TI XIO1100

XIO1100
Data Manual
Literature Number: SLLS690B
June 2006
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Contents
Contents
Section
1
2
3
4
5
6
XIO1100 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2.1
Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2.2
Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2.3
Power Management . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2.3.1
P0 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2.3.2
P0s . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2.3.3
P1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2.4
Clock . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2.5
Reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2.6
Receiver Detection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2.7
Receiver Clock Tolerance Compensation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2.8
Error Detection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2.8.1
8B/10B Decode Error . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2.8.2
Elastic Buffer Overflow Error . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2.8.3
Elastic Buffer Underflow Error . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2.8.4
Disparity Error . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2.9
Loopback . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2.10
Electrical Idle . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2.11
Polarity Inversion . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2.12
Setting Negative Parity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2.13
Terminal Assignments . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2.14
Terminal Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.1
Absolute Maximum Ratings† . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.2
Recommended Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.3
PCI Express Differential Transmitter Output Ranges . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.4
PCI Express Differential Receiver Input Ranges . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.5
Express Differential Reference Clock Input Ranges . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.6
Electrical Characteristics Over Recommended Operating Conditions (VDD_IO) . . . . . . . . . . .
3.7
Implementation−Specific Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Timing Diagrams . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Application Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5.1
Component Connection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5.2
XIO1100 Component Placement . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5.3
Power Supply Filtering Recommendations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5.4
PCIe Layout Guidelines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5.5
PIPE Interface Layout Guidelines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Mechanical Data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Page
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i
List of Figures
Figure
Figure 2−1.
Figure 4−1.
Figure 4−2.
Figure 4−3.
Figure 4−4.
Figure 5−1.
Figure 5−2.
ii
Page
XIO1100 Functional Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
TI−PIPE Input Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
TI−PIPE Data Output Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
TI−PIPE Output Functional Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
TI−PIPE Input Functional Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
External Component Connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Filter Designs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2
20
21
22
23
24
26
List of Tables
Table
Table 2−1.
Table 2−2.
Table 2−3.
Table 2−4.
Table 2−5.
Page
Clock Selection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
RX_STATUS Loopback Detection Code . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
100-pin GGB Signal Name Sorted by Terminal Number . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
100-pin GGB Signal Name Sorted Alphabetically . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
XIO1100 Terminals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3
4
6
7
8
iii
Features
1
XIO1100 Features
D X1 PCI Expresst Serial Link
D TI-PIPE MAC Interface
− PCI Express 1.1 Compliant
− Selectable Reference Clock (100 MHz,
125 MHz)
− Low-Power Capability
D
D
− Source-Synchronous TX and RX Ports
− 125 MHz TX/RX Clocks
− Selectable 16-Bit SDR or 8-Bit DDR Mode
100-Pin MicroStart BGA Package
Selectable 1.5−V or 1.8−V LVCMOS Buffers.
TI and MicroStar BGA are trademarks of Texas Instruments Incorporated
PCI Express is a trademark of PCI−SIG
2
Description
The XIO1100 is a PCI Expresst PHY that is compliant with PCI Express Base Specification Revision 1.1 and
that interfaces the PCI Express Media Access Layer (MAC) to a PCI Express serial link by using a modified
version of the interface described in PHY Interface for the PCI Expresst Architecture (also known as PIPE
interface) by Intel Corporation. This modified version of the PIPE interface is referred to as a TI-PIPE interface
throughout this data manual.
The TI-PIPE interface is a pin-configurable interface that can be configured as either a 16-bit or an 8-bit
interface.
•
•
The 16-bit TI-PIPE interface is a 125 MHz 16-bit parallel interface with a 16-bit output bus (RXDATA) that
is clocked by the RXCLK output clock and a 16-bit input bus (TXDATA) that is clocked by the TXCLK input
clock. Both buses are clocked using Single Data Rate (SDR) clocking in which the data transitions are
on the rising edge of the associated clock.
The 8-bit TI-PIPE interface is a 250 MHz 8-bit parallel interface with an 8-bit output bus (RXDATA) that
is clocked by the RXCLK output clock and an 8-bit input bus (TXDATA) that is clocked by the TXCLK input
clock. Both buses are clocked using Double Data Rate (DDR) clocking in which the data transitions are
on both the rising edge and the falling edge of the clock.
The XIO1100 PHY interfaces to a 2.5 Gbps PCI Express serial link with a transmit differential pair (TXP and
TXN) and a receive differential pair (RXP and RXN). Incoming data at the XIO1100 PHY receive differential
pair (RXP and RXN) is forwarded to the MAC on the RXDATA output bus. Data received from the MAC on
the TXDATA input bus is forwarded to the XIO1100 PHY transfer differential pair (TXP and TXN).
The XIO1100 is also responsible for handling the 8B/10B encoding/decoding and scrambling/unscrambling
of the outgoing data. In addition, XIO1100 can recover/interpolate the clock on the receiver side based on the
transitions guaranteed by the use of the 8B/10B mechanism and supply this to the receive side of the data
link layer logic.
In addition to the TI-PIPE interface, the XIO1100 has some TI-proprietary side-band signals that some
customers may wish to use to take advantage of additional XIO1100 low-power state features (for example,
disabling the PLL during the L1 power state).
2.1
Ordering Information
ORDERING NUMBER
VOLTAGE
TEMPERATURE
PACKAGE
XIO1100
3.3/1.8/1.5
0°C to 70°C
100-terminal GGB
June 2006
SLLS690B
1
Description
2.2
Functional Description
The XIO1100 meets all of the requirements for a PCI−Express PHY as defined by Section 4, Physical Layer
Specifications, of the PCI−SIG document PCI Express Base Specification. The XIO1100 conforms to the
functional behavior described in PHY Interface for the PCI Expresst Architecture by Intel Corporation. There
are only two differences between the XIO1100 TI−PIPE interface and the Intel PIPE interface.
The PIPE interface uses a single SDR clock source to clock both the RXDATA and the TXDATA. The TI−PIPE
interface uses two source synchronous clocks, RX_CLK and TX_CLK, to clock the RXDATA and TXDATA.
RXDATA uses RX_CLK and TXDATA uses TX_CLK.
In the 8-bit mode, the TI−PIPE interface is a DDR (Double Data Rate) interface. In the 16-bit mode, it is an
SDR (Single Data Rate) interface. The PIPE interface is always an SDR interface.
Figure 2−1 shows a functional block diagram of the XIO1100.
REFCLK/REFCLK−
PLL
TX_DATA 16/8
TXP/TXN
TX_CLK
TX_DATAK[1:0]
TX BLOCK
STATUS
COMMAND
RX_DATA 16/8
RX_CLK
RXP/RXN
RX BLOCK
RX_DATAK[1:0]
Figure 2−1. XIO1100 Functional Block Diagram
2.3
Power Management
The three power states are:
2
•
P0
•
P0s
•
P1
SLLS690B
June 2006
Description
2.3.1 P0
P0 is the normal operation state for the XIO1100. The POWERDOWN[1:0] input signals define which of the
three power states that an XIO110 is in at any given time. In states P0, P0s, and P1, the XIO1100 is required
to keep P_CLK operational. For all state transitions between these three states, the XIO1100 indicates
successful transition into the designated power state by a single cycle assertion of PHY_STATUS. For all
power state transitions, the MAC must not begin any operational sequence or more power state transitions
until the XIO1100 has indicated that the initial state transition is finished. P2 state and beacon are not
supported.
In the P0 state, all internal clocks in the XIO1100 are operational. P0 is the only state where the XIO1100
transmits and receives PCI Express signaling. P0 is the appropriate PHY power management state for most
states in the Link Training and Status State Machine (LTSSM). Exceptions are listed as follows for each lower
power XIO1100 state.
2.3.2 P0s
In the P0s state, RX_CLK output stays operational. The MAC moves the XIO1100 to this state only when the
transmit channel is idle. P0s state is used when the transmitter is in state Tx_L0s.Idle. If the receiver detects
an electrical idle while the XIO1100 is in either P0 or P0s power states, the receiver portion of the XIO1100
takes appropriate power saving measures.
2.3.3 P1
In the P1 state, selected internal clocks in the XIO1100 will be turned off. RX_CLK output will stay operational.
The MAC moves the XIO1100 to this state only when both transmit and receive channels are idle. The
XIO1100 does not indicate successful entry into P1 (by asserting PhyStatus) until RX_CLK is stable and the
operating dc common mode voltage is stable and within specification (in accordance with PCI Express Base
Specification). P1 is used for the Disabled state, all Detect states, and L1.Idle state of the Link Training and
Status State Machine (LTSSM). While in P1 state, the optional P1_SLEEP input signal can be used to reduce
even more power consumption by disabling the RX_CLK signal. However, the P1_SLEEP input must not be
asserted when the XIO1100 is in any state other than P1 state, and the XIO1100 must not be transitioned out
of the P1 state as long as P1_SLEEP is asserted.
2.4
Clock
The RX_CLK of XIO1100 is derived from the REFCLK input. A 100 MHz differential clock or a 125 MHz single
ended clock can be used as the source clock. The frequency selection is determined by CLK_SEL. If
CLK_SEL is low during /RESET transitioning from a low state to a high state, the source clock at
REFCLK+/REFCLK− is a 100 MHz differential clock. If CLK_SEL is high during /RESET transitioning from a
low state to a high state, the source clock at REFCLK+ is a 125 MHz single ended clock. In this case, REFCLK−
needs to be tied to VSS.
Table 2−1. Clock Selection
RX_CLK
2.5
CLK_SEL = 0
100 MHz differential clock
CLK_SEL = 1
125 MHz single ended clock
Reset
When the MAC resets the XIO1100 (initial power on), the MAC must hold the XIO1100 in reset until power
and REFCLK to the XIO1100 are stable. The XIO1100 signals that RX_CLK is valid (RX_CLK has been
running at its operational frequency for at least one clock), and the XIO1100 is in the specified power state
by the de−assertion of PhyStatus. While Reset# is asserted, the MAC must have TxDetectRx/Loopback
de−asserted, TxElecIdle asserted, TxCompliance de−asserted, RxPolarity de−asserted, and PowerDown =
P1.
