REG71055-Q1 www.ti.com....................................................................................................................................................................................................... SBAS477 – JULY 2009 30-mA 5.5-V BOOST CHARGE PUMP FEATURES 1 • • • • • • Qualified for Automotive Applications Input Voltage Range: 3.0 V to 5.5 V Automatic Step-Up Operation Low Input Current Ripple Low Output Voltage Ripple Minimum Number of External Components, No Inductors • • • • • 1-MHz Internal Oscillator Allows Small Capacitors Shutdown Mode Thermal and Current Limit Protection 5.5-V Output Voltage Small TSOT23-6 (DDC) Package DESCRIPTION The REG71055 is a switched capacitor voltage converter that produces a regulated, low-ripple output voltage from an unregulated input voltage. Input supply voltage of 3.0 V to 5.5 V makes the REG71055 ideal for a variety of battery sources, such as single-cell Li-Ion, or two- and three-cell nickel- or alkaline-based chemistries. The input voltage may vary below the output voltage and the output remains in regulation. It works equally well for step-up applications without the need for an inductor, providing low EMI dc/dc conversion. The high switching frequency allows the use of small surface-mount capacitors, saving board space and reducing cost. The REG71055 is thermally protected and current limited, protecting the load and the regulator during fault conditions. Typical ground pin current (quiescent current) is 65 µA with no load, and less than 1 µA in shutdown mode. CPUMP 0.22mF Enable REG71055 3.3V to 4.2V CIN 2.2mF R R R LED LED LED COUT 2.2mF GND White LED Backlight Application 1 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2009, Texas Instruments Incorporated REG71055-Q1 SBAS477 – JULY 2009....................................................................................................................................................................................................... www.ti.com This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. ORDERING INFORMATION (1) PACKAGE (2) TA –40°C to 85°C (1) (2) TSOT-23 – DDC ORDERABLE PART NUMBER Reel of 3000 REG71055IDDCRQ1 TOP-SIDE MARKING GIXI For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI web site at www.ti.com. Package drawings, thermal data, and symbolization are available at www.ti.com/packaging. DDC PACKAGE (TOP VIEW) VOUT 1 6 CPUMP+ GND 2 5 VIN Enable 3 4 CPUMP- SIMPLIFIED BLOCK DIAGRAM CPUMP 0.22 µF 4 VIN 6 5 REG71055 CIN 2.2 µF 1 VOUT COUT 2.2 µF Control & Enable 3 Thermal 2 GND 2 Submit Documentation Feedback Copyright © 2009, Texas Instruments Incorporated Product Folder Link(s): REG71055-Q1 REG71055-Q1 www.ti.com....................................................................................................................................................................................................... SBAS477 – JULY 2009 ABSOLUTE MAXIMUM RATINGS (1) VIN Supply voltage VEN Enable input voltage tSC Output short-circuit duration Indefinite TSTG Storage temperature range –65°C to 150°C TLEAD Lead temperature (soldering, 10 seconds) (1) 3 V to 6 V –0.3 V to VIN 260°C Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those specified is not implied. ELECTRICAL CHARACTERISTICS Boldface limits apply over the specified temperature range, TA = –40°C to 85°C TA = 25°C, VIN = VOUT/2 + 0.75 V, IOUT = 10 mA, CIN = COUT = 2.2 µF, CPUMP = 0.22 µF, and VENABLE = 1.3 V (unless otherwise noted) PARAMETER Input voltage, tested startup Output voltage TEST CONDITIONS MIN See conditions under Output Voltage with a resistive load no lower than typical VOUT/IOUT 3.0 IOUT ≤ 10 mA, 3.0 V ≤ VIN ≤ 5.5 V 5.2 IOUT ≤ 30 mA, 3.25 V ≤ VIN ≤ 5.5 V 5.2 Nominal output current TYP MAX UNIT 5.5 V 5.5 5.8 V 5.5 5.8 V 30 mA Short-circuit output current (1) 100 mA Oscillator frequency (2) 1.0 MHz 90 % Efficiency (3) Ripple voltage IOUT = 10 mA, VIN = 3.0 V (4) IOUT = 30 mA 35 mVPP Logic high input voltage, Enable VIN = 3.0V to 5.5 V 1.3 VIN V Logic low input voltage, Enable VIN = 3.0V to 5.5 V –0.2 0.4 V Logic high input current, Enable VIN = 3.0V to 5.5 V 100 nA Logic low input current, Enable VIN = 3.0V to 5.5 V 100 nA Thermal shutdown temperature 160 Thermal shutdown recovery 140 Quiescent current (5) IOUT = 0 mA, VIN = 5.5 V Quiescent current in shutdown mode Specified ambient temperature TA Thermal resistance θJA (1) (2) (3) (4) (5) °C 65 VIN = 3.0 V to 5.5 V, Enable = 0 V 0.01 –40 TSOT23-6 °C 100 µA 1 µA 85 °C 220 °C/W The supply current is twice the output short-circuit current. The converter regulates by enabling and disabling periods of switching cycles. The switching frequency is the oscillator frequency during an active period. See efficiency curves for other VIN/VOUT configurations. Effective series resistance (ESR) of capacitors is < 0.1Ω. Measured when the device is not switching. Submit Documentation Feedback Copyright © 2009, Texas Instruments Incorporated Product Folder Link(s): REG71055-Q1 3 REG71055-Q1 SBAS477 – JULY 2009....................................................................................................................................................................................................... www.ti.com TYPICAL CHARACTERISTICS TA = 25°C, VIN = VOUT/2 + 0.75 V, IOUT = 5 mA, CIN = COUT = 2.2 µF, CPUMP = 0.22 µF, and VENABLE = 1.3 V (unless otherwise noted) SUPPLY CURRENT vs TEMPERATURE (No Load) EFFICIENCY vs VIN 100 90 80 Supply Current (mA) Efficiency (%) 80 70 60 50 60 40 20 40 30 1.5 2.0 2.5 3.0 3.5 VIN (V) 4.0 4.5 5.0 0 -40 -30 -20 -10 0 5.5 10 20 30 40 50 60 70 80 90 Temperature (°C) Figure 1. Figure 2. LOAD TRANSIENT RESPONSE SUPPLY CURRENT vs TEMPERATURE (Not Enabled) 20 18 VOUT 10mA/div 16 Supply Current (nA) 20mV/div 14 12 10 8 6 4 ILOAD 2 BW = 20MHz 0 -40 -30 -20 -10 0 Time (10ms/div) 10 20 30 40 50 60 70 80 90 Temperature (°C) Figure 3. Figure 4. OUTPUT VOLTAGE vs TEMPERATURE OUTPUT VOLTAGE DRIFT HISTOGRAM 25 0.1 Percentage of Units (%) Output Voltage Change (%) 0.2 0.0 -0.1 -0.2 -0.3 -0.4 20 15 10 5 > 100 < 100 < 76 < 52 < 28 140 <4 120 < -20 40 60 80 100 Junction Temperature (°C) < -44 20 < -92 0 < -68 0 -20 < -116 -0.6 -40 < -140 -0.5 VOUT Drift (ppm/°C) Figure 5. 4 Figure 6. Submit Documentation Feedback Copyright © 2009, Texas Instruments Incorporated Product Folder Link(s): REG71055-Q1 REG71055-Q1 www.ti.com....................................................................................................................................................................................................... SBAS477 – JULY 2009 TYPICAL CHARACTERISTICS (continued) TA = 25°C, VIN = VOUT/2 + 0.75 V, IOUT = 5 mA, CIN = COUT = 2.2 µF, CPUMP = 0.22 µF, and VENABLE = 1.3 V (unless otherwise noted) SHORT-CIRCUIT LOAD CURRENT vs VIN 250 225 Load Current (mA) 200 175 150 125 100 75 50 25 0 1.5 2.0 2.5 3.0 3.5 VIN (V) 4.0 4.5 5.0 5.5 Figure 7. Submit Documentation Feedback Copyright © 2009, Texas Instruments Incorporated Product Folder Link(s): REG71055-Q1 5 REG71055-Q1 SBAS477 – JULY 2009....................................................................................................................................................................................................... www.ti.com THEORY OF OPERATION The REG71055 regulated charge pump provides a regulated output voltage for input voltages ranging from less than the output to greater than the output. This is accomplished by automatic mode switching within the device. When the input voltage is greater than the required output, the unit functions as a variable frequency switch-mode regulator. This operation is shown in Figure 8. Transistors Q1 and Q3 are held off, Q4 is on, and Q2 is switched as needed to maintain a regulated output voltage. When the input voltage is less than the required output voltage, the device switches to a step-up or boost mode of operation, as shown in Figure 9. A conversion clock of 50% duty cycle is generated. During the first half cycle the FET switches are configured as shown in Figure 9A, and CPUMP charges to VIN. During the second half cycle the FET switched are configured as shown in Figure 9B, and the voltage on CPUMP is added to VIN. The output voltage is regulated by skipping clock cycles as necessary. Peak Current Reduction In normal operation, the charging of the pump and output capacitors usually leads to relatively high peak input currents which can be much higher than that of the average load current. The regulator incorporates circuitry to limit the input peak