TI TPS60251RTW

TPS60251
www.ti.com
SLVS767 – APRIL 2007
HIGH EFFICIENCY CHARGE PUMP FOR 7 WLEDs WITH I2C INTERFACE
FEATURES
APPLICATIONS
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3.0-V to 6.0-V Input Voltage Range
×1 and ×1.5 Charge Pump
Fully Programmable Current with I2C
– 64 Dimming Steps with 25mA Maximum
(Sub and Main Display Banks)
– 4 Dimming Steps with 80mA Maximum
(DM5 for Auxiliary Application)
2% Current Matching for Sub LEDs at Light
Load Condition (Each 100µA)
750-kHz Charge Pump Frequency
Continuous 230-mA Maximum Output Current
Auto Switching Between ×1 and ×1.5 Mode for
Maximum Efficiency
Built-in Soft Start and Current Limit
Hardware Enable/Disable
Open Lamp Detection
24-Pin 4mm x 4mm QFN
Cellular Phones
PDA, PMP, GPS (Up To 4 Inch Display)
Multidisplay Handheld Devices
DESCRIPTION
The TPS60251 is a high efficiency, constant
frequency charge pump DC/DC converter that uses a
dual mode 1× and 1.5× conversion to maximize
efficiency over the input voltage range. It drives up to
five white LEDs for a main display and up to two
white LEDs for a sub display with regulated constant
current for uniform intensity. By utilizing adaptive
1×/1.5× charge pump modes and very low-dropout
current regulators, the TPS60251 achieves high
efficiency over the full 1-cell lithium-battery input
voltage range.
Four enable inputs, ENmain, ENsub1, ENsub2, and
ENaux, available through I2C, are used for simple
on/off controls for the main, sub1, sub2, and DM5
displays, respectively. To lower operating current
when using one sub display LED, the device
provides independent operation in sub display LEDs.
The TPS60251 is available in a 24-pin 4mmx4mm
thin QFN.
Main Display
95
90
85
IS
DM4 DM3 DM 2 DM1
NC
NC-G
C 2+
C2
1uF
C3
1uF
C2-
GND
C 1+
GND
VOUT
C4
4.7uF
VIN
C1
1uF
Efficiency - %
GND
C 1-
SDAT ENA
NC
Auxiliary Port for Key Pad
or Flash Light
VIO
DS 1 DS 2 DM5
75
70
65
60
SCLK
55
1.8V for I /O
Input
2
80
4 Main LED - 15 mA, VF = 3.1 V
50
I C Interface
3
Sub Display
3.5
4
4.5
5
5.5
6
VI - Input Voltage - V
Figure 1. Typical Application for Sub and Main
Figure 2. Efficiency vs Input Voltage
ORDERING INFORMATION (1)
(1)
PART NUMBER
PACKAGE
TA
TPS60251RTW
24 Pin 4 mm × 4 mm QFN (RTW)
–40°C to +85°C
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2007, Texas Instruments Incorporated
TPS60251
www.ti.com
SLVS767 – APRIL 2007
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range (unless otherwise noted) (1)
VI
VALUE
UNIT
–0.3 to 7
V
650
mA
2
kV
CDM ESD Rating (3)
500
V
MM ESD Rating (4)
200
V
–40 to 85
°C
150
°C
–55 to 150
°C
Input voltage range (all pins)
MAX Output current limit
HBM ESD Rating
(2)
TA
Operating temperature range
TJ
Maximum operating junction temperature
TST
Storage temperature
(1)
(2)
(3)
(4)
Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
The Human body model (HBM) is a 100-pF capacitor discharged through a 1.5-kΩ resistor into each pin. The testing is done according
JEDECs EIA/JESD22-A114.
Charged Device Model
Machine Model (MM) is a 200-pF capacitor discharged through a 500-nH inductor with no series resistor into each pin. The testing is
done according JEDECs EIA/JESD22-A115.
DISSIPATION RATINGS
PACKAGE
THERMAL
RESISTANCE, RθJC
THERMAL
RESISTANCE, RθJA
TA ≤ 25°C POWER
RATING
DERATING FACTOR
ABOVE TA = 25°C
TA = 85°C POWER
RATING
QFN 4×4 RTW
57.9°C/W
37.8°C/W
2.646 W
1.455 W
1.058 W
RECOMMENDED OPERATING CONDITIONS
MIN
NOM
3.0
MAX
6.0
UNIT
VI
Input voltage range
V
IO(max)
Maximum output current
230
mA
CI
Input capacitor
1.0
µF
CO
Output capacitor
4.7
µF
C1, C2
Flying capacitor
TA
Operating ambient temperature
–40
85
TJ
Operating junction temperature
–40
125
°C
CIS(MAX)
Maximum capacitance on IS pin
100
pF
µF
1.0
°C
ELECTRICAL CHARACTERISTICS
VI = 3.5 V, TA = –40°C to 85°C, RIS = 562 kΩ, typical values are at TA = 25°C (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
SUPPLY VOLTAGE
VI
3.0
750-kHz Switching in 1.5× Mode
(IMAIN_LED = 15 mA × 4, IO = 60 mA)
6.0
V
6.7
mA
IQ
Operating quiescent current
No switching in ×1 mode (IO = 100 µA)
68
µA
ISD
Shutdown current
