TI TPA2054D4AYZKR

TPA2054D4A
www.ti.com
SLOS666 – MAY 2010
1.4 W/CH STEREO CLASS-D AUDIO SUBSYSTEM WITH DirectPath™ HEADPHONE
AMPLIFIER AND 3:1 INPUT MUX
Check for Samples: TPA2054D4A
FEATURES
1
•
23
•
•
•
•
•
•
•
•
•
•
•
Stereo Class-D Amp:
– 1.4 W into 8 Ω from 5.0 V (10% THD + N)
– 1.25 W into 8 Ω from 5.0 V (1% THD + N)
DirectPath™ Stereo Headphone Amplifier
– No Output Capacitors Required
Independent Gain Select for Headphone
Amplifier
Eight Programmable Maximum Headphone
Voltage Limits
Two Single-Ended or One Differential Stereo
Input
3:1 Input MUX with Mode Control
32-Step Volume Control for Both Input
Channels
Independent Shutdown for Headphone and
Class-D Amplifiers
Short-Circuit and Thermal-Overload Protection
±8 kV HBM ESD Protection on Headphone
Outputs
I2C™ Interface
25-Ball 2,61 mm × 2,61 mm WCSP
APPLICATIONS
•
•
•
•
Smart Phones / Cellular Phones
Laptop Computers
Portable Gaming
Portable Media Players
Mono+
ABB
Left
SE
8 Speaker
Codec
MP3
Right
SE
TPA2054D4A
8 Speaker
Stereo Class D
plus
DirectPath™
Left
SE
Stereo
Headphone Jack
FM Tuner
The TPA2054D4A features a stereo Class-D power
amplifier along with a stereo DirectPath™ headphone
amplifier. The TPA2054D4A has a mono differential
input and two stereo single-ended (SE) inputs that
can be configured as one stereo differential input.
Both input channels have a 32-step volume control
and the DirectPath headphone amplifier has a 4-level
gain control for coarse volume adjustment. All
amplifiers have output short-circuit and thermaloverload protection.
The Class-D amplifiers deliver 1.25 W into 8 Ω at 1%
THD from a 5.0 V supply, and 700 mW from 3.6 V.
The DirectPath headphone amplifier features an
output voltage limiter to reduce the maximum output
power to one of seven possible limits. The voltage
limiter is programmed through the I2C interface.
DirectPath eliminates the need for external DCblocking output capacitors to the headphones. The
built-in charge pump creates a negative supply
voltage for the headphone amplifier, allowing a 0 V
DC bias at the output.
The DirectPath headphone amplifier gains are +6 dB
(default), 0 dB, –6 dB, and –14 dB, selected through
the I2C interface. This allows the headphone volume
to be different from the loudspeaker volume if both
are used simultaneously.
The TPA2054D4A has a 3:1 input MUX for audio
source selection. Mode and gain controls operate
from a 1.7 V to 3.6 V compatible I2C interface.
SIMPLIFIED SYSTEM BLOCK DIAGRAM
Mono-
DESCRIPTION
The voltage supply range for both the Class-D
amplifiers and the headphone charge pump is 2.5 V
to 5.5 V. The Class-D amplifiers use a combined
7 mA and the headphone amplifier uses 10 mA of
typical quiescent current.
Total supply current in shutdown reduces to less than
4 mA. Undervoltage lockout keeps supply current to
less than 4 µA when the supply voltage is less than
2.1 V.
The TPA2054D4AYZK is available in a 25-ball
2,61 mm × 2,61 mm WCSP package.
Right
SE
1
2
3
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
DirectPath is a trademark of Texas Instruments.
I2C is a trademark of NXP Semiconductors.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2010, Texas Instruments Incorporated
TPA2054D4A
SLOS666 – MAY 2010
www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
ORDERING INFORMATION
TA
PACKAGED DEVICES (1)
PART NUMBER (2)
25-ball, WCSP
TPA2054D4AYZKR
25-ball, WCSP
TPA2054D4AYZKT
–40°C to 85°C
(1)
(2)
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
Web site at www.ti.com.
The YZK packages are only available taped and reeled. The suffix R indicates a reel of 3000, the suffix T indicates a reel of 250.
DEVICE PINOUT
2
A1
A2
A3
A4
A5
VREF
INL_1
INR_1
DVDD
OUTL+
B1
B2
B3
B4
B5
CPN
INR_2
INL_2
RESET
OUTL–
C1
C2
C3
C4
C5
CPP
SDA
SCL
AGND
PGND
D1
D2
D3
D4
D5
HPVSS
MONO–
MONO+
AVDD
OUTR–
E1
E2
E3
E4
E5
HPRIGHT
VDDHP
HPLEFT
PVDD
OUTR+
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SLOS666 – MAY 2010
FUNCTIONAL BLOCK DIAGRAM
1mF
VDD
1mF
Bias Control
and Pop
Suppression
VREF
Power on
Reset
VDD
+6 dB
PWM
0.47mF
+
MONO+
–
MONO–
PGND
VDD
-66dB to +24dB
Volume Control
0.47mF
0.47mF
Mode
Control
OUTL+
Oscillator
+6 dB
LIN+
OUTL–
HBridge
PWM
OUTR–
HBridge
OUTR+
PGND
VDDHP
LIN0.47mF
0.47mF
-66dB to +24dB
Volume Control
HPLEFT
Gain
Select:
RIN+
VSS
VDDHP
+6 dB
0 dB
-6 dB
-14 dB
RIN0.47mF
HPRIGHT
DVDD
VSS
SDA
I2C Interface
SCL
RESET
Headphone
Power
Limiter
Charge
Pump
CPP
VDDHP
CPN
VSS
PGND
1mF
1mF
Figure 1. Differential Input Mode
1mF
VDD
1mF
Bias Control
and Pop
Suppression
VREF
Power on
Reset
VDD
+6 dB
PWM
0.47mF
+
MONO+
–
MONO–
PGND
VDD
-66dB to +24dB
Volume Control
0.47mF
0.47mF
Mode
Control
-66dB to +24dB
Volume Control
RIN1
PWM
HBridge
OUTR–
OUTR+
VDDHP
HPLEFT
Gain
Select:
LIN2
OUTL+
PGND
0.47mF
0.47mF
-66dB to +24dB
Volume Control
RIN2
OUTL–
Oscillator
+6 dB
LIN1
HBridge
+6 dB
0 dB
-6 dB
-14 dB
0.47mF
VSS
VDDHP
HPRIGHT
DVDD
VSS
SDA
I2C Interface
SCL
RESET
Headphone
Power
Limiter
Charge
Pump
CPP
VDDHP
CPN
1mF
VSS
PGND
1mF
Figure 2. Single-Ended (SE) Input Mode
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TERMINAL FUNCTIONS
TERMINAL
INPUT/ OUTPUT/
POWER (I/O/P)
DESCRIPTION
NAME
BALL
WCSP
OUTL+
A5
O
Left speaker positive output; connect to + terminal of loudspeaker
DVDD
A4
P
I2C supply voltage; connect to 1.8V digital supply
INR_1
A3
I
Channel 1 right input (SE-In mode); Left– input (Diff-In mode); connect to ground through 0.47 mF
capacitor if unused
INL_1
A2
I
Channel 1 left input (SE-In mode); Left+ input (Diff-In mode); connect to ground through 0.47 mF
capacitor if unused
VREF
A1
I
1.65 V reference voltage; connect a 1 mF capacitor to ground
OUTL–
B5
O
Left speaker negative output; connect to negative terminal of loudspeaker
RESET
B4
I
Set to logic low to shut device down and return all I2C registers to default state; I2C can only be
programmed once RESET returns to logic high
INL_2
B3
I
Channel 2 left input (SE-In mode); Right+ input (Diff-In mode); connect to ground through 0.47 mF
capacitor if unused
INR_2
B2
I
Channel 2 right input (SE-In mode); Right– input (Diff-In mode); connect to ground through 0.47 mF
capacitor if unused
CPP
B1
P
Charge pump flying capacitor positive terminal; connect positive side of capacitor between CPP and CPN
PGND
C5
P
Class-D ground; connect to ground
AGND
C4
P
Analog ground; connect to ground
SCL
C3
I/O
I2C clock input
SDA
C2
I/O
I2C data input
CPN
C1
P
Charge pump flying capacitor negative terminal; connect negative side of capacitor between CPP and
CPN
OUTR–
D5
O
Right speaker negative output; connect to negative terminal of loudspeaker
