dominantwavelengthrank
6-4. Erivironment
7. Precautionsfor use. . . . . . . . . . . . . . . . . . . . . . . . . . ..*..................
7- 1. Lead forming method
7-2. Notice of installation
7-3. Soldering conditions
.74. For cleaning
Refer to the attachedsheetPage9% 10.
l/10
I Jun/16/99
1PAGE
DG996049
MODEL No.
I
GL6ZR27
I
2/10
2. Outline dimensions and pin connections
5. 6 20. 2
Colorleis
m,
transparency
t
I
i
2. 54F’OM
Pin cont&ions
a. Amxle
0. cathode
~Jote)UnspeciEedtol. to be *02mm
Note) Cold rolled steelleadsareplated with but the tie-bar cut portions haveno plating do not sol&r this part of the product.
unit
mm
Material
Lead : (Fe) Cold rolled steel
Package: Epoxy resin
Fish
I
Lead : Sn platedor wave soldering
I
I
Drawing No.
51106030
Jun/16/9!
PAGE
DG996049
MODEL No.
GL6ZR27
3110
3. Ratings and charactekstics
(Note 1) Duty ratio=l/lO,Pulse width=O.lms
(Note 2) At the position of 1.6mm from the bottom resin package
(Note 3) Refer to the suplement item 6. regarding the standard of rank classification.
3-3. Derating Curve
Peak
Forward
Current
Derating
Curve
Forward
Current
Derating
Curve
60
3
IL
;
f
=
2
5o
40
30
7
L
20
i
10
0
.25
0
Ambient
25
50
Temperature
75 a5 loo
TarC)
125
-25
0
Ambient
25
50
Temperature
75a5100
TarC)
125
DG996049
MODEL No.
Junl16/!w
PAGE
4110
GL6ZR27
Peak
Forward
Current
vs.
Duty
Ratio
(Ta=25%)
10
l/100
1
l/10
Duty
10
Raito
DR
34. cl haracteristics Diagram(typ) (Note 1)
Forward
Current
vs.Forward
Relative
Luminous
intensity
vs. Ambient
Temperature
Voltage
(Ta=25"C)
(IF=2OmA)
100
10
1
0. 1
10
1
1.2
1.4
1.6
Forward
Relative
Luminous
1.6
2
Voltage
Intensity
vs.
2.2
2.4
2.6
-60-40-20
Ambient
VF(V)
Frorard
Voltage
(Ta= d5"c)
10
s
O.E ?5
1
5
-I
.-P
0. 1
z
0.01
0. 1
1
Forward
10
Current
100
IFhA)
(Note 1) Above characteristic data are typical data and not a guarantteed data.
0
20 40
Temprature
60
60
Ta("C)-
100120
Jud16i99
DG996049
MODEL No.
PAGE
GL6ZR27
1
4. Reliability
The reliability of productsshagbe satisfiedwith itemslistedbelow.
4- 1. Test itemsand testconditions
Test items
Confidencelevel: 90%
LTPD
Samples(n)
Defective (C)
(Q/g)
Test conditions
Solderability
230f5=C, 5s
Prior diisition
Soldering
temperature
rl=ll,C=O
20
260+5”c, 5s
n=ll,C=O
20
Mechanicalshock
15OOO&, 0.5ms.
3times/ kXSY$Z direction
n=ll, C=O
20
Variable frequency
vibration
2OOm/s*,100to 2 0OOto lOOHz/sweepfor 4min.