Enable Control Register has 0x00
1.3
µA
VUVLO1
UVLO Threshold voltage1 (1)
VI falling
2.6
V
(1)
2
Input voltage range
Shut down charge pump and power stage and keep I2C content
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ELECTRICAL CHARACTERISTICS (continued)
VI = 3.5 V, TA = –40°C to 85°C, RIS = 562 kΩ, typical values are at TA = 25°C (unless otherwise noted)
PARAMETER
TEST CONDITIONS
VUVLO2
UVLO Threshold voltage2 (2)
VI falling
Vhys
Under-voltage lockout hysterisis
UVLO1
VENA_H
Enable high threshold voltage
VENA_L
Enable low threshold voltage
Soft start time (3)
TS
MIN
TYP
MAX
1.2
1.3
1.5
210
1.5
VI = 3 V, CO = 1 µF,
IMAIN_LED = 15 mA × 4
UNIT
V
mV
VI
V
0.4
V
0.5
ms
CHARGE PUMP
Vout
Overvoltage limit
6.5
V
Fs
Switching frequency
750
kHz
RO
Open loop output impedance
×1 Mode, (VI– VO)/IO
1.2
× 1.5 Mode, (VI× 1.5 – VO)/IO VI = 3.0V (IO =
120mA)
3.5
5.0
0
±2%
±1%
±5%
Ω
CURRENT SINK
ISUB_LED = 100 µA × 2, VDXX = 0.4 V
Km_sub
Current matching of sub LEDs at light
load condition (4)
Km_main
LED to LED Current matching (5)
IMAIN_LED = 15 mA × 4,
3.0 V ≤ VI ≤ 4.2 V
Ka
Current accuracy
ILED = 15 mA
ID_MS
Maximum LED current of DM1-4 and
DS1-2
Main and Sub Display Current Register =
0×01&2(111111),
VDXX = 0.2 V
ID_DM5
Maximum LED current of DM5
Aux Display Current Register = 0×03
(XXXX11), VDM5 = 0.4 V
VIS
IS Pin voltage
3.0V ≤ VI≤ 6.0V
Output current to current set ratio sub
LEDs
Isub
±6%
1.229
25.5
mA
80
mA
1.254
ILED = 100 µA (6)
44.8
ILED = 15 mA(6)
6722
µA(6)
44.8
Imain
Output current to current set ratio main
LEDs
ILED = 100
ILED = 15 mA(6)
6722
IDM5
Output current to current set ratio DM5
ILED = 80 mA(6)
35853
VDropOut
LED Drop out voltage
See
VTH_GU
1× Mode to 1.5× mode transition
threshold voltage (8)
VDXX Falling, 15 mA × 4 measured on the
lowest VDXX
VTH_GD
Input voltage hysteresis for 1.5× to 1×
mode transition
Measured as VI– (VO– VDXX_MIN), IMAIN_LED = 15
mA × 4
(7)
85
1.279
V
80
120
mV
100
120
mV
470
mV
SERIAL INTERFACE TIMING REQUIREMENTS
fmax
Clock frequency
twH(HIGH)
Pulse duration, clock high time
600
twL(LOW)
Pulse duration, clock low time
1300
tr
DATA and CLK rise time
300
ns
tf
DATA and CLK fall time
300
ns
th(STA)
High time (repeated) START
condition(after this period the first clock
pulse is generated)
600
ns
tsu(STA)
Setup time for repeated START
condition
600
ns
th(DATA)
Data input hold time
0
ns
(2)
(3)
(4)
(5)
(6)
(7)
(8)
400
kHz
ns
ns
Shut down completely and come up with all 0's after device restart
Measurement Condition: From enabling the LED driver to 90% output voltage after VI is already up.
LED current matching is defined as: (ISUB_LED_WORST – IAVG_SUB) / IAVG_SUB
LED to LED Current Matching is defined as: (IMAIN_LED_WORST – IAVG_MAIN) / IAVG_MAIN
See the Setting the LED Current section of the data sheet for details on calculating LED current given by dimming step and RIS.
Dropout Voltage is defined as VDXX (WLED Cathode) to GND voltage at which current into the LED drops 10% from the LED current at
VDXX = 0.2 V, WLED current = 15 mA × 4.
As VI drops, VDXX eventually falls below the switchover threshold of 100mV, and TPS60251 switches to 1.5× mode. See the Operating
Principle section for details about the mode transition thresholds.
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ELECTRICAL CHARACTERISTICS (continued)
VI = 3.5 V, TA = –40°C to 85°C, RIS = 562 kΩ, typical values are at TA = 25°C (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
tsu(DATA)
Data input setup time
100
ns
tsu(STO)
STOP condition setup time
600
ns
t(BUF)
Bus free time
1300
ns
I2C
COMPATIBLE INTERFACE VOLTAGE SPECIFICATION (SCLK, SDAT, VIO)
VIO
Serial bus voltage level
1.8
4.5
V
VIL
Low-leveI input voltage
3.0V ≤ VI ≤ 6.0V
0
0.45×VIO
V
VIH
High-level input voltage
3.0V ≤ VI ≤ 6.0V
0.87×VIO
VOL
Low-level output voltage
ILOAD = 2 mA
V
0.4
V
PIN ASSIGNMENTS
QFN 24-PIN RTW
4mm x 4mm
(TOP VIEW)
GND
IS DM4 DM3 DM 2 DM1
C1-
18
19
17
C2+
13
12
NC
20
11
NC
C2-
21
10
GND
C1+
22
9
GND
VOUT
23
8
NC
VIN
24
7
VIO
1
2
16
3
15
4
14
5
6
SCLK SDAT ENA DS1 DS2 DM5
TERMINAL FUNCTIONS
TERMINAL
4
I/O
DESCRIPTION
NAME
NO.
