PREPARED BY: DATE: /?7’ ZJ-dtx /t6 T. cleda ELECTRONIC COMPONENTS GROUP SHARP CORPORATION s PEC~CATION DEVICE SPECIFICATION 1 Opto-Electronic Devices Division FOR Light Emitting Diode MODEL No. I 1 GL6ZJ27 I 1. These specification sheets include materials protected under the copyright of Sharp Corporation (“Sharp”). Please do not reproduce or cause anyone to reproduce them without Sharps consent. 2. When using this product, please observe the absolute maximum ratings and the instructions for use outlined in these specification sheets, as well as the precautions mentioned below. Sharp assumes no responsibility for any damage resulting from use of the product which does not comply with the absolute maximum ratings and the instructions included in these specification sheets, and the precautions mentioned below. (Precautions) (1) This products is designed for use in the following application areas; * OA equipment * Audio visual equipment * Home appliance * Telecommunication equipment (Terminal) * Measuring equipment * Computers * Tooling machines L If the use of the product in the above application areas is for equipment listed in paragraphs (2) or (3), please be sure to observe the precautions given in those respective paragraphs. 1 (2) Appropriate measures, such as fail-safe design and redundant design considering the safety design of the overall system and equipment, should be taken to ensure reliability and safety when this product is used for equipment which demands high reliability and safety in function and precision, such as ; * Transportation control and safety equipment (aircraft, train, automobile etc.) * Rescue and security equipment * Traffic signals * Gas leakage sensor breakers * Other safety equipment c (3) Please do not use this product for equipment which require extremely high reliability and safety in function and precision, such as ; * Space equipment * Telecommunication equipment (for trunk lines) C * Nuclear power control equipment * Medical equipment (4) Please contact and consult with a Sharp sales representative if there are any questions regarding interpretation of the above three paragraphs. 1 1 3. Please contact and consult with a Sharp sales representative for any questions about this product. CUSTOMER’S DATE: BY: APPROVAL. DATE: PRESENTED BY: MKatoh, Department General Manager of Engineering Dept.,IH Ooto-Electronic Devices Division Eiectronic Components Group SHARP CORPORATION DG996048 Jun/16/99 PAGE MODEL No. GL6Zl27 GL6ZT27 Snecification 1. Application This specificationappliesto the light emitting diode deviceModel No. GL6ZJ27. [AlGalnP (dicing or scribe/braketype) Grange LED device] 2. Outline dimensionsandpin connections. . . . . . . . . . . . . . . . . . . . . . .. . . . .Refer to the attachedsheetPage2. 3. Ratingsandcharacteristics. . . . . . . . . . . . . . . . . . . . . ..*................ 3-1. Absolute maximumratings 3-2. Electra-opticalcharacteristics 3-3. DeratingCurve 3-4. CharacteristicsDiagram Refer to the attachedsheetPage3-4. 4. Reliability . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ..*............ 4- 1. Test itemsand testconditions 4-2. MeasurementitemsandFailure judgement criteria Refer to the attachedsheetPage5. Refer to the attachedsheetPage6. 5. Incoming inspection. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ..*......... 5-1. Applied standard 5-2. Samplingmethodand level 5-3. Test items,judgementcriteria and classificaof defect 54. Test itemsthe surfaceis be applied for flat type, judgementcriteria andclassificaof defect 6. Supplement. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ..*............... 6-l. Packing 6-2. Luminousintensity rank 6-3. Dominantwavelengthrank 6-4. Environnient Refer to the attachedsheetPage7-8. 7. Precautionsfor use. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Refer to the attachedsheetPage9- 10. 7- 1. Lead forming method 7-2. Notice of installation 7-3. SolderingConditions .7-4. For cleaning l/10 _ IX996048 Jun/16/99 PAGE MODEL No. 2 ~the dimensions and pin COMeCtionS Colorless transparency I 2. 