,4times/fX~Y,fZ direction
n=ll, C=O
20
Weight:lON, Ss/each terminal
n=ll,C=0
20
Weight:SN, 0” ---*90” -B O”* -90” + 0”
/each terminal
n=ll. C=O
20
Terminal strength
(Tension)
Terminal strength
(Bending)
Temperaturecycling
High temp*andhigh
humidity storage
I
: Dip in rosin flux
-40”c(3Or11in)~+l0O”c(3Omin),30cycles
I
Ta=+60”C. 9O%RH, t=lO0Oh
I-ltigh temperaturestorageTa=10O”C,t=lOOOh
Low temperaturestorageTa=-40”C, t=lO0Oh
I
Operationlife
Ta=25”C, &MAX, t=lOO0h *3
I
I
I
n=22, C=O
I
10
n=22, C=O
10
n=22, C=O
10
n=22. C=O
n=22, C=O
I
I
10
10
4-2. Measurementitemsand Failurejudgementcriteria * 1
Measurement
SjTIlbOl
Failurejudgementcriteria *2
Forward voltage
VF
v, > U.S.L. x 1.2
Reversecurrent
IR
IR > U.S.L. x 2.0
I+rninous intensity
IV
Iv > The first stagevalue X 2.0 or The first stagevalue X 0.5 > Iv
z Solderability : Soldershallbe adhereat the areaof 95% or moreof dippedportion.
s Terminal strength: Packageis not destroyed, and termi.naiis not slack.
* 1: Measuringcondition is in accordancewith specification.
*2: U.S.L. is shownby Upper Specification Limit.
*3: IF MAX.is shownby forward current of absolutemaximumratings.
I
I
I
S/10
Jun/16/99
PAGE
DG996049
MODEL No.
GL6ZR27
5. Incoming inspection
5- 1. Applied standard : IS0 2859-l
5-2. Sampling method and level : A single sampling plannormal inspection level II
: AQL Major defect : 0.065%
Minor defect : 0.4%
5-3. Test items, judgement criteria and classifica of defect
No.
Test items
judgement criteria
1
Disconnection
Not emit light
2
Position of Cutting off
rim
Different from dimension
3
Reverse terminal
Different from dimension
4
Outline dimensions
Not satisfy outline specification
5
characteristics
Over the limit value of specification at Vr, Ia, and Iv
6
Cut off the rim
Exceed -0.2mm
7
Foreign substance
White point : Exceed 4 0.3mm (on top view)
Black point : Exceed 4 0.3mm (on top view)
String form : Exceed 3.Omm (on top view)
8
Scratch
Exceed 4 0.3mm or O.lmm x LOnun (on top view)
9
Void
Exceed 4 0.3mm (on top view)
10
Uneven density of
for scattering
material
classifica of defec
Major defect
Minor defect
Extremely uneven density
11
Unbalanced center
Exceed fo.25mm from package center
12
Burr
Exceed +0.2mm againstprovided dimension
13
Insertion position of
terminal
Insertion position of terminal
5-4. Test items the surface is be applied for flat type, judgement criteria and classifica of defect
No.
Test items
judgement criteria
classifica of defect
14
Chapped the surface
The surface chapped is striking for see the lamp top
Minor defect
15
Hollow the surface
The surface hollow is striking for see the lamp top
6110
DG996049
MODEL No.
GL6ZR27
Junl16/99
PAGE
7110
6. Supplement
6-l. Packing
6-l-l. Inner package
Put 25Opcs the same luminous intensity rank products into pack and put following label by pack.
Product weight : 0.28g (One Product,Typ.)
(Indication label sample)
SHIPRHNT TABLE
- Model number
PART No.
GL6ZFt27
*!
q --00000
CUNTITY
250
- Quantiv of products
LM No.
KA99B19
- Lot number
*
0
0
Q@Q
Cl-Cl cLuminous intensity rank
dominant wavelength rank
SHARP’
MADE IN JAPAN
+ Production country
0
@
@
@
@
production plant code@ be indicated alphabetically)
Support code
Year of production(the last two figures of the year)
(to be indicated alphabetically with January corresponding to A)
Month of production
Date of production(01 cy 3 1)
6-l-2. Outer package
Put 8 packs (the same luminous intensity rank) into outer package.
(approximately 670g per one outer package)
6-l-3. Outer package out line dimension
Width : 14Omm, Depth : 225mm. Night : !%nm
(Note 1) Tolerance:flS%
In regard to luminous intensity , the following ranking shall be carried out.
However the quantity of each rank shall not he pre scribed.
In case of the distribution of the luminous intensity shift to high, at that
point new upper rank is prescribed and lower rank is delete.