current, lowering the total EMI production of the device and lowering output voltage ripple and input current ripple. Input capacitor (CIN) supplies most of the charge required by input current peaks. VIN Q1 Q2 OFF SWITCHED CPUMP Q3 Q4 CIN OFF ON VOUT COUT Step-Down (Buck) Mode Figure 8. Simplified Schematic of the REG71055 Operating in the Step-Down Mode VIN VIN Q2 Q1 OFF OFF CPUMP Q3 CIN CPUMP Q3 Q4 OFF ON Q2 Q1 ON ON Q4 ON CIN OFF VOUT VOUT COUT (A) Step-Up (Boost) Mode COUT (B) Figure 9. Simplified Schematic of the REG71055 Operating in the Step-Up or Boost Mode 6 Submit Documentation Feedback Copyright © 2009, Texas Instruments Incorporated Product Folder Link(s): REG71055-Q1 REG71055-Q1 www.ti.com....................................................................................................................................................................................................... SBAS477 – JULY 2009 Protection The regulator has thermal shutdown circuitry that protects it from damage caused by overload conditions. The thermal protection circuitry disables the output when the junction temperature reaches approximately 160°C, allowing the device to cool. When the junction temperature cools to approximately 140°C, the output circuitry is automatically reenabled. Continuously running the regulator into thermal shutdown can degrade reliability. The regulator also provides current limit to protect itself and the load. Shutdown Mode The EN pin enables the IC when pulled high and places it into energy-saving shutdown mode when pulled low. When in shutdown mode, the output is disconnected from the input and the quiescent current is reduced to 0.01 µA typical. This shutdown mode functionality is only valid when VIN is above the minimum recommended operating voltage. The EN pin cannot be left floating and must be actively terminated either high or low. Capacitor Selection For minimum output voltage ripple, the output capacitor COUT should be a ceramic, surface-mount type. Tantalum capacitors generally have a higher effective series resistance (ESR) and may contribute to higher output voltage ripple. Leaded capacitors also increase ripple due to the higher inductance of the package itself. To achieve best operation with low input voltage and high load current, the input and pump capacitors (CIN and CPUMP, respectively) should also be surface-mount ceramic types. In all cases, X7R or X5R dielectric are recommended. See the typical operating circuit shown in Figure 10 for component values. CPUMP 0.22mF Enable 3 4 6 1 5 VIN CIN 2.2mF REG710 VOUT COUT 2.2mF 2 GND Figure 10. Typical Operating Circuit With light loads or higher input voltage, a smaller 0.1µF pump capacitor (CPUMP) and smaller 1µF input and output capacitors (CIN and COUT, respectively) can be used. To minimize output voltage ripple, increase the output capacitor, COUT, to 10µF or larger. The capacitors listed in Table 1 can be used with the REG71055. This table is only a representative list of compatible parts. Table 1. Suggested Capacitors MANUFACTURER Kemet Panasonic Taiyo Yuden PACKAGE SIZE RATED WORKING VOLTAGE PART NUMBER VALUE TOLERANCE DIELECTRIC MATERIAL C1206C255K8RAC 2.2 µF ±10% X7R 1206 10 V C1206C224K8RAC 0.22 µF ±10% X7R 1206 10 V ECJ−2YBOJ225K 2.2 µF ±10% X5R 805 6.3 V ECJ−2VBIC224K 0.22 µF ±10% X7R 805 16 V ECJ−2VBIC104 0.1 µF ±10% X7R 805 16 V EMK316BJ225KL 2.2 µF ±10% X7R 1206 16 V TKM316BJ224KF 0.22 µF ±10% X7R 1206 25 V Submit Documentation Feedback Copyright © 2009, Texas Instruments Incorporated Product Folder Link(s): REG71055-Q1 7 REG71055-Q1 SBAS477 – JULY 2009....................................................................................................................................................................................................... www.ti.com Efficiency The efficiency of the charge pump regulator varies with the output voltage version, the applied input voltage, the load current, and the internal operation mode of the device. The approximate efficiency is given by: Efficiency (%) = VOUT/(2 ´ VIN) ´ 100 (step-up operating mode) or VOUT VIN ´ 100 (step-down operating mode) Table 2 lists the approximate values of the input voltage at which the device changes internal operating mode. See efficiency curves in