PREPARED BY:
Ln
7-t uedl
APPROVED BY:
F
SPEC.No.
DATE:
lt6/4Y
DATE:
‘T qkc / /t/sf
s#@#ARp
J&16/99
i ISSUE
ELECTRONIC COMPONENTS GROUP
SHARP coRPORATION
PAGE
10 Pages
REPRESENTATIVE DIVISIOON:
Opto-Electronic Devices Division
SPECIFICATION
sd.A*
DG996042
DEVICE SPECIFICATION FOR
Light Emitting Diode
I
MODEL No.
I
GL5ZJ44
1. Thesespecificationsheetsinclude materialsprotectedunderthe copyright of SharpCorporation (“Sharp”).
Pleasedo not reproduceor causeanyone to reproducethem without Sharp’sconsent.
2. When using this product, pleaseobservethe absolutemaximumratingsandthe instructionsfor useoutlined
in thesespecificationsheets,as well asthe precautionsmentionedbelow.Sharpassumes
no responsibility
for any damageresultingfrom useof the product which doesnot comply with the absolutemaximum ratings
and the instructionsincluded in thesespecificationsheets,andthe precautionsmentionedbelow.
(Precautions)
(1) This productsis designedfor usein the following applicationareas;
* OA equipment * Audio visual equipment * Homeappliance
* Telecommunicationequipment(Terminal) * Measuringequipment
1
II * Tooling machines * Computers
If the useof the product in the above applicationareasis for equipmentlisted in paragraphs
(2) or (3), pleasebe sureto observethe precautionsgiven in thoserespectiveparagraphs.
(2) Appropriate measures,suchasfail-safe designandredundantdesignconsidering
the safety designof the overall systemandequipment,shouldbe takento ensurereliability
and safety when this product is usedfor equipmentwhich demandshigh reliability and
safety in function and precision,suchas;
* Transportationcontrol and safety equipment(aircraft, train, automobileetc.)
* Traffic signals * Gasleakagesensorbreakers * Rescueandsecurity equipment
[ * Other safety equipment
(3) Pleasedo not usethis product for equipmentwhich requireextremely high reliability
and safety in function andprecision, suchas;
* Spaceequipment * Telecommunicationequipment(for trunk lines)
C * Nuclear power control equipment * Medical equipment
1
1
(4) Pleasecontact and consult with a Sharpsalesrepresentativeif thereareany questions
regardinginterpretation of the above threeparagraphs.
3. Pleasecontact andconsultwith a Sharp salesrepresentativefor anyquestionsaboutthis product.
CUSTOMERS APPROVAL
‘DATE:
BY:
DepartmentGeneralManager of
EngineeringDept..III
Opto-Electronic DevicesDivision
Electronic ComponentsGroup
SHARP CORPORATION
DG996042
Jun/16/99
PAGE
MODEL No.
GL5ZJ44
GL5ZJ44 Sneeification
/
1. Application
This specificationappliesto the light emitting diodedevice Model No. GL5a44.
[AlGaIS (dicing or scribe/braketype) Orange LED device]
2. Outline dimensionsandpin connections. . . . . . . . . . . . . . . . . . . . . . . . . . . . Refer to the attachedsheetPage2.
3. Ratingsandcharacteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Refer to the attachedsheetPage3-4.
3-l. Absolutemaximumratings
3-2. Electra-opticalcharacteristics
3-3. DeratingCurve
3-4. CharacteristicsDiagram
4. Reliability . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Refer to the attachedsheetPage5.
4- 1. Test itemsandtest conditions
4-2. MeasurementitemsandFailurejudgementcriteria
5. Incoming inspection. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Refer to the attachedsheetPage6.
5- 1. Applied standard
5-2. Samplingmethodandlevel
5-3. Test items,judgementcriteria andclassificaof defect
5-4. Test itemsthe surfaceis be appliedfor flat type, judgementcriteria andclassificaof defect
6. Supplement. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Refer to the attachedsheetPage7-8.
6-l. Packing
6-2. Luminousintensity rank
6-3. Dominantwavelengthrank
6-4. Environment
7. Precautionsfor use . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ..*..............
7-l. Lead forming method
7-2. Notice of installation
7-3. SolderingConditions
.7-k For cleaning
Refer to the attachedsheetPage9- 10.
l/10
JunA6/9!
