www.fairchildsemi.com FSDH321, FSDL321 Green Mode Fairchild Power Switch (FPSTM) Features • Internal Avalanche Rugged Sense FET • Consumes only 0.65W at 240VAC & 0.3W load with Advanced Burst-Mode Operation • Frequency Modulation for low EMI • Precision Fixed Operating Frequency • Internal Start-up Circuit • Pulse by Pulse Current Limiting • Abnormal Over Current Protection • Over Voltage Protection • Over Load Protection • Internal Thermal Shutdown Function • Auto-Restart Mode • Under Voltage Lockout • Low Operating Current (max 3mA) • Adjustable Peak Current Limit • Built-in Soft Start Applications • SMPS for STB, Low cost DVD • Auxiliary Power for PC • Adaptor for Charger Description The FSDx321(x stands for H, L) are integrated Pulse Width Modulators (PWM) and Sense FETs specifically designed for high performance offline Switch Mode Power Supplies (SMPS) with minimal external components. Both devices are integrated high voltage power switching regulators which combine an avalanche rugged Sense FET with a current mode PWM control block. The integrated PWM controller features include: a fixed oscillator with frequency modulation for reduced EMI, Under Voltage Lock Out (UVLO) protection, Leading Edge Blanking (LEB), optimized gate turn-on/turn-off driver, Thermal Shut Down (TSD) protection, Abnormal Over Current Protection (AOCP) and temperature compensated precision current sources for loop compensation and fault protection circuitry. When compared to a discrete MOSFET and controller or RCC switching converter solution, the FSDx321 reduce total component count, design size, weight and at the same time increase efficiency, productivity, and system reliability. Both devices are a basic platform well suited for cost effective designs of flyback converters. OUTPUT POWER TABLE 230VAC ±15%(3) 85-265VAC PRODUCT Adapter(1) Open Frame(2) Adapter(1) Open Frame(2) FSDL321 11W 17W 8W 12W FSDH321 11W 17W 8W 12W FSDL0165RN 13W 23W 11W 17W FSDM0265RN 16W 27W 13W 20W FSDH0265RN 16W 27W 13W 20W FSDL0365RN 19W 30W 16W 24W FSDM0365RN 19W 30W 16W 24W FSDL321L 11W 17W 8W 12W FSDH321L 11W 17W 8W 12W FSDL0165RL 13W 23W 11W 17W FSDM0265RL 16W 27W 13W 20W FSDH0265RL 16W 27W 13W 20W FSDL0365RL 19W 30W 16W 24W FSDM0365RL 19W 30W 16W 24W Table 1. Notes: 1. Typical continuous power in a non-ventilated enclosed adapter measured at 50°C ambient. 2. Maximum practical continuous power in an open frame design at 50°C ambient. 3. 230 VAC or 100/115 VAC with doubler. Typical Circuit AC IN DC OUT Vstr Ipk Drain PWM Vfb Vcc Source Figure 1. Typical Flyback Application Rev.1.0.2 ©2004 Fairchild Semiconductor Corporation FSDH321, FSDL321 Internal Block Diagram Vcc Vstr 5 2 Istart + V BURL /V BURH - Soft start 8V/12V Vcc good Vcc V BURH I B_PEAK Vcc Drain 6,7,8 Internal Bias Vref Freq. Modulation Vcc OSC I delay V FB I FB Normal 2.5R Ipk S Q R Q PWM 3 Burst Gate driver R 4 LEB V SD Vcc 1 GND S Q R Q Vovp TSD Vcc good AOCP Vocp Figure 2. Functional Block Diagram of FSDx321 2 FSDH321, FSDL321 Pin Definitions Pin Number Pin Name 1 GND Sense FET source terminal on primary side and internal control ground. Vcc Positive supply voltage input. Although connected to an auxiliary transformer winding, current is supplied from pin 5 (Vstr) via an internal switch during startup (see Internal Block Diagram section). It is not until Vcc reaches the UVLO upper threshold (12V) that the internal start-up switch opens and device power is supplied via the auxiliary transformer winding. Vfb The feedback voltage pin is the non-inverting input to the PWM comparator. It has a 0.9mA current source connected internally while a capacitor and optocoupler are typically connected externally. A feedback voltage