SCLK
1
I
I2C Interface
SDAT
2
I/O
I2C Interface
ENA
3
I
DS1
4
I
DS2
5
I
DM5
6
I
Current sink input. Connect the cathode of the aux display or the 5th main display white LED to this pin.
VIO
7
I
I/O Voltage input (1.8V). Connect an input voltage supply of 1.8V to VIN to set the logic levels for the I2C
interface.
NC
8, 11, 12
–
No connection
GND
9, 10, 18
–
Ground
DM1
13
I
DM2
14
I
DM3
15
I
DM4
16
I
Hardware enable/disable pin. Connect this pin high to enable the device. Connect this pin low to disable
the device. Do not leave this pin unconnected.
Current sink input. Connect the cathode of one of the sub display white LEDs to this pin.
Current sink input. Connect the cathode of one of the main display white LED to this pin.
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TERMINAL FUNCTIONS (continued)
TERMINAL
NAME
NO.
I/O
DESCRIPTION
IS
17
I
Maximum LED current setting input. Connect a resistor (RIS) between this pin and GND to set the
full-scale white LED current for sub (DS1, DS2), main (DM1, DM2, DM3, DM4), and DM5 LEDs. See the
Setting the LED Current section for details on selecting the correct value for RIS.
C1–
19
–
Connect to the flying capacitor C1
C2+
20
–
Connect to the flying capacitor C2
C2–
21
–
Connect to the flying capacitor C2
C1+
22
–
Connect to the flying capacitor C1
VOUT
23
O
Connect the anodes of the sub, main, and aux display white LEDs to this pin. Bypass VOUT to GND with
a 4.7-µF or greater ceramic capacitor.
VIN
24
I
Supply voltage input. Connect to a 3-V to 6-V input supply source. Bypass VIN to GND with a 1-µF or
greater ceramic capacitor.
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FUNCTIONAL BLOCK DIAGRAM
VIN
24
C 1+
C2 -
C 2 + C1 -
22
21
20
VOUT
DM4
DM3
DM2
DM1
23
16
15
14
13
19
1X, 1.5X CHARGE PUMP
GEAR
CONTROL
&
OPEN LAMP
DETECTION
2
I C
INTERFACE
ENold
5
DS2
4
DS1
6
DM5
9
GND
10
GND
18
GND
ENmain
Main Dimming
6
ENsub1
ENsub 2
Sub Dimming
SCLK
1
ENaux
AUX Dimming
SDAT
6
6
2
BIAS, TEST, & MONITORING
3
7
17
ENA
VIO
IS
TYPICAL CHARACTERISTICS
TABLE OF GRAPHS
DESCRIPTION
Efficiency
Output Impedance of ×1
and ×1.5 Mode
6
REF
Efficiency vs Input Voltage, 4 Main LED - 15mA, 25mA
Figure 3
Efficiency vs Input Voltage, 2 Sub LED with Light Load Condition, ×1 Mode Operation
Figure 4
Switch Resistance vs Free-Air Temperature, ×1 Mode, ILED = 230 mA
Figure 5
Switch Resistance vs Free-Air Temperature, ×1 Mode, ILED = 100 mA
Figure 6
Switch Resistance vs Free-Air Temperature, ×1.5 Mode Charge Pump Open-Loop , ILED = 230 mA
Figure 7
Switch Resistance vs Free-Air Temperature, ×1.5 Mode Charge Pump Open-Loop, ILED = 100 mA
Figure 8
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TYPICAL CHARACTERISTICS (continued)
DESCRIPTION
REF
Shutdown Current
Shutdown Current vs Input Voltage
Figure 9
Input Current
Input Current vs Supply Voltage, 4 Main LED
Figure 10
DM5 with Maximum 80
mA
DM5 Current vs Input Voltage, Programmed with 80 mA
Figure 11
Current Accuracy
WLED Current vs Input Voltage, 4 Main LED with 15 mA
Figure 12
EFFICIENCY
vs
INPUT VOLTAGE
(2 Sub LED with Light Load Condition,
× 1 Mode Operation)
EFFICIENCY
vs
INPUT VOLTAGE
(4 Main LED - 15mA, 25mA)
100
90
25 mA, VF = 3.79 V
80
1 mA, VF = 2.8 V
Efficiency - %
Efficiency - %
80
70
60
0.5 mA, VF = 2.7 V
60
0.2 mA, VF = 2.6 V
40
15 mA, VF = 3.43 V
50
20
3
4
5
6
VI - Input Voltage - V
3
5
VI - Input Voltage - V
Figure 3.
Figure 4.
SWITCH RESISTANCE
vs
FREE-AIR TEMPERATURE
(×1 Mode)
SWITCH RESISTANCE
vs
FREE-AIR TEMPERATURE
(×1 Mode)
4
6
1.15
1.10
1.10
ILED = 230 mA
ILED = 100 mA
VI = 3.3 V
1.05
VI = 3.3 V
Switch Resistance - W
Switch Resistance - W
1.05
1
VI = 3.6 V
0.95
0.90
VI = 3.9 V
0.85
1
VI = 3.6 V
0.95
0.90
0.85
0.80
VI = 3.9 V
0.80
0.75
0.75
0.70
0.70
-40
-20
0
20
40
60
80
0.65
-40
TA - Free-Air Temperature - °C
Figure 5.
-20
0
20
40
TA - Free-Air Temperature - °C
60
80
Figure 6.
