PREPARED BY: T&n DATE: / c 6/ qY (A 4Cl& APPROVED BY: J&l DATE: / /b/P9 ELECTRONIC HARP COMPONENTS GROUP CORPORATION SPECIFICATION mq&za DEVICE SPECIFICATION SPECNo. Ix5996031 ISSUE Jun/16/99 PAGE REPRESENTAlIVE 10 pages DIVISION: Opto-Ekctronic Devices Division FOR Light Emitting Diode MODEL No. GL5ZR302BOS 1. These specification sheets include materials protected under the copyright of Sharp Corporation (“Sharp”). Please do not reproduce or cause anyone to reproduce them without Sharp’s consent. 2. When using this product, please observe the absolute maximum ratings and the instructions for use outlined in these specification sheets, as well as the precautions mentioned below. Sharp assumes no responsibility for any damage resulting from use of the product which does not comply with the absolute maximum ratings and the instructions included in these specification sheets, and the precautions mentioned below. (Precautions) (1) This products is designed for use in the following application areas; * Audio visual equipment * Home appliance * OA equipment * Telecommunication equipment (Terminal) * Measuring equipment * Tooling machines * Computers I r If the use of the product in the above application areas is for equipment listed in paragraphs (2) or (3). please be sure to observe the precautions given in those respective paragraphs. (2) Appropriate measures, such aa fail-safe design and redundant design considering the safety design of the overall system and equipment, should be taken to ensure reliability and safety when this product is used for equipment which demands high reliability and safety in function and precision, such as ; * Transportation control and safety equipment (aircraft, train, automobile etc.) * Gas leakage sensor breakers * Rescue and security equipment * Traftic signals I [ * Other safety equipment (3) Please do not use this product for equipment which require extremely high reliability and safety in function and precision, such as ; * Telecommunication equipment (for trutk lines) * Space equipment * Nuclear power control equipment * Medical equipment C (4) Please contact and consult with a Sharp sales representative if there are any questions regarding interpretation of the above three paragraphs. I 3. Please contact and consult with a Sharp sales representative for any questions about this product. CUSTOMER’S APPROVAL ‘DATE: BY: DATE: PRESENIED J(.l/YL /IS/ m BY: M.Katoh, Department General Manager of Engineering Dcpt.,BI Opto-Electronic Devices Division Electronic Components Group SHARP CORPORATION / DG!39603 1 MODEL No. Jud16/99 PAGE GL5ZR302BOS GL5ZR302BOS Soecification 1. Application This specification applies to the light emitting diode device Model No. GL5ZR302BOS. [AlGalnP (dicing or scribe/brake type) Red LED &vice] 2. Cuthne dimensions and pm co~e%!tions . . . . . . . . . . . . . . . . . . . . . . . . . . . . Refer to the attached sheet Page 2. 3. Ratings and characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Refer to the attached sheet Page 3-4. 3- 1. Absolute maximum ratings 3-2. Electra-optical characteristics 3-3. Derating Curve 3-4. Characteristics Diagram 4. Reliability . . . . . . . . . . . . . . . . . . . . . . . . . ..*........................... 4-l. Test items and test conditions 4-2. Measurement items and Faihue judgement criteria Refer to the attached sheet Page 5. 5. Incoming inspection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Refer to the attached sheet Page 6. 