SHARP S13MD01

S13MD01
S13MD01
8-pin DIP Type SSR
for Low Power Control
■ Features
■ Outline Dimensions
1. Compact 8-pin dual-in-line package
2. RMS ON-state current (IT : 0.3Arms)
(Unit : mm)
Internal connection diagram
8
6
5
3
4
1
2
3
4
5
6
8
3. Repetitive peak OFF-state voltage is high.
4. Isolation voltage between input and output (Viso : 4000Vrms)
5. Recognized by UL (No. E94758)
1
6. Approved by CAS (No. LR63705)
2
Cathode
Anode
Cathode
Cathode
G
T1
T2
2.54 ± 0.25
8
■ Application
6
5
1. Oil fan heaters
2. Microwave ovens
3. Refrigerators
6.5 ± 0.5
S13MD01
Anode
mark
1
2
3
4
1.2 ± 0.3
7.62 ± 0.3
3.4 ± 0.5
3.1 ± 0.5
0.5 TYP. 3.5 ± 0.5
9.66 ± 0.5
0.5 ± 0.1
0.26 ± 0.1
θ: 0 to 13˚
* (Note) Terminals 1 , 3 and 4 are common ones of cathode.
To radiate the heat, solder all of the lead pins on the pattern of PWB.
■ Absolute Maximum Ratings
Input
Output
Parameter
Forward current
Reverse voltage
RMS ON-state current
*1
Peak one cycle surge current
Repetitive peak OFF-state voltage
*2
Isolation voltage
Operating temperature
Storage temperature
*3
Soldering temperature
(Ta = 25˚C )
Symbol
IF
VR
IT
Isurge
VDRM
Viso
Topr
Tstg
Tsol
Rating
50
6
0.3
3
400
4 000
- 25 to +80
- 40 to +125
260
Unit
mA
V
Arms
A
V
Vrms
˚C
˚C
˚C
*1 50Hz sine wave
*2 40 to 60% RH, AC for 1 minute, f=60Hz
*3 For 10 seconds
“ In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that occur in equipment using any of SHARP's devices, shown in catalogs,
data books, etc. Contact SHARP in order to obtain the latest version of the device specification sheets before using any SHARP's device.”
θ
S13MD01
■ Electro-optical Characteristics
(Ta=25˚C)
Parameter
Symbol
Forward voltage
VF
Reverse current
IR
Repetitive peak OFF-state current
IDRM
ON-state voltage
VT
Holding current
IH
Critical rate of rise of OFF-state voltage dv/dt
Minimum trigger current
IFT
Insulation resistance
RISO
Input
Output
Transfer
characteristics
Turn-on time
ton
Fig. 1 RMS ON-state Current vs. Ambient
Temperature
Conditions
IF = 20mA
VR = 3V
VDRM = Rated
IT = 0.3A
VD = 6V
VDRM = (1/ 2 ) • Rated
VD = 6V, R L = 100 Ω
DC500V, 40 to 60% RH
VD = 6V, RL = 100Ω
IF = 20mA
-
Unit
V
µA
µA
V
mA
V/ µ s
mA
Ω
100
µs
60
0.7
50
0.6
Forward current IF (mA)
RMS ON-state current IT (Arms)
-
MAX.
1.4
10
100
3.0
25
10
-
Fig. 2 Forward Current vs. Ambient
Temperature
0.8
0.5
0.4
0.3
0.2
40
30
20
10
0.1
0
- 25
MIN.
TYP.
1.2
100
5 x 10 10 1 x 10 11
0
25
50 60
75 80
Ambient temperature Ta (˚C)
100
0
- 25
0
25
50 55
75 80
Ambient temperature Ta (˚C)
100
S13MD01
Fig. 3 Forward Current vs. Forward Voltage
20
10
5
2
1
0
0.5
1.0
1.5
2.0
2.5
8
6
4
2
0
- 30
3.0
Forward voltage VF (V)
I T = 0.3A
ON-state voltage VT (V)
1.3
1.2
1.1
1.0
0.9
20
40
20
40
60
80
100
60
80
Fig. 6 Relative Holding Current vs.
Ambient Temperature (S13MD01)
Relative holding current IH (t˚C)/IH (25˚C) x100%
1.4
0
0
Ambient Temperature Ta (˚C)
Fig. 5 ON-State Voltage vs. Ambient
Temperature
(S13MD01)
0.8
- 30
VD = 6V
RL= 100Ω
10
Minimum trigger current IFT (mA)
Ta = -
50
- 25˚C
25˚C
100
Forward current IF (mA)
12
50˚C
25˚C
0˚C
200
Fig. 4 Minimum Trigger Current vs.
Ambient Temperature (S13MD01)
103
V D = 6V
102
10
- 30
100
Ambient Temperature Ta (˚C)
0
20
40
60
80
100
Ambient temperature Ta (˚C)
Fig. 7 ON-State Current vs. ON-State Voltage
(S13MD01)
Fig. 8 Turn-on Time vs. Forward Current
(S13MD01)
0.5
100
VD = 6V
RL= 100Ω
Ta= 25˚C
IF = 20mA
Ta = 25˚C
Turn-on time ton (µ s)
ON-state current IT (A)
0.4
0.3
0.2
10
0.1
0
0
0.5
1.0
ON-state voltage VT (V)
1.5
1
10
20
30
40
50
Forward current IF (mA)
100
S13MD01
■ Basic Operation Circuit
R1
2
+ VCC
D1
8
SSR
3
Load
ZS
AC 100V ( S13MD01 )
6
V1
Tr1
(1) DC Drive
Zs : Surge absorption circuit
(2) Pulse Drive
(3) Phase Control
AC supply voltage
Input signal
Load current
(for resistance load)
Notes (1) If large amount of surge is loaded onto Vcc or the driver circuit, add a diode D1 between terminals 2 and 3 to prevent reverse
bias from being applied to the infrared LED.
(2) Be sure to install a surge absorption circuit. An appropriate circuit must be chosen according to the load
(for CR, choose its constant). This must be carefully done especially for an inductive load.
(3) For phase control, adjust such that the load current immediately after the input signal is applied will be more than 30mA.
■ Precautions for Use
(1) All pins must be soldered since they are also used as heat sinks (heat radiation fins).
In designing, consider the heat radiation from the mounted SSR.
(2) For higher radiation efficiency that allows wider thermal margin, secure a wider round pattern for Pin No. 8
when designing mounting pattern. The rounded part of Pin No. 5 (gate) must be as small as possible.
Pulling the gate pattern around increases the change of being affected by external noise.
● As for other general cautions, refer to the chapter "Precautions for Use" (Page 78 to 93).