PREPARED BY: DG996028 SPECNo. DATE: J-h/Am -TL Ueda APPROVED BY: J&16/99 DATE: Jin /h/99 EI..ECTRONIC COMPONENTS GROUP SHARP CORPORATION DEVICE SPECIFICATION 10 pages DMSION: Opto-Electronic Devices Division SPI?CIFICATION ?vQ4lsa ;:: REPRESENTATIVE FOR Light Emitting Diode MODEL No. GL5ZV302BOS 1. These specification sheets include materials protected under the copyright of Sharp Corporation (“Sharp”). Please do not reproduce or cause anyone to reproduce them without Sharp’s consent. 2. When using this product, please observe the absolute maximum ratings and the instructions for use outlined in these specification sheets, as well as the precautions mentioned below. Sharp assumes no responsibility for any damage resulting from use of the product which does not comply with the absolute maximum ratings and the instructions included in these specification sheets, and the precautions mentioned below. (Precautions) (1) This products is designed for use in the following application areas; * Home appliance * OA equipment * Audio visual equipment * Telecommunication equipment (Terminal) * Measuring equipment [ * Tooling machines * Computers If the use of the product in the above application areas is for equipment listed in paragraphs (2) or (3), please be sure to observe the precautions given in those respective paragraphs. 1 (2) Appropriate measures, such as fail-safe design and redundant design considering the safety design of the overall system and equipment, should be taken to ensure reliability and safety when this product is used for equipment which demands high reliability and safety in function and precision, such as ; * Transportation control and safety equipment (aircraft, train, automobile etc.) * Rescue and security equipment * Traffic signals * Gas leakage sensor breakers I [ * Other safety equipment (3) Please do not use this product for equipment which require extremely high reliability and safety in function and precision, such as ; * Space equipment * Telecommunication equipment (for trunk lines) * * Medical equipment C Nuclear power control equipment (4) Please contact and consult with a Sharp sales representative if there are any questions regarding interpretation of the above three paragraphs. 1 3. Please contact and consult with a Sharp sales representative for any questions about this product. DATE: CUSTOMERS ‘DATE: BY: APPROVAL M.Katoh. Department General Manager of Engineering Dcpt.,III Gpto-Electronic Devices Division Electronic Components Group SHARP CORPORATION / DG996028 MODEL No. GL5ZV302BOS GL5ZV302BOS &e&cation 1. Application This specification applies to the light emitting diode device Model No. GLZV302BOS. [AlGaInP (dicing or scribe/brake type) Amber LED device] 2. Outline dimensions and pin connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . Refer to the attached sheet Page 2. 3. Ratings and characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . ..*...*.*..* 3-l. Absolute maximumratings 3-2. Electra-optical characteristics 3-3. Derating Curve 3-4. Characteristics Diagram Refer to the attached sheet Page 3-4. 4. Reliability . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Refer to the attached sheet Page 5. 4- 1. Test items and test conditions 4-2. Measurement items and Failure judgement criteria Refer to the attached sheet Page 6. 5. Incoming inspection ,............................................. 5- 1. Applied standard 5-2. Sampling method and level 5-3. Test items, judgement criteria and classifica of defect 5-4. Test items the surface is be applied for flat type, judgement criteria and classifica of defect 6. Supplement . . . . . . . . . . . . . . . ..*................*................... 6- 1. Packing 6-2. Luminous intensity rank 6-3. Dominant wavelength rank 6-4. Environment Refer to tbe attached sheet Page 7-8. 7. Rmautions for use . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ..-.....RefertotheattachedsheetPageg~lo. 7-l. 7-2. 7-3. I 74. Lead forming method Notice of installation Sol&ring Conditions For cleaning Junil6i99 PAGE l/10 Jud16/99 DG996028 PAGE MODEL No. I 2. Outline dimensions and pin GL5ZV302BOS I 2/10 co~ecti~~~ 54NOM 2. 1 II * .’ 0 +I ,, ln 6 FincoMections 1 . 