PREPARED BY: DATE: suln/tO/?q ruQ.ds. APPROVED BY: <J-un DATE: lik e5 .T qKJ7~s-e ELECTROMC COMPONENTS GROUP SHARP CORPORATION SPECIFICATION DEVICE SPECIFICATION SPECNo. DG996036 ISSUE J&16/99 PAGE REPRESENTATIVE 10 pages DIVISION: Opto-Electronic Devices Division FOR Light Emitting Diode MODEL No. 1. These specification sheets include materials protected under the copyright of Sharp Corporation (“Sharp”). Please do not reproduce or cause anyone to reproduce them without Sharps consent. 2. When using this product, please observe the absolute maximum ratings and the instructions for use outlined in these specification sheets, as well as the precautions mentioned below. Sharp assumes no responsibility for any damage resulting from use of the product which does not comply with the absolute maximum ratings and the instructions included in these specification sheets, and the precautions mentioned below. (Precautions) (1) This products is designed for use in the following application areas; * OA equipment * Audio visual equipment * Home appliance * Telecommunication equipment (Terminal) * Measuring equipment L * Tooling machines * Computers I If the use of the product in the above application areas is for equipment listed in paragraphs (2) or (3). please be sure to observe the precautions given in those respective paragraphs. (2) Appropriate measures, such as fail-safe design and redundant design considering the safety design of the overall system and equipment, should be taken to ensure reliability . and safety when this product is used for equipment which demands high reliability and safety in function and precision, such as ; * Transportanon control and safety equipment (aircraft, train, automobile etc.) * Traffic signals * Gas leakage sensor breakers * Rescue and security equipment [ * Other safety equipment I (3) Please do not use this product for equipment which require extremely high reliability and safety in function and precision, such as ; * Space equipment * Telecommunication equipment (for trunk lines) * Medical equipment I * Nuclear power control equipment (4) Please contact and consult with a Sharp sales representative if there are any questions regarding interpretation of the above three paragraphs. 1 3. Please contact and consult with a Sharp sales representative for any questions about this product. CUSTOMERS DATE: BY: APPROVAL DATE: PRESENTED BY: I M.Katoh, Department General LManager of Engineering Dept.,III Opto-Electronic Devices Division Electronic Components Group SHARP CORPOluTION DG996036 MODEL No. Jun/16/99 PAGE GL5ZJ43 GLSZr43 Sneeification 1. Application This specifkation applies to the light emitting diode device Model No. GL5Z43. [AlGaInP (dicing or scrilxylxake type> Grange LED device] 2. Outline dimensions and pin connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . Refer to the attached sheet Page 2. 3. Ratings and characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Refer to the attached sheet Page 3-4. 3-l. Absolute maximum ratings 3-2. Electra-optical characteristics 3-3. Derating Curve 3-4. Characteristics Diagram 4. Reliability . . . . . . . . . . ..*.......................................... 4- 1. Test items and test conditions 4-2. Measurement items and Failure judgement criteria Refer to the attached sheet Page 5. 5. Incoming inspection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Refer to the attached sheet Page 6. 5- 1. Applied standard 5-2. Sampling method and level 5-3. Test items, judgement criteria and classilica of defect 5-4. Test items the surface is be applied for flat type, judgement criteria and classilica of defect 6. Supplement . . . . . . ..*..................*.......................... 6-l. Packing 6-2. Luminous intensity rank 6-3. Dominant wavelength rank 64. Environment Refer to the attached sheet Page 7-8. 7. Precautions for use . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Refer to the attached sheet Page 9- 10. 7- 1. Lead forming method 7-2. Notice of installation 7-3. Soldering Conditions .74. For cleaning l/10 2. outline dimensions aad pin co~ections Colorless transparency \ Pin COMectiOns 0. Anode 0. cathode rote) Unspecif!ed tol. to be ~0.2mm rote) Cold .rolled steel leads are plated with but the tie-bar cut portions have no plating do not solder this part of the product. . unit mm Material Lead : (Fe) Cold rolled steel Package : Epoxy resin Finish Lead : Sn plated or wave soldering Drawing 51106017 No. DG996036 Jun/16/% MODEL No. PAGE GL5ZJ43 3. 3/10 Ratings and characteristics (Note 1) Duty ratio=l/lO,Pulse width=Qlms (Note 2) At the position of 1.6mm from the bottom resin package (Note 3) Refer to the suplement item 6. regarding the standard of rank classification. 