June 2006
SLLS690B
3
Description
2.6
Receiver Detection
While in the P1 power state, XIO1100 can be instructed to perform a receiver detection operation to determine
if there is a receiver at the other end of the link. The MAC requests XIO1100 to do a receiver detect sequence
by asserting TXDETECTRX/LOOPBACK high. Upon completion of the receiver detection operation, the
XIO1100 asserts PHY_STATUS high for one RX_CLK cycle. While PHY_STATUS is high, XIO1100 drives the
proper receiver status code onto the RX_STATUS[2:0] signals according to Table 2−2. After the receiver
detection has completed (as signaled by the assertion of PhyStatus), the MAC must de−assert
TxDetectRx/Loopback before initiating another receiver detection or a power state transition.
Table 2−2. RX_STATUS Loopback Detection Code
RX_STATUS[2:0]
RECEIVER STATUS
000
Receiver not present
011
Receiver present
NOTE: TX_DET_LOOPBACK must remain asserted until XIO1100 asserts the PHY_STATUS.
2.7
Receiver Clock Tolerance Compensation
The XIO1100 receiver contains an elastic buffer that compensates for differences in frequencies between bit
rates at the two ends of a link. The elastic buffer is capable of holding at least seven symbols to tolerate
worst-case differences (600ppm) in frequency and worst-case intervals between SKP ordered-sets, where
an SKP order-set is a set of symbols transmitted as a group. The first symbol of a SKP ordered-set is a COM
(0xBC) and is followed by three SKP (0x1C) symbols. The purpose of SKP ordered-sets is to allow the
receiving device (in this case, XIO1100) to adjust the data stream that is being received to prevent the elastic
buffer from either overflowing or underflowing due to any differences between the clocking frequencies of the
transmitting device and the receiving device. The XIO1100 monitors the data stream received at the RXP/RXN
differential pair for SKP ordered-sets.
When the XIO1100 detects that an SKP ordered-set is being received, it either adds or removes SKP symbols
from the data stream, depending on the current state of the elastic buffer. If the elastic buffer is in danger of
underflowing, SKP symbols are added to the ordered-set before it is loaded into the buffer. If the elastic buffer
is in danger of overflowing, SKP symbols are removed from the ordered-set before it is loaded into the buffer.
When the XIO1100 detects a SKP ordered-set, the XIO1100 asserts an Add SKP code (001b) on the
RX_STATUS[2:0] bus in the same RX_CLK cycle that it asserts the COM (0xBC) symbol on the
RX_DATA[15:0] bus, if it is adding a SKP symbol to the data stream. In the case of removing an SKP symbol,
the XIO1100 asserts the Remove SKP code (010b) to the RX_STATUS[2:0] when the COM symbol is
asserted.
2.8
Error Detection
If a detectable receive error occurs, the appropriate error code is asserted on the RX_STATUS[2:0] pins for
one RX_CLK cycle as close as possible to the point in the data stream where the error occurred. There are
four error conditions that can be encoded on the RXSTATUS signals. If more than one error happens to occur
on a received byte (or set of bytes transferred across a 16-bit interface), the errors are signaled with the
following priority:
•
8B/10B decode error
•
Elastic buffer overflow
•
Elastic buffer underflow
•
Disparity error
If an error occurs during a SKP ordered-set, such that the error code and the SKP code occur concurrently,
the error code has priority over the SKP code.
4
SLLS690B
June 2006
Description
2.8.1 8B/10B Decode Error
When XIO1100 detects an 8B/10B decode error, it asserts an EDB (0xFE) symbol in the data on the
RX_DATA[15:0] where the bad byte occurred (only the erroneous byte is replaced with the EDB symbol; the
other byte is still valid data). In the same RX_CLK clock cycle that the EDB symbol is asserted on the
RX_DATA[15:0] bus, the 8B/10B decode error code (100b) is asserted on the RX_STATUS[2:0] bus. Since
the 8B/10B decoding error has priority over all other receive error codes, it could mask out a disparity error
occurring on the other byte of data being clocked onto the RX_DATA[15:0] with the EDB symbol.
2.8.2 Elastic Buffer Overflow Error
When the elastic buffer overflows, data is lost during reception. XIO1100 generates an elastic buffer overflow
error when this occurs. The elastic buffer overflow error code (101b) is asserted on the RX_STATUS[2:0] on
the RX_CLK clock cycle that the omitted data would have been asserted. The remaining data asserted on the
RX_DATA[15:0]] bus is still valid data, but the elastic buffer overflow error code on the RX_STATUS[2:0] just
marks a discontinuity point in the data stream being received.
2.8.3 Elastic Buffer Underflow Error
When the elastic buffer underflows, EDB (0xFE) symbols are inserted into the data stream on the
RX_DATA[15:0] bus to fill the holes created by the gaps between valid data. For every RX_CLK clock cycle,
an EDB symbol is asserted on the RX_DATA[15:0] bus, and an elastic buffer underflow error code (111b) is
asserted on the RX_STATUS[2:0] bus.
2.8.4 Disparity Error
When the XIO1100 detects a disparity error, it asserts a disparity error code (111b) on the RX_STATUS[2:0]
bus in the same RX_CLK clock cycle that it asserts the erroneous data on the RX_DATA[15:0] bus. However,
it is not possible to discern which byte had the disparity error.
2.9
Loopback
The XIO1100 begins a loopback operation when the MAC asserts TX_DET_LOOPBACK while holding
TX_ELECIDLE de−asserted. The XIO1100 stops transmitting data to the TXP/TXN signaling pair from the
TI−PIPE interface and begins transmitting the data received at the RXP/RXN signaling pair on the TXP/TXN
signaling pair. This data is not routed through the 8B/10B coding/encoding paths. While in the loopback
operation, the received data is still sent to the RXDATA[15:0] bus of the TI−PIPE interface. The data sent to
the RXDATA[15:0] bus is routed through the 10B/8B decoder. The XIO1100 terminates the loopback operation
and returns to transmitting TXDATA[15:0] over the TXP/TXN signaling pair when the TX_DET_LOOPBACK
signal is de−asserted.
2.10 Electrical Idle
The XIO1100 expects the MAC to issue the required COM (K28.5) symbol and the required number of IDL
symbols (K28.3) on TXDATA[7:0] before asserting the TX_ELECTRICAL signal. The XIO1100 meets the
requirements of the Electrical Requirements of a PCI Express PHY (for these requirements, see Section
4.3.1.9, Electrical Idle, and Table B−2 in Appendix B of PCI Express Base Specification Revision 1.1).
2.11 Polarity Inversion
Polarity inversion can happen in many places in the receive chain, including somewhere in the serial path,
as symbols are placed into the elastic buffer or as symbols are removed from the elastic buffer. The XIO1100
inverts the data received on the RXP/RXN signaling pair when RxPolarity is asserted. The inverted data will
begin showing up on the RXDATA within 20 RX_CLKS of when RxPolarity is asserted.
2.12 Setting Negative Parity
To set the running disparity to negative, TxCompliance is asserted for one clock cycle that matches with the
data that is to be transmitted with negative disparity.
June 2006
SLLS690B
5
Description
2.13 Terminal Assignments
The XIO1100 is packaged in a 100-pin GGB BGA package. See Section 6 for GGB-package terminal diagram.
Table 2−3 lists the terminal assignments in terminal-number order with corresponding signal names for the
GGB package.
Table 2−4 lists the terminal assignments arranged in alphanumerical order by signal name with corresponding
terminal numbers for the GGB package.
Table 2−3. 100-pin GGB Signal Name Sorted by Terminal Number
GGB
NUMBER
6
SIGNAL NAME
GGB
NUMBER
SIGNAL
NAME
GGB
NUMBER
SIGNAL NAME
GGB
NUMBER
SIGNAL NAME
A3
RX_DATA8
C9
RESERVED
G11
VSSA
L6
CLK_SEL
A4
RX_DATA9
C10
VSSA
G12
TXP
L7
VDD_IO
A5
RX_DATA11
C12
RXN
G13
TXN
L8
VSS
A6
RX_DATA13
C13
RXP
H1
TX_DATA13
L9
POWERDOWN1
A7
RX_DATA15
D1
RX_DATA4
H2
TX_DATA14
L10
DDR_EN
A8
RX_DATAK0
D2
RX_DATA5
H3
RX_VALID
L12
VDD_15_COMB
A9
RESERVED
D3
VSS
H11
VDD_33_COMB
L13
VDD_33_COM_IO
A10
RESERVED
D11
VDDA_33
H12
VDDA_15
M3
TX_DATA6
A11
REFCLK−
D12
VSSA
H13
VDDA_15
M4
TX_DATA5
B3
RX_ELECIDLE
D13
VSSA
J1
TX_DATA11
M5
TX_DATA3
B4
RX_DATA10
E1
RX_DATA2
J2
TX_DATA12
M6
TX_DATA1
B5
RX_DATA12
E2
RX_DATA3
J3
VSS
M7
TX_DATAK1
B6
RX_DATA14
E3
RX_STATUS0
J11
VSS
M8
TX_CLK
B7
RX_DATAK1
E11
VDDA_15
J12
VDDA_33
M9
POWERDOWN0
B8
RX_CLK
E12
VSSA
J13
VDDA_33
M10
P1_SLEEP
B9
RESERVED
E13
VDD_15
K1
TX_DATA9
M11
VREG_PD
B10
RESERVED
F1
RX_DATA0
K2
TX_DATA10
N3
TX_DATA7
B11
REFCLK+
F2
RX_DATA1
K3
VDD_IO
N4
TX_DATA4
C1
RX_DATA7
F3
VDD_IO
K11
VSSA
N5
TX_DATA2
C2
RX_DATA6
F11
VDD_15
K12
R0
N6
TX_DATA0
C4
VSS
F12
VSS
K13
R1
N7
TX_DATAK0
C5
VDD_IO
F13
VSSA
L1
TX_DATA8
N8
TXCOMPLIANCE
C6
RX_POLARITY
G1
RX_STATUS1
L2
VSS
N9
TXELECIDLE
C7
VDD_15_CORE
G2
TX_DATA15
L4
VDD_15_CORE
N10
PHY_STATUS
C8
VSS
G3
RX_STATUS2
L5
TXDETECTRX/L
OOPBACK
N11
RESETN
SLLS690B
June 2006
Description
Table 2−4. 100-pin GGB Signal Name Sorted Alphabetically
SIGNAL NAME
CLK_SEL
GGB
NUMBER
SIGNAL NAME
GGB
NUMBER
SIGNAL NAME
GGB
NUMBER
SIGNAL NAME
GGB
NUMBER
L6
RX_DATA8
A3
TX_DATA6
M3
VDD_IO
F3
M10
RX_DATA9
A4
TX_DATA7
N3
VDD_IO
K3
DDR_EN
L10
RX_DATA10
B4
TX_DATA8
L1
VDD_IO
L7
PHY_STATUS
N10
RX_DATA11
A5
TX_DATA9
K1
VDD_IO
C5
POWERDOWN0
M9
RX_DATA12
B5
TX_DATA10
K2
VDDA_15
H12
POWERDOWN1
L9
RX_DATA13
A6
TX_DATA11
J1
VDDA_15
E11
R0
K12
RX_DATA14
B6
TX_DATA12
J2
VDDA_15
H13
R1
K13
RX_DATA15
A7
TX_DATA13
H1
VDDA_33
J13
REFCLK−
A11
RX_DATAK0
A8
TX_DATA14
H2
VDDA_33
D11
REFCLK+
B11
RX_DATAK1
B7
TX_DATA15
G2
VREG_PD
M11
RESERVED
B9
RX_ELECIDLE
B3
TX_DATAK0
N7
VSS
D3
RESERVED
A10
RX_POLARITY
C6
TX_DATAK1
M7
VSS
J3
RESERVED
B10
RX_STATUS0
E3
TXCOMPLIANCE
N8
VSS
L2
RESERVED
A9
RX_STATUS1
G1
TXDETECTRX/
LOOPBACK
L5
VSS
L8
RESERVED
C9
RX_STATUS2
G3
TXELECIDLE
N9
VSS
J11
/RESET
N11
RX_VALID
H3
TXN
G13
VSS
F12
RX_CLK
B8
RXN
C12
TXP
G12
VSS
C8
RX_DATA0
F1
RXP
C13
VDD_15
F11
VSS
C4
RX_DATA1
F2
TX_CLK
M8
VDD_15
E13
VSSA
K11
RX_DATA2
E1
TX_DATA0
N6
VDD_15_COMB
L12
VSSA
G11
RX_DATA3
E2
TX_DATA1
M6
VDD_15_CORE
L4
VSSA
F13
RX_DATA4
D1
TX_DATA2
N5
VDD_15_CORE
C7
VSSA
E12
RX_DATA5
D2
TX_DATA3
M5
VDDA_33
J12
VSSA
D13
RX_DATA6
C2
TX_DATA4
N4
VDD_33_COM_IO
L13
VSSA
D12
RX_DATA7
C1
TX_DATA5
M4
VDD_33_COMB
H11
VSSA
C10
P1_SLEEP
June 2006
SLLS690B
7
Description
2.14 Terminal Descriptions
Table 2−5 describes the XIO1100 terminals. The terminals are grouped by functionality.