0. Ancde 0. cathode Note) Unspecifiedtol. to be t02mn1 Note) Cold,roUedsteelleadsare plated with but the tie-bar cut portionshaveno plating do not solderthis part of the product. unit mm Material Lead : (Fe) Cold rolled steel Package: Epoxy resin Finish Lead : Sn platedor wave soldering Drawing No. 51106009 .Jun/16/99 PAGE DG996028 MODEL No. 3110 GL5ZV302BOS 3. Ratings and characteristics (Note 1) Duty ratio=l/lO,Pulse width=O. lms (Note 2) At the position of 1.6mm from the bottom resin package (Note 3) Refer to the suplement item 6. regarding the standard of rank classification. 3-3. Derating Curve Peak Forward Current Derating Forward Curve 120 60 2 -e 100 50 + f 80 40 2 60 30 -z E 4o 5 20 : a 0 Current Derating Curve 20 10 0 -25 0 Ambient 25 50 Temperature 75 85100 TarC) 125!5 -25 0 Ambient 25 50 Temperature 750J 100 Ta(OC) 125 1 Junl16l99 1 PAGE DG996028 MODEL I Peak Forward Current vs. No. GLfZV302BOS 4110 Duty Ratio (Ta=25W 10 l/100 Duty 3-4. 1 l/10 Characteristics Raito Diag-ram(typ) Forwaid Current 10 DR (Note 1) vs.Forward Relative Luminous Intensity vs. Ambient Temperature Voltage (Ta=25’%) ( I F=2Om4) 100 z 100 O- .f E 2 .-: !i ii 0. 1 1 1.21.41.6 1.8 Forward Relative Luminous 2 Vo I tage Intensity vs. llllllllllllllll 10 -60 -40 -20 2.22.42.6 Ambient VF (v) Frorard Voltace (Ta+Y’C) 1000 0. 1 Forward (Note 10 1 1) Above characteristic Current 100 IF h4) data are typical data and not a guaranneed data. 0 20 40 60 80 100 120 Temprature Ta(“C) I DG996028 MODEZ I Jun/16/!39 PAGE No. GLSZV302BOS 4. Reliability The reliability of products shall be satisfied with items listed below. 4-2. Measurement items and Failure judgement criteria *1 Failure judgement criteria *2 Measurement Symbol Forward voltage vF v, > u.s&. Reverse current IR IR > U.S.L. x 2.0 Luminous intensity IV x 1.2 Iv > The first stage value X 2.0 or The first stage value X 0.5 > Iv s Solderability : Solder shall be adhere at the area of 95% or more of dipped portion. s Terminal strength : Package is not destroyed, and terminal is not slack *l: Measuring condition is in accordance with specification. *2: U.S.L. is shown by Upper Specification Limit. *3: IF MAX.is shown by forward current of absolute maximum ratings. ( 5110 I Jun/16/99 LX996028 MODEL No. 1 PAGE GLSZV302BOS 5. Incoming inspection 5-l. Applied standard : IS0 2859-l 5-2. Sampling method and level : A single sampling plan,notmal inspection level II : AQL Major defect : 0.065% Minor defect : 0.4% 5-3. Test items, judgement criteria and classifica of defect No. Test items judgement criteria 1 Disconnection Not emit light 2 Position of Cutting off rim Different from dimension 3 Reverse tenninai Different from dimension 4 Outline dimensions Not satisfy outline specification 5 Characteristics Over the limit value of specification at Vr, Ia, and Iv 6 Cut off the rim Exceed -0.2mm 7 Foreign substance White point : Exceed Q 0.3mm (on top view) Black point : Exceed 4 0.3mm (on top view) String form : Exceed 3.Omm (on top view) 8 Scratch Exceed Q 0.3mm or O.lmm x l.Omm (on top view) I C ,lassifica of defer Major defect Minor defect Exceed 4~0.3mm (on top view) 10 Uneven density of material for scattering 11 Unbalanced center 12 Burr I 13 I Insertion position of Extremely uneven density Exceed #.25mm from package center Exceed +0.2mm againstprovided dimension I Insertion oosition of terminal 5-4. Test items the surface is be applied for flat type, judgement criteria and classifica of defect No. Test items judgement criteria classifica of defec 14 Chapped the surface The surface chapped is striking for see the lamp top Minor defect 15 Hollow tbe surface Tbe surface hollow is striking for see the lamp top 6110 DG996028 MODEL No. GL5ZV302BOS Jlld16/!w PAGE 7110 6. Supplement 6-1. Packing 6-l-l. Inner package Put 25Opcs the same luminous intensity rank products into pack and put following label by pack Product weight : 0.28g (One Product,Typ.) (Indication label sample) SHIPldENT TAEU? PARTNo. GLXV302BOS - Modelnumber QUANTITY 250 - Quantity of products LOTNo. KA99819 - Lot number * 0 0 Q@Q o-n t - Luminous intensity rank dominant wavelength rank SHARP= RADEIN JAPAN + Production country *y @ @ @ @ @) g q cJcln0 --- Production plant code(to be indicated alphabetically) Support code Year of production(the last two figures of the year) (to be indicated alphabetically with January corresponding to A) Month of production Date of production(Ol-31) 6-l-2. Cuter package Put a packs (the same luminous intensity rank) into outer package. (approximately 670g per one outer package) 6-l-3. Outer package out line dimension Width: 14Omn1, Depth: 225mm, Hight: . 