3-3. Derating Curve Peak Forward Current Derating Curve Forward 120 a s e - 100 g 80 z 2 60 -0 5 40 2 ,” m d Current Derating Curve 60 20 0’ -25 ’ 0 Ambient I 25 50 Temperature I 75 ‘?iO Ta(W I 125 -25 0 Ambient 25 50 Temperature 7585 100 Ta (%I 125 DG996036 MODEL No. GL5ZJ43 Jud16/9!3 PAGE I Peak Forward Current vs. Duty I 4/10 Ratio 10 l/100 1 l/10 Duty DR 3-4. Characteristics Diagram&p) Forward 10 Raito Current (Note 1) vs.Forward Relative Luminous Intensity vs. Ambient Temperature Voltage ( I F=2OmN (Ta=25"C) loo 1000 Iiii”“iiiitlltrll IIII : O- IIIIII l-00 EE J A .-: c, 5 0. 1 2 1 1.2 1.4 1.6 Forward Relative Luminous 1.8 2 Voltage Intensity vs. 2.2 2.4 Ambient VFOJ) Frorard Voltap~ (Ta+X'C) 1000 .-5 t G .->” z G p: 10 -60 -40 -20 0 20 40 60 80 2.6 100 10 0. 1 0. 01 0. 1 1 Forward 10 Current 100 IFhA) (Note 1) Above characteristic data are typical data and not a guarantteed data. Temprature TarC)_ 100 120 Jun/16/99 DG996036 MODEL PAGE No. GL5ZJ43 5110 4. Reliability The reliability of products shall be satisfied with items listed below. Ll. Test items and test conditions Test items Cordidence level: 90% Samples (n) LTPD Defective (C) (%) Test conditions Solderability 23025°C. 5s Prior disposition : Dip in rosin flux n=ll. C=O 20 soldering temperature 260t5”C. n=ll, C=O 20 n=ll, C=O 20 n=ll, C=O 20 Mechanical shock 5s 15 0OOm/s*, 0.5ms. 3times f iX+Y&Z direction 2OOm/s*, 100 to 2 0OOto lOOH&weep for 4min. ,4timesffX,*Yfi direction Variable frequency vibration Terminal strength (Tension) Terminal strength (Bending) Weight: 1ON. Ss/each terminal n=ll. C=O 20 Weight:SN,O” + 9O” + O”* -90” + 0” /each terminal n=ll, C=O 20 Temperature cycling -4O”c(3Omin)~+10O”c(3Omin),30 n=22, C=O 10 High temp. and high humidity storage Ta=+6O”c, 9O%RH, t=100Oh n=22, C=O 10 igh temperature storage Ta=lO0”C, t=10OOh n=22, C=O 10 ow temperature storage Ta=40”C, n=22. C=O 10 n=22, C=O 10 Operation life cycles t=lOO0h Ta=25@C, IrMAX, t=lOOOh *3 4-2. Measurement items and Failure judgement criteria *l Measurement Symbol Failure judgement criteria *2 Forward voltage VF v, > U.S.L. x 1.2 Reverse current IR IR > U.S.L. x 2.0 Luminous intensity Iv Iv > The first stage value X 2.0 or The first stage value X 0.5 > Iv z Solderability : Solder shall be adhere at the area of 95% or more of dipped portion. % Terminal strength : Package is not destroyed, and terminal is not slack. * 1: Measuring condition is in accordance with specification. *2: U.S.L. is shown by Upper Specification Limit. *3: IF MAX.is shown by forward current of absolute maximum ratings. Jlln/16/99 DG996036 PAGE MODEL, No. GL5ZJ43 5. Incoming inspection 5-l. Applied standard : IS0 2859-1 5-2. Sampling method and level : A single sampling plannormal inspection level lI : AQL Major defect : 0.065% Minor defect : 0.4% 5-3. Test items. iudaement criteria and classifica of defect No. 1 Test items DiscoMection judgement criteria Not emit light 2 Position of Cutting off rim Different from dimension 3 Reverse terminal Different from dimension 4 Outline dimensions classifica of defer Major defect Not satisfy outline specification 5 characteristics Over the limit value of specification at V,, Ia, and Iv 6 Cut off the rim Exceed -0.2mm 7 Foreign substance White pint : Exceed d 0.3nun (on top view) Black point : Exceed 4 0.3mm (on top view) String form: Exceed 3.Omm (on top view) 8 Scratch Exceed 9 0.3mm or O.lmm x l&run (on top view) 9 Void Exceed 4 0.3mm (on top view) 10 Uneven density of material for scattering Extremely uneven density 11 Unbalanced center Exceed +&25mm from package center 12 Burr Exceed +0.2mm againstprovided dimension .3 Insertion position of terminal Insertion position of terminal Minor defect 5-4. Test items the surface is be applied for flat type, judgement criteria and classifica of defect No. Test items judgement criteria classifica of defec 14 Chapped the surface The surface chapped is striking for see the lamp top Minor defect 15 Hollow the surface The surface hollow is striking for see the lamp top 6110 DG996036 MODEL No. Jun/16/99 PAGE GL5ZJ43 7/10 6. Supplement 6-l. Packing 6-l-l. Inner package Put 25Opcs the same luminous intensity rank products into pack and put following label by pack. Product weight : 0.28g (One ProducfTyp.) (Indication label sample) SHIPMENT TABLE PART No. GL5ZJ43 + Model number *o clclclclo ClUANTITY 250 + Quantity of products - cl --LOT No. KA99B19 4- Lot number * 0 0 O@ 0 Cl-0 t - Luminous intensity rank dominant wavelength rank SHARP’ MADE IN JAPAN + Production country 0 @ @ @ @ Production plant code(to be indicated alphabetically) support code Year of production(the last two figures of the year) Month of production (to be indicated alphabetically with January correspondingto A) Date of production(Ol-3 1) 6-l-2. Outer package Put 8 packs (the sameluminous intensity rank) into outer package. (approximately 670g per one outer package) 6-l-3. Outer packageout line dimension Width : 14Omm.Depth : 225mm, Hight : 90mm 6-2Luminous intensimrank (Note 1) Rank Luminous intensity tTa=25aC 1 .