6-3.Dominant
Rank
I
Y
Z
1
2
3
I
wavelength rank (Note 2)
Dominant wavelength
I
1
unit
Ta=25”C)
Condition
1
1
1
1
I
1
run
ItF2cmA
628.5
631.5
634.5
637.5
640.5
-
632.5
635.5
638.5
641.5
644.5
I
(Note 2) The condition of measurement : The measurement of the light emission from the front side of lamp.
This rank value is the setting value of when that classifies it the rank and be not a guarantee value.
Also I shall not ask the delivery ratio of each rank.
m6049
MODEL No.
GL6ZR27
64. Environment
641. Ozonosphere destructive chemicals.
(1) The &vice doesn’t contain following substance.
(2) The &vice doesn’t have a production line whose processrequires following substance.
Restricted pk CFCs,halones,CCl+TrichloroethsWMethychloroform)
6-4-2. Bromic non-burning materials
The &vice doesn’t contain bromic non-burning materials(PBBO~BBs)
Jud16/99
PAGE
8110
DG996049
Jud16/!?
PAGE
MODEL No.
GL6ZRZ7
9/10
7. Precautionsfor use
7 - 1. Lead fowing method
Avoid forming a lead pin with the lead pin base as
a fulcrum:be sure to hold a lead pin firmly when
forming. Lead pins should be formed before soldering.
7 - 2. Notice of installation
7-2-l installation on a P W B
Khen mounting an LED lamp on a P’RB,donot apply
physical stress to the lead pins.
The lead pin pitch should match the PVBpin-hole
pitch:absolutely avoid widening or narrowing
the lead pins.
Whenpositioning an LED lamp,basically employ
an LEDwith tie-bar cut or use a spacer.
7-2-2 Whenan LED 1 is mounted directly on. a P W B
If the bottom face of an LED lamp is mounted
directly on single-sided Pm,the base of the
lead pins may be subjected to physical stress
due to PVBwarp, cutting or clinching of lead
pins. Prior to use, be sure to check that no
disconnection inside of the resin or damageto
resin etc., is found. Whenan LED lamp is mounted
on a double-sided PIVB,theheat during soldering
affects the resin;therefore,keep
the LED lamp
more that 1.6ma afloat above the PIVB.
7-2-3 Installation using a holder
During an LEDlamp positioning,when a holder is
used, a holder should be designed not to subject
lead pins to any undue stress.
(Note)Pay attention to the thermal expansion coefficient
of the material used for the holder.Since the
holder expands and contracts due to preheat and
soldering heat, mechanical stress may be applied to
the lead pins, resulting in disconnection.
7-Z-4 Installation to the case
Do not fix part C with adhesives when fixed to the
case as shown in Figure.A hole of the case should
be designed not to subject the inside of resin
to any undue stress.
l
l
Good
.
r
lx996049
MODEL. No.
CL62227
7 - 3. S oldering Conditions
Solder the lead pins under the following conditions
C ondi tions
Type of Soldering
295°C
+5”c,
within 3 seconds
1. Manual soldering
260C
*S”c.
within
5 seconds
2. Wave soldering
Preheating
70°C
to
8O”C,
within 30 seconds
3. Auto soldering
Soldering 245”c+5”c, within 5 seconds
(Note) Avoid dipping resin into soldering bath.
Avoid applying stress to lead pins while they are heated-For example ,
when the LED lamp is moved with the heat applied to the lead pins during
manual soldering or solder repair, disconnection way occur.
bldcrinr
iroe
7 - 4. For cleaning
( 1)
Solvent cleaning : Solvent temperature 45°C or less
Immersion for 3 min or less
( 2 > Ultrasonic cleaning : The effect to device by ultrasonic cleaning differs
by cleaning bath size,ultrasonic power
output, cleaning time, P’WB
size or device mounting
condition etc. Please test it in actual using condition
and confirm that doesn’t occur any defect before starting
the ultrasonic cleaning.
( 3 > Applicable solvent : Ethyl alcohol, Methyl alcohol, Isopropyl alcohol
In case when the other solvent is u&xi, there are cases that
the packaging resin is eroded. Please use the other solvent
after thorough confirmation is performed in actual using condition.
Jud16/99
PAGE
lO/lO