DG996042
PAGE
MODEL No.
GL5ZT44
2/10
2. Outline dimensions and pin conmctions
,O.S
LO.1
r
0
:
1
pin
COMCCtiOllS
CD.
Anode
0.
cathode
rote) Unspecified tol. to be +0.2mm
rote) Cold.rolled steel leads are plated with but the tie-bar cut portions have no plating do not solder this part of the product.
unit
mm
Material
Lead : (Fe) Cold rolled steel
Package : Epoxy resin
Fiih
Lead : Sn plated or wave soldering
Drawing No.
51106023
DG996042
Jul/16/!I!
PAGE
MODEL No.
GL5ZJ44
3110
3. Ratingsandcharacteristics
3-1. Absolutemaximumratings
(Ta=25OC)
Parameter
S)lTdJOl
Value
unit
Power dissipation
P
130
mW
Continuousforward current
50
mA
1,
Peak forward current(Note1)
100
mA
IN
Derating factor
0.67
DC
Pulse
1.33
IReversevoltage
I
Va
I
5
I v I
Operating temperature
Topr
40
85
“C
Storagetemperature
Tstg
-40
100
“C
Solderingtemperature(Note2)
Tsol
260 (within 5 seconds)
“C
(Note 1) Duty ratio=l/lO,Pulse width=O.lms
(Note 2) At the positionof 1.6mmfrom the bottom resinpackage
Terminal capacitance
V=OV,f=lMHz
60
Ct
I
Viewing Angle
261/2 I
IP=2OmA
15
(Note 3) Refer to the suplementitem 6. regardingthe standardof rank classification.
-
pF
deg.
3-3. Derating Curve
Peak
Forward
Current
Derating
Curve
Forward
Current
Derating
Curve
60
60
‘:i
0
-25
0
Ambient
25
50
Temperature
75 =lOO
ia
125
-25
0
Ambient
25
50
Temperature
75
85
100
TarC)
125
Juld16/94
DG996042
MODEL No.
I
Peak
Forward
Current
vs.
PAGE
GL5ZJ44
I
4110
Duty Ratio
(Ta=25"C)
loo
10
l/100
l/10
Duty
3-4. Characteristics
10
1
Raito
DR
Diagram(typ) (Note 1)
Forward
Current
vs.Forward
Relative
Luminous
Intensity
vs. Ambient
Temperature
Voltage
(Ta=25%)
(lF=2OmA)
100
10
1
0. 1
1
1.2
1.4
1.6
Forward
Relative
Luminous
1.8
2
Voltage
Intensity
vs.
-60
2.22.42.6
VFW
Frorard
Voltage
(Ta=25"C)
1000
100
10
1
0. 1
Forward
10
Current
loo
IFhA)
(Note 1) Above characteristic data are typical data and not a gmrantteed data.
-40-20
Ambient
0
20 40
Temprature
60 80
Ta("C)
100 120
JlJd16/99
DG996042
MODEL
No.
PAGE
5110
GL5ZJ44
4. Reliability
The reliability of products shall be satisfied with items listed below.
4- 1. Test items and test conditions
Test items
Confidence level: 90:
Samples (n)
LTF’D
Defective (C)
(o/o)
Test conditions
Solderability
230*5”c,
5s
Prior disposition : Dip in rosin flux
n=ll,
Soldering
temperature
260f5”C,
n=ll,C=O
20
n=ll,
C=O
20
n=ll.
C=O
20
n=ll, C=O
20
n=ll,C=O
20
n=22, C=O
10
n=22, C=O
10
High temperature storage Ta=lOO”C, t=lOOOh
n=22, C=O
10
Low temperature storage Ta=AO”C, t=lOOOh
n=22, C=O
10
n=22, C=O
10
Mechanical shock
Variable frequency
vibration
Terminal strength
(Tension)
Terminal strength
(Bending)
5s
15 OOOm/s2,05ms,
3times I kX,*Yp!Z direction
200m/s2, 100 to 2 000 to 1OOHJsweep for 4min.
