ILX550K 10680 pixel × 3 line CCD Linear Sensor (Color) Description The ILX550K is a reduction type CCD linear sensor developed for color image scanner. This sensor reads A4-size documents at a density of 1200DPI. 24 pin DIP (Plastic) Features • Number of effective pixels: 32040 pixels (10680 pixels × 3) • Pixel size: 4µm × 4µm (4µm pitch) • Distance between line: 32µm (8 lines) • Single-sided readout • Ultra low lag/High sensitivity • Single 12V power supply • Maximum data rate: 5MHz/Color • Input Clock Pulse: CMOS 5V drive • Number of output: 3 (R, G, B) • Package: 24 pin Plastic DIP (400mil) 12 φROG-G Driver 13 φROG-B 16 φROG-R V °C Driver Absolute Maximum Ratings 15 • Supply voltage VDD • Operating temperature –10 to +55 Block Diagram 10 GND φ2 15 11 φ1 φ2 24 1 φ1 2 φRS 5 VDD Output amplifier VOUT-B 21 3 Output amplifier 4 13 φROG-B VOUT-G 14 NC GND Output amplifier 23 VOUT-R 20 10680 10680 10680 φROG-G 12 φCLP R G B 15 φ2 GND 10 φ1 11 CCD register 16 φROG-R Blue 9 Read out gate NC CCD register 17 NC Green 8 Read out gate NC CCD register 18 NC Red 7 Read out gate NC 22 19 NC GND 6 1 NC 1 20 VOUT-R 1 5 D18 D19 VDD D18 D19 21 VOUT-B D18 D19 4 D69 S1 VOUT-G D69 S1 22 GND D69 S1 3 S10680 D70 GND 23 φCLP S10680 D70 2 D74 D75 φRS S10680 D70 24 φ2 D74 D75 1 D74 D75 φ1 Driver Pin Configuration (Top View) Sony reserves the right to change products and specifications without prior notice. This information does not convey any license by any implication or otherwise under any patents or other right. Application circuits shown, if any, are typical examples illustrating the operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits. –1– E00420-PS ILX550K Pin Description Pin No. Symbol Pin No. Description Symbol Description 1 φ1 Clock pulse input 13 φROG-B Clock pulse input 2 φRS Clock pulse input 14 NC NC 3 GND GND 15 φ2 Clock pulse input 4 VOUT-G Signal output (green) 16 φROG-R Clock pulse input 5 VDD 12V power supply 17 NC NC 6 NC NC 18 NC NC 7 NC NC 19 NC NC 8 NC NC 20 VOUT-R Signal output (red) 9 NC NC 21 VOUT-B Signal output (blue) 10 GND GND 22 GND GND 11 φ1 Clock pulse input 23 φCLP Clock pulse input 12 φROG-G Clock pulse input 24 φ2 Clock pulse input Recommended Supply Voltage Item VDD Min. Typ. Max. Unit 11.4 12 12.6 V Clock Characteristics Item Symbol Min. Typ. Max. Unit Input capacity of φ1, φ2 Cφ1, Cφ2 — 500 — pF Input capacity of φRS CφRS — 10 — pF Input capacity of φCLP CφCLP — 10 — pF Input capacity of φROG CφROG — 10 — pF Clock Frequency Symbol Min. Typ. Max. Unit fφ1, fφ2, fφRS, fφCLP — 1 5 MHz Item Frequency of φ1, φ2, φRS, φCLP Input Clock Pulse Voltage Condition Min. Typ. Max. Unit High level 4.75 5.0 5.25 V Low level — 0 0.1 V Item φ1, φ2, φRS, φCLP, φROG pulse voltage –2– ILX550K Electrooptical Characteristics (Note 1) (Ta = 25°C, VDD = 12V, fφRS = 1MHz, Input clock = 5Vp-p, Light source = 3200K, IR cut filter CM-500S (t = 1.0mm)) Item Symbol Min. Typ. Max. Unit Remarks Red RR 1.8 2.7 3.6 Green RG 2.1 3.3 4.5 V/(lx · s) Note 2 Blue RB 1.7 2.6 3.5 Sensitivity nonuniformity PRNU — 4 20 % Note 3 Saturation output voltage VSAT 2 2.5 — V Note 4 Red SER 0.56 0.93 — Green SEG 0.44 0.76 — lx · s Note 5 Blue SEB 0.57 0.96 — Dark voltage average VDRK — 2 5 mV Note 6 Dark signal nonuniformity DSNU — 4 12 mV Note 6 Image lag IL — 0.02 — % Note 7 Supply current IVDD — 25 50 mA Total transfer efficiency TTE 92 98 — % Output impedance Zo — 450 — Ω Offset level VOS — 7.3 — V Sensitivity Saturation exposure Note 8 Notes) 1. In accordance with the given electrooptical characteristics, the black level is defined as the average value of D18, D19 to D67. 2. For the sensitivity test light is applied with a uniform intensity of illumination. 