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SWITCH RESISTANCE
vs
FREE-AIR TEMPERATURE
(×1.5 Mode Charge Pump Open-Loop)
SWITCH RESISTANCE
vs
FREE-AIR TEMPERATURE
(×1.5 Mode Charge Pump Open-Loop)
3.8
3.8
ILED = 230 mA
ILED = 100 mA
3.6
Switch Resistance - W
Switch Resistance - W
3.6
VI = 3 V
3.4
3.2
3
3.4
VI = 3 V
3.2
3
2.8
2.8
-40
-20
40
20
TA - Free-Air Temperature - °C
0
60
2.6
-40
80
-20
0
20
40
60
80
TA - Free-Air Temperature - °C
Figure 7.
Figure 8.
SHUTDOWN CURRENT
vs
INPUT VOLTAGE
INPUT CURRENT
vs
SUPPLY VOLTAGE
(4 Main LED)
10
0.16
0.15
ICC - Input Current - A
Shutdown Current - mA
8
6
4
TA = 85°C
TA = 25°C
TA = -40°C
2
0.14
0.13
0.12
0.11
25 mA
0.10
0.09
0.08
0.07
0.06
15 mA
0.05
0.04
0.03
0.02
2 mA
0.01
0
3
5
4
6
3
Figure 9.
8
4
5
VI - Input Voltage - V
VI - Input Voltage - V
Figure 10.
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DM5 CURRENT
vs
INPUT VOLTAGE
(Programmed with 80 mA)
WLED CURRENT
vs
INPUT VOLTAGE
(4 Main LED with 15 mA)
0.08
0.016
0.07
0.014
0.06
0.012
WLED Current - A
DM5 Current - A
DM2
0.05
0.04
VDM5 = 0.4 V
0.03
0.02
VDM5 = 0.35 V
VDM5 = 0.3 V
VDM5 = 0.15 V
VDM5 = 0.25 V
0.01
VDM5 = 0.1 V
VDM5 = 0.2 V
VDM5 = 0.05 V
DM1
DM3
DM4
0.010
0.008
0.006
0.004
0.002
0
2.5
3
3.5
VI - Input Voltage - V
4
0
3
4
5
6
VI - Input Voltage - V
Figure 11.
Figure 12.
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APPLICATION INFORMATION
APPLICATION OVERVIEW
Most of the current handsets fall into one of three categories. First is the clamshell design, with a main display
on the inside, a secondary display on the outside and a keypad backlight. Second is the bar design, with a main
display and a keypad backlight. Third is the slide type (slide-up and slide-down) design, with a main display and
two keypad banks (inside and outside). The TPS60251 is well suited for use in these three major phone designs
because it has 7 individually regulated white LED current paths for driving up to five white LEDs in main display
and up to two white LEDs in sub display with regulated constant current for uniform intensity. The main and sub
display LED channels drive up to 25mA and an auxiliary LED output (DM5) drives up to 80mA that can be
assigned for keypad backlight, torch light or low cost/weak camera flash application using the I2C interface.
The TPS60251 circuit uses only 5 external components: the input/output capacitors, 2 chargepump flying
capacitors, and one resistor that sets the maximum WLED current. The few external components combined with
the small 4mm×4mm QFN package provide for a small total solution size. By combining independent control of
three separate banks of backlight LEDs with low cost and weak flash capability, the TPS60251 helps designers
minimize power consumption especially in light load conditions while reducing component count and package
size.
OPERATING PRINCIPLE
Charge pumps are becoming increasingly attractive in battery-operated applications where board space and
maximum height of the converter are critical constraints. The major advantage of a charge pump is the use of
only capacitors as storage elements. The TPS60251 chargepump provides regulated LED current from a 3-V to
6-V input source. It operates in two modes. The 1× mode, where the input is connected to the output through a
pass element, and a high efficiency 1.5× charge pump mode. The IC maximizes power efficiency by operating in
1× and 1.5× modes as input voltage and LED current conditions require. The mode of operation is automatically
selected by comparing the forward voltage of the WLED plus the voltage of current sink for each LED with the
input voltage. The IC starts up in 1× mode, and automatically transitions to 1.5× if the voltage at any current sink
input (DM_or DS_) falls below the 100-mV transition voltage. The IC returns to 1× mode as the input rises.
Figure 13 provides a visual explanation of the 1× to 1.5× transition.
In 1.5× mode, the internal oscillator determines the charge/discharge cycles for the flying capacitors. During a
charge cycle, the flying capacitors are connected in series and charged up to the input voltage. After the on-time
of the internal oscillator expires, the flying capacitors are reconfigured to be in parallel and then connected in
series to the input voltage. This provides an output of 1.5× the input voltage. After the off-time of the internal
oscillator expires, another charge cycle initiates and the process repeats.
10
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APPLICATION INFORMATION (continued)
VA
VO
VI
VF
CP WLED Driver
VDX
VI
x1 Operating
Area
x1.5 Operating
Area
VHYS
VB
VC
Figure 13. Input Voltage Hysteresis Between ×1 and ×1.5 Mode
As shown in Figure 13, there is input voltage hysteresis voltage between 1× and 1.5× mode to ensure stable
operation during mode transition. For the 1 cell Li-Ion battery input voltage range, the TPS60251 operates in 1×
mode when a fully charged battery is installed. Once the battery voltage drops below the VB level, which is the
mode transition voltage from 1× to 1.5×, the WLED driver operates in 1.5× mode. Once in 1.5× mode, the battery
voltage must rise to the VC level in order to transition from 1.5× to 1×. This hysteresis ensures stable operation
when there is some input voltage fluctuation at the 1×/1.5× mode transition. The WLED driver provides a typical
280mV hysteresis voltage (VHYS) that changes based on LED current, to prevent oscillating between modes.