Table 2−5. XIO1100 Terminals
TERMINAL
NAME
I/O
DESCRIPTION
NO.
PIPE INTERFACE
/RESET
N11
I
Reset the device. This signal is active low and asynchronous.
POWERDOWN[1:0]
L9, M9
I
Power State Control:
Value: Description
00: P0, normal operation (used for all Polling, Configuration, Recovery, Loop−back,
and Hot-Reset states, and the L0 state of the LTSSM)
01: P0s, low recovery time latency, power−saving state (used for the TX_L0s.idle
state of the LTSSM)
10: P1, longer recovery time (64µs max) latency, lower power state (used for the
disabled state, all detect states, and the L1.idle state of the LTSSM)
PHY_STATUS
N10
O
Used to communicate completion of several PHY functions, including power
management state transitions and receiver detection
TX_CLK
M8
I
Synchronous input clock for TX_DATA[15:0] and TX_DATAK[1:0] inputs
If the DDR_EN signal is low during /RESET transitioning from a low state to a high
state, TX_CLK is a SDR clock and TX_DATA[15:0] and TX_DATAK[1:0] are latched
on the rising edge of TX_CLK.
If the DDR_EN signal is high during /RESET transitioning from a low state to a high
state, TX_CLK is a DDR clock and TX_DATA[7:0] and TX_DATAK[0] are latched on
both the rising and the falling edge of TX_CLK.TX_DATA[15:8] and TX_DATAK[1]
are not used.
TX_DATA[15:0]
G2, H2, H1, J2,
J1, K2, K1, L1,
N3, M3, M4,
N4, M5, N5,
M6, N6
I
Parallel Data Transmit Bus
If the DDR_EN signal is low during /RESET transitioning from a low state to a high
state, TX_DATA[15:0] is latched off the bus on the rising edge of TX_CLK.
TX_DATA[7:0] represents the first symbol and TX_DATA[15:8] represents the
second symbol to be transmitted over the TXN and TXP differential signal pair.
If the DDR_EN signal is high during /RESET transitioning from a low state to a high
state, TX_DATA[7:0] is latched off the bus on both edges of the TX_CLK.
TX_DATA[15:8] is not used and should be grounded. The data on TX_DATA[7:0]
during the rising edge of the clock represents the first symbol and data on
TX_DATA[7:0] during the falling edge of the clock represents the second symbol to
be transmitted over the TXN and TXP differential signal pair.
TX_DATAK[1:0]
M7, N7
I
Data/Control for the Parallel Data Transmit Bus
If the DDR_EN signal is low during /RESET transitioning from a low state to a high
state, TX_DATAK[0] corresponds to the TX_DATA[7:0] and TX_DATAK[1] to
TX_DATA[15:8].
If the DDR_EN signal is high during /RESET transitioning from a low state to a high
state, the state of TX_DATAK[0] corresponds to the data on the TX_DATA[7:0] bus
during the same phase of the clock. TX_DATAK[1] is not used and should be
grounded.
A value of zero indicates that the corresponding TXDATA bits contain data
information; a value of one indicates that the corresponding TXDATA bits contain a
control byte.
NOTE: The TI−PIPE interface can operate at either 1.5 V or 1.8 V, depending on the voltage level of VDD_IO. If VDD_IO is 1.5 V, the TI−PIPE
interface operates at 1.5 V level. If VDD_IO is 1.8 V, the TI−PIPE interface operates at 1.8 V level.
8
SLLS690B
June 2006
Description
Table 2−5. XIO1100 Terminals (Continued)
TERMINAL
TX_ELECIDLE
N9
I/O
I
DESCRIPTION
Forces TXN/TXP outputs to electrical idle.
When de−asserting low while in P0 state (POWERDOWN[1:0] = 00), indicates that
valid data is on the TXDATA bus and that this data should be transmitted.
When asserted high while in P0s state (POWERDOWN[1:0] = 01), always asserted
for P0s state.
When asserted high while in P1 state (POWERDOWN[1:0] = 10), always asserted
for P1 state.
TX_COMPLIANCE
N8
I
Transmit Compliance Pattern
When asserted high, the XIO1100 sets the running disparity to negativity. Used
when transmitting the compliance pattern.
TX_DET_LOOPBACK
L5
I
Begin Receive Detect/Begin Loop−Back
Input to device to either begin a receive detect operation or enter loop−back mode.
RX_CLK
B8
O
Synchronous Output Clock for RX_DATA[15:0] and RX_DATAK[1:0] outputs
If the DDR_EN signal is low during /RESET transitioning from a low state to a high
state, RX_CLK is a SDR clock, and RX_DATA[15:0] and RX_DATAK[1:0] are
latched on the rising edge of RX_CLK.
If the DDR_EN signal is high during /RESET transitioning from a low state to a high
state, RX_CLK is a DDR clock and RX_DATA[7:0] and RX_DATAK[0] are latched
on both the rising and falling edge of the RX_CLK. RX_DATA[15:8] and
RX_DATAK[1] are not used.
RX_CLK is also used as the internal PCLK for the XIO1100.
RX_DATA[15:0]
A7, B6, A6, B5,
A5, B4, A4, A3,
C1, C2, D2, D1,
E2, E1, F2, F1
O
Parallel Data Receive Bus
If the DDR_EN signal is low during /RESET transitioning from a low state to a high
state, RX_DATA[15:0] is latched on the rising edge of the RX_CLK. RX_DATA[7:0]
represents the first symbol received, and RX_DATA[15:8] represents the second
symbol received from the RXN and RXP differential signal pair.
If the DDR_EN signal is high during /RESET transitioning from a low state to a high
state, RX_DATA[7:0] is latched on both the rising edge and falling edge of the
RX_CLK. The data on RX_DATA[7:0] during the rising edge of the RX_CLK
represents the first symbol received, and the data on RX_DATA[7:0] during the
falling edge of the RX_CLK represents the second symbol received from the RXN
and RXP differential signal pair.
RX_DATA[15:8] is not used.
RX_DATAK[1:0]
B7, A8
O
Data/Control for the parallel data receive bus
If the DDR_EN signal is low during /RESET transitioning from a low state to a high
state, the state of RX_DATAK[0] corresponds to RX_DATA[7:0], and RX_DATAK[1]
corresponds to RX_DATA[15:8].
If the DDR_EN signal is high during /RESET transitioning from a low state to a high
state, the state of RX_DATA[0] corresponds to the data on RX_DATA[7:0] during the
same phase of the clock. RX_DATAK[1] is not used.
A value of zero indicates that the corresponding RXDATA bits contain data
information. A value of one indicates that the corresponding RXDATA bits contain a
control byte.
NOTE: The TI−PIPE interface can operate at either 1.5 V or 1.8 V, depending on the voltage level of VDD_IO. If VDD_IO is 1.5 V, the TI−PIPE
interface operates at 1.5 V level. If VDD_IO is 1.8 V, the TI−PIPE interface operates at 1.8 V level.
June 2006
SLLS690B
9
Description
Table 2−5. XIO1100 Terminals (Continued)
TERMINAL
RX_STATUS[2:0]
G3, G1, E3
I/O
O
DESCRIPTION
Encodes receiver status and error codes for the received data stream and receive
detection, as follows:
Value: Description
000: Received data ok
001: 1 SKP added
010: 1 SKP removed
011: Receiver detected
100: 8B/10B decode error
101: Elastic buffer overflow
110: Elastic buffer underflow
111: Receive disparity error
RX_VALID
H3
O
Indicates symbol lock and valid data on RX_DATA[15:0] and RX_DATAK[1:0]
RX_POLARITY
C6
I
Instructs the XIO1100 to perform polarity inversion on the RXN and RXP differential
signal pair. Asserting a high on this signal instructs the XIO1100 to perform the
polarity inversion.