AVDD
D4
P
Supply voltage
MONO-
D2
I
Inverting mono input, typically connected to baseband OUT-
MONO+
D3
I
Non-inverting mono input, typically connected to baseband OUT+
HPVSS
D1
P
Negative supply generated by the charge pump; connect a 1mF capacitor to ground to reduce voltage
ripple
OUTR+
E5
O
Right speaker positive output; connect to positive terminal of loudspeaker
PVDD
E4
P
Supply voltage
HPLEFT
E3
O
Headphone left channel output
VDDHP
E2
P
Headphone charge pump supply voltage
HPRIGHT
E1
O
Headphone right channel output
ABSOLUTE MAXIMUM RATINGS (1)
over operating free-air temperature range, TA = 25°C (unless otherwise noted)
Supply voltage
VI
Input voltage
VALUE
UNIT
VDDHP, PVDD, AVDD
–0.3 to 6.0
V
DVDD
–0.3 to 3.6
V
–0.3 to VDD + 0.3
V
–0.3 to DVDD + 0.3
V
INL_1, INL_2, INR_1, INR_2, MONO+, MONOSDA, SCL, RESET
Output continuous total power dissipation
See Dissipation Rating
Table
TA
Operating free-air temperature range
–40 to 85
°C
TJ
Operating junction temperature range
–40 to 150
°C
Tstg
Storage temperature range
–65 to 150
°C
ESD
Electrostatic discharge,
HBM
OUTL+, OUTL–, OUTR+, OUTR–
2k
V
HPLEFT and HPRIGHT
8k
V
(1)
4
Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
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SLOS666 – MAY 2010
DISSIPATION RATINGS
PACKAGE
TA < 25°C
DERATING FACTOR
TA = 70°C
TA = 85°C
YZK (WCSP)
1.12 W
9 mW/°C
720 mW
585 mW
RECOMMENDED OPERATING CONDITIONS
over operating free-air temperature range (unless otherwise noted)
VIH
VIL
MIN
MAX
Class-D supply voltage, PVDD
2.5
5.5
V
Charge pump supply voltage, VDDHP
2.5
5.5
V
I2C supply voltage, DVDD
1.7
3.3
V
High-level input voltage
Low-level input voltage
SDA, SCL, RESET, DVDD = 1.8 V
1.3
SDA, SCL, RESET, DVDD = 3.3 V
3.0
UNIT
V
SDA, SCL, RESET, DVDD = 1.8 V
0.3
V
85
°C
MAX
UNIT
SDA, SCL, RESET, DVDD = 3.3 V
TA
Operation free-air temperature
–40
ELECTRICAL CHARACTERISTICS
TA = 25°C (unless otherwise noted)
MIN
TYP
DC Power supply rejection ratio
(Class-D amplifiers)
PARAMETER
VDD = 2.5 V to 5.5 V, Single-ended mode
TEST CONDITIONS
48
75
dB
DC Power supply rejection ratio
(headphone amplifiers)
VDD = 2.5 V to 5.5 V, Single-ended mode
60
80
dB
High-level input current (SDA, SCL,
RESET)
1
mA
Low-level input current (SDA, SCL,
RESET)
1
mA
2.3
V
15.8
20
mA
VDD = 4.2 V, Class-D active, Headphone deactivated, no load
7.5
10.5
mA
VDD = 4.2 V, Headphone active, Class-D deactivated, no load
10
13.5
mA
VDD = 2.5 V to 5.5 V, RESET ≥ VIH, SWS = 1
(software shutdown mode)
2.5
4
mA
VDD = 2.5 V to 5.5 V, RESET ≤ 0.3 V (hard shutdown mode)
0.2
2
mA
TYP
MAX
UNIT
400
kHz
AVDD Power on reset ON threshold
2.0
AVDD Power on reset hysteresis
0.2
VDD = 5.5 V, Class-D and Headphone amplifiers active, no load
Supply current
V
TIMING CHARACTERISTICS
For I2C Interface Signals Over Recommended Operating Conditions (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
fSCLN
Frequency, SCL
No wait states
tW(H)
Pulse duration, SCL high
0.6
ms
tW(L)
Pulse duration, SCL low
1.3
ms
tsu1
Setup time, SDA to SCL
100
ns
th1
Hold time, SCL to SDA
10
ns
t(buf)
Bus free time between stop and start condition
1.3
ms
tsu2
Setup time, SCL to start condition
0.6
ms
th2
Hold time, start condition to SCL
0.6
ms
tsu3
Setup time, SCL to stop condition
0.6
ms
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Figure 3. SCL and SDA Timing
Figure 4. Start and Stop Conditions Timing
DEVICE RESET
Apply logic low to the RESET pin to deactivate the TPA2054D4A and return all I2C registers to their default state.
This clears the LIM_Lock bit to logic low, allowing changes to the headphone output limiter byte. Refer to the
Register Map section for a complete list of default states. The I2C registers cannot be programmed until
RESETreturns to logic high. The TPA2054D4A activates in soft shutdown mode, SWS bit at logic high.
OPERATING CHARACTERISTICS
VDD = 3.6 V, TA = 25°C, RSPEAKER = 8 Ω + 33 mH, RHEADPHONES = 16 Ω, Total HP Gain = 6 dB, Total Class-D Gain = 6 dB,
MODE[2:0] = 001 (single-ended mode)(unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
POWER AMPLIFIER
PO
VOS
Speaker output power
Offset Voltage
THD = 1%, VDD = 3.6 V, f = 1 kHz
700
mW
THD = 10%, VDD = 3.6 V, f = 1 kHz
860
mW
THD = 1%, VDD = 4.2 V, f = 1 kHz
940
mW
VDD = 5.5 V
–13
Output impedance in shutdown
SNR
Signal-to-noise ratio
PO = 250 mW;
En
Noise output voltage
Total gain = 0 dB; A-weighted
THD+N
Total harmonic distortion plus noise
kSVR
AC-Power supply rejection ratio
6
5
13
mV
2
kΩ
90
dB
22
mVRMS
VDD = 5.0 V, PO = 1 W, f = 1 kHz
0.18
%
VDD = 3.6 V, PO = 0.6 W, f = 1 kHz
0.25
%
200 mVpp ripple, f = 217 Hz, Total gain = 0 dB
-75
dB
200 mVpp ripple, f = 4 kHz, Total gain = 0 dB
-70
dB
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SLOS666 – MAY 2010
OPERATING CHARACTERISTICS (continued)
VDD = 3.6 V, TA = 25°C, RSPEAKER = 8 Ω + 33 mH, RHEADPHONES = 16 Ω, Total HP Gain = 6 dB, Total Class-D Gain = 6 dB,
MODE[2:0] = 001 (single-ended mode)(unless otherwise noted)
PARAMETER
TEST CONDITIONS
Thermal shutdown
MIN
Class-D switching frequency
ΔAV
Gain matching
MAX
UNIT
Threshold
155
°C
Hysteresis
35
°C
Output short-circuit protection
fCLK
TYP
2.4
250
300
Between left and right channels
0.1
THD = 1%, VDD = 5.0 V, HP_Vout[2:0] = 000
150
THD = 1%, VDD = 3.0 V, HP_Vout[2:0] = 000
83
A
350
kHz
dB
HEADPHONE AMPLIFIER
PO
Headphone output power (1)
(Outputs in Phase)
VO
Maximum headphone output voltage
VOS
Offset Voltage
THD = 10 %, HP_VOUT[2:0] = 111
0.14
THD = 10 %, HP_VOUT[2:0] = 100
0.23
VDD = 5.5 V, Total gain = 0 dB
–3.5
Output impedance in shutdown
0.5
mW
VRMS
3.5
mV
225
MΩ
SNR
Signal-to-noise ratio
PO = 50 mW;
90
dB
En
Noise output voltage
Total gain = 0 dB; A-weighted, VDD = 5.0 V
12
mVRMS
THD+N
Total harmonic distortion plus noise(1)
kSVR
AC-Power supply rejection ratio
PO = 30 mW into 16 Ω, VDD = 3.6 V, f = 1 kHz
0.02
PO = 50 mW into 32 Ω, VDD = 5.0 V, f = 1 kHz
0.01
%
200 mVpp ripple, f = 217 Hz, Total gain = 0 dB
-89
dB
200 mVpp ripple, f = 4 kHz, Total gain = 0 dB
%
-83
dB
Output short-circuit protection
200
mA
fOSC
Charge pump switching frequency
300
kHz
ΔAV
Gain matching
0.1
dB
20.9
kΩ
1.65
V
8.25
ms
Between Left and Right channels
INPUT SECTION
RIN
Input impedance (differential)
Volume = 24 dB
VREF
Reference voltage
VDD = 3.6 V, all active modes
16
Start-up time from shutdown
(1)
Per output channel
TEST SET-UP FOR GRAPHS
TPA2054D4A
CI
+
Measurement
Output
–
IN+
OUT+
Load
CI
IN–
VDD
+
OUT–
30 kHz
Low-Pass
Filter
+
Measurement
Input
–
GND
1 mF
VDD
–
(1)
All measurements were taken with a 1-mF CI (unless otherwise noted.)