of 6V triggers over load protection (OLP). There is a time delay while charging between 3V and 6V using an internal 5uA current source, which prevents false triggering under transient conditions but still allows the protection mechanism to operate under true overload conditions. Ipk Pin to adjust the current limit of the Sense FET. The feedback 0.9mA current source is diverted to the parallel combination of an internal 2.8kΩ resistor and any external resistor to GND on this pin to determine the current limit. If this pin is tied to Vcc or left floating, the typical current limit will be 0.7A. Vstr This pin connects directly to the rectified AC line voltage source. At start up the internal switch supplies internal bias and charges an external storage capacitor placed between the Vcc pin and ground. Once the Vcc reaches 12V, the internal switch is disabled. Drain The Drain pin is designed to connect directly to the primary lead of the transformer and is capable of switching a maximum of 650V. Minimizing the length of the trace connecting this pin to the transformer will decrease leakage inductance. 2 3 4 5 6, 7, 8 Pin Function Description Pin Configuration 8DIP 8LSOP GND 1 8 Drain Vcc 2 7 Drain Vfb 3 6 Drain Ipk 4 5 Vstr Figure 3. Pin Configuration (Top View) 3 FSDH321, FSDL321 Absolute Maximum Ratings (Ta=25°C, unless otherwise specified) Parameter Symbol Value Unit VSTR,MAX 650 V VDRAIN,MAX 650 V VDGR 650 V Gate-Source (GND) Voltage VGS ±20 V Drain Current Pulsed (1) IDM 1.5 ADC Continuous Drain Current (Tc=25°C) ID 0.7 ADC Continuous Drain Current (Tc=100°C) ID 0.32 ADC EAS 10 mJ Maximum Vstr Pin Voltage Maximum Drain Pin Voltage Drain-Gate Voltage (RGS=1MΩ) Single Pulsed Avalanche Energy (2) VCC,MAX 20 V Input Voltage Range VFB −0.3 to Vstop V Total Power Dissipation PD 1.25 W Operating Junction Temperature. TJ +150 °C Operating Ambient Temperature. TA -25 to +85 °C TSTG -55 to +150 °C Maximum Supply Voltage Storage Temperature Range. Note: 1. Repetitive rating: Pulse width limited by maximum junction temperature 2. L = 24mH, starting Tj = 25°C 4 FSDH321, FSDL321 Electrical Characteristics (Sense FET Part) (Ta = 25°C unless otherwise specified) Parameter Symbol Condition Min. Typ. Max. Unit Sense FET SECTION Drain-Source Breakdown Voltage BVDSS VGS=0V, ID=50µA 650 720 - V Startup Voltage (Vstr) Breakdown BVSTR VCC=0V, ID=1mA 650 720 - V VDS=Max. Rating, VGS=0V - - 25 µA VDS=0.8Max. Rating, VGS=0V, TC=125°C - - 200 µA RDS(ON) VGS=10V, ID=0.5A - 14 19 Ω gfs VDS=50V, ID=0.5A 1.0 1.3 - S - 162 - - 18 - - 3.8 - Zero Gate Voltage Drain Current Static Drain-Source on Resistance (Note) Forward Trans conductance (Note) IDSS Input Capacitance CISS Output Capacitance COSS Reverse Transfer Capacitance CRSS Turn on Delay Time td(on) Rise Time Turn Off Delay Time Fall Time tr td(off) tf Total Gate Charge (Gate-Source + Gate-Drain) Qg Gate-Source Charge Qgs Gate-Drain (Miller) Charge Qgd VGS=0V, VDS=25V, f=1MHz VDD=0.5B VDSS, ID=1.0A (MOSFET switching time is essentially independent of operating temperature) VGS=10V, ID=1.0A, VDS=0.5B VDSS (MOSFET switching time is essentially independent of operating temperature) - 9.5 - - 19 - - 33 - - 42 - - 7.0 - - 3.1 - - 0.4 - pF ns nC Note: 1. Pulse test: Pulse width ≤ 300µS, duty ≤ 2% 2. 