RX_ELECIDLE
B3
O
Indicates receiver detection of an electrical idle of the RXP and RXN signal pair.
This is an asynchronous signal.
REFERENCE CLOCK PIN
REFCLK+
REFCLK−
B11
A11
I
The positive and negative terminals for the input reference clock. If CLK_SEL is low
during /RESET transitioning from low to high, a 100 MHz clock source has to be
applied to REFCLK+ and REFCLK−. If CLK_SEL is high during /RESET
transitioning from low to high, a 125 MHz clock source has to be applied to
REFCLK+. REFCLK− is not used and should be grounded.
R0
R1
K12
K13
I
Terminals for a 14.56KÙ 1% resistors (recommended 5.90K and 8.66K resistors in
series)
TRANSMIT AND RECEIVE PIN
TXP
G12
O
PCI express link differential pair TX positive terminal
TXN
G13
O
PCI express link differential pair TX negative terminal
RXP
C13
I
PCI express link differential pair RX positive terminal. The XIO1100 has integrated
50-Ω termination resistor to VSS on the RXP terminal, eliminating the need for
external components.
RXN
C12
I
PCI express link differential pair RX negative terminal. The XIO1100 has integrated
50-Ω termination resistor to VSS on the RXN terminal, eliminating the need for
external components.
M10
I
P1 low-power enable.
MISC
P1_SLEEP
This input, when asserted high, enables a low−power mode when the XIO1100
enters the P1 state. If the input is asserted when the power−down state is P1
(POWERDOWN[1:0] = 10), the device enters a low−power mode. In this mode, the
PLL is disabled and the RX_CLK is unavailable. The P1_SLEEP input must not be
asserted when the XIO1100 is in any state other than P1 state and the XIO1100
must not be transitioned out of the P1 state as long as P1_SLEEP is asserted.
NOTE: The TI−PIPE interface can operate at either 1.5 V or 1.8 V, depending on the voltage level of VDD_IO. If VDD_IO is 1.5 V, the TI−PIPE
interface operates at 1.5 V level. If VDD_IO is 1.8 V, the TI−PIPE interface operates at 1.8 V level.
10
SLLS690B
June 2006
Description
Table 2−5. XIO1100 Terminals (Continued)
TERMINAL
CLK_SEL
L6
I/O
I
DESCRIPTION
Clock Select
This input, when asserted low during /RESET transitioning from low to high, selects
the 100 MHz differential clock source. A 100MHz clock source has to be applied to
REFCLK+ and REFCLK−.
This input, when asserted high during /RESET transitioning to high, selects the
125 MHz single ended clock source. A 125 MHz clock source has to be applied to
REFCLK+. REFCLK− has to be connected to VSS.
VREG_PD
M11
I
This pin must be pulled to GND during normal operation.
DDR_EN
L10
I
DDR_EN
This input, when asserted high during /RESET transitioning to low state to high
state, defines the TI−PIPE interface to be a 8−bit DDR interface; otherwise, it is an
16-bit SDR interface.
Value: Description
1: DDR_EN is an 8−bit DDR interface
0: DDR_EN is a 16−bit SDR interface
RESERVED
RESERVED
B9
RESERVED
RESERVED
A10
RESERVED
RESERVED
B10
RESERVED
RESERVED
A9
RESERVED
RESERVED
C9
RESERVED. This pin needs to be pulled to GND during normal operation.
POWER SUPPLY TERMINALS
VDD_15
E13, F11
PWR
1.5−V digital power supply.
VDD_15_CORE
C7, L4
PWR
1.5−V core voltage.
VDDA_15
E11, H12, H13
PWR
1.5−V analog power supply.
VDD_15_COMB
L12
PWR
1.5−V main power output. It should be connected to a filter network of 0.01µF, 1µF,
and 1000pF capacitors.
VDDA_33
D11, J12, J13
PWR
3.3−V analog power supply.
VDD_33_COMB
H11
PWR
3.3−V main output. It should be connected to a filter network of 0.01µF, 1µF, and
1000pF capacitors.
VDD_33_COMB_IO
L13
PWR
3.3−V I/O output. It should be connected to a filter network of 0.01µF, 1µF, and
1000pF capacitors.
VDD_IO
C5, F3, K3, L7
PWR
Power supply for digital I/O. Can be either 1.5 V or 1.8 V depending on desired
signaling level.
VSS
D3, J3, L2, L8,
J11, F12, C4,
C8
GND
Digital ground.
VSSA
K11, G11, F13,
E12, D13, D12,
C10
GND
Analog ground.
NOTE: The TI−PIPE interface can operate at either 1.5 V or 1.8 V, depending on the voltage level of VDD_IO. If VDD_IO is 1.5 V, the TI−PIPE
interface operates at 1.5 V level. If VDD_IO is 1.8 V, the TI−PIPE interface operates at 1.8 V level.
June 2006
SLLS690B
11
Electrical Characteristics
3
Electrical Characteristics
3.1
Absolute Maximum Ratings†
Supply voltage range:
Input voltage range,
3.3 V Supply . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 3.6 V
1.8 V Supply . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 1.95 V
1.5 V Supply . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 1.65 V
VI: PCI Express (RX) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.6 V to 0.6 V
VI: PCI Express REFCLK (single-ended) . . . . . . . . . . –0.5 V to VDDA_33 + 0.5 V
VI: PCI Express REFCLK (differential) . . . . . . . . . . . . . . . –0.5 V toVDD_15 + 0.5 V
Input clamp current, (VI < 0 or VI > VDD) (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±20 mA
Output clamp current, (VO < 0 or VO > VDD) (see Note 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±20 mA
Human body model (HBM) ESD performance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1500 V
Charged device model (CDM) ESD performance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 500 V
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –65°C to 150°C
† Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. Applies for external input and bidirectional buffers. VI < 0 or VI > VDD.
2. Applies to external output and bidirectional buffers. VO < 0 or VO > VDD.
3.2
Recommended Operating Conditions
OPERATION
MIN
NOM
MAX
UNIT
Supply voltage
1.5 V
1.35
1.5
1.65
V
Supply voltage
3.3 V
3
3.3
3.6
V
VDD_IO (1.5 V)
VDD_IO (1.8 V)
Supply voltage (I/O)
1.5V
1.35
1.5
1.65
V
Supply voltage (I/O)
1.8V
1.65
1.8
1.95
V
TA
TJ
Operating ambient temperature range
0
25
70
°C
Virtual junction temperature (Note 3)
0
25
115
°C
VDD_15
VDDA_15
VDD_15_CORE
VDDA_33
NOTES: 3. The junction temperature reflects simulated conditions. The customer is responsible for verifying junction temperature.
NOTE: The TI−PIPE interface can operate either at 1.5 V or 1.8 V, depending on the voltage level of VDD_IO. If VDD_IO is 1.5 V, the TI−PIPE
interface operates at 1.5 V level. If VDD_IO is 1.8 V, the TI−PIPE interface operates at 1.8 V level.
12
SLLS690B
June 2006
Electrical Characteristics
3.3
PCI Express Differential Transmitter Output Ranges
PARAMETER
UI
Unit interval
TERMINALS
TXP, TXN
MIN
NOM
MAX
399.88
400
400.12
UNIT
ps
COMMENTS
Each UI is 400 ps ±300 ppm. UI does not account for
SSC−dictated variations.
See Note 4.
VTX–DIFFp–p
Differential peak–to–
peak output voltage
TXP, TXN
0.8
VTX–DE–RATIO De–emphasized differential
output voltage (ratio)
TXP, TXN
−3.0
TTX–EYE
Minimum TX eye width
TXP, TXN
0.75
TTX–EYE–MEDIAN–to–
MAX–JITTER
Maximum time between
the jitter median and
maximum deviation
from the median
TXP, TXN
−3.5
1.2
V
VTX–DIFFp–p = 2*|VTXP − VTXN|
See Note 5.
−4.0
dB
This is the ratio of the VTX–DIFFp–p of the second and
following bits after a transition divided by the
VTX–DIFFp–p of the first bit after a transition.
See Note 5.
UI
The maximum transmitter jitter can be derived as
TTXMAX– JITTER = 1 − TTX–EYE = 0.3 UI
See Notes 5 and 6.
UI
Jitter is defined as the measurement variation of the
crossing points (VTX–DIFFp–p = 0 V) in relation to recovered TX UI. A recovered TX UI is calculated over 3500
consecutive UIs of sample data. Jitter is measured using all edges of the 250 consecutive UIs in the center of
the 3500 UIs used for calculating the TX UI.
0.15
See Notes 5 and 6.
TTX–RISE,
TTX–FALL
P/N TX output rise/fall
time
TXP, TXN
VTX–CM–ACp
RMS ac peak common
mode output voltage
TXP, TXN
VTX–CM–DC–ACTIVE–
IDLE–DELTA
Absolute delta of dc
common mode voltage
during L0 and electrical
idle.
TXP, TXN
VTX–CM–DC–LINE–DELTA
Absolute delta of dc
common mode voltage
between P and N
TXP, TXN
0.125
0
UI
See Notes 5 and 8.
20
mV
VTX–CM–ACp = RMS(|VTXP + VTXN|/2 – VTX–CM–DC)
VTX–CM–DC = DC(avg) of |VTXP + VTXN|/2
See Note 5.
100
mV
|VTX–CM–DC – VTX–CM–Idle–DC| ≤ 100 mV
VTX–CM–DC = DC(avg) of |VTXP + VTXN|/2 [during L0]
VTX–CM–Idle–DC = DC(avg) of |VTXP + VTXN|/2 [during
electrical idle]
See Note 5.
0
25
mV
|VTXP–CM–DC – VTXN–CM–DC| ≤ 25 mV when
VTXP–CM–DC = DC(avg) of |VTXP|
VTXN–CM–DC = DC(avg) of |VTXN|
See Note 5.
NOTES: 4. No test load is necessarily associated with this value.
5. Specified at the measurement point into a timing and voltage compliance test load and measured over any 250 consecutive TX
UIs.