(2)
A 33-mH inductor was placed in series with the load resistor to emulate a small speaker for efficiency measurements.
(3)
The 30-kHz low-pass filter is required, even if the analyzer has an internal low-pass filter. An RC low-pass filter (1 kΩ
4.7 nF) is used on each output for the data sheet graphs.
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TYPICAL CHARACTERISTIC GRAPHS
CI = 1 mF, Cbypass = 1 mF
Total Gain = 6 dB
PO = 150 mW
RL = 8 Ω + 33 µH
VDD = 3 V
DIFF Mode
0.1
0.01
SE Mode
0.001
20
100
1k
10
Total Gain = 6 dB
PO = 300 mW
RL = 8 Ω + 33 µH
VDD = 3.6 V
1
0.1
SE Mode
0.01
DIFF Mode
0.001
10k 20k
20
100
f − Frequency − Hz
1k
Total Gain = 6 dB
PO = 600 mW
RL = 8 Ω + 33 µH
VDD = 5 V
1
0.1
SE Mode
0.01
DIFF Mode
0.001
20
10k 20k
100
1k
10k 20k
f − Frequency − Hz
G003
G002
Figure 6.
Figure 7.
TOTAL HARMONIC DISTORTION +
NOISE (HP)
vs
FREQUENCY
TOTAL HARMONIC DISTORTION +
NOISE (HP)
vs
FREQUENCY
TOTAL HARMONIC DISTORTION +
NOISE (HP)
vs
FREQUENCY
10
Total Gain = 6 dB
PO = 35 mW
RL = 16 Ω
VDD = 3 V
1
0.1
DIFF Mode
0.01
SE Mode
0.001
20
100
1k
10k 20k
f − Frequency − Hz
THD+N − Total Harmonic Distortion + Noise − %
Figure 5.
THD+N − Total Harmonic Distortion + Noise − %
THD+N − Total Harmonic Distortion + Noise − %
10
f − Frequency − Hz
G001
10
Total Gain = 6 dB
PO = 50 mW
RL = 16 Ω
VDD = 3.6 V
1
0.1
DIFF Mode
0.01
SE Mode
0.001
20
100
1k
10k 20k
10
Total Gain = 6 dB
PO = 100 mW
RL = 16 Ω
VDD = 5 V
1
0.1
DIFF Mode
0.01
SE Mode
0.001
20
100
1k
G006
G005
Figure 9.
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10k 20k
f − Frequency − Hz
f − Frequency − Hz
G004
Figure 8.
8
TOTAL HARMONIC DISTORTION +
NOISE (SP)
vs
FREQUENCY
THD+N − Total Harmonic Distortion + Noise − %
10
1
TOTAL HARMONIC DISTORTION +
NOISE (SP)
vs
FREQUENCY
THD+N − Total Harmonic Distortion + Noise − %
THD+N − Total Harmonic Distortion + Noise − %
TOTAL HARMONIC DISTORTION +
NOISE (SP)
vs
FREQUENCY
Figure 10.
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SLOS666 – MAY 2010
TYPICAL CHARACTERISTIC GRAPHS (continued)
CI = 1 mF, Cbypass = 1 mF
Total Gain = 6 dB
PO = 20 mW
RL = 32 Ω
VDD = 3 V
0.1
DIFF Mode
0.01
SE Mode
0.001
20
100
1k
10k 20k
10
Total Gain = 6 dB
PO = 30 mW
RL = 32 Ω
VDD = 3.6 V
1
0.1
SE Mode
0.01
DIFF Mode
0.001
20
f − Frequency − Hz
100
1k
10
Total Gain = 6 dB
PO = 50 mW
RL = 32 Ω
VDD = 5 V
1
0.1
DIFF Mode
0.01
SE Mode
0.001
10k 20k
20
100
f − Frequency − Hz
10k 20k
1k
f − Frequency − Hz
G007
G008
G009
Figure 12.
Figure 13.
TOTAL HARMONIC DISTORTION +
NOISE (SP)
vs
OUTPUT POWER
TOTAL HARMONIC DISTORTION +
NOISE (SP)
vs
OUTPUT POWER
TOTAL HARMONIC DISTORTION +
NOISE (HP)
vs
OUTPUT POWER
100
10
Total Gain = 6 dB
RL = 8 Ω + 33 µH
Stereo Differential
VDD = 3 V
1
VDD = 2.5 V
0.1
VDD = 3.6 V
0.01
0.001
0.01
VDD = 5 V
0.1
1
PO − Output Power − W
10
G010
Figure 14.
THD+N − Total Harmonic Distortion + Noise − %
Figure 11.
THD+N − Total Harmonic Distortion + Noise − %
THD+N − Total Harmonic Distortion + Noise − %
TOTAL HARMONIC DISTORTION +
NOISE (HP)
vs
FREQUENCY
THD+N − Total Harmonic Distortion + Noise − %
10
1
TOTAL HARMONIC DISTORTION +
NOISE (HP)
vs
FREQUENCY
THD+N − Total Harmonic Distortion + Noise − %
THD+N − Total Harmonic Distortion + Noise − %
TOTAL HARMONIC DISTORTION +
NOISE (HP)
vs
FREQUENCY
100
10
Total Gain = 6 dB
RL = 8 Ω + 33 µH
Stereo Single-Ended
VDD = 3 V
1
VDD = 2.5 V
0.1
VDD = 3.6 V
0.01
0.001
0.01
VDD = 5 V
0.1
1
PO − Output Power − W
Figure 15.
10
100
10
Total Gain = 6 dB
RL = 16 Ω
Stereo Differential
VDD = 5 V
1
VDD = 3.6 V
VDD = 3 V
0.1
0.01
0.001
0.0001
VDD = 2.5 V
0.001
0.01
0.1
PO − Output Power − W
G011
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G012
Figure 16.
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TYPICAL CHARACTERISTIC GRAPHS (continued)
CI = 1 mF, Cbypass = 1 mF
Total Gain = 6 dB
RL = 16 Ω
Stereo Single-Ended
VDD = 5 V
1
VDD = 3.6 V
VDD = 3 V
0.1
0.01
VDD = 2.5 V
0.001
0.0001
0.001
0.01
1
0.1
Total Gain = 6 dB
RL = 32 Ω
Stereo Differential
VDD = 5 V
1
VDD = 3 V
VDD = 3.6 V
0.1
0.01
VDD = 2.5 V
0.001
0.0001
0.001
0.01
1
0.1
PO − Output Power − W
G013
10
Total Gain = 6 dB
RL = 32 Ω
Stereo Single-Ended
VDD = 3.6 V
1
VDD = 3 V
VDD = 5 V
0.1
0.01
VDD = 2.5 V
0.001
0.0001
0.001
0.01
1
0.1
PO − Output Power − W
G014
G015
Figure 19.