54 OM i Pin coMections 0. Anode 0. cathode iote) Unspecified tol. to be +0&m rote) Cold rolled steel leads are plated with but the tie-bar cut portions have no plating do not solder this part of the product. unit mm Material Lead : (Fe) Cold rolled steel Package : Epoxy resin Fiih Lead : Sn plated or wave soldering Drawing No. 51106029 Junl16l99 PAGE DG996048 MODEL No. GL6ZJ27 3110 3. Ratings and characteristics \ (Note 1) Duty ratb=l/lO,Pulse tidth=O. lms (Note 2) At the position of 1.6mm from the bottom resin package (Note 3) Refer to the suplement item 6. regarding the standard of rank classification. 3-3. Derating Curve Peak Forward Current Derating Forward Curve Current Derating Curve 120 5 e 100 01 -25 0 Ambient 25 50 Temperature 1585100 Ta?C) 125 -25 I I I 0 25 50 Ambient Temperature 795I I 1 100 125 Ta("C) DG996048 MODEL .Jun/16/99 PAGE No. GL6ZJ27 Peak Forward vs. Duty Ratio (Ta=25%) Current l/100 1 l/10 Duty 3-4. Characteristics Current 10 DR Raito Diagram(typ) Forward 4110 (Note 11 Relative Luminous intensity vs. Ambient Temperature Voltage vs.Forward (Ta=25”C) ( I F=2OmA) 1000 .-s t E 2o- 100 .f E 5 2 .-e ?fl z J O.l"!"'Ir""""' 1 1.2 1.4 1.6 Forward Relative Luminous 1.8 2 Voltage Intensity vs. 2.2 2.4 Ambient VFW) Froward Voltage (Ta=25"C) 1000 .-:: 2 2 100 10 2 Oh .E E 5 -J 2 .-+ 2 d 1 0. 1 0.01 0. 1 Forward (Note l)Above 10 1 Current characteristicdataaretypicaldata 10 -60 -40 -20 2.6 100 IFW) andnotagumtteeddata. 0 20 40 60 80 100 120 Temprature Ta(OC)- DG996048 Jun/16/99 MODEL No. PAGE GL6ZJ27 5/10 4. Reliability The reliability of productsshallbe satisfiedwith itemslisted below. t-1. Test itemsandtestconditions Test items Solderability Confidencelevel: 904 Samples(n) LTPD Defective (Cl (%) Test conditions 23Or+5'=C. 5s n=ll. C=O 20 n=ll, C=O 20 n=ll, C=O 20 n=ll, c=O 20 Weight:lON. Ss/each terminal n=ll, C=O 20 Weight:SN, 0” -90” /each terminai n=ll, C=O 20 n=22, C=O 10 n=22, C=O 10 tigh temperaturestorageTa=lOO”c, t=lOOOh n=22,c=-O 10 ow temperaturestorageTa=-40=, t=lOOOh n=22, C=O 10 n=22, C=O 10 Soldering temperature Mechanicalshock Variabie frequency vibration Terminalstrength (Tension) Terminal strength (Bending) Prior disposition: Dip in rosin flux 26025°C. 5s 15 OOOm/s*, 0.5ms, 3tirnes/ S,fY,iZ direction 2Olh/s*, 100 to 2 000 to lOOH&weep for 4min. ,4times/&iY ,Ez direction -+ OQ -90” -+ 0” Temperaturecycling -40~(3Omin)~+l~“c(3~in),30 High temp*andhigh humidity storage Ta=+60”C, 9O%RH,t=lOOOh Operationlife cycles Ta=25”C, IrMAX, t=lOOOh*3 4-2. MeasurementitemsandFailurejudgementcriteria * 1 Measurement QIllbOl Failurejudgementcriteria *2 Forward voltage vF v,>u.s.L.x 1.2 Reversecurrent IR I,>u.s.L.x 2.0 J.mninousintensity IV Iv > The first stagevalueX 2.0 or The first stagevalue X 0.5 > Iv s Solderability : Sol&r shallbe adhereat the areaof 95% or moreof dippedportion. Z Terminal strength: Packageis not destroyed,and terminal is not slack. *l: Measuringcondition is in accordancewith specification. *2: U.S.L. is shownby Upper Specification Limit. *3: lr MAX.is shownby forward current of absolutemaximumratings. DG996048 MODEL I Jun/16/9! No. I 1 PAGE GL62J27 5. Incoming inspection 5-l. Applied standard : IS0 2859-l 5-2. Sampling method and level : A single sampling phn,normal inspection level II : AQL Major defect : 0.065% Minor defect : 0.4% classifica of defer Exceed 9 0.3mm or O.lmm x 1. 9 Void Exceed @0.3mm (on top view) 10 Uneven density of material for scattering Extremely uneven density 11 Unbalanced center Exceed M.25mm from package center 12 BUlT Exceed +0.2mm againstprovided dimension 13 Insertion position of terminal Insertion position of terminal 5-4. Test items the surface is be applied for flat type, judgement criteria and classifica of defect No. Test items judgement criteria classifica of defect 14 Chapped the surface The surface chapped is striking for see the lamp top Minor defect 15 Hollow the surface The surface hollow is striking for see the lamp top 6110 .Tunll61W DG996048 MODEL No. I GL6Z27 PAGE I 7110 6. Supplement 6-l. Packing 6-l-l. Inner package Put 25Opcsthe sameluminousintensity rank productsinto pack andput following labelby pack. Product weight: 0.28g (One Prodwt,Typ.) (Indication labelsample) SHIPMENTTABLE PART No. GL6ZJ27 + Mcdel number *cl cl 00000 250 - Quantity of products QUANXTY KA99B19 * Lot number* LOT No. -5-G 0 0 0 O-0 t- Luminous SHARP’ AfADE IN JAPAN 0 @ @ @ @ intensity rank dominantwavelengthrank + Production country Productionplantccxie(to be indicatedalphabetically) Support code Year of prcduction(thelast two figures of the year) Month of production (to be indicatedalphabeticallywith Januarycorrespondingto A) Date of production(Ol-31) 6-l-2. Outer package Put 8 packs (the sameluminousintensity rank) into outer package. (approximately670gper one outer package) 6-l-3. Outer packageout line dimension Width: 14Omm.Depth: 225mm. Hight: 90mm (Note 1) Tolerance:flS% In regardto luminousintensity , the following ranking shallbe carriedout. However the quantity of eachrank shallnot be pre scribed. In caseof the distributionof the luminousintensity shift to high, at that point new upperrank is prescribedand lower rank is delete. 