6. A TTX–EYE = 0.75 UI provides for a total sum of deterministic and random jitter budget of TTX–JITTER–MAX = 0.25 UI for the
transmitter collected over any 250 consecutive TX UIs. The TTX–EYE–MEDIAN–to–MAX–JITTER specification ensures a jitter
distribution in which the median and the maximum deviation from the median is less than half of the total TX jitter budget collected
over any 250 consecutive TX UIs. It must be noted that the median is not the same as the mean. The jitter median describes the
point in time where the number of jitter points on either side is approximately equal, as opposed to the averaged time value.
7. The transmitter input impedance results in a differential return loss greater than or equal to 12 dB and a common mode return
loss greater than or equal to 6 dB over a frequency range of 50 MHz to 1.25 GHz. This input impedance requirement applies to
all valid input levels. The reference impedance for return loss measurements is 50 Ω to ground for both the P and N lines. Note
that the use of the series capacitors CTX is optional for the return loss measurement.
8. Measured between 20% and 80% at transmitter package terminals into a test load for both VTXP and VTXN
June 2006
SLLS690B
13
Electrical Characteristics
PARAMETER
TERMINALS
VTX–IDLE–DIFFp
Electrical idle differential peak output voltage
TXP, TXN
VTX–RCV–DETECT
The amount of voltage
change allowed during
receiver detection
TXP, TXN
VTX–DC–CM
The TX dc common
mode voltage
TXP, TXN
ITX–SHORT
TX short circuit current
limit
TXP, TXN
TTX–IDLE–MIN
Minimum time spent in
electrical idle
TXP, TXN
TTX–IDLE–SET–to–IDLE
Maximum time to
transition to a valid
electrical idle after
sending an electrical
idle ordered set
TXP, TXN
TTX–IDLE–to–DIFF–DATA
Maximum time to
transition to valid TX
specifications after
leaving an electrical idle
condition
TXP, TXN
RLTX–DIFF
Differential return loss
TXP, TXN
RLTX–CM
Common mode return
loss
ZTX–DIFF–DC
DC differential TX
impedance
MIN
NOM
UNIT
COMMENTS
20
mV
VTX–IDLE–DIFFp = |VTXP–Idle − VTXN–Idle| ≤ 20 mV
See Note 5.
600
mV
The total amount of voltage change that a transmitter
can apply to sense whether a low impedance receiver is
present.
3.6
V
The allowed dc common mode voltage under any condition.
90
mA
Total current the transmitter can provide when shorted
to its ground
UI
Minimum time a transmitter must be in electrical Idle.
Utilized by the receiver to start looking for an electrical
idle exit after successfully receiving an electrical idle
ordered set.
20
UI
After sending an electrical idle ordered set, the transmitter must meet all electrical idle specifications within this
time. This is considered a debounce time for the transmitter to meet electrical idle after transitioning from L0.
20
UI
Maximum time to meet all TX specifications when transitioning from electrical idle to sending differential data.
This is considered a debounce time for the TX to meet
all TX specifications after leaving electrical idle.
10
dB
Measured over 50 MHz to 1.25 GHz. See Note 7.
TXP, TXN
6
dB
Measured over 50 MHz to 1.25 GHz. See Note 7.
TXP, TXN
80
Ω
TX dc differential mode low impedance
0
0
MAX
50
100
120
NOTES: 4. No test load is necessarily associated with this value.
5. Specified at the measurement point into a timing and voltage compliance test load and measured over any 250 consecutive TX
UIs.
6. A TTX–EYE = 0.75 UI provides for a total sum of deterministic and random jitter budget of TTX–JITTER–MAX = 0.25 UI for the
transmitter collected over any 250 consecutive TX UIs. The TTX–EYE–MEDIAN–to–MAX–JITTER specification ensures a jitter
distribution in which the median and the maximum deviation from the median is less than half of the total TX jitter budget collected
over any 250 consecutive TX UIs. It must be noted that the median is not the same as the mean. The jitter median describes the
point in time where the number of jitter points on either side is approximately equal, as opposed to the averaged time value.
7. The transmitter input impedance results in a differential return loss greater than or equal to 12 dB and a common mode return
loss greater than or equal to 6 dB over a frequency range of 50 MHz to 1.25 GHz. This input impedance requirement applies to
all valid input levels. The reference impedance for return loss measurements is 50 Ω to ground for both the P and N lines. Note
that the use of the series capacitors CTX is optional for the return loss measurement.
8. Measured between 20% and 80% at transmitter package terminals into a test load for both VTXP and VTXN
14
SLLS690B
June 2006
Electrical Characteristics
PARAMETER
TERMINALS
MIN
ZTX–DC
Transmitter dc impedance
TXP, TXN
40
CTX
TXP, TXN
75
NOM
MAX
UNIT
200
COMMENTS
Ω
Required TXP as well as TXN dc impedance during all
states
nF
All transmitters are ac–coupled and are required on the
PWB.
AC coupling capacitor
NOTES: 4. No test load is necessarily associated with this value.
5. Specified at the measurement point into a timing and voltage compliance test load and measured over any 250 consecutive TX
UIs.
6. A TTX–EYE = 0.75 UI provides for a total sum of deterministic and random jitter budget of TTX–JITTER–MAX = 0.25 UI for the
transmitter collected over any 250 consecutive TX UIs. The TTX–EYE–MEDIAN–to–MAX–JITTER specification ensures a jitter
distribution in which the median and the maximum deviation from the median is less than half of the total TX jitter budget collected
over any 250 consecutive TX UIs. It must be noted that the median is not the same as the mean. The jitter median describes the
point in time where the number of jitter points on either side is approximately equal, as opposed to the averaged time value.
7. The transmitter input impedance results in a differential return loss greater than or equal to 12 dB and a common mode return
loss greater than or equal to 6 dB over a frequency range of 50 MHz to 1.25 GHz. This input impedance requirement applies to
all valid input levels. The reference impedance for return loss measurements is 50 Ω to ground for both the P and N lines. Note
that the use of the series capacitors CTX is optional for the return loss measurement.
8. Measured between 20% and 80% at transmitter package terminals into a test load for both VTXP and VTXN
3.4
PCI Express Differential Receiver Input Ranges
PARAMETER
UI
TERMINALS
RXP, RXN
MIN
NOM
MAX
399.88
400
400.12
UNIT
ps
Unit interval
COMMENTS
Each UI is 400 ps ±300 ppm. UI does not account
for SSC−dictated variations.
See Note 9.
VRX–DIFFp–p
Differential input peak–to–peak
voltage
RXP, RXN
0.175
TRX–EYE
Minimum receiver eye width
RXP, RXN
0.4
1.200
V
VRX–DIFFp–p = 2*|VRXP − VRXN|
See Note 10.
UI
The maximum interconnect media and transmitter
jitter that can be tolerated by the receiver is derived
as
TRX–MAX–JITTER = 1 − TRX–EYE = 0.6 UI.
See Notes 10 and 11.
NOTES: 9. No test load is necessarily associated with this value.
10. Specified at the measurement point and measured over any 250 consecutive UIs. A test load must be used as the RX device when
taking measurements. If the clocks to the RX and TX are not derived from the same reference clock, the TX UI recovered from
3500 consecutive UI is used as a reference for the eye diagram.
11. A TRX–EYE = 0.40 UI provides for a total sum of 0.60 UI deterministic and random jitter budget for the transmitter and interconnect
collected any 250 consecutive UIs. The TRX–EYE–MEDIAN–to–MAX–JITTER specification ensures a jitter distribution in which the
median and the maximum deviation from the median is less than half of the total UI jitter budget collected over any 250 consecutive
TX UIs. It must be noted that the median is not the same as the mean. The jitter median describes the point in time where the
number of jitter points on either side is approximately equal, as opposed to the averaged time value. If the clocks to the RX and
TX are not derived from the same reference clock, the TX UI recovered from 3500 consecutive UIs must be used as the reference
for the eye diagram.
12. The receiver input impedance results in a differential return loss greater than or equal to 15 dB with the P line biased to 300 mV
and the N line biased to −300 mV and a common mode return loss greater than or equal to 6 dB (no bias required) over a frequency
range of 50 MHz to 1.25 GHz. This input impedance requirement applies to all valid input levels. The reference impedance for
return loss measurements is 50 Ω to ground for both the P and N line (i.e., as measured by a Vector Network Analyzer with 50–Ω
probes). The use of the series capacitors CTX is optional for the return loss measurement.
13. Impedance during all link training status state machine (LTSSM) states. When transitioning from a PCI Express reset to the detect
state (the initial state of the LTSSM), there is a 5–ms transition time before receiver termination values must be met on the
unconfigured lane of a port.
14. The RX dc common mode impedance that exists when no power is present or PCI Express reset is asserted. This helps ensure
that the receiver detect circuit does not falsely assume a receiver is powered on when it is not. This term must be measured at
300 mV above the RX ground.
June 2006
SLLS690B
15
Electrical Characteristics
PARAMETER
TERMINALS
TRX–EYE–MEDIAN–to–MAX–JITTER
Maximum time between the
jitter median and maximum
deviation from the median
RXP, RXN
MIN
NOM
MAX
0.3
UNIT
COMMENTS
UI
Jitter is defined as the measurement variation of the
crossing points (VRX–DIFFp–p = 0 V) in relation to
recovered TX UI. A recovered TX UI is calculated
over 3500 consecutive UIs of sample data. Jitter is
measured using all edges of the 250 consecutive
UIs in the center of the 3500 UIs used for calculating
the TX UI.
See Notes 10 and 11.
VRX–CM–ACp
AC peak common mode input
voltage
RXP, RXN
RLRX–DIFF
Differential return loss
RXP, RXN
150
10
mV
VRX–CM–ACp = RMS(|VRXP +VRXN|/2 –VRX–CM–DC)
VRX–CM–DC = DC(avg) of |VRXP + VRXN|/2
See Note 10.
dB
Measured over 50 MHz to 1.25 GHz with the P and
N lines biased at +300 mV and −300 mV, respectively.
See Note 12.
RLRX–CM
Common mode return loss
RXP, RXN
6
dB
Measured over 50 MHz to 1.25 GHz with the P and
N lines biased at +300 mV and −300 mV, respectively.
See Note 12.
ZRX–DIFF–DC
DC differential input impedance
RXP, RXN
ZRX–DC
DC input impedance
RXP, RXN
80
100
120
Ω
RX dc differential mode impedance.
See Note 13.
40
50
60
Ω
Required RXP as well as RXN dc impedance (50 Ω
±20% tolerance).
See Notes 10 and 13.
