S101D01/S101D02/S201D01/S201D02 S101D01/S101D02 S201D01/S201D02 16-Pin DIP Type SSR for Low Power Control ■ Features ■ Outline Dimensions 1. Compact ( 16-pin dual-in-line package type) 2. RMS ON-state current I T : 1.2Arms 3. Built-in zero-cross circuit ( S101D02 , S201D02 ) 4. Recognised by UL, file No. E94758 5. Approved by CSA, No. LR63705 Internal connection diagram 2 3 4 5 6 16 7 *To radiate the heat, solder the lead pins 4 to 7 , 9 on the pattern of the PWB without using a socket such that there is no open pin left. 2 Anode 3 Cathode 11 T 1 9 , 13 T 2 15 Gate 16 NC 1. Fan heaters 2. Microwave ovens 3. Refrigerators 4. Air conditioners ❈ Zero-cross circuit 9 11 13 16 15 ■ Applications 15 11 13 9 S101D01 S201D01 S101D02 S201D02 Anode mark 2 3 4 5 2.54 ± 0.25 19.82 6 7 1.2 ± 0.2 ❈ Zero-cross circuit for 0.5 ± 0.1 Input Output Forward current Reverse voltage RMS ON-state current *1 Peak one cycle surge current Repetitive peak OFF-state voltage *2 Isolation voltage Operating temperature Storage temperature *3 Soldering temperature 0.26 ± 0.1 θ : 0 to 13˚ θ S101D02 /S201D02 ■ Absolute Maximum Ratings Parameter 7.62 ± 0.3 ± 0.5 0.5TYP. 3.5 ± 0.5 For 200V lines 3.4 ± 0.5 For 100V lines A ( Model No. ) S101D01 S101D02 S201D01 S201D02 6.5 ± 0.5 A ■ Model Line-ups For phase control No built-in zerocross circuit Built-in zerocross circuit ( Unit : mm ) ( Ta = 25˚C ) Symbol Rating S101D01/S101D02 IF VR IT I surge V DRM V iso T opr T stg T sol S201D01/S201D02 50 6 1.2 12 400 600 4 000 - 25 to + 85 - 40 to + 125 260 *1 50Hz, sine wave *2 40 to 60% RH, AC 60Hz for 1 minute *3 For 10 seconds “ In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that occur in equipment using any of SHARP's devices, shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest version of the device specification sheets before using any SHARP's device.” Unit mA V A rms A V V rms ˚C ˚C ˚C S101D01/S101D02/S201D01/S201D02 ■ Electrical Characteristics Input Output Transfer characteristics ( Ta = 25˚C ) Parameter Forward voltage Reverse current Repetitive S101D01 / S101D02 peak OFF-state S201D01 / S201D02 current ON-state voltage Holding current Zero-cross voltage S101D02 / S201D02 Critical rate of S101D01 / S101D02 rise of OFF-state S201D01 / S201D02 voltage Minimum trigger current Isolation resistance Turn-on time Symbol VF IR I DRM VT IH V OX dV/dt I FT R ISO t on 1.6 80 1.4 70 1.2 60 1.0 0.8 0.6 0.4 0 40 50 25 75 85 Ambient temperature T a ( ˚C ) 40 30 20 Minimum trigger current I FT ( mA ) - 25˚C Ta = 75˚C 20 10 5 2 0.5 1.0 1.5 2.0 Forward voltage V F ( V ) 25 50 55 75 85 Ambient temperature T a ( ˚C ) 100 12 100 50 0 Fig. 4 Minimum Trigger Current vs. Ambient Temperature ( S101D01) 50˚C 25˚C 0˚C 200 Forward current I F ( mA ) MAX. 1.4 10 - 5 10 - 4 10 - 4 1.7 25 35 10 100 50 0 - 25 100 Fig. 3 Forward Current vs. Forward Voltage 1 0 TYP. 1.2 1011 - 10 0.2 0 - 25 MIN. 200 100 5 x 1010 - Fig. 2 Forward Current vs. Ambient Temperature Forward current I F ( mA ) RMS ON-state current IT ( Arms ) Fig. 1 RMS ON-state Current vs. Ambient Temperature Conditions I F = 20mA V R = 3V V DRM = 400V V DRM = 600V I T = 1.2A V D = 6V Resistance load, I F = 15mA V DRM = 1/ 2 • 400V V DRM = 1/ 2 • 600V V D = 6V, R L = 100Ω DC500V, 40 to 60% RH V D = 6V, RL = 100Ω , I F = 20mA 2.5 3.0 VD = 6V RL = 100 Ω 10 8 6 4 2 0 - 30 0 20 40 60 80 Ambient temperature Ta ( ˚C ) 100 Unit V A A A V mA V V/ µ s V/ µ s mA Ω µs S101D01/S101D02/S201D01/S201D02 Fig. 5 Minimum Trigger Current vs. Ambient Temperature (S101D02 , S201D02 ) 12 Fig. 6 Minimum Trigger Current vs. Ambient Temperature (S201D01 ) 12 VD = 6V RL= 100Ω Minimum trigger current I FT ( mA ) Minimum trigger current I FT ( mA ) VD = 6V RL= 100Ω 10 8 6 4 2 0 - 30 0 20 40 60 80 Ambient temperature T a ( ˚C ) Relative holding current IH (t˚C) /I H ( 25˚C ) x 100(% ) I T = 1.2A 1.3 ON-state voltage VT ( V ) 6 4 2 0 20 40 60 80 Ambient temperature T a ( ˚C ) 100 Fig. 8 Relative Holding Current vs. Ambient Temperature 1.4 1.2 1.1 1.0 0.9 0 20 40 60 80 Ambient temperature T a ( ˚C ) V D = 6V 103 102 101 - 30 100 Fig. 9 ON-state Current vs. ON-state Voltage 0 20 40 60 80 Ambient temperature T a ( ˚C ) 100 Fig.10 Turn-on Time vs. Forward Current (S101D01 ) 100 90 80 70 60 1.2 I F = 20mA T a = 25˚C Turn-on time t on ( µ s ) 1.0 ON-state current I T ( A ) 8 0 - 30 100 Fig. 7 ON-state Voltage vs. Ambient Temperature 0.8 - 30 10 0.8 0.6 0.4 VD = 6V RL= 100Ω T a = 25˚C 50 40 30 20 0.2 0 0 0.5 1.0 ON-state voltage V T ( V ) 1.5 10 10 20 30 40 50 Forward current I F ( mA ) 100 S101D01/S101D02/S201D01/S201D02 Fig.11 Turn-on Time vs. Forward Current (S101D02 , S201D02 ) Fig.12 Turn-on Time vs. Forward Current (S201D01) 200 100 VD = 6V RL= 100Ω T a = 25˚C VD = 6V RL= 100Ω Turn-on time t on ( µ s ) Turn-on time t on ( µ s ) T a = 25˚C 50 40 30 20 100 50 40 30 10 10 20 30 40 50 Forward current I F ( mA ) 20 10 100 20 30 40 50 Forward current I F ( mA ) 100 ■ Basic Operation Circuit R1 + VCC 13 2 D1 SSR 3 Load ZS AC 100V (S101D01 / S101D02 ) AC 200V (S201D01 / S201D02 ) 11 V1 Tr1 ( 1 ) DC Drive ZS : Surge absorption circuit ( 2 ) Pulse Drive ( 3 ) Phase Control AC supply voltage Input signal Load current ( for resistance load) Notes 1 ) If large amount of surge is loaded onto V CC or the driver circuit, add a diode D 1 between terminals 2 and 3 to prevent reverse bias from being applied to the infrared LED. 2 ) Be sure to install a surge absorption circuit. An appropriate circuit must be chosen according to the load ( for CR, choose its constant ) . This must be carefully done especially for an inductive load. 3 ) For phase control, adjust such that the load current immediately after the input signal is applied will be more than 60mA. ( Precautions for Use ) 1 ) All pins must be soldered since they are also used as heat sinks ( heat radiation fins ) . In designing, take into the heat radiation from the mounted SSR. 2 ) For higher radiation efficiency that allows wider thermal margin, secure a wider round pattern for Pin 13 when designing mounting pattern. The rounded part of Pin 15 ( gate ) must be as small as possible. Pulling the gate pattern around increases the change of being affected by external noise. 3 ) As for other general cautions, refer to the chapter “ Precautions for Use ” 9