5- 1. Applied standard 5-2. Sampling method and level 5-3. Test items, judgement criteria and classifxa of defect 54. Test items the surface is be applied for flat type, judgement criteria and classifica of defect 6. Supplement . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Refer to the attached sheet Page 7-8. 6-1. Packing 6-2. Luminous intensity rank 6-3. Dominant wavelengthrank 6-4. Environment 7. Precautionsfor use . . . . . . ..I...................................... 7- 1. Lead forming method 7-2. Notice of installation 7-3. SolderingConditions ‘7-4. For cleaning Refer to the attached’sheetPage9- 10. l/10 Jun/l6/99 PAGE DC89603 1 MODEL No. 2. Outline dimensions and pin cormeetions 00 10r 18~s trvinqare~Y iI I i 0 G o cd . e A I I II : Ix i i i i i I o iti. lt--lr i j -z 0. 5 +o. 1 ;;I pin connections 0. Anode 0: cathode p4ote) Umpecified tol. to be f0.2mm mote) Cold rolled steel leads are plated with but the tie-bar cut portions have no plating do not sol&r this part of the product. unit mm Material Lead : (Fe) Cold rolled steel Package : Epoxy resin Fiih Lead : Sn plated or wave soldering Drawing No. 51106012 lx99603 MODEL No. Jun/16/9 1 PAGE GL5ZR302BOS 3/10 3. Ratingsandcharacteristics’ (Note 1) Duty ratio=1/1O,FUsewidth=O.lms (Note 2) At the positionof 1.6mmfrom the bottom resin package (Note 3) Refer to the suplementitem 6. regardingthe standardof rankclassification. 3-3. DeratingCurve Peak a .5 Forward Current Derating Curve Forward 120 60 100 50 80 40 60 30 Current Derating Curve e z t! 2 20 10 -25 0 Ambient 25 50 Temperature 75 a510C TarC) 125 -25 0 Ambient 25 50 Temperature 75--100 Ta (“C) 125 \ Jurl/16/99 DG99603 1 MODEL No. PAGE 4110 GL5ZR302BOS Peak Forward Current vs. Duty Ratio (Ta=25”C) 10 l/100 1 l/10 Duty Raito 3-4. Characteristics Diagram&p) Forward Current 10 OR (Note 1) vs.Forward Relative Luminous Intensity vs. Ambient Temperature Voltage (Ta=25”C) loo 1000 t 1 1.2 1.4 1.6 Forward Relative ( I F=2OmA) Lminour 1.8 2 Voltage Intensity VS. 2.22.4 -60 2.6 M(V) Frowrrd Voltage (Ta=25”C) 1000 5, 2ii z u: .aea v 5 -l >” .% 2 100 10 1 0. 1 0. 01 1 0. 1 Forward 10 Current 100 IFhA) (Note 1) Above characteristic data are typical data and not a gmrantteed data. -40 -20 Ambient 0 20 40 Temprature 60 80 TarC). 100 120 DG99603 1 JLud16/9!I MODEL No. PAGE GL5ZR302BOS 5110 4. Reliability The reliability of productsshallbe satisfiedwith items listed below. L Cl. Test itemsandtestconditions Test items Confidencelevel: 90’ Samples(n) LTPC Defective (C) @IO) Test conditions Solderability 230t5”C, 5s Prior disposition: Dip in rosin flux n=ll, C=O 20 Soldering temperature 260f5”C; n=ll, C=O 20 n=ll, C=O 20 n=ll.C=O 20 Mechanical shock Variable frequency vibration 5s 15 OOOm/sz, 05ms, 3timesI 33SYptZ direction 2OOm/s*,100to 2 000 to lOOHz/sweepfor 4min. ,4times/S&Y&Z direction Terminal strength (Tension) Weight: ION, S/each terminal n=ll,C=O 20 Terminal strength (Bending) Weight:SN,O” + 90” --) O”* -90” + 0” /each terminal n=ll, C=O 20 Temperaturecycling 40~(3Omin)~+100”c(3Omin),30 cycles n=22, C=O 10 High temp. andhigh humidity storage Ta=+60”C, 9O%RH,t=lOOOh n=22. C=O 10 I!Iigh temperaturestorageTa=lOO”C, t=lOOOh n=22, C=O 10 Low temperaturestorageTa=4O”c, t=lOOOh n=22, C=O 10 n=22, C=O 10 Operation life Ta=25”c, IFMAX. t=lOOOh*3 4-2. MeasurementitemsandFailure judgementcriteria * 1 Measurement Symbol Failurejudgementcriteria *2 Forward voltage vF VF > U.S.L. x 1.2 Reversecurrent IR IR > U.S.L. x 2.0 Luminousintensity Iv Iv > The first stagevalueX 2.0 or The first stagevalueX 0.5 > Iv s Solderability : Soldershallbe adhereat the areaof 95% or moreof dippedpotion. g Terminal strength: Packageis not destroyed,and terminal is not slack. * 1: Measuringcondition is in accordancewith specification. *2: U.S.L. is shownby UpperSpecificationLimit. *3: IF MAXis shownby forward current of absolutemaximum ratings. Jud16/95 DG99603 1 MODEL PAGE No. GL5ZR302BOS 5. Incoming inspection 5-1. Applied standard: IS0 2859-l 5-2. Samplingmethodandlevel : A single samplingplannormalinspectionlevel II : AQI.. Major defect : 0.065% Minor defect : 0.4% 5-3. Test items,judgementcriteria and classilicaof defect No. 1 Disconnection I 2 I I Reverseterminal I Outline dimensions I 5 I characteristics I I Cut off therim 6 I Positionof Cutting off Al 31 4 judgementcriteria Test items I I Not emit light Different from dimension Major defect Different from dimension Not satisfy outline specification Over the limit value of specificationat V,, Ia, andIv Exceed -0.2mm 7 Foreignsubstance White point : Exceed $J0.3mm (on top view) Black point : Exceed d 0.3mm (on top view) String form: Exceed 3.Omm(ontopview) 8 Scratch Exceed Q0.3mmor O.lmm x l.Omm(on top view) 9 Void Exceed @0.3mm (on top view) 10 Unevendensityof materialfor scattering Extremely unevendensity 11 Unbalancedcenter I I 12 BUlT 13 Insertionpositionof terminal Exceed MZrnm I :lassifica of deft Minor defect from packagecenter Exceed +0.2mmagainstprovideddimension Insertion positionof terminal 5-4. Test itemsthe surfaceis be applied for flat type, judgementcriteria andclassificaof defect judgementcriteria No. Testitems 14 Chappedthe surface The surfacechappedis striking for seethe lamptop 15 Hollow the surface The surfacehollow is striking for seethe lamptop I classifica of defec --J Minor defect 6110 DG99603 1 MODEL No. I GL5ZR302BOS Jun/16/99 PAGE 1 7110 6. Supplement 6-l. Packing 6-l-l. Inner package Put 25Opcs the same luminous intensity rank products into pack and put following label by pack. Product weight : 0.28g (One Product,Typ.) (Indication label sample) SHIPMENT TABLE PARTNo. GL5ZR302BOS - Modelnumber *o q q uuuu 250 - Quantity of products QUANTITY *Lotnumber* LOT No. KA99B19 05 0 0 0 Cl-0 tLuminousintensityrank dominantwavelengthrank SHARP’ + Productioncountry MADE IN JAPAN 0 @ @) @ @ Productionplant code(tobe indicatedalphabetically) Supportcode Year of production(thelast two figures of the year) (to be indicatedalphabeticallywith Januarycorrespondingto A) Month of production Date of production(01u 3 1) 6-l-2. Outer package Put 8 packs (the sameluminousintensity rank) into outerpackage. (approximately 670g per oneouter package) 6-l-3. Outer packageout line dimension Width: 14Omm,Depth: 225mm, I-I@: 9Omm 6-2.Luminousintensity rank (Note 1) Rank Luminousintensity 1 I 360 1 I 185 I 518 1 266 J K I 383 746 1. 552 ( 10751 I I 1 Unit (Ta=ZpC) 1Condition mcd (Note 1) Tolerance:flS% In regardto luminousintensity , the following rankingshallbe carried out. However the quantity of eachrank shallnot be pre scribed. In caseof the distribution of the luminousintensity shift to high, at that point new upperrank is prescribedand lower rank is delete. 