3. PRNU is defined as indicated below. Ray incidence conditions are the same as for Note 2. VOUT-G = 500mV (Typ.) PRNU = (VMAX – VMIN)/2 VAVE × 100 [%] Where the 5340 pixels are divided into blocks of 100, the maximum output of each block is set to VMAX, the minimum output to VMIN and the average output to VAVE. 4. Use below the minimum value of the saturation output voltage. 5. Saturation exposure is defined as follows. SE = VSAT R , Where R indicates RR, RG, RB, and SE indicates SER, SEG, SEB. 6. Optical signal accumulated time τint stands at 5.5ms. 7. VOUT-G = 500mV (Typ.) VOUT 8. Vos is defined as indicated below. VOUT indicates VOUT-R, VOUT-G and VOUT-B. VOS GND –3– –4– VOUT φCLP φRS φ2 φ1 φROG D68 D19 D18 D17 D3 4 S10678 S2 S1 D69 1-line output period (10755 pixels) Dummy signal (69 pixels) Optical black (50 pixels) , , D67 D2 3 2 Note) The transfer pulses (φ1, φ2) must have more than 10755 cycles. VOUT indicates VOUT-R, VOUT-G, VOUT-B. φROG indicates φROG-R, φROG-G, φROG-B. 0 5 0 5 0 5 0 5 0 5 1 D1 Clock Timing Chart 1 ILX550K D75 D74 10755 D71 D70 S10680 S10679 ILX550K Clock Timing Chart 2 t4 t5 φROG t2 t6 φ1 t7 t1 t3 φ2 Clock Timing Chart 3 t6 t7 φ1 φ2 t10 t9 φRS t8 t16 t15 t14 t17 φCLP t13 , , t11 t12 VOUT –5– ILX550K Clock Pulse Recommended Timing Item Symbol Min. Typ. Max. Unit φROG, φ1 pulse timing t1 50 100 — ns φROG pulse high level period t2 3 5 — µs φROG, φ1 pulse timing t3 1 2 — µs φROG pulse rise time t4 0 5 — ns φROG pulse fall time t5 0 5 — ns φ1 pulse rise time/φ2 pulse fall time t6 0 20 — ns φ1 pulse fall time/φ2 pulse rise time t7 0 — ns φRS pulse high level period t8 30 20 50∗1 — ns φRS pulse rise time t9 0 20 — ns φRS pulse fall time t10 0 20 — ns t11 — 50 — ns t12 — 20 — ns t13 40 100 — ns t14 40 100 — ns t15 10 50 — ns φCLP pulse rise time t16 0 20 — ns φCLP pulse fall time t17 0 20 — ns Signal output delay time φCLP pulse high level period φCLP pulse timing ∗1 These timing is the recommended condition under fφRS = 1MHz. –6– –7– 2Ω IC1 47µF/16V 2Ω φRS 2 3 100Ω 5.1kΩ 4 Tr1 5 VOUT-G 6 7 IC1: 74AC04 Tr1: 2SC2785 8 9 10 2Ω IC1 φ1 11 φROG-G 100Ω 12 Application circuits shown are typical examples illustrating the operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits or for any infringement of third party patent and other right due to same. φ1 1 100Ω 13 14 15 16 17 100Ω 18 2Ω φROG-B 19 100Ω φ2 20 100Ω Tr1 VOUT-R φROG-R 21 Tr1 VOUT-B 5.1kΩ 22 100Ω 5.1kΩ 23 100Ω φCLP 24 φ2 φ2 φ1 φCLP φRS GND GND VOUT-B VOUT-G VOUT-R VDD NC NC NC NC NC NC φROG-R NC φ2 GND NC φ1 φROG-B φROG-G IC1 ∗ Data rate fφRS = 1MHz 0.1µF 12V Application Circuit∗ IC1 ILX550K ILX550K Example of Representative Characteristics (VDD = 12V, Ta = 25°C) Spectral sensitivity characteristics (Standard characteristics) 1.0 Relative sensitivity 0.8 0.6 0.4 0.2 0 400 450 500 550 600 Wavelength [nm] Dark voltage rate vs. Ambient temperature (Standard characteristics) 10 Output voltage rate Dark voltage rate 700 Output voltage rate vs. Integration time (Standard characteristics) 100 10 1 0.1 –10 650 1 0.1 0 10 20 30 40 50 Ta – Ambient temperature [°C] 60 1 Offset level vs. Supply voltage (Standard characteristics) 5 τ int – Integration time [ms] 10 Offset level vs. Ambient temperature (Standard characteristics) 10 10 Ta = 25°C 8 Vos – Offset level [V] Vos – Offset level [V] 8 6 4 ∆Vos ≈ 0.7 ∆VDD 2 0 11.4 6 4 ∆Vos ≈ 1mV/ °C ∆Ta 2 12 VDD – Supply voltage [V] 0 –10 12.6 –8– 0 10 20 30 40 50 Ta – Ambient temperature [°C] 60 ILX550K Notes of Handling 1) Static charge prevention CCD image sensors are easily damaged by static discharge. Before handling be sure to take the following protective measures. a) Either handle bare handed or use non chargeable gloves, clothes or material. Also use conductive shoes. b) When handling directly use an earth band. c) Install a conductive mat on the floor or working table to prevent the generation of static electricity. d) Ionized air is recommended for discharge when handling CCD image sensor. e) For the shipment of mounted substrates, use boxes treated for prevention of static charges. 