ZRX–HIGH–IMP–DC
Powered−down dc input
impedance
RXP, RXN
200k
Ω
Required RXP as well as RXN dc impedance when
the receiver terminations do not have power.
See Note 14.
NOTES: 9. No test load is necessarily associated with this value.
10. Specified at the measurement point and measured over any 250 consecutive UIs. A test load must be used as the RX device when
taking measurements. If the clocks to the RX and TX are not derived from the same reference clock, the TX UI recovered from
3500 consecutive UI is used as a reference for the eye diagram.
11. A TRX–EYE = 0.40 UI provides for a total sum of 0.60 UI deterministic and random jitter budget for the transmitter and interconnect
collected any 250 consecutive UIs. The TRX–EYE–MEDIAN–to–MAX–JITTER specification ensures a jitter distribution in which the
median and the maximum deviation from the median is less than half of the total UI jitter budget collected over any 250 consecutive
TX UIs. It must be noted that the median is not the same as the mean. The jitter median describes the point in time where the
number of jitter points on either side is approximately equal, as opposed to the averaged time value. If the clocks to the RX and
TX are not derived from the same reference clock, the TX UI recovered from 3500 consecutive UIs must be used as the reference
for the eye diagram.
12. The receiver input impedance results in a differential return loss greater than or equal to 15 dB with the P line biased to 300 mV
and the N line biased to −300 mV and a common mode return loss greater than or equal to 6 dB (no bias required) over a frequency
range of 50 MHz to 1.25 GHz. This input impedance requirement applies to all valid input levels. The reference impedance for
return loss measurements is 50 Ω to ground for both the P and N line (i.e., as measured by a Vector Network Analyzer with 50–Ω
probes). The use of the series capacitors CTX is optional for the return loss measurement.
13. Impedance during all link training status state machine (LTSSM) states. When transitioning from a PCI Express reset to the detect
state (the initial state of the LTSSM), there is a 5–ms transition time before receiver termination values must be met on the
unconfigured lane of a port.
14. The RX dc common mode impedance that exists when no power is present or PCI Express reset is asserted. This helps ensure
that the receiver detect circuit does not falsely assume a receiver is powered on when it is not. This term must be measured at
300 mV above the RX ground.
16
SLLS690B
June 2006
Electrical Characteristics
PARAMETER
TERMINALS
VRX–IDLE–DET–DIFFp–p
Electrical idle detect threshold
RXP, RXN
TRX–IDLE–DET–DIFF–ENTER–TIME
Unexpected electrical idle enter
detect threshold integration
time
RXP, RXN
MIN
65
NOM
MAX
UNIT
COMMENTS
175
mV
VRX–IDLE–DET–DIFFp–p =2*|VRXP−VRXN| measured
at the receiver package terminals
10
ms
An unexpected electrical idle (VRX–DIFFp–p <
VRX–IDLE–DET–DIFFp–p) must be recognized no longer thanTRX–IDLE–DET–DIFF–ENTER–TIME tosignal an
unexpected idle condition.
NOTES: 9. No test load is necessarily associated with this value.
10. Specified at the measurement point and measured over any 250 consecutive UIs. A test load must be used as the RX device when
taking measurements. If the clocks to the RX and TX are not derived from the same reference clock, the TX UI recovered from
3500 consecutive UI is used as a reference for the eye diagram.
11. A TRX–EYE = 0.40 UI provides for a total sum of 0.60 UI deterministic and random jitter budget for the transmitter and interconnect
collected any 250 consecutive UIs. The TRX–EYE–MEDIAN–to–MAX–JITTER specification ensures a jitter distribution in which the
median and the maximum deviation from the median is less than half of the total UI jitter budget collected over any 250 consecutive
TX UIs. It must be noted that the median is not the same as the mean. The jitter median describes the point in time where the
number of jitter points on either side is approximately equal, as opposed to the averaged time value. If the clocks to the RX and
TX are not derived from the same reference clock, the TX UI recovered from 3500 consecutive UIs must be used as the reference
for the eye diagram.
12. The receiver input impedance results in a differential return loss greater than or equal to 15 dB with the P line biased to 300 mV
and the N line biased to −300 mV and a common mode return loss greater than or equal to 6 dB (no bias required) over a frequency
range of 50 MHz to 1.25 GHz. This input impedance requirement applies to all valid input levels. The reference impedance for
return loss measurements is 50 Ω to ground for both the P and N line (i.e., as measured by a Vector Network Analyzer with 50–Ω
probes). The use of the series capacitors CTX is optional for the return loss measurement.
13. Impedance during all link training status state machine (LTSSM) states. When transitioning from a PCI Express reset to the detect
state (the initial state of the LTSSM), there is a 5–ms transition time before receiver termination values must be met on the
unconfigured lane of a port.
14. The RX dc common mode impedance that exists when no power is present or PCI Express reset is asserted. This helps ensure
that the receiver detect circuit does not falsely assume a receiver is powered on when it is not. This term must be measured at
300 mV above the RX ground.
June 2006
SLLS690B
17
Electrical Characteristics
3.5
Express Differential Reference Clock Input Ranges
PARAMETER
TERMINALS
fIN–DIFF
Differential input frequency
REFCLK+
fIN–SE
Single–ended input
frequency
REFCLK+
VRX–DIFFp–p
Differential input
peak–to–peak voltage
REFCLK+
VIH–SE
MIN
NOM
MAX
UNIT
COMMENTS
100
MHz
The input frequency is 100 MHz + 300 ppm and
− 2800 ppm including SSC–dictated variations.
125
MHz
The input frequency is 125 MHz + 300 ppm and
− 300 ppm.
REFCLK−
0.175
1.200
V
VRX–DIFFp–p = 2*|VREFCLK+ − VREFCLK−|
REFCLK+
0.7VDD_33
VDD_33
V
Single–ended, reference clock mode high-level
input voltage
VIL–SE
REFCLK+
0
0.3VDD_33
V
Single–ended, reference clock mode low-level
input voltage
VRX–CM–ACp
AC peak common
mode input voltage
REFCLK+
Duty cycle
REFCLK+
ZRX–DIFF–DC
DC differential input
impedance
REFCLK+
ZRX–DC
DC input impedance
REFCLK+
REFCLK−
140
mV
REFCLK−
40%
60%
VRX–CM–ACp = RMS(|VREFCLK+ +VREFCLK−|/2 –
VRX–CM–DC)
VRX–CM–DC =DC(avg) of|VREFCLK++VREFCLK−|/2
Differential and single–ended waveform input duty
cycle
REFCLK−
20
kΩ
REFCLK+/− dc differential mode impedance
20
kΩ
REFCLK+ dc single–ended mode impedance
REFCLK−
REFCLK−
NOTE 15: The XIO1100 is compliant with the defined system jitter models for a PCI–Express reference clock and associated TX/RX link. These
system jitter models are described in the PCI–Express Jitter Modeling, Revision 1.0RD document. Any usage of the XIO1100 in a system
configuration that does not conform to the defined system jitter models requires the system designer to validate the system jitter budgets.
18
SLLS690B
June 2006
Electrical Characteristics
3.6
Electrical Characteristics Over Recommended Operating Conditions (VDD_IO)
PARAMETER
OPERATION
TEST
CONDITIONS
MIN
TYP
MAX
UNIT
VIH
High-level input voltage (Note 16)
VDD_IO
0.7 VDD_IO
VDD_IO
V
VIL
Low-level input voltage (Note 16)
VDD_IO
0
0.3 VDD_IO
V
VI
Input voltage
0
VDD_IO
V
VO
Output voltage (Note 17)
0
VDD_IO
V
tT
Input transition time (trise and tfall)
0
25
ns
VOH
High-level output voltage
VDD_IO
IOH = −8 mA
VOL
Low-level output voltage
VDD_IO
IOL = 8 mA
IOH
High−level output current
−8
mA
IOL
Low−level output current
8
mA
IOZ
High-impedance, output current
(Note 17)
VDD_IO
VI = 0 to VDD_IO
±20
µA
II
Input current (Note 18)
VDD_IO
VI = 0 to VDD_IO
±1
µA
0.8 VDD_IO
V
0.22VDD_IO
V
NOTES: 16. Applies to external inputs and bidirectional buffers.
17. Applies to external outputs and bidirectional buffers.
18. Applies to external input buffers.
3.7
Implementation−Specific Timing
NORM
MAX
Transmit
Latency
TIMING
Time for data moving between the parallel interface and the PCI Express serial lines. Timing is
measured from when the data is transferred across the parallel interface (i.e., the rising edge of
TX_CLK) and when the first bit of the equivalent 10−bit symbol is transmitted on the Tx+/Tx−
serial lines.
29.2 ns
33.2 ns
Receive
Latency
Time for data moving between the parallel interface and the PCI Express serial lines. Timing is
measured from when the first bit of a 10−bit symbol is available on the Rx+/Rx− serial lines to
when the corresponding 8−bit data is transferred across the parallel interface (i.e., the rising
edge of RX_CLK).
77.2 ns
93.2 ns
Loopback
Enable Latency
Amount of time that the XIO1100 requires to begin looping back receive data. Duration is from
when TxDetectRx/Loopback is asserted until the receive data is being transmitted on the serial
pins.
25.2 ns
29.2 ns
N_FTS with
Common Clock
Number of FTS ordered sets required by the receiver to obtain reliable bit and symbol lock when
operating with a common clock.
23
23
N_FTS without
Common Clock
Number of FTS ordered sets required by the receiver to obtain reliable bit and symbol lock when
operating without a common clock.
255
255
XIO1100 Lock
Time
Amount of time required for the XIO1100 receiver to obtain reliable bit and symbol lock after
valid TSx ordered−sets are present at the receiver.
2.0 µs
4.0 µs
P0s to P0
Transitioning
Time
Amount of time required for the XIO1100 to return to the P0 state after having been in the P0s
state. Time is measured from when the MAC sets the PowerDown signals to P0 until the
XIO1100 asserts PhyStatus. The XIO1100 asserts PhyStatus when it is ready to begin data
transmission and reception.
28.0 ns
32.0 ns
P1 to P0
Transitioning
Time
Amount of time required for the XIO1100 to return to the P0 state after having been in the P1
state. Time is measured from when the MAC sets the PowerDown signals to P0 until the
XIO1100 asserts PhyStatus. The XIO1100 asserts PhyStatus when it is ready to begin data
transmission and reception.