6-3.Dominantwavelengthrank (Note 2) Rank Dominant wavelength I 632.5 : Y 1 628.5 - I 3 1 640.5 - b44.5 Unit 1 (Ta=2pC ) Condition I I (Note 2) The condition of measurement: The measurement of the light emissionfrom the front sideof lamp. This rank value is the setting value of whenthat ‘classifiesit the rank and be not a guaranteevalue. Also I shall not ask the delivery ratio of eachrank. Ix996031 MODEL No. GL5ZR302BOS 6-4. EnviromIlent 641. Ozonospheredestructivechemicals. (1) The device doesn’tcontain following substance. (2) The device doesn’thave a productionline whoseprocessrequiresfollowing substance. Restrictedpart: CFCs~ones,C~,Trichloroethane(Methych 642. Bromic non-burningmaterials The &vice doesn’tcontain bromic non-burningmaterials(PBBOs,PBBs) Jun/16/9!3 PAGE 8/10 JunA6/99 DG996031 MODEL No. 7. Pnxautions PAGE for use 7 - 1. Lead forming method Avoid forming a lead pin with the lead pin base as a fulcrum:be sure to hold a lead pin firmly when forming. Lead pins should be formed before soldering. 7 - 2. Notice of installation 7-2-l installation on a P W B Vhen mounting an LEDlamp on a PIB,do not apply physical stress to the lead pins. The lead pin pitch should match the PIB pin-hole pitch:absolutely avoid widening or narrowing the lead pins. Ihen positioning an LEDlamp, basically employ an LEDwith tie-bar cut or use a spacer. 7-2-2 Whenan LED 1 is mounted directly on a P W B ’ If the bottom face of an LED lamp is mounted directly on single-sided PW,the base of the lead pins may be subjected to physical stress due to PYBwarp,cutting or clinching of lead pins.Prior to use,be sure to check that no disconnection inside of the resin or damageto resin etc.,is found-Then an LED lamp is mounted on a double-sided PWB,theheat during soldering affects the resin;therefore.keep the LED lamp more that l.6mm afloat above the PWB. 7-2-3 Installation using a holder During an LED lamp positioning,when a holder is used,a holder should be designed not to subject lead pins to any undue stress. (Note)Pay attention to the thermal expansion coefficient of the material used for the holder.Since the holder expands and contracts due to preheat and soldering heat, mechanical stress may be applied to the lead pins, resulting in disconnection. 7-Z-4 Installation to the-case Do not fix part C with adhesives when fixed to the case as shown in Figure.A hole of the case should be designed not to subject the inside of resin to any undue stress. l NG l Good fib 0 n . 611 - ~ 1 DG99603 1 Jud16/99 PAGE MODEL No. I GL5ZR302BOS 7 - 3. S oldering Conditions Solder the lead pins under the following conditions Conditions Type of Soldering 295”c+YC, within 3 seconds 1. Manual soldering 2. Wave soldering 26O“C+5”c. within 5 seconds Preheating 7O’c to 8O“C, within 30 seconds 3. Auto soldering 1 Soldering 245”ct-5”c, within 5 seconds 1 (Note) Avoid dipping resin into soldering bath. Avoid applying stress to lead pins while they are heated.For example when the LED lamp is moved with the heat applied to the lead pins dur Lg manual soldering or solder repair,disconnection may occur. I 7 - 4. For cleaning ( 1) Solvent cleaning : Solvent temperature 45°C or less Immersion for 3 min or less (2 > Ultrasonic cleaning : The effect to device by ultrasonic cleaning differs by cleaning bath size,ultrasonic power output,cleaning time,PW size or device mounting condition etc. Please test it in actual using condition and confirm that doesn’t occur any defect before starting the ultrasonic cleaning. ( 3 > Applicable solvent Ethyl alcohol. Methyl alcohol, Isopropyl alcohol In case when the other solvent is used,there are cases that the packaging resin is eroded. Please use the other solvent after thorough confirmation is performed-in actual using condition. I lo/lo