--- 4 Q R S T 3417 4920 7085 10203 - 6657 9586 13803 ( 19877) -- ~_ unit Condition mcd +2OmA (Note 1) Tolerance:*15% In regardto luminousintensity , the following ranking shallbe carried out. However the quantity of eachrank shall not be pre scribed. In caseof the distribution of the luminous intensity shift to high, at that point new upperrank is prescribedand lower rank is delete. 6-3.Dominant wavelengthrank (Note 2) (Ta=25”C) Rank Dominant wavelength unit Condition T 613.5 617.0 I U 616.0 619.5 V 618.5 622.0 run 1~2Om4 W 621.0 624.5 X 623.5 627.0 I-INote 2) The condition of measurement: The measurementof the light emission from the front sideof lamp. This rank value is the setting value of when that classifiesit the rank and be not a guaranteevalue. Also I shall not ask the delivery ratio of eachrank. DG!N6036 MODEL No. GL5ZJ43 64 Environment 641. Ozonosphere destructive chemicals. (1) The device doesn’t contain following substance. (2) The device doesn’t have a production line whose process requires following substance. Restricted part: CFCsJlalonestCCL,Trichloroethane(Methych 642. Bromic non-burning materials The device doesn’t contain bromic non-burning materia.Ls(PBBOs~BBs) Junt16l99 PAGE 8110 IX996036 I 7. pncaurions Junl16/99 PAGE MODEL, No. GL5ZJ43 9110 for use 7 - 1. Lead forming method Avoid forming a lead pin with the lead pin base as a fulcrum:be sure to hold a lead pin firmly when forming. Lead pins should be formed before soldering. 7 - 2. Notice of installation 7-2-l installation on a P W B Vhen mounting an LED lamp on a PVB,do not apply physical stress to the lead pins. *The lead pin pitch should match the PYB pin-hole pitch:absolutely avoid widening or narrowing the lead pins. Vhen positioning an LED lamp,basically employ an LED with tie-bar cut or use a spacer. 7-2-2 Vhen an LED 1 is mounted directly on a P W B If the bottom face of an LED lamp is mounted directly on single-sided Pm, the base of the lead pins may be subjected to physical stress due to PIB warpcutting or clinching of lead pins. Prior to use, be sure to check that no disconnection inside of the resin or damage to resin etc.,is found-When an LED lamp is mounted on a double-sided PYB,the heat during soldering affects the resin;therefore,keep the LED lamp more that 1.61~s~ afloat above the PVB. 7-2-3 Installation using a holder During an LED lamp positioning,when a holder is used,a holder should be designed not to subject lead pins to any undue stress. (Note)Pay attention to the thermal expansion coefficient of the material used for the holder.Since the holder expands and contracts due to preheat and soldering heat,mechanical stress may be applied to the lead pins, resulting in disconnection. 7-2-4 Installation to the case Do not fix part C with adhesives when fixed to the case as shown in Figure-A hole of the case should be designed not to subject the inside of resin to any undue stress. NG l Good DG996036 MODEL No. GL5ZJ43 7 - 3. Soldering Conditions ’ Solder the lead pins under the following conditions Conditions Type of S oldering 29%+5”c. within 3 seconds 1. Manual soldering 26O”ck5”c, within 5 seconds 2. Wave soldering Preheating 70°C to 8O”c, within 30 seconds 3. Auto soldering Soldering 245”c+5”c, within 5 seconds (Note) Avoid dipping resin into soldering bath Avoid applying stress to lead pins while they are heated. For example , when the LED lamp is moved with the heat applied to the lead pins during manual soldering or solder repair,disconnection may occur. 7 - 4. For cleaning ( 1) Solvent cleaning : Solvent temperature 45°C or less Immersion for 3 min or less (2 > Ultrasonic JunllWW PAGE cleaning : The effect to device by ultrasonic cleaning differs by cleaning bath size,ultrasonic power output,cleaning time,PW size or device mounting condition etc. Please test it in actual using condition and confirm that doesn’t occur any defect before starting the ultrasonic cleaning. ( 3 > Applicable solvent : Ethyl alcohol, Yethyl alcohol, Isopropyl alcohol In case when the other solvent is used,there are cases that the packaging resin is eroded. Please use the other solvent after thorough confirmation is performed in actual using condition. lo/lo