the Typical Characteristics section for various loads and input voltages. Table 2. Operating Mode Change vs VIN PRODUCT OPERATING MODE CHANGES AT VIN OF REG71055 Step-up only Layout Large transient currents flow in the VIN, VOUT, and GND traces. To minimize both input and output ripple, keep the capacitors as close as possible to the regulator using short, direct circuit traces. A suggested printed circuit board (PCB) routing is shown in Figure 11. The trace lengths from the input and output capacitors have been kept as short as possible. AREA: < 0.08 sq. inches VENABLE VOUT VIN COUT CP CIN GND Figure 11. Suggested PCB Design for Minimum Ripple 8 Submit Documentation Feedback Copyright © 2009, Texas Instruments Incorporated Product Folder Link(s): REG71055-Q1 REG71055-Q1 www.ti.com....................................................................................................................................................................................................... SBAS477 – JULY 2009 APPLICATION CIRCUITS 0.22mF CP1 0.22mF CP2 3.3V 3.0V 1.8V + VIN - 2.2mF CIN 5.0V VIN VOUT VIN REG710-3.3 REG710-3 EN VOUT REG71050 REG710-5 2.2mF GND EN 2.2mF COUT GND Figure 12. Circuit for Step-Up Operation From 1.8 V to 5 V With 10-mA Output Current 0.22mF CP1 VIN VOUT VOUT REG710-3.3 + VIN - 4.7mF CIN 4.7mF COUT GND 0.22mF CP2 VIN VOUT REG710-3.3 GND Figure 13. Circuit for Doubling the Output Current CPUMP 0.22mF Enable 3.3V to 4.2V REG71050 REG710-5 CIN 2.2mF R R R LED LED LED COUT 2.2mF GND Figure 14. Circuit for Driving LEDs Submit Documentation Feedback Copyright © 2009, Texas Instruments Incorporated Product Folder Link(s): REG71055-Q1 9 REG71055-Q1 SBAS477 – JULY 2009....................................................................................................................................................................................................... www.ti.com 0.22mF CVIN £ VOUT C+ REG710-3.3 2.2mF EN 3.3V VOUT VIN IL 2.2mF GND RL 2.2mF 74HC04 5818 5818 -2.7V at 1mA when IL = 10mA 2.2mF Figure 15. Negative Bias Supply 10 Submit Documentation Feedback Copyright © 2009, Texas Instruments Incorporated Product Folder Link(s): REG71055-Q1 PACKAGE OPTION ADDENDUM www.ti.com 24-Aug-2009 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing REG71055IDDCRQ1 ACTIVE SOT DDC Pins Package Eco Plan (2) Qty 6 3000 Green (RoHS & no Sb/Br) Lead/Ball Finish CU NIPDAU MSL Peak Temp (3) Level-1-260C-UNLIM (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. OTHER QUALIFIED VERSIONS OF REG71055-Q1 : • Catalog: REG71055 NOTE: Qualified Version Definitions: • Catalog - TI's standard catalog product Addendum-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 20-Jul-2010 TAPE AND REEL INFORMATION *All dimensions are nominal Device REG71055IDDCRQ1 Package Package Pins Type Drawing SOT DDC 6 SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) 3000 179.0 8.4 Pack Materials-Page 1 3.2 B0 (mm) K0 (mm) P1 (mm) 3.2 1.4 4.0 W Pin1 (mm) Quadrant 8.0 Q3 PACKAGE MATERIALS INFORMATION www.ti.com 20-Jul-2010 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) REG71055IDDCRQ1 SOT DDC 6 3000 203.0 203.0 35.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed. TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. To minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in such safety-critical applications. TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions: Products Applications Amplifiers amplifier.ti.com Audio www.ti.com/audio Data Converters dataconverter.ti.com Automotive www.ti.com/automotive DLP® Products www.dlp.com Communications and Telecom www.ti.com/communications DSP dsp.ti.com Computers and Peripherals www.ti.com/computers Clocks and Timers www.ti.com/clocks Consumer Electronics www.ti.com/consumer-apps Interface interface.ti.com Energy www.ti.com/energy Logic logic.ti.com Industrial www.ti.com/industrial Power Mgmt power.ti.com Medical www.ti.com/medical Microcontrollers microcontroller.ti.com Security www.ti.com/security RFID www.ti-rfid.com Space, Avionics & Defense www.ti.com/space-avionics-defense RF/IF and ZigBee® Solutions www.ti.com/lprf Video and Imaging www.ti.com/video Wireless www.ti.com/wireless-apps Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2010, Texas Instruments Incorporated