The transition voltage, VB, depends on VDX (the mode transition threshold voltage), VF (WLED forward voltage
drop) and VA (the drop out voltage of the charge pump stage) and is calculated as follows:
VB = VA + VF + VDX
VA = ROUT1X× ILEDTOTAL
Where ROUT1X is the 1× mode output impedance of the IC. See the Electrical Characteristics table for output
impedance specifications.
The TPS60251 switches to 1.5× mode when the input voltage is below VB and remains in 1.5× mode as long as
the input is lower than VC. 1.5× Mode is exited when the input voltage rises above VC. VC is calculated as:
VC = VF + 470 mV
The input voltage mode transition hysteresis voltage (VHYS) between 1× and 1.5× is calculated using the
following equation.
VHYS = VC– VB = 470 mV – VDX– VA, where VDX = 100 mV
Note that VA is the key factor in determining VHYS and is dependant on the 1× mode charge pump output
impedance and WLED current.
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APPLICATION INFORMATION (continued)
LED CURRENT SINKS (DM_, DS_)
The TPS60251 has constant current sinks which drive seven individual LED current paths. Each current sink
regulates the LED current to a constant value determined by the I2C interface. The internal register addressing
allows the LED main channels DM1~DM5 to be controlled independently from the LED sub channels DS1~DS2.
The maximum current is programmable by the user (see the Setting the LED Current section). All the LED
channels sink up to 25mA of current except DM5 which has an 80-mA maximum current when configured as an
auxiliary output. Using the I2C interface, the user may assign DM5 to the main display bank with up to 25-mA
current or as an auxiliary output for torch or keypad light or low/weak camera flash with 80-mA current. DM5 has
64 dimming steps which is the main and sub display banks when assigned to the main display. However, it has
its own current programming register and enable control. When assigned as an auxiliary, DM5 has 4 dimming
steps (full scale, 70%, 40%, 20%).
These optimized current sinks minimize the voltage headroom required to drive each LED and maximize power
efficiency by increasing the amount of time the controller stays in 1× mode before transitioning to 1.5× mode.
OPEN LAMP DETECTION
In system production it is often necessary to leave LED current paths open depending on the phone model. For
example, one phone may use 2 LEDs to backlight the main display while another uses 4 LEDs. Rather than use
two different ICs for these different phone applications, the TPS60251 may be used in both applications with no
additional efficiency loss in the 2 LED applications. In traditional LED driver applications when an LED current
path is open, the current sink voltage falls to ground and the current regulation circuitry drives the output to a
maximum voltage in an attempt to regulate the current for the missing LED path. This severely reduces the
system efficiency. The TPS60251 uses 7 internal comparators to detect when an open LED condition occurs
and shut down the open current sink. The open lamp detection is enabled/disabled using the I2C interface.
ENABLING THE DEVICE
The TPS60251 contains a hardware enable input for situations where the IC cannot be disabled using the I2C
interface. Connect the EN input high to enable the device for normal operation. Connect EN low to disable the
device and place it in a low power shutdown. The hardware enable overrides the I2C enable. When EN is pulled
low, the TPS60251 is completely disabled (shutdown mode) and all internal registers are set to 0x00h while the
software shutdown using I2C keeps all internal registers.
ENABLING THE LED BANKS
The I2C interface is used to enable/disable the LED banks. The MAIN, SUB, and AUX LEDs are individually
controlled. Additionally, the two SUB LEDs (DS_) can be enabled independently.
CAPACITOR SELECTION
The TPS60251 is optimized to work with ceramic capacitors with a dielectric of X5R or better. The two flying
capacitors must be the same value for proper operation. The 750-kHz switching frequency requires that the
flying capacitor be less than 4.7µF. Use of 1-µF ceramic capacitors for both chargepump flying capacitors is
recommended.
For good input voltage filtering, low ESR ceramic capacitors are recommended. A 1-µF ceramic input capacitor
is sufficient for most of the applications. For better input voltage filtering this value can be increased.
The output capacitor controls the amount of ripple on the output. Since small ripple is undetectable by the
human eye, a 4.7-µF output capacitor works well. If better output filtering and lower ripple is desired, a larger
output capacitor may be used.
I/O INPUT
The input logic low and high threshold voltage for I2C interface is changed by supplying voltage to VIO. The
voltage range of VIO is 1.8V to VI. This allows the user to optimize the input logic low and high I2C threshold
voltages for the TPS60251 to cover different voltage levels for I2C interface for the various phone models.
12
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SLVS767 – APRIL 2007
APPLICATION INFORMATION (continued)
SETTING THE LED CURRENT
The maximum LED current is user programmable using the IS input. Connect a resistor from IS to GND to set
the maximum LED current. The resistor value is calculated using the following equation between 2mA and
25.5mA:
ILED(mA) +
ƪǒ
1.254 ) 1.276
R IS
10 *6
Ǔ
ƫ ǒ
Step 500
* 1.254 ) 1.276
R IS
3.5 10 *6
10 *6
Ǔ
1714.29
10 6
(1)
Where RIS is the resistor from IS to GND, ILED is the LED current in µA and Step is the dimming step set by the
I2C interface (1 to 63). ILED may be set up to 25mA (RIS = 562 kΩ).
RIS has an effect on the current steps that are programmed using the I2C. When the current is programmed
below 1.5mA, the current is determined by the following equation:
ǒ
ILED(mA) + 1.254 ) 1.276
R IS
10 *6
Ǔ
Step 100
3.5 10 *6
(2)
This equation provides a greater resolution in current steps at lower currents.