SUPPLY RIPPLE REJECTION RATIO
(SP)
vs
FREQUENCY
SUPPLY RIPPLE REJECTION RATIO
(SP)
vs
FREQUENCY
SUPPLY RIPPLE REJECTION RATIO
(HP)
vs
FREQUENCY
0
0
0
Total Gain = 0 dB
RL = 8 Ω + 33 µH
Stereo Differential
Input Level = 0.2 Vpp
−20
−40
VDD = 3.6 V
VDD = 3 V
−60
−80
VDD = 5 V
VDD = 2.5 V
−100
100
1k
10k 20k
−20
Total Gain = 0 dB
RL = 8 Ω + 33 µH
Stereo Single-Ended
Input Level = 0.2 Vpp
−40
VDD = 2.5 V
VDD = 3.6 V
−60
−80
VDD = 3 V
VDD = 5 V
−100
−120
20
100
1k
10k 20k
f − Frequency − Hz
f − Frequency − Hz
−20
Total Gain = 0 dB
RL = 32 Ω
Stereo Differential
Input Level = 0.2 Vpp
−40
VDD = 2.5 V
−60
VDD = 3.6 V
VDD = 3 V
−80
−100
−120
20
VDD = 5 V
100
1k
Figure 21.
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10k 20k
f − Frequency − Hz
G017
G016
Figure 20.
ksvr − Supply Ripple Rejection Ratio − dB
Figure 18.
−120
20
10
100
Figure 17.
ksvr − Supply Ripple Rejection Ratio − dB
ksvr − Supply Ripple Rejection Ratio − dB
PO − Output Power − W
100
10
TOTAL HARMONIC DISTORTION +
NOISE (HP)
vs
OUTPUT POWER
THD+N − Total Harmonic Distortion + Noise − %
100
10
TOTAL HARMONIC DISTORTION +
NOISE (HP)
vs
OUTPUT POWER
THD+N − Total Harmonic Distortion + Noise − %
THD+N − Total Harmonic Distortion + Noise − %
TOTAL HARMONIC DISTORTION +
NOISE (HP)
vs
OUTPUT POWER
G018
Figure 22.
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TYPICAL CHARACTERISTIC GRAPHS (continued)
CI = 1 mF, Cbypass = 1 mF
SUPPLY RIPPLE REJECTION RATIO
(HP)
vs
FREQUENCY
EFFICIENCY (SP)
vs
OUTPUT POWER PER CHANNEL
100
Total Gain = 0 dB
RL = 32 Ω
Stereo Single-Ended
Input Level = 0.2 Vpp
80
−40
VDD = 3 V
VDD = 2.5 V
−60
−80
VDD = 3.6 V
60
50
VDD = 3 V
40
30
100
1k
Total Gain = 6 dB
RL = 8 Ω + 33 µH
Stereo Single-Ended
10
VDD = 5 V
VDD = 3.6 V
0
0.00
10k 20k
G019
Total Gain = 6 dB
RL = 8 Ω + 33 µH
Stereo Single-Ended
Pdiss = PdissL + PdissR
0.35
0.30
0.25
VDD = 3.6 V
0.20
VDD = 2.5 V
0.15
0.10
VDD = 5 V
0.05
VDD
=3
VDD
=V
3V
0.00
0.25
0.50
0.75
1.00
1.25
1.50
PO − Output Power Per Channel − W
f − Frequency − Hz
0.0
0.5
1.0
1.5
2.0
2.5
PO − Total Output Power − W
G020
3.0
G021
Figure 23.
Figure 24.
Figure 25.
TOTAL POWER DISSIPATION (HP)
vs
TOTAL OUTPUT POWER
TOTAL POWER DISSIPATION (HP)
vs
TOTAL OUTPUT POWER
OUTPUT POWER PER CHANNEL
(SP)
vs
SUPPLY VOLTAGE
0.6
0.8
0.7
PD − Total Power Dissipation − W
VDD = 5 V
VDD = 3 V
0.6
VDD = 3.6 V
0.5
0.4
0.3
VDD = 2.5 V
0.2
Total Gain = 6 dB
RL = 16 Ω
Stereo Single-Ended
Pdiss = PdissL + PdissR
0.1
0.0
0.0
0.1
0.2
0.3
0.4
PO − Total Output Power − W
0.5
1.6
Total Gain = 6 dB
RL = 32 Ω
Stereo Single-Ended
Pdiss = PdissL + PdissR
PO − Output Power Per Channel − W
0.9
PD − Total Power Dissipation − W
VDD = 5 V
VDD = 2.5 V
70
20
−100
−120
20
PD − Total Power Dissipation − W
−20
0.40
90
η − Efficiency − %
ksvr − Supply Ripple Rejection Ratio − dB
0
TOTAL POWER DISSIPATION (SP)
vs
TOTAL OUTPUT POWER
VDD = 5 V
0.4
VDD = 3.6 V
0.3
0.2
0.1
VDD = 3 V
0.5
G022
Figure 26.
0.0
0.00
VDD = 2.5 V
0.05
0.10
0.15
Total Gain = 6 dB
RL = 8 Ω + 33 µH
Stereo Single-Ended
1.4
1.2
THD+N = 10%
1.0
0.8
THD+N = 1%
0.6
0.4
0.2
0.0
0.20
0.25
PO − Total Output Power − W
Figure 27.
G023
2.5
3.0
3.5
4.0
4.5
5.0
VDD − Supply Voltage − V
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G024
Figure 28.
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TYPICAL CHARACTERISTIC GRAPHS (continued)
CI = 1 mF, Cbypass = 1 mF
OUTPUT POWER PER CHANNEL
(HP)
vs
SUPPLY VOLTAGE
OUTPUT POWER PER CHANNEL
(HP)
vs
SUPPLY VOLTAGE
PO − Output Power Per Channel − W
0.15
0.10
THD+N = 1%
0.05
Total Gain = 6 dB
RL = 16 Ω
Stereo Single-Ended
2.5
3.0
3.5
4.0
4.5
5.0
VDD − Supply Voltage − V
0.08
THD+N = 1%
0.06
0.04
Total Gain = 6 dB
RL = 32 Ω
Stereo Single-Ended
0.02
2.5
5.5
3.0
3.5
4.0
4.5
5.0
VDD − Supply Voltage − V
G025
5.5
0
−10
−20
Total Gain = 6 dB
Input Level = 0.2 Vpp
RL = 8 Ω + 33 µH
VDD = 3.6 V
−30
−40
−50
−60
−70
−80
20
100
1k
10k 20k
f − Frequency − Hz
G026
G027
Figure 29.
Figure 30.
Figure 31.
COMMON-MODE REJECTION RATIO
(HP)
vs
FREQUENCY
CROSSTALK (SP)
vs
FREQUENCY
CROSSTALK (HP)
vs
FREQUENCY
0
0
0
Total Gain = 6 dB
Input Level = 0.2 Vpp
RL = 32 Ω
VDD = 3.6 V
−10
−20
−20
−40
Crosstalk − dB
CMRR − Common-Mode Rejection Ratio − dB
THD+N = 10%
0.10
0.00
0.00
−30
−40
−50
PO = 250 mW
RL = 8 Ω + 33 µH
VDD = 3.6 V
Stereo Single-Ended
−20
−60
−80
Left to Right
PO = 35 mW
RL = 32 Ω
VDD = 3.6 V
Stereo Single-Ended
−40
Left to Right
−60
−80
−100
−60
−80
20
100
1k
10k 20k
G028
Figure 32.