1S = --R 5 FSDH321, FSDL321 Electrical Characteristics (Control Part) (Continued) (Ta=25°C unless otherwise specified) Parameter Symbol Condition Min. Typ. Max. Unit UVLO SECTION Start Threshold Voltage VSTART VFB=GND 11 12 13 V Stop Threshold Voltage VSTOP VFB=GND 7 8 9 V 90 100 110 ±2.5 ±3 ±3.5 45 50 55 ±1.0 ±1.5 ±2.0 - ±5 ±10 % FSDH321 62 67 72 % FSDL321 71 77 83 % 0.70 0.90 1.1 mA 5.5 6.0 6.5 V 3.5 5.0 6.5 µA 0.4 0.5 0.6 V 0.25 0.35 0.45 V - 150 - mV OSCILLATOR SECTION Initial Accuracy FOSC Frequency Modulation FMOD Initial Accuracy FOSC Frequency Modulation FMOD Frequency Change With Temperature (2) ∆F/∆T Maximum Duty Cycle Dmax FSDH321 FSDL321 -25°C ≤ Ta ≤ +85°C kHz kHz FEEDBACK SECTION Feedback Source Current IFB Shutdown Feedback Voltage VSD Shutdown Delay Current IDELAY Ta=25°C, Vfb = 0V Ta=25°C, Vfb = 4V BURST MODE SECTION VBURH Burst Mode Voltage VBURL Tj = 25°C Hysteresis CURRENT LIMIT(SELF-PROTECTION)SECTION Peak Current Limit(3) ILIM Tj = 25°C 0.60 0.70 0.80 A Current Limit Delay(1) TCLD Tj = 25°C - 600 - ns TSS Vfb = 4V 10 15 20 ms 125 145 - °C 18 19 20 V 0.7 0.85 1.0 mA 1 3 5 mA SOFT START SECTION Soft Start Time PROTECTION SECTION Thermal Shutdown Temperature (1) Over Voltage Protection TSD - VOVP TOTAL STANDBY CURRENT SECTION Startup Charging Current ICH VCC=0V Operating Supply Current (Control Part Only) IOP VCC = 14V, Vfb = 0V Note: 1. These parameters, although guaranteed, are not 100% tested in production 2. These parameters, although guaranteed, are tested in EDS (wafer test) process 3. di/dt = 250mA/uS 6 FSDH321, FSDL321 Comparison Between FSDM311 and FSDx321 Function FSDM311 FSDx321 FSDx321 Advantages Soft-Start 15mS 15mS • Gradually increasing current limit during soft-start further reduces peak current and voltage component stresses • Eliminates external components used for soft-start in most applications • Reduces or eliminates output overshoot External Current Limit not applicable Programmable of default current limit • Smaller transformer • Allows power limiting (constant overload power) • Allows use of larger device for lower losses and higher efficiency. Frequency Modulation not applicable ±1.5KHz @50KHz ±3.0KHz @100KHz • Reduced conducted EMI Burst Mode Operation Yes-built into controller Yes-built into controller • Improve light load efficiency • Reduces no-load consumption • Transformer audible noise reduction Drain Creepage at Package 7.62mm 7.62mm • Greater immunity to arcing as a result of build-up of dust, debris and other contaminants 7 FSDH321, FSDL321 Typical Performance Characteristics (Control Part) 1.20 1.20 1.00 1.00 Normalized Normalized (These characteristic graphs are normalized at Ta = 25°C) 0.80 0.60 0.40 0.80 0.60 0.40 0.20 0.20 0.00 0.00 -50 0 50 100 -50 150 0 T emp[ ℃] 1.20 1.00 1.00 Normalized Normalized 1.20 0.80 0.60 0.40 0.20 150 0.80 0.60 0.40 0.20 0.00 0.00 -50 0 50 100 150 -50 0 T emp[ ℃] 50 100 150 T emp[ ℃] Operating supply current (Iop) Maximum duty cycle (Dmax) 1.20 1.20 1.00 1.00 Normalized Nomalized 100 Frequency Modulation (FMOD) Operating Frequency (Fosc) 0.80 0.60 0.40 0.20 0.80 0.60 0.40 0.20 0.00 0.00 -50 0 50 100 T emp[ ℃] Start Threshold Voltage (Vstart) 8 50 T emp[ ℃] 150 -50 0 50 100 T emp[ ℃] Stop Threshold Voltage (Vstop) 150 FSDH321, FSDL321 1.20 1.20 1.00 1.00 Normalized Normalized Typical Performance Characteristics (Continued) 0.80 0.60 0.40 0.80 0.60 0.40 0.20 0.20 0.00 0.00 -50 0 50 100 -50 150 0 Feedback Source Current (Ifb) 150 100 150 Peak current limit (ILIM) 1.20 1.20 1.00 1.00 Normalized Normalized 100 T emp[ ℃] T emp[ ℃] 0.80 0.60 0.40 0.20 0.80 0.60 0.40 0.20 0.00 0.00 -50 0 50 100 150 -50 0 T emp[ ℃] 50 T emp[ ℃] Startup Charging Current (Ich) Start up Current (Istart) 1.20 1.20 1.00 1.00 Normalized Normalized 50 0.80 0.60 0.40 0.80 0.60 0.40 0.20 0.20 0.00 0.00 -50 0 50 100 T emp[ ℃] Burst peak current (Iburst) 150 -50 0 50 100 150 Temp[℃] Over Voltage Protection (Vovp) 9 FSDH321, FSDL321 Functional Description 1. Startup : In previous generations of Fairchild Power Switches (FPSTM) the Vstr pin had an external resistor to the DC input voltage line. In this generation the startup