6-3.Dominantwavelengthrank (Note 2) Dominantwavelength Rank 617.0 T 613.5 U 616.0 619.5 622.0 V 618.5 W 624.5 621.0 627.0 X 623.5 - Unit (Ta=25”C) Condition nm IF2OmA (Note 2) The conditionof measurement: The measurementof the light emissionfrom the front sideof lamp. This rank value is the settingvalue of when that classifiesit the rank andbe not a guaranteevalue. Also I shallnot ask the delivery ratio of eachrank. . DO996048 MODELNo. I GL6ZJ27 64. Environment 6-4-l. ozOnosphere destructive chemicals. (1) The &vice doesn’t contain following substance. (2) The &vice doesn’t have a production line whose processnquires following substance. Restricted part: CFCsJlalones,CCb,Trichloroethane(Methych) I 642. Bromic non-burning materials The &vice doesn’t contain bromic non-burning materials(PBBOs,PBBs) Junl16/99 PAGE 1 8/10 DG996048 MODEL I Jud16/99 No. ( PAGE GL6ZJ27 7. Precautions g/10 for use 7 - 1. Lead forming method Avoid forming a lead pin with the lead pin base as a fulcrum:be sure to hold a lead pin firmly when forming. Lead pins should be forsed before soldering. 7 - 2. Notice of installation 7-2-l installation on a P W B Vhen mounting an LED lamp on a PW.do not apply physical stress to the lead pins. *The lead pin pitch should match the PllB pin-hole pitch:absolutely avoid widening or narrowing the lead pins. Bhen positioning an LED lamp,basically employ an LEDwith tie-bar cut or use a spacer. 7-2-2 !Yhenan LED 1 is mounted directly on a P WB If the bottom face of an LED lamp is mounted directly on single-sided PVE$the base of the lead pins may be subjected to physical stress due to PWBwarp,cutting or clinching of lead pins. Prior to’ use, be sure to check that no disconnection inside of the resin or damageto resin etc.,is found.Yhen an LED lamp is mounted on a double-sided PTBthe heat during soldering affects the resin;therefore,keep the LED lamp more that 1.6mmafloat above the PWB. 7-2-3 Installation using a holder During an LED lamp positioning,when a holder is used,a holder should be designed not to subject lead pins to any undue stress. (Note)Pay attention to the thermal expansion coefficient of the material used for the holder.Since the holder expands and contracts due to preheat and soldering heat, mechanical stress may be applied to the lead pins, resulting in disconnection. 7-2-4 Installation to the case Do not fix part C with adhesives when fixed to the case as shown in Figure.A hole of the case should be designed not to subject the ins ide of resin to any undue stress. - y)&+FJJp- d~cn c formint NG l Good 0 I !. 6mm c I Do48 MODELNo. GL6ZJ27 7 - 3. S oldering Conditions Solder the lead pins under the following conditions Conditions Type of Soldering 295°C*S”c. within 3 seconds 1. Manual soldering 260°Ck 5°C. within 5 seconds 2. Wave soldering Preheating 70°C to 8OC, within 30 seconds 3. Auto soldering S oldering 245°Cf YC, within 5 seconds (Note) Avoid dinning resin into soldering bath. Avoid applying stress to lead pins while they are heated-For example , when the LEDlamp is moved with the heat applied to the lead pins during manual soldering or solder repair,disconnection mayoccur. i ton 7 - 4. For cleaning ( 1) Solvent cleaning : Solvent temperature 45°C or less Immersion for 3 min or less (2 > Ultrasonic cleaning : The effect to device by ultrasonic cleaning differs by cleaning bath size,ultrasonic power output,cleaning time,Pm size or device mounting condition etc. Please test it in actual using condition and confirm that doesn’t occur any defect before starting the ultrasonic cleaning. ( 3 > Applicable solvent : Ethyl alcohol, Methyl alcohol, Isopropyl alcohol In case when the other solvent -is used, there are cases that the packaging resin is eroded. Please use the other solvent after thorough confirmation is performed in actual using condition. JunhY99 PAGE lo/lo