−140
20
Right to Left
−100
−120
−70
f − Frequency − Hz
12
0.12
Crosstalk − dB
PO − Output Power Per Channel − W
THD+N = 10%
0.20
CMRR − Common-Mode Rejection Ratio − dB
0.14
0.25
COMMON-MODE REJECTION RATIO
(SP)
vs
FREQUENCY
Right to Left
100
1k
10k 20k
f − Frequency − Hz
−120
20
100
1k
G029
Figure 33.
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10k 20k
f − Frequency − Hz
G030
Figure 34.
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SLOS666 – MAY 2010
TYPICAL CHARACTERISTIC GRAPHS (continued)
CI = 1 mF, Cbypass = 1 mF
SUPPLY CURRENT
vs
SUPPLY VOLTAGE
SUPPLY CURRENT
vs
SUPPLY VOLTAGE
50
35
30
25
20
15
10
40
35
30
25
20
15
10
5
5
0
0
2.5
3.0
3.5
4.0
4.5
5.0
VDD − Supply Voltage − V
5.5
Total Gain = 6 dB
HP Load = 32 Ω
RL = 8 Ω + 33 µH
Speaker and Headphone Enabled
45
IDD − Supply Current − mA
40
Total Gain = 6 dB
HP Load = 32 Ω
RL = 8 Ω + 33 µH
Headphone Enabled Only
45
IDD − Supply Current − mA
IDD − Supply Current − mA
50
50
Total Gain = 6 dB
HP Load = 32 Ω
RL = 8 Ω + 33 µH
Speaker Enabled Only
45
40
35
30
25
20
15
10
5
0
2.5
3.0
3.5
4.0
4.5
5.0
VDD − Supply Voltage − V
G031
Figure 35.
5.5
2.5
3.0
3.5
SPEAKER OUTPUT - STARTUP
4.0
4.5
5.0
VDD − Supply Voltage − V
G032
Figure 36.
5.5
G033
Figure 37.
SPEAKER OUTPUT - SHUTDOWN
2.0
2.0
SDA
1.5
1.5
SDA
1.0
V − Voltage − V
1.0
V − Voltage − V
SUPPLY CURRENT
vs
SUPPLY VOLTAGE
0.5
SPKR Output
SPKR Output
0.5
0.0
0.0
−0.5
−0.5
−1.0
0
2
4
6
8
10
12
14
16
18
20
−1.0
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
t − Time − ms
t − Time − ms
G034
Figure 38.
G035
Figure 39.
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TYPICAL CHARACTERISTIC GRAPHS (continued)
CI = 1 mF, Cbypass = 1 mF
HEADPHONE OUTPUT - STARTUP
HEADPHONE OUTPUT - SHUTDOWN
2.0
2.0
SDA
1.5
1.5
1.0
V − Voltage − V
V − Voltage − V
1.0
SDA
0.5
Headphone Output
Headphone Output
0.5
0.0
0.0
−0.5
−0.5
−1.0
0
2
4
6
8
10
12
14
16
18
20
−1.0
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
t − Time − ms
t − Time − ms
G036
Figure 40.
14
G037
Figure 41.
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SLOS666 – MAY 2010
DETAILED DESCRIPTION
GENERAL I2C OPERATION
The I2C bus employs two signals, SDA (data) and SCL (clock), to communicate between integrated circuits in a
system. The bus transfers data serially one bit at a time. The address and data 8-bit bytes are transferred most
significant bit (MSB) first. In addition, each byte transferred on the bus is acknowledged by the receiving device
with an acknowledge bit. Each transfer operation begins with the master device driving a start condition on the
bus and ends with the master device driving a stop condition on the bus. The bus uses transitions on the data
terminal (SDA) while the clock is at logic high to indicate start and stop conditions. A high-to-low transition on
SDA indicates a start and a low-to-high transition indicates a stop. Normal data-bit transitions bust occur within
the low time of the clock period. Figure 42 shows a typical sequence. The master generates the 7-bit slave
address and the read/write (R/W) bit to open communication with another device and then waits for an
acknowledge condition. The TPA2054D4A holds SDA low during the acknowledge clock period to indicate
acknowledgment. When this occurs, the master transmits the next byte of the sequence. Each device is
addressed by a unique 7-bit slave address plus R/W bit (1 byte). All compatible devices share the same signals
via a bidirectional bus using a wired-AND connection.
An external pull-up resistor must be used for the SDA and SCL signals to set the logic high level for the bus.
Figure 42. Typical I2C Sequence
There is no limit on the number of bytes that can be transmitted between start and stop conditions. When the last
word transfers, the master generates a stop condition to release the bus. Figure 42 shows a generic data
transfer sequence.
SINGLE AND MULTI-BYTE TRANSFERS
The serial control interface supports both single-byte and multi-byte read/write operations for all registers. During
multi-byte reads, the TPA2054D4A responds with data, one byte at a time, starting at the register assigned
provided the master devices continue to acknowledge.
The TPA2054D4A supports sequential I2C addressing. For write transactions, if a register is issued followed by
data for that register and all the remaining registers that follow, a sequential I2C write transaction has occurred.
For I2C sequential write transactions, the register issued then serves as the starting point and the amount of data
subsequently transmitted, before a stop or start is transmitted, determines how many registers are written to.
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SINGLE-BYTE WRITE
As shown in Figure 43, a single-byte data write transfer begins with the master device transmitting a start
condition followed by the I2C device address and the read/write bit. The read/write bit determines the direction of
the data transfer. For a write data transfer, the read/write bit must be set to 0. After receiving the correct I2C
device address and the read/write bit, the TPA2054D4A responds with an acknowledge bit. Next, the master
transmits the register byte corresponding to the TPA2054D4A internal memory address being accessed. After
receiving the register byte, the TPA2054D4A again responds with an acknowledge bit. Finally, the master device
transmits a stop condition to complete the single-byte data write transfer.
Figure 43. Single-Byte Write Transfer
MULTI-BYTE WRITE AND INCREMENTAL MULTI-BYTE WRITER
A multiple-byte data write transfer is identical to a single-byte data write transfer with the exception that multiple
data bytes are transmitted by the master device to the TPA2054D4A as shown in Figure 44. After receiving each
data byte, the TPA2054D4A responds with an acknowledge bit.
Figure 44. Multiple-Byte Write Transfer
SINGLE-BYTE READ
As shown in Figure 45, a single-byte data read transfer begins with the master device transmitting a start
condition followed by the I2C device address and the read/write bit. For the data read transfer, both a write
followed by a read are actually done. Initially, a write is done to transfer the address byte of the internal memory
address to be read. As a result, the read/write bit is set to a 0.
After receiving the TPA2054D4A address and the read/write bit, the TPA2054D4A responds with an
acknowledge bit. The master then sends the internal memory address byte, after which the TPA2054D4A issues
an acknowledge bit. The master device transmits another start condition followed by the TPA2054D4A address
and the read/write bit again. This time, the read/write bit is set to 1, indicating a read transfer. Next, the
TPA2054D4A transmits the data byte from the memory address being read. After receiving the data byte, the
master device transmits a not-acknowledge followed by a stop condition to complete the single-byte data read
transfer.
Figure 45. Single-Byte Read Transfer
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MULTI-BYTE READY
A multiple-byte data read transfer is identical to a single-byte read transfer except that multiple data bytes are
transmitted by the TPA2054D4A to the master device as shown in Figure 46. With the exception of the last data
byte, the master device responds with an acknowledge bit after receiving each data byte.