,4timeslfX,fY,&Z
direction
Weight: lON, S/each
terminal
Weight:SN,O” -90”
/each terminal
* O”-+-90”
Temperature cycling
40~(3Omin)~+1OO”c(3Omin).30
High temp. and high
humidity storage
Ta=+6O”C, 9O%RH, t=lOOOh
Operation life
-0”
cycles
Ta=25”c, IF MAX, t=lOOOh *3
C=O
20
4-2. Measurement items and Failure judgement criteria * 1
Measurement
Symbol
Failure judgement criteria *2
Forward voltage
vF
v, > U.S.L. x 1.2
Reverse current
IR
IR > u.sL.
Luminous intensity
Iv
x 2.0
Iv > The first stage value X 2.0 or The first stage value X 0.5 > Iv
z Solderability : Solder shall be adhere at the area of 95% or more of dipped portion.
z Terminal strength : Package is not destroyed, and terminal is not slack.
* 1: Measuring condition is in accordance with speciiication.
*2: U.S.L. is shown by Upper Specification Limit.
*3: IF m.is
shown by forward current of absolute maximum ratings.
Jun/16/99
DG996042
MODEL No.
PAGE
GL5ZJ44
5. Incoming inspection
5-1. Applied standard : IS0 2859-1
5-2. Sampling method and level : A single sampling plan,nonnal inspection level II
: AQL Major defect : 0.065%
Minor defect : 0.4%
Different from dimension
Outline dimensions
8
Scratch
Exceed 4 0.3mm or O.lmm x l.Omm (on top view)
9
Void
Exceed Q,0.3mrn (on top view)
10
Uneven density of
material for scattering
Extremely uneven density
11
Unbalanced center
Exceed ti.25mrn from package center
12
Burr
Exceed +0.2mm againstprovided dimension
13
Insertion position of
terminal
Insertion position of terminal
Minor defect
5-4. Test items the surface is be applied for flat type, judgement criteria and classifica of defbct
No.
Test items
judgement criteria
classifica of defer:
14
Chapped the surface
The surface chapped is striking for see the lamp top
Minor defect
15
Hollow the surface
The surface hollow is striking for see the lamp top
6110
DG996042
MODEL No.
I
GL5ZJ44
JunJ16/99
PAGE
I
7110
6. Supplement
6-l. Packing
6-l- 1. Inner package
Put 25Opcs the same luminous intensity rank products into pack and put following label by pack.
Product weight : 0.28g (One Product,Typ.)
(Indication label sample)
SHIPMENT TABLE
I
GL5ZJ44
+ Model number
PART No.
*clcl --q 00clcl
250
- Quantity of products
QUANTITY
M99819
+ Lot number *
LOT No.
0
0
00
0
r3-Cl
Luminous intensity rank
dominant wavelength rank
SHARP
Production country
!dADE IN JAPAN
4
0
@
@
@
0
Production plant code(to be indicated alphabetically)
Support code
Year of production(the last two figures of the year)
(to be indicated alphabetically with January corresponding to A)
Month of production
Date of production(01 N 3 1)
6-l-2. Outer package
Put 8 packs (the same luminous intensity rank) into outer package.
(approximately 670g per one outer package)
6-l-3. Outer package out line dimension
Width: 14Omm, Depth: 225mm, Hight:
9Omm
~l
(Note 1) Tolerance:flS%
In regard to luminous intensity , the following ranking shall be carried out.
However the quantity of each rank shall not be pre scribed.
In case of the distribution of the lurninous intensity shift to high, at that
point new upper rank is prescribed and lower rank is delete.
:Ta=25”C)
6-3.Dominar-n wavelength rank (Note 2)
Rank
Dominant
wavelength
unit
Condition
.
T
613.5
617.0
U
616.0
619.5
V
618.5
622.0
nm
IF2omA
W
1 621.0
624.5
X
i 623.5
627.0
1
(Note 2) The condition of measurement : The measurement of 1 : light emission from the front side of lamp.