resistor is replaced by an internal high voltage current source and a switch that shuts off when 15mS goes by after the supply voltage, Vcc, gets above 12V. The source turns back on if Vcc drops below 8V. Vcc Vfb Vo 0.9mA FB 3 OSC D1 Cfb D2 28R Vfb* Gate driver R 431 VSD Vin,dc Vref 2uA OLP Istr Figure 5. Pulse width modulation (PWM) circuit Vstr Vcc UVLO <8V on J-FET 15m S After UVLO start(>12V) off Figure 4. High voltage current source 2. Feedback Control : The FSDx321 employs current mode control, shown in figure 5. An opto-coupler (such as the H11A817A) and shunt regulator (such as the KA431) are typically used to implement the feedback network. Comparing the feedback voltage with the voltage across the Rsense resistor plus an offset voltage makes it possible to control the switching duty cycle. When the reference pin voltage of the KA431 exceeds the internal reference voltage of 2.5V, the H11A817A LED current increases, thus pulling down the feedback voltage and reducing the duty cycle. This event typically happens when the input voltage is increased or the output load is decreased. 3. Leading edge blanking (LEB) : At the instant the internal Sense FET is turned on, there usually exists a high current spike through the Sense FET, caused by the primary side capacitance and secondary side rectifier diode reverse recovery. Excessive voltage across the Rsense resistor would lead to incorrect feedback operation in the current mode PWM control. To counter this effect, the FPSTM employs a leading edge blanking (LEB) circuit. This circuit inhibits the PWM comparator for a short time (TLEB) after the Sense FET is turned on. 10 4. Protection Circuit : The FPSTM has several protective functions such as over load protection (OLP), over voltage protection (OVP), abnormal over current protection (AOCP), under voltage lock out (UVLO) and thermal shutdown (TSD). Because these protection circuits are fully integrated inside the IC without external components, the reliability is improved without increasing cost. Once the fault condition occurs, switching is terminated and the Sense FET remains off. This causes Vcc to fall. When Vcc reaches the UVLO stop voltage, 8V, the protection is reset and the internal high voltage current source charges the Vcc capacitor via the Vstr pin. When Vcc reaches the UVLO start voltage,12V, the FPSTM resumes its normal operation. In this manner, the auto-restart can alternately enable and disable the switching of the power Sense FET until the fault condition is eliminated. 4.1 Over Load Protection (OLP) : Overload is defined as the load current exceeding a pre-set level due to an unexpected event. In this situation, the protection circuit should be activated in order to protect the SMPS. However, even when the SMPS is in the normal operation, the over load protection circuit can be activated during the load transition. In order to avoid this undesired operation, the over load protection circuit is designed to be activated after a specified time to determine whether it is a transient situation or an overload situation. In conjunction with the Ipk current limit pin (if used) the current mode feedback path would limit the current in the Sense FET when the maximum PWM duty cycle is attained. If the output consumes more than this maximum power, the output voltage (Vo) decreases below the set voltage. This reduces the current through the opto-coupler LED, which also reduces the opto-coupler transistor current, thus increasing the feedback voltage (Vfb). If Vfb exceeds 3V, the feedback input diode is blocked and the 5uA Idelay current source starts to charge Cfb slowly up to Vcc. In this condition, Vfb continues increasing until