Figure 46. Multi-Byte Read Transfer
REGISTER MAPS
REGISTER
BIT 7
BIT 6
BIT 5
BIT 4
BIT 3
BIT 2
BIT 1
BIT 0
1
Reserved
Reserved
Reserved
PAL_Fault
PAR_Fault
HPL_Fault
HPR_Fault
Thermal
2
Reserved
Reserved
Reserved
SWS
HPL_Enable
HPR_Enable
PA_Enable
Reserved
3
LIM_Lock
Reserved
Reserved
Reserved
Reserved
Mode[2]
Mode[1]
Mode[0]
4
Reserved
Reserved
Reserved
Mon_Vol[4]
Mon_Vol[3]
Mon_Vol[2]
Mon_Vol[1]
Mon_Vol[0]
5
Reserved
Reserved
Reserved
ST1_Vol[4]
ST1_Vol[3]
ST1_Vol[2]
ST1_Vol[1]
ST1_Vol[0]
6
Reserved
Reserved
Reserved
ST2_Vol[4]
ST2_Vol[3]
ST2_Vol[2]
ST2_Vol[1]
ST2_Vol[0]
7
Reserved
Reserved
Reserved
HP_Vout[2]
HP_Vout[1]
HP_Vout[0]
HP_Gain[1]
HP_Gain[0]
The TPA2054D4A I2C address is 0xE0 (binary 11100000) for writing and 0xE1 (binary 11100001) for reading.
Refer to the General I2C Operation section for more details.
Bits labeled Reserved are reserved for future enhancements. They may not be written to as it may change the
function of the device. If read, these bits may assume any value.
Any register above address 0x07 is reserved for testing and should not be written to because it may change the
function of the device. If read, these bits may assume any value.
Fault Register (Address: 1)
BIT
7
6
5
4
3
2
1
0
Function
Reserved
Reserved
Reserved
PAL_Fault
PAR_Fault
HPL_Fault
HPR_Fault
Thermal
Reset Value
0
0
0
0
0
0
0
0
Reserved
These bits are reserved for future enhancements. They will not change state if programmed. If
read these bits may assume any value.
PAL_Fault
Logic high indicates an over-current event has occurred on the Class-D left channel output. This
bit is clear-on-write. Only logic low can be written to this bit.
PAR_Fault
Logic high indicates an over-current event has occurred on the Class-D right channel output.
This bit is clear-on-write. Only logic low can be written to this bit.
HPL_Fault
Logic high indicates an over-current event has occurred on the headphone left channel output.
This bit is clear-on-write. Only logic low can be written to this bit.
HPR_Fault
Logic high indicates an over-current event has occurred on the headphone right channel output.
This bit is clear-on-write. Only logic low can be written to this bit.
Thermal
Logic high indicates thermal shutdown activated. Bit automatically clears when the thermal
condition lowers past the hysteresis threshold.
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Power Management Register (Address: 2)
BIT
7
6
5
4
3
2
1
0
Function
Reserved
Reserved
Reserved
SWS
HPL_Enable
HPR_Enable
PA_Enable
Reserved
Reset Value
0
0
0
1
0
0
0
0
Reserved
These bits are reserved for future enhancements. They will not change state if programmed. If
read these bits may assume any value.
SWS
Software shutdown. Set to logic high to deactivate the TPA2054D4A. Logic low reactivates the
charge pump and input amplifiers; enable headphone and Class-D amplifiers using HPL_Enable,
HPR_Enable, and PA_Enable. Default on turn-on is SWS logic high.
HPL_Enable Headphone left channel enable. Set to logic low to deactivate left channel.
HPR_Enable Headphone right channel enable. Set to logic low to deactivate right channel.
PA_Enable
Class-D power amplifier enable. Set to logic low to deactivate both left and right Class-D power
amplifiers.
Mux Output Control Register (Address: 3)
BIT
7
6
5
4
3
2
1
0
Function
LIM_Lock
Reserved
Reserved
Reserved
Reserved
Mode[2]
Mode1]
Mode[0]
Reset Value
0
0
0
0
0
0
0
1
Reserved
These bits are reserved for future enhancements. They will not change state if programmed. If
read these bits may assume any value.
LIM_Lock
Limiter change lockout. Set bit to logic high to prevent any changes to the HP_Vout[2:0] and
LIM_Lock bits. The LIM_Lock bit can only be returned to 0 by applying logic low to the RESET
pin or powering down VDD.
Mode[2:0]
Sets mux output mode. Refer to Modes of Operation section for details. Default mode is 001
(Stereo 1 Input mode) on power-up.
Mono Input Volume Control Register (Address: 4)
BIT
7
6
5
4
3
2
1
0
Function
Reserved
Reserved
Reserved
Mon_Vol[4]
Mon_Vol[3]
Mon_Vol[2]
Mon_Vol[1]
Mon_Vol[0]
Reset Value
0
0
0
1
0
0
1
1
Reserved
These bits are reserved for future enhancements. They will not change state if programmed. If
read these bits may assume any value.
Mon_Vol[4:0] Five-bit volume control for Mono Input. 11111 sets device to its highest gain (+24 dB); 00000
sets device to its lowest gain (–66 dB). Default setting on power-up is 10011 (+7 dB).
Stereo Input 1 Volume Control Register (Address: 5)
BIT
7
6
5
4
3
2
1
0
Function
Reserved
Reserved
Reserved
ST1_Vol[4]
ST1_Vol[3]
ST1_Vol[2]
ST1_Vol[1]
ST1_Vol[0]
Reset Value
0
0
0
1
0
0
0
0
Reserved
These bits are reserved for future enhancements. They will not change state if programmed. If
read these bits may assume any value.
ST1_Vol[4:0] Five-bit volume control for Stereo Input 1 in single-ended input mode and stereo input pair in
differential input mode. 11111 sets device to its highest gain (+24 dB); 00000 sets device to its
lowest gain (–66 dB). Default setting on power-up is 10000 (+0 dB).
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Stereo Input 2 Volume Control Register (Address: 6)
BIT
7
6
5
4
3
2
1
0
Function
Reserved
Reserved
Reserved
ST2_Vol[4]
ST2_Vol[3]
ST2_Vol[2]
ST2_Vol[1]
ST2_Vol[0]
Reset Value
0
0
0
1
0
0
0
0
Reserved
These bits are reserved for future enhancements. They will not change state if programmed. If
read these bits may assume any value.
ST2_Vol[4:0] Five-bit volume control for Stereo Input 2. 11111 sets device to its highest gain (+24 dB); 00000
sets device to its lowest gain (–66 dB). Default setting on power-up is 10000 (+0 dB).
Headphone Output Control Register (Address: 7)
BIT
7
6
5
4
3
2
1
0
Function
Reserved
Reserved
Reserved
HP_Vout[2]
HP_Vout[1]
HP_Vout[0]
HP_Gain[1]
HP_Gain[0]
Reset Value
0
0
0
0
0
0
0
0
Reserved
These bits are reserved for future enhancements. They will not change state if programmed.
If read these bits may assume any value.
HP_Vout[2:0]
Headphone output voltage limiter. Sets the maximum output voltage / power to the
headphones.
HP_Gain[1:0]
Headphone gain select. Sets the gain of the headphone output amplifiers.
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TPA2054D4A
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MODES OF OPERATION
The TPA2054D4A has several operating modes for single-ended and differential inputs. Stereo 1 refers to the
LIN_1 and RIN_1 input pair; Stereo 2 refers to the LIN_2 and RIN_2 input pair.
Mux Output Mode
The input mux selects which device input is directed to both the Class-D and headphone amplifiers. Mux
summing and output are after the channel volume controls, as shown in the Simplified Functional Diagram.
Program the mux mode using the Mode[2:0] bits in Mux Output Control (Register 3, Bits 0–2). Select the
appropriate mode according to the table below.