This rank value is the setting value of when that classifies it the rank and be not a guarantee value.
Also I shall not ask the delivery ratio of each rank.
c
Do996042
I
GL5ZJ44
6-4. Environment
641. Ozonospheredestructivechemicals.
(1) The devicedoesn’tcontainfollowing substance.
(2) The devicedoesn’thave a production line whoseprocessrequiresfollowing substance.
Restricted part CFCs,halones,C~,TrichLoroethane(Methychloroforn)
642. Bromic non-burningmaterials
The device doesu’tcontainbromic non-burning materials(PBBOs,PBBs)
Jud16/99
PAGE
MODEL No.
8110
Jun/16/99
DC396042
PAGE
MODEL No.
g/10
GLSZJ44
7. Precautionsfor use
7 - 1. Lead forming method
Avoid forming a lead pin with the lead pin base as
a fulcrum:be sure to hold a lead pin firmly when
forming. Lead pins should be formed before soldering.
7 - 2. Notice of installation
7-Z-l installation on a PWB
Yhen mounting an LED lamp on a PW, do not apply
physical stress to the lead pins.
The lead pin pitch should match the P’#Bpin-hole
pitch:absolutely avoid widening or narrowing
the lead pins.
Whenpositioning an LED lamp.basically employ
an LEDwith tie-bar cut or use a spacer.
7-Z-2 Whenan LED 1 is mounted directly on a P WB
If the bottom face of an LED lamp is mounted
directly on single-sided PWB,the base of the
lead pins may be subjected to physical stress
due to PYBwarp,cutting or clinching of lead
pins.Prior to use,be sure to check that no
disconnection inside of the resin or damageto
resin etc., is found. Bhen an LED lamp is mounted
on a double-sided PW,the heat during soldering
affects the resin;therefore.keep
the LED lamp
more that 1.6mmafloat above the P!B.
7-2-3 Installation using a holder
During an LEDlamp positioning,when a holder is
used,a holder should be designed not to subject
lead pins to any undue stress.
(Note)Pay attention to the thermal expansion coefficient
of the material used for the holder-since the
holder expands and contracts due to preheat and
soldering heat, mechanical stress may be applied to
the lead pins, resulting in disconnection.
7-2-4 Installation to the case
Do not fix part C with adhesives when fixed to the
case as shown in Figure..1 hole of the case should
be designed not to subject the ins ide of res in
to any undue stress.
l
NG
l
GoocI
I
I
I
I
;’ ,:
I:,
‘; ; /c-
,,
,..
C
c&Se
0
I ,,’
,,, ’ I,
.’
YE
DG996042
MODEL
I
PAGE
GL5ZT44
7 - 3. Soldering Conditions
Solder the lead pins under the following conditions
Type of Soldering
Conditions
1. Manual soldering
29SC+5”c, within 3 seconds
2. Wave soldering
26O”c+5”c. within 5 seconds
3. Auto soldering
P reheating 70°C to 80°C. vithin 30 seconds
Soldering 245”c*YC, within 5 seconds
(Note) Avoid dipping resin into soldering bath.
Avoid applying stress to lead pins while they are heated-For example ,
when the LED lamp is moved with the heat applied to the lead pins during
manual soldering or solder repair,disconnection mayoccur.
7 - 4. For cleaning
( 1)
Jud16/99
No.
Solvent cleaning : Solvent temperature 45°C or less
Immersion for 3 ruin or less
( 2 > Ultrasonic cleaning : The effect to device by ultrasonic cleaning differs
by cleaning bath size,ultrasonic power
output, cleaning time,PBB size or device mounting
condition etc. Please test it in actual using condition
and confirm that doesn’t occur any defect before starting
the ultrasonic cleaning.
( 3 > Applicable solvent : Ethyl alcohol. Yethyl alcohol, Isopropyl alcohol
In case when the other solvent is used,there are cases that
the packaging resin is eroded. Please use the other solvent
after thorough confirmation is performed in actual using condition.
I
lo/lo