it reaches 6V, when the switching operation is terminated as shown in figure 6. The delay time for shutdown is the time required to charge Cfb from 3V to 6V with 5uA. FSDH321, FSDL321 enabled and monitors the current through the sensing resistor. The voltage across the resistor is then compared with a preset AOCP level. If the sensing resistor voltage is greater than the AOCP level, pulse by pulse AOCP is triggered regardless of uncontrollable LEB time. Here, pulse by pulse AOCP stops Sense FET within 350nS after it is activated. Vcc 8V OLP 6V FPS switching Following Vcc 3V Delay current (5uA) charges the Cfb t1 t2 t1 = − 1 RC t 2 = C fb In (1 − fb t3 t4 V ( t 1) ); V ( t1) = 3V , R = 2 . 8 K Ω , C fb = C R t fb _ fig . 2 (V (t1 + t 2) − V (t1)) ; I delay = 5uA,V (t1 + t 2) − V (t1) = 3V I delay Figure 6. Over load protection 4.2 Thermal Shutdown (TSD) : The Sense FET and the control IC are integrated, making it easier for the control IC to detect the temperature of the Sense FET. When the temperature exceeds approximately 140°C, thermal shutdown is acti- 4.4 Over Voltage Protection (OVP) : In case of malfunction in the secondary side feedback circuit, or feedback loop open caused by a defect of solder, the current through the opto-coupler transistor becomes almost zero. Then, Vfb climbs up in a similar manner to the over load situation, forcing the preset maximum current to be supplied to the SMPS until the over load protection is activated. Because excess energy is provided to the output, the output voltage may exceed the rated voltage before the over load protection is activated, resulting in the breakdown of the devices in the secondary side. In order to prevent this situation, an over voltage protection (OVP) circuit is employed. In general, Vcc is proportional to the output voltage and the FPSTM uses Vcc instead of directly monitoring the output voltage. If VCC exceeds 19V, OVP circuit is activated resulting in termination of the switching operation. In order to avoid undesired activation of OVP during normal operation, Vcc should be properly designed to be below 19V. vated. 4.3 Abnormal Over Current Protection (AOCP) : PWM COMPARATOR Vfb CLK LEB Drain Out Driver Vsense AOCP COMPARATOR S Q R 5. Soft Start : The FPSTM has an internal soft start circuit that increases the feedback voltage together with the Sense FET current slowly after it starts up. The typical soft start time is 15msec, as shown in figure 8, where progressive increments of Sense FET current are allowed during the start-up phase. The pulse width to the power switching device is progressively increased to establish the correct working conditions for transformers, inductors, and capacitors. The voltage on the output capacitors is progressively increased with the intention of smoothly establishing the required output voltage. It also helps to prevent transformer saturation and reduce the stress on the secondary diode. Rsense VAOCP Drain current [A] Figure 7. AOCP Function & Block Even though the FPSTM has OLP (Over Load Protection) and current mode PWM feedback, these are not enough to protect the FPSTM when a secondary side diode short or a transformer pin short occurs. In addition to start-up, softstart is also activated at each restart attempt during autorestart and when restarting after latch mode is activated. The FPSTM has an internal AOCP (Abnormal Over Current Protection) circuit as shown in figure 7. When the gate turn-on signal is applied to the power Sense FET, the AOCP block is 0.7A 0.4A Tss 11 FSDH321, FSDL321 D R A IN 5V Burst Operation Burst Operation Feedback Normal Operation S W IT C H OFF GND I_ o v e r 0.5V 0.5V Rsense 0.3V 0.35V Current waveform Switching