2) Notes on Handling CCD Packages The following points should be observed when handling and installing packages. a) Remain within the following limits when applying static load to the package: (1) Compressive strength: 39N/surface (Do not apply load more than 0.7mm inside the outer perimeter of the glass portion.) (2) Shearing strength: 29N/surface (3) Tensile strength: 29N/surface (4) Torsional strength: 0.9Nm , , Cover glass 0.9Nm ,, ,, ,, ,, Plastic portion 39N 29N 29N Adhesive Ceramic portion (1) (2) (3) (4) b) In addition, if a load is applied to the entire surface by a hard component, bending stress may be generated and the package may fracture, etc., depending on the flatness of the ceramic portion. Therefore, for installation, either use an elastic load, such as a spring plate, or an adhesive. c) Be aware that any of the following can cause the package to crack or dust to be generated. (1) Applying repetitive bending stress to the external leads. (2) Applying heat to the external leads for an extended period of time with soldering iron. (3) Rapid cooling or heating. (4) Prying the plastic portion and ceramic portion away at a support point of the adhesive layer. (5) Applying the metal a crash or a rub against the plastic portion. Note that the preceding notes should also be observed when removing a component from a board after it has already been soldered. 3) Soldering a) Make sure the package temperature does not exceed 80°C. b) Solder dipping in a mounting furnace causes damage to the glass and other defects. Use a grounded 30W soldering iron and solder each pin in less then 2 seconds. For repairs and remount, cool sufficiently. c) To dismount an imaging device, do not use a solder suction equipment. When using an electric desoldering tool, ground the controller. For the control system, use a zero cross type. –9– ILX550K 4) Dust and dirt protection a) Operate in clean environments. b) Do not either touch glass plates by hand or have any object come in contact with glass surfaces. Should dirt stick to a glass surface, blow it off with an air blower. (For dirt stuck through static electricity ionized air is recommended.) c) Clean with a cotton bud and ethyl alcohol if the glass surface is grease stained. Be careful not to scratch the glass. d) Keep in a case to protect from dust and dirt. To prevent dew condensation, preheat or precool when moving to a room with great temperature differences. 5) Exposure to high temperatures or humidity will affect the characteristics. Accordingly avoid storage or usage in such conditions. 6) CCD image sensors are precise optical equipment that should not be subject to mechanical shocks. – 10 – 5.0 ± 0.3 4.0 ± 0.5 – 11 – H 1.778 1 5.43g LS-B25-01(E) 42ALLOY LEAD MATERIAL DRAWING NUMBER GOLD PLATING LEAD TREATMENT PACKAGE MASS Plastic,Ceramic PACKAGE MATERIAL 5.334 42.72 (4µmX10680pixels) 55.7 ± 0.3 24pin SDIP(400mil) No.1Pixel (Green) 24 PACKAGE STRUCTURE V 7.8 ± 0.3 Unit: mm 0.46 12 13 0.3 M 0˚ to 9˚ 10.16 4.28 ± 0.5 10.0 ± 0.3 2. The thickness of the cover glass is 0.7mm, and the refractive index is 1.5. 1. The height from the bottom to the sensor surface is 2.38 ± 0.3mm. 0.25 Package Outline ILX550K Sony Corporation 3.58