GP1A30R GP1A30R OPIC Photointerrupter with Encoder Function ■ Features ■ Outline Dimensions 1. 2-phase ( A, B ) digital output 2. Possible to use plastic disk 3. High sensing accuracy ( Disk slit pitch : 0.7mm ) 4. TTL compatible output 5. Compact and light Input Output Transfer characteristics Duty ratio Response frequency 5 11.4 6.4 4 - R1.3 ± 0.15 (1.27) 3 4 GND 5 V CC 6 V OA 8.0 6.0 1.4 ± 0.15 4 - R2.5 15.0 ± 0.15 20.0 4 (2.54) 1 * Tolerance :± 0.3mm * ( ) : Reference dimensions 6 *“ OPIC” ( Optical IC ) is a trademark of the SHARP Corporation. An OPIC consists of a light-detecting element and signalprocessing circuit integrated onto a single chip. *2 For 5 seconds ■ Electro-optical Characteristics Parameter Forward voltage Reverse current Operating supply voltage High level output voltage Low level output voltage Supply current 12.0 7.5 ± 0.1 3 - (1.27) 2 Symbol Rating Unit IF 65 mA I FM 1 A 6 V VR P 100 mW VCC 7 V I OL 20 mA 250 mW PO 0 to + 70 ˚C T opr T stg - 40 to + 80 ˚C Tsol 260 ˚C *1 Pulse width <= 100µ s, Duty ratio= 0.01 2.0 ± 0.15 (7.25) ( Ta= 25˚C ) 4 3 OPIC 8.0MIN. 4.4 10.5MIN. 9.9 ■ Absolute Maximum Ratings 2 GP1A30R 1. Electronic typewriters, printers 2. Numerical control machines 6 5 1 Anode 2 Cathode 3 V OB 6.4 ± 0.15 4 ± 0.15 1 2.5 ± 0.15 0.8 ± 0.15 OPIC 2- φ2.0 ± 0.1 Internal connection diagram ■ Applications Parameter Forward current *1 Peak forward current Input Reverse voltage Power dissipation Supply voltage Output Low level output current Power dissipation Operating temperature Storage temperature *2 Soldering temperature ( Unit : mm ) ( Unless otherwise specified, Ta = 0 to + 70˚C ) Symbol VF IR VCC VOH VOL I CC *5 DA *5 DB f MAX. *3 Measured under the condition shown in Measurement Conditions. *4 In the condition that output A and B are low level. Conditions Ta= 25˚C, I F = 30mA Ta= 25˚C, V R = 3V *3 V CC= 5V, I F = 30mA I OL = 8mA, V CC = 5V, I F = 30mA *3*4 I F = 30mA, V CC= 5V V CC= 5V, I F = 30mA, *3 f= 2.5kHz *3 V CC= 5V, I F = 30mA *3 MIN. 4.5 2.4 20 20 - TYP. 1.2 5.0 4.9 0.1 5 50 50 - *5 t AH t BH x 100 DA = x 100, DB = t AP t BP “ In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that occur in equipment using any of SHARP's devices, shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest version of the device specification sheets before using any SHARP's device.” MAX. 1.5 10 5.5 0.4 20 80 80 5 Unit V µA V V V mA % % kHz GP1A30R ■ Output Waveforms Output A ( VOA) t AH t AP Output B ( VOB) t AB1 t BH t BP Rotational direction: Counterclockwise when seen from OPIC light detector Fig. 1 Forward Current vs. Ambient Temperature Fig. 2 Output Power Dissipation vs. Ambient Temperature 100 300 Output power dissipation Po ( mW ) 90 Forward current I F ( mA ) 80 70 65 60 50 40 30 20 250 200 150 100 50 10 0 0 0 25 50 70 75 0 100 Ambient temperature Ta ( ˚C ) 25 50 70 75 Fig. 3 Duty Ratio vs. Frequency Fig. 4 Phase Difference vs. Frequency 0.9 130 V CC = 5V VCC = 5V 120 T a = 25˚C 0.7 t AH t AP ( Output A ) 0.6 0.5 0.4 t BH ( ) t BP Output B 0.3 Phase differenceθ AB1 ( deg. ) I F = 30mA 0.8 Duty ratio 100 Ambient temperature Ta ( ˚C ) I F = 30mA T a = 25˚C 110 100 θ AB1 =x t ABI 360˚ t AP 5 10 90 80 70 60 0.2 0.1 1 2 5 Frequency f ( kHz ) 10 20 50 1 2 Frequency f ( kHz ) 20 GP1A30R Fig. 5 Duty Ratio