MODE
BYTE:
MODE[2:0]
MUX OUTPUT
MUX MODE
LEFT
MUX OUTPUT DESCRIPTION
RIGHT
000
Mono Input
Mono+ – Mono-
Mono+ – Mono-
Differential mono input
001
Stereo 1 Input
LIN_1
RIN_1
LIN_1 and RIN_1 stereo single-ended input
010
Stereo 2 Input
LIN_2
RIN_2
LIN_2 and RIN_2 stereo single-ended input
011
Stereo Differential
LIN_1–RIN_1
LIN_2–RIN_2
LIN_1 and RIN_1 compose the left channel; LIN_2 and
RIN_2 compose the right channel
100
Stereo Differential
(mono-mode)
(LIN_1–RIN_1) +
(LIN_2–RIN_2)
(LIN_1–RIN_1) +
(LIN_2–RIN_2)
Left and right differential inputs summed and directed to
left and right mux output
101
Stereo 1
(mono-mode)
LIN_1 + RIN_1
LIN_1 + RIN_1
LIN_1 + RIN_1 distributed to both left and right inputs of
the headphone and Class-D amplifiers
110
Stereo 2
(mono-mode)
LIN_2 + RIN_2
LIN_2 + RIN_2
LIN_2 + RIN_2 distributed to both left and right inputs of
the headphone and Class-D amplifiers
111
Mute
Mute
Mute
All inputs muted; no audio available at mux output
Differential Input Mode
The LIN_1 and RIN_1 input pair and the LIN_2 and RIN_2 input pair are configurable as either single-ended or
differential inputs. Differential transmission between an audio source and the TPA2054D4A input improves
system noise rejection when compared to single-ended transmission.
In differential input modes, connect the Left+ and Left– source signal to LIN_1 and RIN_1, respectively; connect
Right+ and Right– to LIN_2 and RIN_2, respectively. Single-ended input modes allow selection between two
stereo sources. Differential input modes allow connection to only one stereo source.
START-UP SEQUENCING AND SHUTDOWN CONTROL
For correct start up with no turn-on pop, apply PVDD and VDDHP before applying DVDD. The TPA2054D4A
starts up in soft shutdown mode with the SWS bit (Register 2, Bit 4) at logic high.
The stereo Class-D power amplifiers, left headphone amplifier, and right headphone amplifier each have their
own enable bits within the Power Management byte (Register 2, Bits 3–1). Set the corresponding bit to logic high
to enable these amplifiers. Disabling an amplifier mutes its output and reduces supply current. Set SWS to logic
high to deactivate all sections except the I2C interface, reducing total supply current to 2 mA, max.
Set RESET to logic low to deactivate all sections including the I2C interface. The I2C registers cannot be
programmed while RESET remains at logic low. Refer to the Headphone Output Limiter Lockout section for more
details on using RESET.
All register contents are maintained provided the supply voltage is not powered down and RESET remains at
logic high. On deactivation of DVDD or PVDD, or on RESET set to logic low, all information programmed into the
registers by the user is lost, returning to their default state once power is reapplied.
20
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Class-D Output Amplifiers
To enable both Class-D power amplifiers, set the PA_Enable bit (Register 2, Bit 1) to logic high. The left and
right channel Class-D outputs cannot be separately activated. Total Class-D section typical current is 7 mA when
active and less than 1 mA when deactivated.
All Class-D outputs have short-circuit current protection and thermal overload protection. The PAL_Fault and
PAR_Fault bits (Register 1, Bits 4 and 3) indicate an over-current event on the left and right Class-D channel
outputs. These bits are clear-on-write; only logic low can be written.
The Thermal bit (Register 1, Bit 1) goes to logic high if a thermal shutdown event occurs. It returns to logic low
once the device temperature returns below 150°C.
DirectPath Headphone Amplifier
Set the HPL_Enable bit (Register 2, Bit 3) to logic high to enable the headphone left output and the HPR_Enable
bit (Register 2, Bit 2) to logic high to enable the headphone right output. The headphone amplifier draws 10 mA
of typical supply current with both left and right outputs active and less than 1 mA when deactivated.
The HPL_Fault and HPR_Fault bits (Register 1, Bits 2 and 1) indicate an over-current event on the left and right
headphone outputs. These bits are clear-on-write; only logic low can be written.
HEADPHONE OUTPUT LIMITER LOCKOUT
Setting the LIM_Lock bit (Register 3, Bit 7) to logic high prevents any register changes to the HP_Vout byte
(Register 7, Bits 4-2) and the LIM_Lock bit itself. The LIM_Lock bit will remain locked at logic high until the power
supply is deactivated or logic low is applied to the RESET pin. All volume control, mux modes and shutdown
registers remain writable regardless of LIM_Lock status.
MAXIMUM HEADPHONE POWER REGULATOR
The HP_Vout byte (Register 7, Bits 4-2) sets the maximum output voltage from the headphone amplifiers. This is
useful for limiting the maximum output power to the headphones. The HP_Vout byte sets the internally regulated
supply voltage to the headphone amplifiers according to the table below. The table also shows the equivalent
10% THD output into 16 Ω and 32 Ω loads.
(1)
MAX HEADPHONE
OUTPUT BYTE: HP_VOUT[2:0]
VOUT,MAX
POUT,MAX INTO 16Ω
(10% THD)
POUT,MAX INTO 32Ω
(10% THD)
000
±VDDHP (1)
130 mW (at VDDHP = 3.6 V)
65 mW (at VDDHP = 3.6 V)
001
±1.13 V
40 mW
20 mW
010
±0.54 V
9 mW
4.5 mW
011
±0.38 V
4.5 mW
2.3 mW
100
±0.315 V
3.1 mW
1.6 mW
101
±0.253 V
2.0 mW
1.0 mW
110
±0.227 V
1.6 mW
0.8 mW
111
±0.196 V
1.2 mW
0.6 mW
With no load. Maximum output voltage decreases as load resistance decreases.
HEADPHONE GAIN VALUES
For the DirectPath headphone amplifier, left and right output channels
HEADPHONE GAIN REGISTER BYTE:
HP_GAIN[1:0]
NOMINAL GAIN
00
+6 dB
01
0 dB
10
–6 dB
11
–14 dB
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TPA2054D4A
SLOS666 – MAY 2010
www.ti.com
INPUT VOLUME CONTROL
The TPA2054D4A has three independent volume controls: one for the Mono differential input, one for the
STEREO1 input pair (LIN_1 and RIN_1), and one for the STEREO2 input pair (LIN_2 and RIN_2). Each has 5-bit
(32-step) resolution and are audio tapered; gain step changes are smaller at higher gain settings. The volume
control range is –66 dB to +24 dB.
Total input-to-output gain is input gain plus the headphone or Class-D amplifier gain. The Class-D amplifier gain
is fixed at +6 dB. The headphone gain is programmable at +6 dB (default), 0 dB, –6 dB, and –14 dB. Headphone
gain is set via the I2C interface.
The Mono Input volume control byte is located at Register 4, Bits 4 – 0. The Stereo Input 1 volume control byte is
located at Register 5, Bits 4–0. The Stereo Input 2 volume control byte is at Register 6, Bits 4–0. Gain matching
between the left and right channels for STEREO1 and STEREO2 is within 0.1 dB. In differential input mode, the
Stereo Input 1 byte (Register 5) controls left and right channel gain.
The input impedance to the TPA2054D4A decreases as channel gain increases. See the Operating
Characteristics section for specifications. Values listed in Audio Taper Gain Values table are nominal values.
AUDIO TAPER GAIN VALUES
For input channel volume controls
22
VOLUME CONTROL
REGISTER BYTE: VOL[4:0]
NOMINAL GAIN
VOLUME CONTROL
REGISTER BYTE: VOL[4:0]
NOMINAL GAIN
00000
–66 dB
10000
0 dB
00001
–56 dB
10001
+3 dB
00010
–48 dB
10010
+5 dB
00011
–44 dB
10011
+7 dB
00100
–40 dB
10100
+9 dB
00101
–36 dB
10101
+11 dB
00110
–32 dB
10110
+13 dB
00111
–28 dB
10111
+15 dB
01000
–24 dB
11000
+17 dB
01001
–21 dB
11001
+18 dB
01010
–18 dB
11010
+19 dB
01011
–15 dB
11011
+20 dB
01100
–12 dB
11100
+21 dB
01101
–9 dB
11101
+22 dB
01110
–6 dB
11110
+23 dB
01111
–3 dB
11111
+24 dB
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SLOS666 – MAY 2010
DECOUPLING CAPACITOR, CS
The TPA2054D4A is a high-performance Class-D audio amplifier that requires adequate power supply
decoupling to ensure the efficiency is high and total harmonic distortion (THD) is low. For higher frequency
transients, spikes, or digital hash on the line, a good low equivalent-series-resistance (ESR) 1-mF ceramic
capacitor (typically) placed as close as possible to the device PVDD (L, R) lead works best. Placing this
decoupling capacitor close to the TPA2054D4A is important for the efficiency of the Class-D amplifier, because
any resistance or inductance in the trace between the device and the capacitor can cause a loss in efficiency.