28.0 ns
32.0 ns
Reset to Ready
Time
Timed from when Reset# is de−asserted until the XIO1100 de−asserts PHY_STATUS.
10.0 ns
11.0 ns
June 2006
DESCRIPTION
SLLS690B
19
Timing Diagrams
4
Timing Diagrams
TI−PIPE Input Timing
tcyc
TX_CLK
TxData[7:0] (DDR mode)
TxDataK[0] (DDR mode)
tfsu
trsu
tfh
TxData[15:0] (SDR mode)
TxDataK[1:0] (SDR mode)
TxDetectRx/Loopback
TxElecIdle
TxCompliance
RxPolarity
PowerDown[1:0]
tfh
trsu
tfh
Figure 4−1. TI−PIPE Input Timing
20
PARAMETER
DESCRIPTION
VALUE
tcyc
Period, TX_CLK
8 ns (TYP)
trsu
Input Setup to TX_CLK rising
1.3 ns (MAX)
trh
Input Hold from TX_CLK rising
0.1 ns (MIN)
tfsu
Input Setup to TX_CLK falling
1.3 ns (MAX)
tfh
Input Hold from TX_CLK falling
0.1 ns (MIN)
SLLS690B
June 2006
Timing Diagrams
TI−PIPE Data Output Timing
tcyc
RX_CLK
RxData[7:0] (DDR mode)
RxDataK[0] (DDR mode)
trco
tfh
tfh
tfco
RxData[15:0] (SDR mode)
RxDataK[1:0] (SDR mode)
RxValid
PhyStatus
RxElecIdle
RxStatus[2:0]
trco
tfh
Figure 4−2. TI−PIPE Data Output Timing
PARAMETER
DESCRIPTION
VALUE
tcyc
Period, RX_CLK
8.0 ns (TYP)
trco
Clock to output, RX_CLK rising
2.0 ns (MAX)
trh
Output hold, RX_CLK rising
0.7 ns (MIN)
tfco
Clock to output, RX_CLK falling
2.0 ns (MAX)
tfh
Output hold, RX_CLK falling
0.7 ns (MIN)
June 2006
SLLS690B
21
Timing Diagrams
TI−PIPE Output Functional Timing
RX_CLK
RxData[7:0] (DDR mode)
RxDataK[0] (DDR mode)
RxData[15:0] (SDR mode)
RxDataK[1:0] (SDR mode)
SYMBOL (N)
SYMBOL (N+1)
RxData[7:0] − SYMBOL (N)
RxData[15:8] − SYMBOL (N+1)
RxValid
PhyStatus
RxElecIdle
RxStatus[2:0]
Figure 4−3. TI−PIPE Output Functional Timing
22
SLLS690B
June 2006
Timing Diagrams
TI−PIPE Input Functional Timing
TX_CLK
TxData[7:0] (DDR mode)
TxDataK[0] (DDR mode)
TxData[15:0] (SDR mode)
TxDataK[1:0] (SDR mode)
SYMBOL (N)
SYMBOL (N+1)
TxData[7:0] − SYMBOL (N)
TxData[15:8] − SYMBOL (N+1)
TxDetectRx/Loopback
TxElecIdle
TxCompliance
RxPolarity
PowerDown[1:0]
Figure 4−4. TI−PIPE Input Functional Timing
June 2006
SLLS690B
23
Application Information
5
Application Information
5.1
Component Connection
Details regarding connection of components to the various terminals of the XIO1100 are discussed primarily
in entries for each terminal in the terminal functions table.
K13
RESETN
P1_SLEEP
POWERDOWN0
POWERDOWN1
DDR_EN
N11
M10
M9
L9
L10
M8
TX_CLK
N6
M6
N5
M5
N4
M4
M3
N3
L1
K1
K2
J1
J2
H1
H2
G2
TX_DATA0
TX_DATA1
TX_DATA2
TX_DATA3
TX_DATA4
TX_DATA5
TX_DATA6
TX_DATA7
TX_DATA8
TX_DATA9
TX_DATA10
TX_DATA11
TX_DATA12
TX_DATA13
TX_DATA14
TX_DATA15
TX_DATAK0
TX_DATAK1
TXCOMPLIANCE
TXDETECTRX
TXELECIDLE
RX_POLARITY
N7
M7
N8
L5
N9
C6
L7
K3
F3
C5
VDD_IO
VDD_IO
VDD_IO
VDD_IO
L4
C7
F11
E13
H13
H12
E11
R0
RX_CLK
R1
RESETN
P1_SLEEP
POWERDOWN0
POWERDOWN1
DDR_EN (1=8bit 0=16bit)
TX_CLK
TX_DATA0
TX_DATA1
TX_DATA2
TX_DATA3
TX_DATA4
TX_DATA5
TX_DATA6
TX_DATA7
TX_DATA8
TX_DATA9
TX_DATA10
TX_DATA11
TX_DATA12
TX_DATA13
TX_DATA14
TX_DATA15
OUTPUTS
K12
8.66K (1%)
RX_STATUS0
RX_STATUS1
RX_STATUS2
RX_VALID
RX_ELECIDLE
PHYSTATUS
TX_DATAK0
TX_DATAK1
TXCOMPLIANCE
TXDETECTRX / LOOPBACK
TXELECIDLE
RX_POLARITY
XIO1100GGB
RX_DATA0
RX_DATA1
RX_DATA2
RX_DATA3
RX_DATA4
RX_DATA5
RX_DATA6
RX_DATA7
RX_DATA8
RX_DATA9
RX_DATA10
RX_DATA11
RX_DATA12
RX_DATA13
RX_DATA14
RX_DATA15
RX_DATAK0
RX_DATAK1
VREG_PD
5.90K (1%)
R2
RSVD
RSVD
RSVD
RSVD
RSVD
C2
0.01uF
C3
1000pF
L13
C4
1uF
C5
0.01uF
C6
1000pF
C7
1uF
C8
0.01uF
C9
1000pF
L12
B8
F1
F2
E1
E2
D1
D2
C2
C1
A3
A4
B4
A5
B5
A6
B6
A7
A8
B7
E3
G1
G3
H3
B3
N10
RX_CLK
RX_DATA0
RX_DATA1
RX_DATA2
RX_DATA3
RX_DATA4
RX_DATA5
RX_DATA6
RX_DATA7
RX_DATA8
RX_DATA9
RX_DATA10
RX_DATA11
RX_DATA12
RX_DATA13
RX_DATA14
RX_DATA15
RX_DATAK0
RX_DATAK1
RX_STATUS0
RX_STATUS1
RX_STATUS2
RX_VALID
RX_ELECIDLE
PHYSTATUS
A9
B10
A10
B9
C9
M11
R1
VDD_33_COM_IO
C1
1uF
H11
CLK_SEL (0=100MHz Diff 1=125MHz Single)
VSSA
VSSA
VSSA
VSSA
VSSA
VSSA
VSSA
CLK_SEL
VDD_33_COMB
VDD_15_COMB
C10
D12
D13
E12
F13
G11
K11
L6
REFCLKN
REFCLKP
VDD_15_CORE
VDD_15_CORE
VDD_15
VDD_15
A11
B11
REFCLKN
REFCLKP
RXN
RXP
1.5V_1.8VD
INPUTS
RXN
RXP
TXN
TXP
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
C12
C13
1.5VD
C4
C8
D3
F12
J11
J3
L2
L8
G13
G12
TXP
VDDA_15
VDDA_15
VDDA_15
U1
1.5VA
VDDA_33
VDDA_33
VDDA_33
TXN
J13
D11
J12
3.3VA
Figure 5−1. External Component Connections
Figure 5−1 does not show the decoupling capacitors for the power supplies. Texas Instruments recommends
using at least one 0.1 µF capacitor for each power supply pin. In addition to the 0.1 µF capacitor, Texas
Instruments recommends adding 0.01 µF and 0.001 µF capacitors for each analog power supply pin. Texas
Instruments also recommends isolating the analog power from the digital power.
24
SLLS690B
June 2006
Application Information
5.2
XIO1100 Component Placement
The filter network on VDD_33_COMB, VDD_33_COMB_IO, and VDD_15_COMB needs to be placed as
close as possible to each pin (specifically H11, L13, and L12). It is recommended that the trace width for these
three pins be at least 10 mils.
The R0 and R1 terminals connect to an external resistor to set the drive current for the PCI Express TX driver.
The recommended resistor value is 14,560-Ω with 1% tolerance. A 14,560-Ω resistor is a custom value. To
eliminate the need for a custom resistor, two series resistors are recommended: a 5,900-Ω 1% resistor and
an 8,660-Ω 1% resistor. Trace lengths must be kept short to minimize noise coupling into the reference resistor
terminals.
5.3
Power Supply Filtering Recommendations
To meet the PCI Express jitter specifications, low-noise power supplies are required on several of the XIO1100
voltage terminals. The power terminals that require low-noise power include VDDA_15 and VDDA_33. This
section provides guidelines for the filter design to create low-noise power sources.
The least expensive solution for low-noise power sources is to filter existing 3.3 V and 1.5 V power supplies.
This solution requires analysis of the noise frequencies present on the power supplies. The XIO1100 has
external interfaces operating at clock rates of 100 MHz, 125 MHz, 250 MHz, and 2.5 GHz. Other devices
located near the XIO1100 may produce switching noise at different frequencies. Also, the power supplies that
generate the 3.3 V and 1.5 V power rails may add low frequency ripple noise. Linear regulators have feedback
loops that typically operate in the 100 kHz range. Switching power supplies typically have operating
frequencies in the 500 kHz range. When analyzing power supply noise frequencies, the first, third, and fifth
harmonic of every clock source should be considered.
Critical analog circuits within the XIO1100 must be shielded from this power-supply noise. The fundamental
requirement for a filter design is to reduce power-supply noise to a peak-to-peak amplitude of less than 25 mV.
This maximum noise amplitude should apply to all frequencies from 0 Hz to 12.5 GHz.
The following information should be considered when designing a power supply filter:
1. Ideally, the series resonance frequency for each filter component should be greater than the fifth harmonic
of the maximum clock frequency. With a maximum clock frequency of 1.25 GHz, the third harmonic is
3.75 GHz and the fifth harmonic is 6.25 GHz. Finding inductors and capacitors with a series resonance
frequency above 6.25 GHz is both difficult and expensive. Components with a series resonance frequency
in the 4 to 6 GHz range are a good compromise.