6-2.Luminous intensity rank (Note 1) Luminous intensity Rank K 383 746 L 552 1075 M 795 1548 N 1144 f 2229 ‘) %un unit (Ta=25”c) Condition mcd 1*2OnlA (Note 1) Tolerance:fl5% In regardto luminousintensity, the following rankingshallbe carriedout. However the quantity of eachrank shallnot be prescribed. In caseof the distribution of the luminousintensity shift to high, at that point new upperrank is prescribedand lower rank is delete. 6-3Dominant wavelengthrank (Note 2) Rank Dominant wavelength H 581.0 584.5 I 583.5 587.0 J 586.0 589.5 K 588.5 592.0 L 591.0 594.5 A Ta=25”C) cm-- ., unit Condition run IF2OnlA f (Note 2) The condition of measurement : The measurement of the-tight emission from the front side of lamp. This rank value is the setting value of whenthat classifiesit the rank and be not a guaranteevalue. Also I shallnot askthe delivery ratio of eachrank. DG596028 MODEL No. GL5ZV302BOS 6-4. Environment 641. Ozonospheredestructivechemicals. (1) The &vice does& contain following substance. (2) The &vice doesn’thave a production line whoseprocessrequiresfollowing substance. Restrictedpart: CFCs,Mones,CCl+Tricbloroethane(Methychloroform) 642. Bromic non-burningmaterials The device doesn’tcontainbromic non-burningmaterk&(PBBOs,PBBs) Jun/16/99 PAGE 8110 Juni16i99 xi996028 MODEL PAGE No. GL5ZV302BOS 9/10 7. Precaution5for use ? - 1. Lead forming method Avoid forming a lead pin with the lead pin base as a fulcrum:be sure to hold a lead pin firmly when forming. Lead pins should be formed before soldering. 7 - 2. Notice of installation 7-Z-l installation on a PW B !hen mounting an LED lamp on a PWB, do not apply physical stress to the lead pins. The lead pin pitch should match the PTEIpin-hole pitch:absolutely avoid widening or narrowing the lead pins. $nen positioning an LED lamp,basically employ an LEDwith tie-bar cut or use a spacer. 7-2-2 lVhenan LED 1 is mounted directly on a PWB If the bottom face of an LED lamp is mounted directly on single-sided P’JE!,the base of the lead pins may be subjected to physical stress due to PYBwarp,cutting or clinching of lead pins. Prior to use, be sure to check that no disconnection inside of the resin or damageto resin etc., is found. Then an LED lamp is mounted on a double-sided PWBthe heat during soldering affects the resin;therefore,keep the LED lamp more that 1.6mmafloat above the P’R. 7-2-3 Installation using a holder During an LED lamp positioning,when a holder is used,a holder should be designed not to subject lead pins to any undue stress. (Note)Pay attention to the thermal expansion coefficient of the material used for the holder.Since the holder expands and contracts due to preheat and soldering heat,mechanical stress may be applied to the lead pins, resulting in disconnection. 7-2-4 Installation to the case Do not fix part C with adhesives when fixed to the case as shown in Figure.h hole of the case should be designed not to subject the inside of resin to any undue stress. l l r 1 lb 0 n I.618 GL5ZV302BOS 7 - 3. S oldering Conditions Solder the lead pins under the following conditions Conditions Type of Soldering 295°C &SC, within 3 seconds 1. Manual soldering 260°C t 5°C. vithin 5 seconds 2. Wave soldering Preheating 70°C to 8O“C, vithin 30 seconds 3. Auto soldering S oldering 245°C+5”c, vithin 5 seconds (Note) Avoid dipping resin into soldering bath Avoid applying stress to lead pins while they are heated. For example , when the LED lamp is moved with the heat applied to the lead pins during manual soldering or solder repair,disconnection way occur. 7 - 4. For cleaning (1) Solvent cleaning : Solvent temperature 45°C or less Immersion for 3 min or less (21 Ultrasonic cleaning : The effect to device by ultrasonic cleaning differs by cleaning bath size,ultrasonic power output, cleaning time, P!!E?size or device mounting condition etc. Please test it in actual using condition and confirm that doesn’t occur any defect before starting the ultrasonic cleaning. ( 3 > Applicable solvent : Ethyl alcohol, Methyl alcohol, Isopropyl alcohol In case when the other solvent is used,there are cases that the packaging resin is eroded. Please use the other solvent after thorough confirmation is performed in actual using condition. I lo/lo