For filtering lower-frequency noise signals, a 4.7 mF or greater capacitor placed near the audio power amplifier
would also help, but it is not required in most applications because of the high PSRR of this device.
INPUT CAPACITORS, CI
The input capacitors and input resistors form a high-pass filter with the corner frequency, fC, determined in
Equation 1.
1
fC =
(2p ´ RI ´ CI )
(1)
The value of the input capacitor is important to consider as it directly affects the bass (low frequency)
performance of the circuit. Speakers in wireless phones cannot usually respond well to low frequencies, so the
corner frequency can be set to block low frequencies in this application. Not using input capacitors can increase
output offset. Equation 2 is used to solve for the input coupling capacitance. If the corner frequency is within the
audio band, the capacitors should have a tolerance of ±10% or better, because any mismatch in capacitance
causes an impedance mismatch at the corner frequency and below.
1
CI =
(2p ´ RI ´ fC )
(2)
BOARD LAYOUT
In making the pad size for the WCSP balls, it is recommended that the layout use non solder mask defined
(NSMD) land. With this method, the solder mask opening is made larger than the desired land area, and the
opening size is defined by the copper pad width. Figure 47 and Table 1 shows the appropriate diameters for a
WCSP layout. The TPA2054D4A evaluation module (EVM) layout is shown in the next section as a layout
example.
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TPA2054D4A
SLOS666 – MAY 2010
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Figure 47. Land Pattern Dimensions
Table 1. Land Pattern Dimensions (1)
(1)
(2)
(3)
(4)
(5)
(6)
(7)
SOLDER PAD
DEFINITIONS
COPPER PAD
SOLDER MASK (5)
OPENING
COPPER
THICKNESS
Non solder mask
defined (NSMD)
275 mm
(+0.0, –25 mm)
375 mm
(+0.0, –25 mm)
1 oz max (32 mm)
(2) (3) (4)
STENCIL (6)
(7)
OPENING
275 mm × 275 mm Sq. (rounded
corners)
STENCIL
THICKNESS
125 mm thick
Circuit traces from NSMD defined PWB lands should be 75 mm to 100 mm wide in the exposed area inside the solder mask opening.
Wider trace widths reduce device stand off and impact reliability.
Best reliability results are achieved when the PWB laminate glass transition temperature is above the operating the range of the
intended application.
Recommend solder paste is Type 3 or Type 4.
For a PWB using a Ni/Au surface finish, the gold thickness should be less 0.5 mm to avoid a reduction in thermal fatigue performance.
Solder mask thickness should be less than 20 mm on top of the copper circuit pattern
Best solder stencil performance is achieved using laser cut stencils with electro polishing. Use of chemically etched stencils results in
inferior solder paste volume control.
Trace routing away from WCSP device should be balanced in X and Y directions to avoid unintentional component movement due to
solder wetting forces.
COMPONENT LOCATION
Place all the external components very close to the TPA2054D4A. Placing the decoupling capacitor, CS, close to
the TPA2054D4A is important for the efficiency of the Class-D amplifier. Any resistance or inductance in the
trace between the device and the capacitor can cause a loss in efficiency.
TRACE WIDTH
Recommended trace width at the solder balls is 75 mm to 100 mm to prevent solder wicking onto wider PCB
traces. For high current pins (PVDD (L, R), PGND, and audio output pins) of the TPA2054D4A, use 100-mm
trace widths at the solder balls and at least 500-mm PCB traces to ensure proper performance and output power
for the device. For the remaining signals of the TPA2054D4A, use 75-mm to 100-mm trace widths at the solder
balls. The audio input pins (INR± and INL±) must run side-by-side to maximize common-mode noise cancellation.
24
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SLOS666 – MAY 2010
EFFICIENCY AND THERMAL INFORMATION
The maximum ambient temperature depends on the heat-sinking ability of the PCB system. The derating factor
for the packages are shown in the dissipation rating table. Converting this to qJA for the WCSP package:
q JA =
1
1
=
= 111°C/W
Derating Factor
0.009
(3)
Given qJA of 111°C/W, the maximum allowable junction temperature of 150°C, and the maximum internal
dissipation of 0.12 W (0.06 W per channel) for 1.4 W per channel, 8-Ω load, 5-V supply, from Figure 24 , the
maximum ambient temperature can be calculated with the following equation:
TAMax = TJMax - θJAPDMAX = 150 - 111(0.12) = 137°C
(4)
Equation 4 shows that the calculated maximum ambient temperature is 137°C at maximum power dissipation
with a 5-V supply and 8-Ω a load. The TPA2054D4A is designed with thermal protection that turns the device off
when the junction temperature surpasses 150°C to prevent damage to the IC. Also, using speakers more
resistive than 8-Ω dramatically increases the thermal performance by reducing the output current and increasing
the efficiency of the amplifier.
OPERATION WITH DACS AND CODECS
In using Class-D amplifiers with CODECs and DACs, sometimes there is an increase in the output noise floor
from the audio amplifier. This occurs when mixing of the output frequencies of the CODEC/DAC mix with the
switching frequencies of the audio amplifier input stage. The noise increase can be solved by placing a low-pass
filter between the CODEC/DAC and audio amplifier. This filters off the high frequencies that cause the problem
and allow proper performance. See the functional block diagram.
FILTER FREE OPERATION AND FERRITE BEAD FILTERS
A ferrite bead filter can often be used if the design is failing radiated emissions without an LC filter and the
frequency sensitive circuit is greater than 1 MHz. This filter functions well for circuits that just have to pass FCC
and CE because FCC and CE only test radiated emissions greater than 30 MHz. When choosing a ferrite bead,
choose one with high impedance at high frequencies, and low impedance at low frequencies. In addition, select a
ferrite bead with adequate current rating to prevent distortion of the output signal.
Use an LC output filter if there are low frequency (< 1 MHz) EMI sensitive circuits and/or there are long leads
from amplifier to speaker. Figure 48 shows typical ferrite bead and LC output filters.
Ferrite
Chip Bead
OUTP
1 nF
Ferrite
Chip Bead
OUTN
1 nF
Figure 48. Typical Ferrite Bead Filter (Chip bead example: TDK: MPZ1608S221A)
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25
PACKAGE OPTION ADDENDUM
www.ti.com
14-Jun-2010
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package
Drawing
Pins
Package Qty
Eco Plan
(2)
Lead/
Ball Finish
MSL Peak Temp
(3)
Samples
(Requires Login)
TPA2054D4AYZKR
ACTIVE
DSBGA
YZK
25
3000
Green (RoHS
& no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
Request Free Samples
TPA2054D4AYZKT
ACTIVE
DSBGA
YZK
25
250
Green (RoHS
& no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
Purchase Samples
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
26-Apr-2012
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
TPA2054D4AYZKR
DSBGA
YZK
25
3000
180.0
8.4
TPA2054D4AYZKT
DSBGA
YZK
25
250
180.0
8.4
Pack Materials-Page 1
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
2.75
2.75
0.81
4.0
8.0
Q1
2.75
2.75
0.81
4.0
8.0
Q1
PACKAGE MATERIALS INFORMATION
www.ti.com
26-Apr-2012
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
TPA2054D4AYZKR
DSBGA
YZK
25
3000
210.0
185.0
35.0
TPA2054D4AYZKT
DSBGA
YZK
25
250
210.0
185.0
35.0
Pack Materials-Page 2
D: Max = 2.602 mm, Min =2.542 mm
E: Max = 2.602 mm, Min =2.542 mm
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