OFF Switching OFF Figure 8. Soft Start Function Figure 10. Circuit for Burst Operation 6. Burst operation :In order to minimize power dissipation in standby mode, the FPSTM enters burst mode operation. + 0.35V/0.5V 0.3/0.5V - 0.5V 0.5V Vcc IB_PEAK Vcc Idelay FB Vcc IFB Normal PWM 3 2.5R Burst R MOSFET Current 7. Frequency Modulation : EMI reduction can be accomplished by modulating the switching frequency of a switched power supply. Frequency modulation can reduce EMI by spreading the energy over a wider frequency range than the band width measured by the EMI test equipment. The amount of EMI reduction is directly related to the depth of the reference frequency. As can be seen in Figure 11, the frequency changes from 97KHz to 100KHz (from 48.5KHz to 51.5KHz ; FSDL321)in 4mS for the FSDH321. Frequency modulation allows the use of a cost effective inductor instead of an AC input mode choke to satisfy the requirements of world wide EMI limits. Internal Oscillator Figure 9. Circuit for Burst operation 103kHz As the load decreases, the feedback voltage decreases. As shown in figure 10, the device automatically enters burst mode when the feedback voltage drops below VBURH(500mV). Switching still continues but the current limit is set to a fixed limit internally to minimize flux density in the transformer. The fixed current limit is larger than that defined by Vfb = VBURH and therefore, Vfb is driven down further. Switching continues until the feedback voltage drops below VBURL(350mV). At this point switching stops and the output voltages start to drop at a rate dependent on the standby current load. This causes the feedback voltage to rise. Once it passes VBURH(500mV) switching resumes. The feedback voltage then falls and the process repeats. Burst mode operation alternately enables and disables switching of the power Sense FET thereby reducing switching loss in Standby mode. 12 Drain to Source voltage Drain to Vds Waveform 6kHz 97kHz 100kHz 103kHz Turn-on Turn-off Figure 11. Frequency Modulation Waveform for FSDH321 FSDH321, FSDL321 8. Adjusting Current limit function: As shown in fig 12, a combined 2.8KΩ internal resistance is connected into the non-inverting lead on the PWM comparator. A external resistance of Y on the current limit pin forms a parallel resistance with the 2.8KΩ when the internal diodes are biased by the main current source of 900uA. 5uA 900uA Feed Back 3 2 KΩ 4 Current Limit PWM comparator 0.8 KΩ AK Ω Rsense SenseFET Sense Figure 12. Peak current adjustment For example, FSDH321 has a typical Sense FET current limit (ILIM) of 0.7A. The Sense FET current can be limited to 0.5 by inserting a kΩ between the current limit pin and ground which is derived from the following equations: 0.7: 0.5 = 2.8KΩ : XKΩ , X = 2KΩ, Since X represents the resistance of the parallel network, Y can be calculated using the following equation: Y = X / (1 - (X/2.8KΩ)) ; Y = 7KΩ 13 FSDH321, FSDL321 Typical application circuit 1. PC Auxiliary Power Circuit (10W Output Power) C101 10nF 630V R102 100kΩ 1W R101 680kΩ 1W L201 10uH D201 SB360 T1 EE1625 140~375 VDC INPUT 1 10 2 7 C201 1000uF 16V C203 470uF 16V 5V (+/-5%) 2A D101 UF 4007 3 M Vcc 5 IC101 FSDx321 3 D102 1N4937 Vstr Drain 6,7,8 Vfb Vcc 2 D103 1N4937 R103 10Ω Ω 4 C102 47uF 50V R104 10Ω Ω 5 C104 22nF GND 1 C103 10uF 50V R202 330Ω Ω 6 PC301 H11A817A R201 1kΩ Ω C301 2.2nF IC201 KA431 R203 2kΩ Ω C202 100nF R204 2kΩ Ω 10W PC Auxiliary Power Circuit 10W PC Auxiliary Power, 150~375VDC Input Power supply: It shows a auxiliary power for PC. Efficiency at 10W, 150/ 375VDC is ≥70%. The PC application has the standard of standby power consumption, under 1W at the output load, 0.5W and height input voltage, 