STEP
ILED
STEP
ILED
STEP
ILED
STEP
ILED
1
100µA
17
2.5mA
33
10.5mA
49
18.5mA
2
200µA
18
3.0mA
34
11.0mA
50
19.0mA
3
300µA
19
3.5mA
35
11.5mA
51
19.5mA
4
400µA
20
4.0mA
36
12.0mA
52
20.0mA
5
500µA
21
4.5mA
37
12.5mA
53
20.5mA
6
600µA
22
5.0mA
38
13.0mA
54
21.0mA
7
700µA
23
5.5mA
39
13.5mA
55
21.5mA
8
800µA
24
6.0mA
40
14.0mA
56
22.0mA
9
900µA
25
6.5mA
41
14.5mA
57
22.5mA
10
1.0mA
26
7.0mA
42
15.0mA
58
23.0mA
11
1.1mA
27
7.5mA
43
15.5mA
59
23.5mA
12
1.2mA
28
8.0mA
44
16.0mA
60
24.0mA
13
1.3mA
29
8.5mA
45
16.5mA
61
24.5mA
14
1.4mA
30
9.0mA
46
17.0mA
62
25.0mA
15
1.5mA
31
9.5mA
47
17.5mA
63
25.5mA
16
2.0mA
32
10.0mA
48
18.0mA
Figure 14. Dimming Steps for Sub, Main, and Keypad Backlight
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TPS60251
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Figure 14 shows the dimming steps for sub, main, and auxiliary display banks in the 25mA maximum current
application. To satisfy today’s requirements on LED current, the TPS60251 covers low LED current area from
100µA to 1.5mA with 100-µA dimming step (total 16 steps for 25-mA maximum current) for the new LCD panels
which have improved transparency rates. For LED currents in the range from 2mA to 25mA, the device uses 48
dimming steps with 0.5mA step. Also, DM5 has 4 dimming steps once the current path is assigned for auxiliary
applications with maximum 80-mA current.
RIS also affects the current for the auxiliary application. The four current levels (20%, 40%, 70%, and 100%) are
determined by the following equations:
ƪǒ
ƪǒ
ƪǒ
ƪǒ
I AUX(100%) +
I AUX(70%) +
I AUX(40%) +
I AUX(20%) +
1.254 ) 1.276
R IS
10*6
1.254 ) 1.276
R IS
10*6
1.254 ) 1.276
R IS
10*6
1.254 ) 1.276
R IS
10*6
Ǔ
ƫ
ƫ
ƫ
ƫ
8000
3.5 10 *6
Ǔ
6000
3.5 10 *6
Ǔ
4000
3.5 10 *6
Ǔ
2000
3.5 10 *6
10
(3)
9.333
(4)
8
(5)
8
(6)
SERIAL INTERFACE
The serial interface is compatible with the standard and fast mode I2C specifications, allowing transfers at up to
400 kHz. The interface adds flexibility to the WLED driver solution, enabling most functions to be programmed to
new values depending on the instantaneous application requirements. Register contents remain intact as long
as VCC remains above UVLO2 (typical 1.3V) and ENA is high.
For normal data transfer, DATA is allowed to change only when CLK is low. Changes when CLK is high are
reserved for indicating the start and stop conditions. During data transfer, the data line must remain stable
whenever the clock line is high. There is one clock pulse per bit of data. Each data transfer is initiated with a
start condition and terminated with a stop condition. When addressed, the TPS60251 device generates an
acknowledge bit after the reception of each byte. The master device (microprocessor) must generate an extra
clock pulse that is associated with the acknowledge bit. The TPS60251 device must pull down the DATA line
during the acknowledge clock pulse so that the DATA line is a stable low during the high period of the
acknowledge clock pulse. Setup and hold times must be taken into account. During read operations, a master
must signal the end of data to the slave by not generating an acknowledge bit on the last byte that was clocked
out of the slave. In this case, the slave TPS60251 device must leave the data line high to enable the master to
generate the stop condition.
DATA
CLK
Data line
stable;
data valid
Change
of data
allowed
Figure 15. Bit Transfer on the Serial Interface
14
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SLVS767 – APRIL 2007
CE
DATA
CLK
S
P
START Condition
STOP Condition
Figure 16. START and STOP Conditions
SCLK
...
SDAT
A5
A6
Start
A4
...
... A0
R/W
AC
K
0
0
R7
R6
R5
... R0
...
AC
K
D7
D6 D5
...D0
0
Slave Address
AC
K
0
Register Address
Data
Stop
NOTE: SLAVE=TPS60251
Figure 17. Serial I/F READ From TPS60251: Protocol A
SCLK
SDAT
...
A6
.. A0
...
R/W
AC
K
0
0
R7
.. R0
...
AC
K
A6
.. A0
...
R/W
AC
K
1
0
0
Start
Slave Address
NOTE: SLAVE=TPS60251
Register
Address
Slave Address
D7
.. D0
Slave
Drives
the Data
Repeated
Start
AC
K
Master
Drives
ACK and Stop
Stop
Figure 18. Serial I/F READ From TPS60251: Protocol B
Figure 19. Serial I/F Timing Diagram
The I2C interface uses a combined protocol in which the START condition and the Slave Address are both
repeated. The TPS60251 provides 2 I2C Slave Address using internal EEPROM in case more than 1 device is
used in the system. The primary I2C Slave Address is 1110111. For the alternative I2C address, contact the
factory.