2. The inductor(s) associated with the filter must have a dc resistance low enough to pass the required
current for the connected power terminals. The voltage drop across the inductor must be low enough to
meet the minus 10% voltage margin requirement associated with each XIO1100 power terminal. Power
supply output voltage variation must be considered, as well as voltage drops associated with any
connector pins and circuit board power distribution geometries.
3. The Q versus frequency curve associated with the inductor must be appropriate to reduce power terminal
noise to less than the maximum peak−to−peak amplitude requirement for the XIO1100. Recommending
a specific inductor is difficult, because every system design is different and therefore the noise frequencies
and noise amplitudes are different. Many factors influence the inductor selection for the filter design.
Power supplies must have adequate input and output filtering. A sufficient number of bulk and bypass
capacitors is required to minimize switching noise. Assuming that board level power is properly filtered
and minimal low frequency noise is present, frequencies less than 10 MHz, an inductor with a Q greater
than 20 from approximately 10 MHz to 3 GHz should be adequate for most system applications.
4. The series component(s) in the filter may either be an inductor or a ferrite bead. Testing has been
performed on both component types. When measuring PCI Express link jitter, the inductor or ferrite bead
solutions produce equal results. When measuring circuit board EMI, the ferrite bead is a superior solution.
June 2006
SLLS690B
25
Application Information
5. When designing filters associated with power distribution, the power supply is a low-impedance source,
and the device power terminals are a low-impedance load. The best filter for this application is a T filter.
See Figure 5−2 for a T filter circuit. Some systems may require this type of filter design if the power
supplies or nearby components are exceptionally noisy. This type of filter design is recommended if a
significant amount of low frequency noise (frequencies less than 10 MHz) is present in a system.
6. For most applications a Pi filter is adequate. See Figure 5−2 for a Pi filter circuit. When implementing a
Pi filter, the two capacitors and the inductor must be located next to each other on the circuit board and
must be connected together with wide, low impedance traces. Capacitor ground connections must be
short and low-impedance.
7. If a significant amount of high frequency noise (frequencies greater than 300 MHz) is present in a system,
creating an internal circuit board capacitor helps reduce this noise. This capacitor is accomplished by
locating power and ground planes next to each other in the circuit board stack-up. A gap of 0.003 mils
between the power and ground planes significantly reduces this high frequency noise.
8. Another option for filtering high-frequency logic noise is to create an internal board capacitor using signal
layer copper plates. When a component requires a low-noise power supply, usually the Pi filter is located
near the component. A plate capacitor may be created directly under the Pi filter. In the circuit board
stack-up, select a signal layer that is physically located next to a ground plane. Then, generate an internal
0.25 inch by 0.25 inch plate on that signal layer. Assuming a 0.006 mil gap between the signal layer plate
and the internal ground plane, this arrangement generates a 12 pF capacitor. By connecting this plate
capacitor to the trace between the Pi filter and the component’s power terminals, an internal circuit board
high frequency bypass capacitor is created. This solution is extremely effective for switching frequencies
above 300 MHz.
Figure 5−2 illustrates two different filter designs that may be used with the XIO1100 to provide low-noise power
to critical power terminals.
POWER SUPPLY
SIDE
COMPONENT
SIDE
Pi FILTER DESIGN
POWER SUPPLY
SIDE
COMPONENT
SIDE
T FILTER DESIGN
Figure 5−2. Filter Designs
26
SLLS690B
June 2006
Application Information
5.4
PCIe Layout Guidelines
The XIO1100 TXP and TXN terminals comprise a low-voltage, 100-Ω differentially driven signal pair. The RXP
and RXN terminals for the XIO1100 receive a low-voltage, 100-Ω differentially driven signal pair. The XIO1100
has integrated 50-Ω termination resistors to VSS on both the RXP and RXN terminals, eliminating the need
for external components.
Each lane of the differential signal pair must be ac-coupled. The recommended value for the series capacitor
is 0.1 µF. To minimize stray capacitance associated with the series capacitor circuit board solder pads,
0402-sized capacitors are recommended.
When routing a 2.5-Gb/s low-voltage, 100-Ω differentially driven signal pair, the following circuit board design
guidelines must be considered:
1. The PCI Express drivers and receivers are designed to operate with adequate bit error rate margins over
a 20” maximum length signal pair routed through FR4 circuit board material.
2. Each differential signal pair must be 100-Ω differential impedance with each single-ended lane measuring
in the range of 50-Ω to 55-Ω impedance to ground.
3. The differential signal trace lengths associated with a PCI Express high-speed link must be length
matched to minimize signal jitter. This length-matching requirement applies only to the P and N signals
within a differential pair. The transmitter differential pair does not need to be length matched to the receiver
differential pair. The absolute maximum trace length difference between the TXP signal and TXN signal
must be less than 5 mils. This value also applies to the RXP and RXN signal pair.
4. If a differential signal pair is broken into segments by vias, series capacitors, or connectors, the length
of the positive signal trace must be length matched to the negative signal trace for each segment. Trace
length differences over all segments are additive and must be less than 5 mils.
5. The location of the series capacitors is critical. For add-in cards, the series capacitors are located between
the TXP/TXN terminals and the PCI Express connector. In addition, the capacitors are placed near the
PCI Express connector. This translates to two capacitors on the motherboard for the downstream link,
and two capacitors on the add-in card for the upstream link. If both the upstream device and the
downstream device reside on the same circuit board, the capacitors are located near the TXP/TXN
terminals for each link.
6. The number of vias must be minimized. Each signal trace via reduces the maximum trace length by
approximately 2 inches. For example: if 6 vias are needed, the maximum trace length is 8 inches.
7. When routing a differential signal pair, 45-degree angles are preferred over 90-degree angles. Signal
trace length matching is easier with 45-degree angles, and overall signal trace length is reduced.
8. The differential signal pairs must not be routed over gaps in the power planes or ground planes. This
causes impedance mismatches.
9. If vias are used to change from one signal layer to another signal layer, it is important to maintain the same
50-Ω impedance reference to the ground plane. Changing reference planes causes signal trace
impedance mismatches. If changing reference planes cannot be prevented, bypass capacitors
connecting the two reference planes next to the signal trace vias help reduce the impedance mismatch.
If possible, the differential signal pairs must be routed on the top and bottom layers of a circuit board. Signal
propagation speeds are faster on external signal layers.
The XIO1100 supports two options for the PCI Express reference clock: a 100-MHz common differential
reference clock or a 125-MHz asynchronous single-ended reference clock. Both implementations are
described.
The first option is a system-wide 100-MHz differential reference clock. A single clock source with multiple
differential clock outputs is connected to all PCI Express devices in the system. The differential connection
between the clock source and each PCI Express device is point−to−point. This system implementation is
referred to as a common clock design.
June 2006
SLLS690B
27
Application Information
The XIO1100 is optimized for this type of system clock design. The REFCLK+ and REFCLK− terminals provide
differential reference clock inputs to the XIO1100. The circuit board routing rules associated with the 100-MHz
differential reference clock are the same as the 2.5-Gb/s TX and RX link routing rules already described. The
only difference is that the differential reference clock does not require series capacitors. The requirement is
a dc connection from the clock driver output to the XIO1100 receiver input.
Terminating the differential clock signal is circuit−board−design specific. However, the XIO1100 design has
no internal 50-Ω−to−ground termination resistors. Both REFCLK inputs, which are at approximately 20 kΩ to
ground, are high−impedance inputs.
The second option is a 125-MHz asynchronous single-ended reference clock. For this case, the devices at
each end of the PCI Express link have different clock sources. The XIO1100 has a 125-MHz single-ended
reference clock option for asynchronous clocking designs. When the CLK_SEL input terminal is tied to VSS,
this clocking mode is enabled.
The single-ended reference clock is attached to the REFCLK+ terminal. The REFCLK+ input, which is at
approximately 20 kΩ, is a high-impedance input. Any clock termination design must account for a
high-impedance input. The REFCLK− terminal needs to be attached to VSS.
5.5
PIPE Interface Layout Guidelines
The XIO1100 PIPE interface can operate at either 125 MHz or 250 MHz, depending on the state of the
DDR_EN pin. Due to the high frequencies, high-speed design techniques should be employed. When routing
the PIPE interface, the following circuit board design guidelines must be considered:
1. Due to the synchronous clock design of the XIO1100, the TX_DATA path and the RX_DATA path do not
require a matched length with respect to each other.
2. The TX_DATA path signals should be length matched to each other. The tolerance is dependent on the
setup/hold times for both the FPGA or ASIC and the XIO1100.
3. The RX_DATA path signals should be length matched to each other. The tolerance is dependent on the
setup/hold times for both the FPGA or ASIC and the XIO1100.
4. Because of the edge rates of the PIPE interface (0.9 ns rise and fall time at a 10 pF load), it is important
to keep the traces as short as possible. It is recommended to keep the trace length below 2.5 inches
(assuming FR4 and a velocity of 172 ps per inch) to reduce the effect of crosstalk. Obviously, increasing
the edge-to-edge spacing of the traces also reduces the effect of crosstalk.
5. In cases where the trace length is long and/or goes through a connector, it is recommended to use series
termination resistors on each PIPE signal. These resistors need to be placed as close as possible to the
source (resistors for the RX_DATA path next to the XIO1100 and resistors for the TX_DATA path next to
the FPGA or ASIC). The value of the series termination resistor depends on the impedance (Zo) of the
trace. Normally, the value of this resistor is Zo minus the output impedance of the driver. For the XIO1100,
the output impedance of the RX_DATA path is 25-Ω (typ).
It is recommended to model your design before going to fabrication. An I/O Buffer Information Specification
(IBIS) model of the XIO1100 is available upon request.
28
SLLS690B
June 2006
Mechanical Data
6
Mechanical Data
June 2006
SLLS690B
29
PACKAGE OPTION ADDENDUM
www.ti.com
5-Feb-2007
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
XIO1100GGB
ACTIVE
BGA
GGB
100
160
TBD
SNPB
Level-3-220C-168 HR
XIO1100ZGB
ACTIVE
BGA
ZGB
100
160
Green (RoHS &
no Sb/Br)
SNAGCU
Level-3-260C-168 HR
Lead/Ball Finish
MSL Peak Temp (3)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 1