230VAC. For this the FSDH321 also has the burst operating function like the any other green mode FPS like FSDM0265RN or FSDM0365RN and so on. This skill reduces the MOSFET switching numbers and power MOSFET switching loss. This design takes advantage of self protection without external components and high switching frequency, 100kHz. The frequency makes using a small size transformer core possible. The EE16 or EE1625 can be used for 10W application. This is achieved by preventing the green FPS from switching when the input voltage goes below a level needed to maintain output regulation, and keeping it off until the input voltage goes above the under-voltage threshold, when the AC is turned on again. For example with the resistor, R101, 680kΩ, the threshold voltage is around 150VAC(210VDC) at the room temperature. Leakage inductance clamping is provided by R102 and 14 C101, keeping the DRAIN voltage below 650 V under all conditions. And R102 dissipates power to prevent rising of DRAIN Voltage caused by leakage inductance. The frequency modulation feature of FSDH321 allows the circuit shown to meet CISPR2AB with simple EMI filtering. The secondary is rectified and smoothed by D201. Similarly D102 and D103 are also rectifiers for main power control IC and FSDH321 respectively. The 5V output voltage require two capacitors in parallel to meet the ripple current requirement. Switching noise filtering is provided by L201. The output is regulated by the reference (TL431) voltage in secondary. It is sensed via R203 and R204. Resistor R201 provides bias for TL431 and R202 sets the overall DC gain. R2012, C202 and R203 provide loop compensation. FSDH321, FSDL321 2. Transformer Specification (10W Output Power) 1. Schematic Diagram EE1625 N p/2 1 N p/2 2 10 3 9 Na N 5V Np/2 NM Vcc N M Vcc Na 8 4 N5V 5 7 Np/2 6 2. Winding Specification P in ( S ! F ) W ire T u rn s W in d in g M e th o d 3 ! 2 0 .1 5 φ × 1 80 S o le n o id w in d in g N p /2 In s u la tio n : P o ly e s te r T a p e t = 0 .0 5 0 m m , 3 L a y e rs 10 ! 7 N 5V 0 .5 5 φ × 1 12 S o le n o id w in d in g In s u la tio n : P o ly e s te r T a p e t = 0 .0 5 0 m m , 3 L a y e rs 4 ! 6 N M VCC 0 .2 0 φ × 1 40 S o le n o id w in d in g In s u la tio n : P o ly e s te r T a p e t = 0 .0 5 0 m m , 3 L a y e rs 2 ! 1 N p /2 0 .1 5 φ × 1 80 S o le n o id w in d in g In s u la tio n : P o ly e s te r T a p e t = 0 .0 5 0 m m , 3 L a y e rs 5 ! 6 Na 0 .2 0 φ × 1 34 S o le n o id w in d in g O u te r In s u la tio n : P o ly e s te r T a p e t = 0 .0 5 0 m m , 3 L a y e rs 3. Electric Specification and Core and Bobbin P in Spec. R e m a rk In d u c ta n c e 1 – 3 1 .8 m H 1 kH z, 1 V L e a ka g e 1 - 3 100uH 2 n d s id e a ll s h o rt C o re EE1625 B o b b in EE1625 15 FSDH321, FSDL321 Layout Considerations SURFACE MOUNTED COPPER AREA FOR HEAT SINKING DC_link Capacitor #1 : GND #2 : VCC #3 : Vfb #4 : Ipk #5 : Vstr #6 : Drain #7 : Drain #8 : Drain Y1CAPACITOR Figure 13. Layout Considerations for FSDx321 using 8DIP 16 - + DC OUT FSDH321, FSDL321 Package Dimensions 8DIP 17 FSDH321, FSDL321 Package Dimensions (Continued) 8LSOP 18 FSDH321, FSDL321 Ordering Information Product Number Package Marking Code BVDSS FOSC RDS(on) FSDH321 8DIP DH321 650V 100KHz 14Ω FSDL321 8DIP DL321 650V 50KHz 14Ω FSDH321L 8LSOP DH321 650V 100KHz 14Ω FSDL321L 8LSOP DL321 650V 50KHz 14Ω 19 FSDH321, FSDL321 DISCLAIMER FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. LIFE SUPPORT POLICY FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury of the user. 2. A critical component in any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. www.fairchildsemi.com 10/1/04 0.0m 001 Stock#DSxxxxxxxx 2004 Fairchild Semiconductor Corporation