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TPS60251
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Enable Control Register (Address: 0x00h)
ENABLE
B7
B6
B5
B4
B3
B2
B1
B0
X
ENold
ENmain
ENsub2
ENsub1
ENaux
DM5H
DM5L
BIT NAME
Bit 6
ENold (Enable Open Lamp Detection)
1: Open Lamp Detection Enabled
0: Open Lamp Detection Disabled
Bit 5
ENmain
1: Enable Main Display LEDs (DM1-DM4)
0: Disable Main Display LEDs
Bit 4
ENsub2
1: Enable Sub Display LED 2 (DS2)
0: Disable Sub Display LED 2
Bit 3
ENsub1
1: Enable Sub Display LED 1 (DS1)
0: Disable Sub Display LED 1
Bit 2
ENaux
1: Enable Aux Display LED (DM5)
0: Disable Aux Display LED
Bits 1,0
DM5H, DM5L
DM5H
(B1)
DM5L
(B0)
0
0
Shutdown mode. All outputs disabled, all internal registers set to 0x00h
0
1
Enable the IC and Group DM5 as main display with maximum current of 25mA
1
0
Enable the IC and set as Aux output with maximum current of 80mA. Dimming
steps determined by Iaux0 and Iaux1 bits.
1
1
Shutdown mode. All outputs disabled, all internal registers set to 0x00h
DM5 Mode and Shutdown Mode
Sub Display Current Control Register (Address: 0x01h)
SUB DISP
CURRENT
B7
B6
B5
B4
B3
B2
B1
B0
BIT NAME
X
X
Isub5
Isub4
Isub3
Isub2
Isub1
Isub0
Bits 5 - 0
Isub5 - Isub0 (total 64 steps)
6-Bit command (64 steps) to these bits sets the current for DS1 and DS2.
For LED currents between 0 and 1.5mA, one step = 0.1mA increment
For LED currents between 1.5 and 25.5mA, one step = 0.5mA increment
Main Display Current Control Register (Address: 0x02h)
MAIN DISP
CURRENT
B7
B6
B5
B4
B3
B2
B1
B0
BIT NAME
X
X
Imain5
Imain4
Imain3
Imain2
Imain1
Imain0
Bits 5 - 0
16
Imain5 - Imain0 (total 64 steps)
6-Bit command (64 steps) to these bits sets the current for DM1-DM4.
For LED currents between 0 and 1.5mA, one step = 0.1mA increment
For LED currents between 1.5 and 25.5mA, one step = 0.5mA increment
Submit Documentation Feedback
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SLVS767 – APRIL 2007
Aux Output Brightness and Operation Mode Control Register (Address: 0x03h)
AUX DISP
CURRENT
B7
B6
B5
B4
B3
B2
B1
B0
BIT NAME
Iaux5
Iaux4
Iaux3
Iaux2
Iaux1
Iaux0
Mode1
Mode0
Bits 7 - 2 (DM5 set to Main Display Mode)
Iaux5 - Iaux0 (total 64 steps)
6-Bit command (64 steps) to these bits sets the current for DM5.
For LED currents between 0 and 1.5mA, one step = 0.1mA increment
For LED currents between 1.5 and 25.5mA, one step = 0.5mA increment
Bits 7 - 2 (DM5 set to Aux Display Mode)
Bits 1,0
Iaux5
(B7)
Iaux4
(B6)
Iaux3
(B5)
Iaux2
(B4)
Iaux1
(B3)
Iaux0
(B2)
Aux Dimming
Step
X
X
X
X
0
0
20%
X
X
X
X
0
1
40%
X
X
X
X
1
0
70%
X
X
X
X
1
1
100%
Mode1, Mode0
Mode1 Mode0
(B1)
(B0)
TPS60251 Mode
0
0
Auto-Switchover Mode. The TPS60251 selects
1×/1.5× mode as described in the Operating Principle
section.
0
1
1× Mode. TPS60251 remains in 1× mode regardless
of the input voltage. LED current may not regulate at
lower input voltages when in this mode.
1
0
1.5× Mode. TPS60251 remains in 1.5× mode
regardless of the input voltage.
1
1
Auto-Switchover Mode. The TPS60251 selects
1×/1.5× mode as described in the Operating Principle
section.
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TPS60251
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APPLICATION CIRCUITS
Main Display
R1
562 kW
GND IS
C1-
DM4 DM3 DM2 DM1
NC
C2+
C2
C3
1 mF 1 mF
NC-G
C2-
GND
C1+
GND
VOUT
C4
4.7 mF
VIN
C1
1 mF
NC
VIO
SDAT ENA DS1 DS2 DM5
SCLK
1.8V for I/O
Input
I2C Interface
Sub Display
Figure 20. The Typical Application Circuit for Sub and Main Display
As shown in Figure 20, this is a typical application circuit for a clam shell phone with 5 main LEDs and 2 sub
LEDs. Recently, the LCD panel makers have developed a new panel that has improved the transparency rate
which makes system efficiency with a 100-µA LED current a critical load point. To meet system efficiency
requirements with the light load conditions for the new LCD operating panel, the TPS60251 has a maximum
55-µA operating current with the 100-µA output load condition. In this application, the controller always operates
in 1× mode due to the WLED's low forward voltage drop (about 2.6VF with a 100-µA WLED current). Thus, the
total efficiency at a light load condition is determined using Equation 7:
IO VF
h Light +
Vin ǒI O ) I opǓ
(7)
Where:
IO: Output Load (WLED) Current
VF: Forward Voltage Drop of WLED
Vin: Input Voltage
Iop: Operating Current of LED Driver
18
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SLVS767 – APRIL 2007
Main Display
R1
562 kW
GND IS
C1-
DM4 DM3 DM2 DM1
NC
NC-G
C2+
C2
1 mF
C3
1 mF
C2-
GND
C1+
GND
NC
VOUT
C4
4.7 mF
VIN
C1
1 mF
Auxiliary Port for Key Pad
or Flash Light
VIO
SDAT ENA DS1 DS2 DM5
330 W
SCLK
1.8V for I/O
Input
I2C Interface
Sub Display
Figure 21. The Typical Application Circuit for Sub, Main, and Keypad Backlight
Figure 21 shows the typical application circuit for sub, main, and keypad backlight. In this application, DM5 is
assigned as the auxiliary input for the keypad lighting application.