vs. Ambient Temperature 1.0 140 V CC = 5V I F = 30mA f = 2.5kHz 0.8 t AH t AP ( Output A ) 0.7 t BH ( Output B ) t BP 0.6 V CC = 5V I F = 30mA f = 2.5kHz 130 Phase difference θ AB1 ( deg. ) 0.9 Duty ratio Fig. 6 Phase Difference vs. Ambient Temperature 0.5 0.4 0.3 120 110 θ AB1 = 100 90 80 70 0.2 60 0.1 50 0 40 0 25 50 75 0 100 25 50 75 Ambient temperature Ta ( ˚C ) Ambient temperature Ta ( ˚C ) Fig. 7 Duty Ratio vs. Distance ( X direction ) 0.9 0.6 0.5 t AH t AP ( Output A ) t BH t BP ( Output B ) V CC = 5V I F = 30mA f= 2.5kHz Ta = 25˚C 120 Phase difference θ AB1 ( deg. ) 0.7 0.4 0.3 100 Fig. 8 Phase Difference vs. Distance ( X direction ) 130 V CC = 5V I F = 30mA f= 2.5kHz T a = 25˚C 0.8 Duty ratio t AB1 x 360˚ t AP 110 100 θ AB1= t ABI x 360˚ t AP 90 Reference position (- ) 80 ( +) 70 GP1A30R 0.2 60 0.1 - 1.0 50 - 1.0 Disk - 0.5 0 0.5 1.0 Distance X ( mm ) ( Shifting encoder ) Fig. 9 Duty Ratio vs. Distance ( Y direction ) 0.9 120 Phase difference θ AB1 ( deg. ) Duty ratio 0.7 t AH ( Output A ) t AP t BH ( Output B ) t BP 0.6 0.5 0.4 0.3 0.2 0.1 - 1.0 0 0.5 1.0 Fig.10 Phase Difference vs. Distance ( Y direction ) 130 V CC = 5V I F = 30mA f= 2.5kHz T a = 25˚C 0.8 - 0.5 Distance X ( mm ) ( Shifting encoder ) 110 VCC = 5V I F = 30mA f= 2.5kHz T a = 25˚C θ AB1 = 100 t AB1 x 360˚ t AP 90 GP1A30R 80 (+) Reference position (-) 70 60 Disk - 0.5 0 0.5 Distance Y ( mm ) ( Shifting encoder ) 1.0 50 - 1.0 - 0.5 0 0.5 Distance Y ( mm ) ( Shifting encoder ) 1.0 GP1A30R Fig.11 Duty Ratio vs. Distance ( Z direction ) 0.9 130 0.7 Phase difference θ AB1 ( deg. ) V CC = 5V I F = 30mA f= 2.5kHz T a = 25˚C 0.8 t AH ( Output A ) t AP t BH ( Output B ) t BP 0.6 Duty ratio Fig.12 Phase Difference vs. Distance ( Z direction ) 0.5 0.4 0.3 VCC = 5V I = 30mA 120 F f= 2.5kHz T = 25˚C 110 a t AB1 t AP x 360˚ θ AB1 = 100 90 80 Z 70 ( Detecting side ) Disk OPIC 60 0.2 ( Emitting side ) 0.1 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 50 0.8 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 Distance Z ( mm ) ( Shifting encoder ) Distance Z ( mm ) ( Shifting encoder ) ■ Measurement Conditions <Basic Design> A 15 GP1A30R 20 8 .4 R 13 3 5 4-R1.3 R O ( distance between the disk center and half point of a slit ) , P ( slit pitch ) , S 1 and S 2 ( installing position of photointerrupter ) will be provided by the following equations. Slit pitch : P ( slit center ) N R O= 120 x 13.45 ( mm ) N: number of slits 2x p x RO ( mm ) N S 1= R O- 1.765 ( mm ) , S 2= S 1+ 6.7( mm ) Note ) When the number of slits is changed, values in parenthesis are also changed according to the number. P= 1.4 Disk center φ 31.6, 0.1t 11.4 120 slits ( Ex. ) In the case of N= 200P/R Enlarged drawing of A portion Slit pitch : P 200 x 13.45 ( mm ) 120 = 22.42mm R O= 4 A S1 r2 0.8 2 7.5 12 0.3 Disk 6.4 S2 (18.385) 9.9 P (11.685 ) ( 1 ) This module is designed to be operated at I F = 30mA TYP. ( 2 ) Fixing torque : MAX. 0.6Nm (6kgf • cm ) ( 3 ) In order to stabilize power supply line, connect a by-pass capacitor of more than 0.01µF between Vcc and GND near the device. ( 4 ) As for other general cautions, refer to the chapter “ Precautions for Use ” . r1 ■ Precautions for Use r1= r2 Disk center 2 x p x 22.42 ( mm ) 200 = 0.704mm S 1= 22.42- 1.765 = 20.655mm S 2= 20.655+ 6.7 = 27.355mm P=