LAYOUT GUIDELINES
There are several points to consider when laying out a PCB for charge pump based solutions. In general, all
capacitors should be as close as possible to the device. This is especially important when placing the flying
capacitors (C2, C3 in Figure 20 and Figure 21). To provide accurate WLED current, the current path with the
current setting resistor must be short to avoid any interference from other switching components. In cases where
DM5 is assigned for torch/flash applications, with a maximum 80-mA WLED current, this current path must be
kept wide to reduce the trace resistance.
Submit Documentation Feedback
19
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements,
improvements, and other changes to its products and services at any time and to discontinue any product or service without notice.
Customers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s
standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this
warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily
performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and
applications using TI components. To minimize the risks associated with customer products and applications, customers should
provide adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask
work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services
are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such
products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under
the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and is
accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an
unfair and deceptive business practice. TI is not responsible or liable for such altered documentation.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service
voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business
practice. TI is not responsible or liable for any such statements.
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would
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representatives against any damages arising out of the use of TI products in such safety-critical applications.
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are
specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military
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TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products
are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any
non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products
Applications
Amplifiers
amplifier.ti.com
Audio
www.ti.com/audio
Data Converters
dataconverter.ti.com
Automotive
www.ti.com/automotive
DSP
dsp.ti.com
Broadband
www.ti.com/broadband
Interface
interface.ti.com
Digital Control
www.ti.com/digitalcontrol
Logic
logic.ti.com
Military
www.ti.com/military
Power Mgmt
power.ti.com
Optical Networking
www.ti.com/opticalnetwork
Microcontrollers
microcontroller.ti.com
Security
www.ti.com/security
Low Power
Wireless
www.ti.com/lpw
Telephony
www.ti.com/telephony
Video & Imaging
www.ti.com/video
Wireless
www.ti.com/wireless
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2007, Texas Instruments Incorporated
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements,
improvements, and other changes to its products and services at any time and to discontinue any product or service without notice.
Customers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s
standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this
warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily
performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and
applications using TI components. To minimize the risks associated with customer products and applications, customers should
provide adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask
work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services
are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such
products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under
the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and is
accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an
unfair and deceptive business practice. TI is not responsible or liable for such altered documentation.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service
voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business
practice. TI is not responsible or liable for any such statements.
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would
reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement
specifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications
of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related
requirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding any
applications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and its
representatives against any damages arising out of the use of TI products in such safety-critical applications.
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are
specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is
solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in
connection with such use.
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products
are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any
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Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products
Applications
Amplifiers
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Audio
www.ti.com/audio
Data Converters
dataconverter.ti.com
Automotive
www.ti.com/automotive
DSP
dsp.ti.com
Broadband
www.ti.com/broadband
Interface
interface.ti.com
Digital Control
www.ti.com/digitalcontrol
Logic
logic.ti.com
Military
www.ti.com/military
Power Mgmt
power.ti.com
Optical Networking
www.ti.com/opticalnetwork
Microcontrollers
microcontroller.ti.com
Security
www.ti.com/security
Low Power
Wireless
www.ti.com/lpw
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www.ti.com/telephony
Video & Imaging
www.ti.com/video
Wireless
www.ti.com/wireless
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2007, Texas Instruments Incorporated
PACKAGE OPTION ADDENDUM
www.ti.com
7-May-2007
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
TPS60251RTWR
ACTIVE
QFN
RTW
24
3000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
TPS60251RTWT
ACTIVE
QFN
RTW
24
250
CU NIPDAU
Level-2-260C-1 YEAR
Green (RoHS &
no Sb/Br)
Lead/Ball Finish
MSL Peak Temp (3)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
17-May-2007
TAPE AND REEL INFORMATION
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
Device
17-May-2007
Package Pins
Site
Reel
Diameter
(mm)
Reel
Width
(mm)
A0 (mm)
B0 (mm)
K0 (mm)
P1
(mm)
W
Pin1
(mm) Quadrant
TPS60251RTWR
RTW
24
FRB
330
12
4.3
4.3
1.5
12
12
PKGORN
T2TR-MS
P
TPS60251RTWR
RTW
24
MLA
330
12
4.3
4.3
1.5
12
12
PKGORN
T2TR-MS
P
TPS60251RTWT
RTW
24
FRB
330
12
4.3
4.3
1.5
12
12
PKGORN
T2TR-MS
P
TPS60251RTWT
RTW
24
MLA
330
12
4.3
4.3
1.5
12
12
PKGORN
T2TR-MS
P
TAPE AND REEL BOX INFORMATION
Device
Package
Pins
Site
Length (mm)
Width (mm)
Height (mm)
TPS60251RTWR
RTW
TPS60251RTWR
RTW
24
FRB
342.9
336.6
20.6
24
MLA
346.0
346.0
TPS60251RTWT
29.0
RTW
24
FRB
342.9
336.6
20.6
TPS60251RTWT
RTW
24
MLA
346.0
346.0
29.0
Pack Materials-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
17-May-2007
Pack Materials-Page 3
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